Packaging structure, light-emitting device and backlight module

Abstract

The embodiment of the utility model provides a packaging structure, a light-emitting device and a backlight module, the packaging structure comprises a support, a lens and a quantum dot film, the support is provided with a hollow part, and the lens covers an opening at one end of the hollow part; the quantum dot film is arranged in the hollow part, so that a chip containing cavity is defined in the hollow part, and the chip containing cavity is located on the side, away from the lens, of the quantum dot film.

Description

Technical Field

[0001] The present application relates to the field of optoelectronic display technology, and in particular to a packaging structure, a light-emitting device and a backlight module. Background Art

[0002] In the related art, some display products are equipped with quantum dot films or quantum dot diffusion plates in the backlight module to improve the color gamut of the display products. However, the area of ​​the quantum dot films or quantum dot diffusion plates required for such display products is relatively large, resulting in high costs and failure to meet application requirements. Utility Model Content

[0003] The embodiments of the present application provide a packaging structure, a light-emitting device and a backlight module, which can achieve a higher display color gamut at a lower cost and better meet application requirements.

[0004] In a first aspect, an embodiment of the present application provides a packaging structure, comprising a bracket, a lens and a quantum dot film, wherein the bracket is provided with a hollow portion, and the lens covers an opening at one end of the hollow portion; the quantum dot film is arranged in the hollow portion to define a chip accommodating cavity in the hollow portion, and the chip accommodating cavity is located on a side of the quantum dot film away from the lens.

[0005] In some embodiments, the bracket includes a bracket body and a reflective layer, the hollow portion is located on the bracket body, and the reflective layer is formed on a side wall surface of the hollow portion.

[0006] In some embodiments, the side wall surface of the hollow portion is a reflective surface.

[0007] In some embodiments, the hollow portion is a through hole, one end of which opens on a side surface of the bracket facing the lens, and the other end of which opens on a side surface of the bracket away from the lens.

[0008] In some embodiments, the hollow portion is a groove, and the groove is formed on a surface of the bracket facing the lens.

[0009] In some embodiments, an annular groove is provided on the side wall of the hollow portion, and the edge of the quantum dot film is embedded in the annular groove to separate the hollow portion into the chip accommodating cavity and the light guide cavity, and the light guide cavity opens toward the lens.

[0010] In some embodiments, the hollow portion has a groove sub-portion and a main hollow sub-portion, the groove sub-portion is arranged on a side surface of the bracket facing the lens, and the main hollow sub-portion is arranged at the bottom of the groove sub-portion; the quantum dot film covers the bottom of the groove sub-portion to define the main hollow sub-portion as the chip accommodating cavity.

[0011] In some embodiments, a light entrance hole is provided on a side of the lens facing the hollow portion, and the quantum dot film is blocked between the light entrance hole and the chip accommodating cavity.

[0012] In a second aspect, an embodiment of the present application provides a light-emitting device, comprising a light-emitting chip and the packaging structure described in any one of the above embodiments, wherein the light-emitting chip is disposed in the chip accommodating cavity.

[0013] In some embodiments, the light-emitting device further includes a substrate, and the bracket is disposed on the substrate; when the hollow portion is a through hole, the light-emitting chip is disposed on the substrate, and the chip accommodating cavity opens toward the substrate.

[0014] In a third aspect, an embodiment of the present application provides a backlight module, comprising the light-emitting device described in any one of the above embodiments.

[0015] The embodiment of the present application sets the quantum dot film in the packaging structure so that the use area of ​​the quantum dot film is limited to a small range of the packaging structure. There is no need to use a whole film that is at least close to the size of the display product screen. The amount of quantum dot film and material cost required for the display product can be significantly reduced, thereby achieving a higher display color gamut at a lower cost and better meeting application requirements. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] In order to more clearly illustrate the technical solutions in the embodiments of the present application, the drawings required for use in the description of the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present application. For those skilled in the art, other drawings can be obtained based on these drawings without paying any creative work.

[0017] Figure 1 is a cross-sectional structural diagram of a packaging structure provided by some embodiments of the present application;

[0018] Figure 2 is another cross-sectional structural diagram of a packaging structure provided by some embodiments of the present application;

[0019] Figure 3 is another cross-sectional structural diagram of a packaging structure provided by some embodiments of the present application;

[0020] Figure 4 is another cross-sectional structural diagram of a packaging structure provided by some embodiments of the present application;

[0021] Figure 5 is another cross-sectional structural diagram of a packaging structure provided by some embodiments of the present application;

[0022] Figure 6is a cross-sectional structural diagram of a light emitting device provided in some embodiments of the present application;

[0023] Figure 7 is another cross-sectional structural diagram of a light emitting device provided in some embodiments of the present application;

[0024] Figure 8 This is another cross-sectional structural diagram of the light-emitting device provided in some embodiments of the present application.

[0025] Description of main component symbols:

[0026] 1- packaging structure, 10- bracket, 11- hollow part, 11a- chip accommodating cavity, 11b- light guide cavity, 111- annular groove, 112- sinking groove sub-part, 113- main hollow sub-part, 12- bracket body, 13- reflective layer, 20- lens, 21- light entrance hole, 30- quantum dot film, 2- light-emitting chip, 3- substrate. DETAILED DESCRIPTION

[0027] The following will be combined with the drawings in the embodiments of the present application to clearly and completely describe the technical solutions in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, not all of the embodiments. Based on the embodiments in the present application, all other embodiments obtained by those skilled in the art without creative work are within the scope of protection of this application.

[0028] In the description of the present application, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside" and the like indicate positions or positional relationships based on the positions or positional relationships shown in the accompanying drawings, which are only for the convenience of describing the present application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the present application. In addition, the terms "first" and "second" are only used for descriptive purposes and cannot be understood as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Therefore, the features defined as "first" and "second" may explicitly or implicitly include one or more of the said features. In the description of the present application, the meaning of "multiple" is two or more, unless otherwise clearly and specifically defined.

[0029] “A and / or B” includes the following three combinations: A only, B only, and a combination of A and B.

[0030] The use of "suitable for" or "configured to" in this application is meant to be open and inclusive language, which does not exclude devices that are suitable for or configured to perform additional tasks or steps. In addition, the use of "based on" is meant to be open and inclusive, because the process, step, calculation or other action "based on" one or more stated conditions or values ​​can be based on additional conditions or values ​​beyond the stated values ​​in practice.

[0031] In this application, the word "exemplary" is used to mean "used as an example, illustration, or description." Any embodiment described in this application as "exemplary" is not necessarily to be construed as being preferred or advantageous over other embodiments. The following description is given to enable any technician in the field to implement and use the present application. In the following description, details are listed for the purpose of explanation. It should be understood that a person of ordinary skill in the art can recognize that the present application can be implemented without using these specific details. In other instances, well-known structures and processes will not be elaborated in detail to avoid obscuring the description of the present application with unnecessary details. Therefore, the present application is not intended to be limited to the embodiments shown, but is consistent with the widest scope consistent with the principles and features disclosed in the present application.

[0032] like Figures 1 to 8 As shown, in the first aspect, an embodiment of the present application provides a packaging structure 1, which includes a bracket 10, a lens 20 and a quantum dot film 30, which can achieve a higher display color gamut at a lower cost and can better meet application requirements.

[0033] The bracket 10 is provided with a hollow portion 11, and the lens 20 covers an opening at one end of the hollow portion 11, and can be fixed by optical adhesive, for example. The quantum dot film 30 is arranged in the hollow portion 11 to define a chip accommodating cavity 11a in the hollow portion 11, and the chip accommodating cavity 11a is used to accommodate the light-emitting chip 2. Here, the chip accommodating cavity 11a is located on the side of the quantum dot film 30 away from the lens 20; accordingly, when the light-emitting chip 2 is arranged in the chip accommodating cavity 11a, the quantum dot film 30 is blocked between the light-emitting chip 2 and the lens 20.

[0034] In this way, when the light emitting chip 2 emits light, the light emitted by the light emitting chip 2 can only irradiate the quantum dot film 30, but cannot directly irradiate the lens 20. When the light emitted by the light emitting chip 2 irradiates the quantum dot film 30, the quantum dots in the quantum dot film 30 are excited to emit light of a preset wavelength, for example, converting the blue light emitted by the light emitting chip 2 into red light and green light; these excited lights are then irradiated onto the lens 20, achieving a higher display color gamut.

[0035] Compared with the related art, the embodiment of the present application sets the quantum dot film 30 in the packaging structure 1, so that the use area of ​​the quantum dot film 30 is limited to a small range of the packaging structure 1. There is no need to use a whole film that is at least close to the screen size of the display product. The amount and material cost of the quantum dot film 30 required for the display product can be significantly reduced, thereby achieving a higher display color gamut at a lower cost and better meeting application requirements.

[0036] The structure of the hollow portion 11 can be determined according to actual needs, and can adopt types such as a through hole structure, a groove structure, etc., which is not limited in the embodiment of the present application. Figure 1 , Figure 3 and Figure 6 As shown, in some embodiments, the hollow portion 11 may be a through hole, one end of which is opened on a side surface of the bracket 10 facing the lens 20, and the other end is opened on a side surface of the bracket 10 away from the lens 20; accordingly, the opening of the through hole located on a side surface of the bracket 10 away from the lens 20 is the opening of the chip accommodating cavity 11a, so that the opening of the chip accommodating cavity 11a faces away from the lens 20. Here, the packaging structure 1 can be used in combination with the substrate 3, the bracket 10 and the light-emitting chip 2 are respectively arranged on the substrate 3, the opening of the chip accommodating cavity 11a faces the substrate 3, and the light-emitting chip 2 is located in the chip accommodating cavity 11a.

[0037] like Figure 2 , Figure 4 and Figure 7 As shown, in other embodiments, the hollow portion 11 may be a groove, so that the hollow portion 11 has a groove structure. The groove is formed on the side surface of the bracket 10 facing the lens 20, suitable for accommodating and installing the light-emitting chip 2, forming a relatively compact and safe packaging structure 1. Here, the packaging structure 1 can be suitable for packaging application scenarios such as POB (package on board) packaging.

[0038] The location of the quantum dot film 30 in the hollow portion 11 can be determined according to actual needs, and the embodiment of the present application does not limit this. Figure 1 and Figure 2 As shown, in some embodiments, an annular groove 111 may be provided on the side wall of the hollow portion 11. The edge of the quantum dot film 30 is embedded in the annular groove 111 to separate the hollow portion 11 into a chip accommodating cavity 11a and a light guide cavity 11b; here, the light guide cavity 11b opens toward the lens 20. In this way, the quantum dot film 30 is disposed in the middle region of the hollow portion 11 along the depth direction thereof; when the quantum dot film 30 is excited to emit excitation light, the excitation light irradiates the lens 20 along the light guide cavity 11b.

[0039] In some examples, the hollow portion 11 has the above-mentioned through-hole structure, and the annular groove 111 can be arranged on the side wall of the hollow portion 11 and located in the area between the two end openings of the through-hole structure, so that the quantum dot film 30 is located in the area between the two end openings of the hollow portion 11, thereby defining a chip accommodating cavity 11a and a light-guiding cavity 11b that are isolated from each other in the through-hole structure. In other examples, the hollow portion 11 can have the above-mentioned groove structure, and the annular groove 111 can be arranged on the side wall of the hollow portion 11 and located in the area between the opening and the bottom of the groove structure, so that the quantum dot film 30 is located in the area between the opening and the bottom of the groove of the hollow portion 11, thereby defining a chip accommodating cavity 11a and a light-guiding cavity 11b that are isolated from each other in the groove structure.

[0040] like Figure 3 and Figure 4 As shown, in other embodiments, the hollow portion 11 may have a groove sub-portion 112 and a main hollow sub-portion 113; the groove sub-portion 112 is arranged on the side surface of the bracket 10 facing the lens 20, and the main hollow sub-portion 113 is arranged at the bottom of the groove of the groove sub-portion 112. The quantum dot film 30 covers the bottom of the groove of the groove sub-portion 112 to define the main hollow sub-portion 113 as a chip accommodating cavity 11a. In this way, the quantum dot film 30 is arranged in the open end area of ​​the hollow portion 11, which defines the hollow portion 11 as a single cavity structure having only the chip accommodating cavity 11a; when the quantum dot film 30 is excited to emit excitation light, the excitation light is directly irradiated onto the lens 20.

[0041] The structure of the bracket 10 can be determined according to actual needs, and the present embodiment of the application does not limit this. Figures 1 to 4 As shown, in some embodiments, the bracket 10 may have a single-layer structure and be made of a material having a high reflectivity and a significant reflective effect on the light emitted by the light-emitting chip 2. Here, the side wall surface of the hollow portion 11 may be a reflective surface having a high reflectivity for the light emitted by the light-emitting chip 2 and the excitation light of the quantum dot film 30. Exemplarily, the bracket 10 may be a white reflective bracket made of white reflective material.

[0042] In some examples, when the quantum dot film 30 divides the hollow portion 11 into the chip receiving cavity 11a and the light guiding cavity 11b, the sidewall surfaces of the chip receiving cavity 11a and the light guiding cavity 11b are both reflective surfaces. When the light emitted by the light emitting chip 2 is irradiated onto the sidewall surface of the chip receiving cavity 11a, the sidewall surface of the chip receiving cavity 11a can efficiently reflect the light, so that at least most of the light cannot pass through the sidewall surface of the chip receiving cavity 11a and escape by transmission, but after one or more reflections in the chip receiving cavity 11a, it is irradiated onto the quantum dot film 30 along the light passage defined by the chip receiving cavity 11a. Furthermore, the quantum dot film 30 is excited to emit excitation light, part of which can be directly irradiated onto the lens 20 along the light passage defined by the light guide cavity 11b; the rest of the excitation light is first irradiated onto the side wall surface of the light guide cavity 11b, and the side wall surface of the light guide cavity 11b can efficiently reflect the light, so that at least most of the light cannot pass through the side wall surface of the light guide cavity 11b and escape by transmission, but after one or more reflections in the light guide cavity 11b, it irradiates onto the lens 20 along the light passage defined by the light guide cavity 11b. In this way, the utilization rate of the reflected light and the light output of the hollow portion 11 can be increased, thereby increasing the light output display brightness.

[0043] In other examples, when the quantum dot film 30 defines the hollow portion 11 as a chip receiving cavity 11a, the side wall surface of the chip receiving cavity 11a is a reflective surface. When the light emitted by the light-emitting chip 2 is irradiated onto the side wall surface of the chip receiving cavity 11a, the side wall surface of the chip receiving cavity 11a can efficiently reflect the light, so that at least most of the light cannot pass through the side wall surface of the chip receiving cavity 11a and escape by transmission, but after one or more reflections in the chip receiving cavity 11a, it is irradiated onto the quantum dot film 30 along the light passage defined by the chip receiving cavity 11a; then, the quantum dot film 30 is excited to emit excitation light, and the excitation light can be directly irradiated onto the lens 20.

[0044] like Figure 5As shown, in other embodiments, the bracket 10 may have a multi-layer structure, including a bracket body 12 and a reflective layer 13. The above-mentioned hollow portion 11 is located on the bracket body 12, and the reflective layer 13 is formed on the side wall surface of the hollow portion 11. Here, the bracket body 12 can be made of a material that has a high reflectivity and a more significant reflective effect on the light emitted by the light-emitting chip 2 and the quantum dot film 30, or it can be made of a material that has no significant reflective effect on the light emitted by the light-emitting chip 2 and the quantum dot film 30 but can transmit a large amount of light, and the embodiment of the present application is not limited to this; and the reflective layer 13 can be made of a material that has a high reflectivity and a more significant reflective effect on the light emitted by the light-emitting chip 2 and the quantum dot film 30. The reflection process of the reflective layer 13 on the light emitted by the light-emitting chip 2 and the quantum dot film 30 can refer to the reflection process when the side wall surface of the hollow portion 11 is a reflective surface, and it will not be repeated here.

[0045] The material of the lens 20 can be determined according to actual needs, and can be, for example, a silicone lens 20, a plastic lens 20, etc., which is not limited in the embodiments of the present application. The type of the lens 20 can be determined according to actual needs, and can be, for example, a reflective lens, a refractive lens, etc., which is not limited in the embodiments of the present application. In some embodiments, a light entrance hole 21 can be provided on the side of the lens 20 facing the hollow portion 11, and the quantum dot film 30 is blocked between the light entrance hole 21 and the chip accommodating cavity 11a. In this way, the excitation light generated by the quantum dot film 30 can be irradiated onto the hole wall of the light entrance hole 21, and then pass through the hole wall of the light entrance hole 21 and enter the lens 20.

[0046] like Figures 6 to 8 As shown, in the second aspect, an embodiment of the present application provides a light-emitting device, which includes a light-emitting chip 2 and a packaging structure 1 provided in any of the above embodiments, and the light-emitting chip 2 is arranged in a chip accommodating cavity 11a. The type of the light-emitting chip 2 can be determined according to actual needs, and can be, for example, Mini LED, Micro LED and other types, which are not limited in the embodiment of the present application. Since the light-emitting device adopts the above-mentioned packaging structure 1, the amount and material cost of the quantum dot film 30 required for the display product can be significantly reduced, so that a higher display color gamut can be achieved at a lower cost, which can better meet the application requirements.

[0047] In some embodiments, the light-emitting device may further include a substrate 3, and the bracket 10 is disposed on the substrate 3. The type of the substrate 3 may be determined according to actual needs, and may be, for example, a hard printed circuit board, a flexible circuit board, etc., which is not limited in the embodiments of the present application. In some examples, the hollow portion 11 may have the above-mentioned through-hole structure, and the light-emitting chip 2 may be disposed on the substrate 3; here, the opening of the chip accommodating cavity 11a faces the substrate 3, and the light-emitting chip 2 is located in the chip accommodating cavity 11a.

[0048] In the third aspect, the embodiment of the present application provides a backlight module, which includes the light-emitting device provided by any of the above embodiments. The type of the backlight module can be determined according to actual needs, and can adopt types such as direct backlight, edge-entry backlight, etc., which are not limited by the embodiment of the present application. Since the backlight module has the above-mentioned light-emitting device, the backlight module does not need to be provided with a quantum dot whole film or whole panel that is at least close to the size of the display product screen, which can significantly reduce the amount and material cost of the quantum dot film 30 required for the display product, thereby achieving a higher display color gamut at a lower cost, which can better meet the application requirements.

[0049] The packaging structure, light-emitting device and backlight module provided in the embodiments of the present application are introduced in detail above. Specific examples are used in this article to illustrate the principles and implementation methods of the present application. The description of the above embodiments is only used to help understand the method of the present application and its core idea. At the same time, for technical personnel in this field, according to the idea of ​​the present application, there will be changes in the specific implementation method and application scope. In summary, the content of this specification should not be understood as a limitation on the present application.

Claims

1. A packaging structure, characterized in that: It includes a bracket, a lens and a quantum dot film, wherein the bracket is provided with a hollow portion, and the lens covers an opening at one end of the hollow portion; the quantum dot film is arranged in the hollow portion to define a chip accommodating cavity in the hollow portion, and the chip accommodating cavity is located on a side of the quantum dot film away from the lens.

2. The packaging structure according to claim 1, characterized in that: The bracket comprises a bracket body and a reflective layer, the hollow portion is located on the bracket body, and the reflective layer is formed on a side wall surface of the hollow portion.

3. The packaging structure according to claim 1, characterized in that: The side wall surface of the hollow portion is a reflective surface.

4. The packaging structure according to claim 1, characterized in that: The hollow portion is a through hole, one end of which opens on a side surface of the bracket facing the lens, and the other end of which opens on a side surface of the bracket away from the lens.

5. The packaging structure according to claim 1, characterized in that: The hollow portion is a groove, and the groove is formed on a surface of the bracket facing the lens.

6. The packaging structure according to claim 1, characterized in that: An annular groove is provided on the side wall of the hollow portion, and the edge of the quantum dot film is embedded in the annular groove to separate the hollow portion into the chip accommodating cavity and the light guiding cavity, and the light guiding cavity opens toward the lens.

7. The packaging structure according to claim 1, characterized in that: The hollow portion comprises a groove sub-portion and a main hollow sub-portion, the groove sub-portion being arranged on a side surface of the bracket facing the lens, and the main hollow sub-portion being arranged at the bottom of the groove sub-portion; the quantum dot film is covered at the bottom of the groove sub-portion to define the main hollow sub-portion as the chip accommodating cavity.

8. The packaging structure according to claim 1, characterized in that: A light entrance hole is provided on the lens at one side facing the hollow portion, and the quantum dot film is blocked between the light entrance hole and the chip accommodating cavity.

9. A light emitting device, characterized in that: It comprises a light-emitting chip and the packaging structure according to any one of claims 1 to 8, wherein the light-emitting chip is arranged in the chip accommodating cavity.

10. The light emitting device according to claim 9, characterized in that: The light emitting device further comprises a substrate, and the bracket is arranged on the substrate; when the hollow portion is a through hole, the light emitting chip is arranged on the substrate, and the chip accommodating cavity opens toward the substrate.

11. A backlight module, characterized in that: Comprising the light-emitting device according to claim 9 or 10.

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