Vehicle-mounted mainboard with heat dissipation structure

Abstract

The utility model belongs to the technical field of vehicle-mounted main boards, particularly relates to a vehicle-mounted main board with a heat dissipation structure, and provides the following scheme that the vehicle-mounted main board comprises a main board, a connector arranged on the main board and a heat dissipation block arranged at the bottom of the main board, the upper cover plate and the lower cover plate are respectively arranged above and below the heat dissipation shell, the front mounting bracket and the rear mounting bracket are arranged at the front end and the rear end of the heat dissipation shell, and the side plates are arranged on the left side and the right side of the heat dissipation shell. According to the vehicle-mounted mainboard with the heat dissipation structure, the overall effect is that the size of an original heat dissipation block is not changed, the internal space is not affected, and the overall heat dissipation effect is improved; the overall structural part is designed into the sectional material capable of dissipating heat, the original heat dissipation block of the main board is in surface contact with the sectional material of equipment, the heat dissipation area is increased, heat is better transferred and then is transferred out through heat conduction teeth of the external sectional material, the heat is taken away, and heat dissipation holes are formed in the side faces, so that air circulation is facilitated, and the internal temperature is improved.

Description

Technical Field

[0001] The utility model relates to the technical field of vehicle-mounted mainboards, in particular to a vehicle-mounted mainboard with a heat dissipation structure. Background Art

[0002] The onboard motherboard is one of the core components of rail equipment. It provides power and power management; data transmission and control; scalability and compatibility; hardware support and coordination; heat dissipation and protection.

[0003] With the continuous development of science and technology, more and more equipment functions appear in people's lives, and the performance requirements for the motherboard are getting higher and higher. At the same time, the requirements for its heat dissipation are also getting higher and higher. Good heat dissipation capacity can make the motherboard play the best performance and control the temperature of the motherboard and other hardware devices within a safe range.

[0004] The existing motherboard temperature control methods include active heat dissipation and passive heat dissipation. Due to the particularity of the rail transit industry, considering safety, stability and space energy consumption, passive heat dissipation is the best choice, adding heat sinks to the motherboard to increase the heat dissipation area, but the effect of passive heat dissipation cannot guarantee that the motherboard can run well under long-term, high-load, high-temperature and low-temperature environments. Utility Model Content

[0005] The purpose of the utility model is to provide a vehicle-mounted mainboard with a heat dissipation structure in view of the defects of the prior art, so as to solve the problems raised in the above-mentioned background technology.

[0006] The heat dissipation shell is composed of an upper cover plate and a lower cover plate respectively arranged on the upper and lower parts of the heat dissipation shell, a front mounting bracket and a rear mounting bracket respectively arranged on the front and rear ends of the heat dissipation shell, and side plates respectively arranged on the left and right sides of the heat dissipation shell. The upper cover plate and the lower cover plate are respectively provided with evenly arranged heat dissipation teeth on the outer sides. The upper and lower sides of the opposite surfaces of the front mounting bracket and the rear mounting bracket are provided with multiple groups of slide grooves arranged parallel to each other. The slide grooves on the upper side are adapted to the side edges of the upper cover plate for sliding splicing at the slide grooves. The slide grooves on the lower side are adapted to the side edges of the lower cover plate for sliding splicing at the slide grooves. Both sides of the two groups of side plates are fixedly connected to the front mounting bracket and the rear mounting bracket by bolts respectively. Multiple groups of ventilation holes are evenly arranged on the side plates.

[0007] By adopting the above technical solution, the overall effect is not only to maintain the original size of the heat dissipation block and to leave the internal space unaffected, but also to improve the overall heat dissipation effect.

[0008] The front mounting bracket is provided with a mounting opening corresponding to the connector.

[0009] By adopting the above technical solution, it is convenient to place the connector.

[0010] The rear mounting bracket is also provided with a grounding port.

[0011] By adopting the above technical solution, it is convenient to connect the grounding wire to the device.

[0012] The upper ends of the front mounting bracket and the rear mounting bracket are bent outwardly at 90 degrees, and the lower ends of the front mounting bracket and the rear mounting bracket are bent inwardly in an arc line.

[0013] By adopting the above technical solution, the device can be conveniently fixed on the vehicle body.

[0014] The highest points of the upper cover plate and the lower cover plate, the highest points of the side plate, and the highest points of the front mounting bracket and the rear mounting bracket are on the same horizontal plane, so that the upper end surface of the heat dissipation housing after splicing is a plane.

[0015] By adopting the above technical solution, the upper end surface of the device can be fitted on the vehicle body.

[0016] The bottom end of the lower cover plate, the lowest point of the side plate, and the lowest points of the front mounting bracket and the rear mounting bracket are on the same horizontal plane, so that the lower end surface of the heat dissipation housing after splicing is a plane.

[0017] By adopting the above technical solution, the overall structure of the device can be installed neatly.

[0018] The beneficial effects of the vehicle-mounted mainboard with the heat dissipation structure of the utility model are:

[0019] 1. The vehicle-mounted motherboard with heat dissipation structure not only does not change the size of the original heat dissipation block, so that the internal space is not affected, but also improves the overall heat dissipation effect;

[0020] 2. The overall structural parts are designed to have heat dissipating profiles. The original heat dissipation block of the mainboard is in contact with the profile surface of the equipment to increase its heat dissipation area and better transfer heat. The heat is then transferred out by the heat-conducting teeth of the external profile to take away the heat. There are heat dissipation holes on the sides to facilitate air circulation and improve the internal temperature.

[0021] 3. The upper and lower front and rear structural parts are all profiles, with an overall modular design, simple installation, convenient later maintenance, and can be customized in different specifications and lengths according to customer requirements. BRIEF DESCRIPTION OF THE DRAWINGS

[0022] Figure 1 This is a schematic diagram of the overall structure of the vehicle-mounted mainboard with a heat dissipation structure proposed by the utility model;

[0023] Figure 2Another perspective view of the vehicle mainboard with heat dissipation structure proposed by the utility model;

[0024] Figure 3 This is an exploded first-view diagram of the vehicle-mounted mainboard with a heat dissipation structure proposed by the utility model;

[0025] Figure 4 This is an exploded second viewing angle diagram of the vehicle-mounted mainboard with a heat dissipation structure proposed by the utility model;

[0026] Figure 5 This is an internal exploded view of the vehicle-mounted mainboard with a heat dissipation structure proposed by the utility model.

[0027] In the figure: 1. Main board; 2. Heat sink; 3. Upper cover; 4. Lower cover; 5. Side panel; 6. Front mounting bracket; 7. Rear mounting bracket; 8. Grounding port; 9. Connector. DETAILED DESCRIPTION

[0028] The preferred embodiments of the present invention are described in detail below in conjunction with the accompanying drawings so that the advantages and features of the present invention can be more easily understood by those skilled in the art, thereby making a clearer and more definite definition of the protection scope of the present invention.

[0029] Reference Figure 1-5 A vehicle-mounted motherboard with a heat dissipation structure includes a motherboard 1, a connector 9 installed on the motherboard 1, the connector 9 is used to connect external devices and transmit data, and a heat dissipation block 2 installed at the bottom of the motherboard 1, which is used to provide heat dissipation for the motherboard 1 and is fastened to the motherboard 1 through male and female studs. The motherboard 1 is installed on the inner side of a heat dissipation housing, and the heat dissipation housing is surrounded by an upper cover plate 3 and a lower cover plate 4 respectively arranged on the upper and lower sides thereof, a front mounting bracket 6 and a rear mounting bracket 7 arranged on the front and rear ends thereof, and a side plate 5 arranged on the left and right sides thereof. The outer sides of the upper cover plate 3 and the lower cover plate 4 are both distributed with evenly arranged heat dissipation teeth, and the upper and lower sides of the opposite surfaces of the front mounting bracket 6 and the rear mounting bracket 7 are The sides are provided with multiple groups of slide grooves arranged parallel to each other. The slide grooves on the upper side are adapted to the side edges of the upper cover plate 3 and are slidably spliced ​​at their slide grooves. The slide grooves on the lower side are adapted to the side edges of the lower cover plate 4 and are slidably spliced ​​at their slide grooves. Both sides of the two groups of side panels 5 are fixedly connected to the front mounting bracket 6 and the rear mounting bracket 7 by bolts respectively. The rear mounting bracket 7 is also provided with a grounding port 8 for connecting a grounding wire. The front mounting bracket 6 is provided with a mounting port corresponding to the connector 9. The upper ends of the front mounting bracket 6 and the rear mounting bracket 7 are bent outwardly at 90 degrees, and the lower ends of the front mounting bracket 6 and the rear mounting bracket 7 are bent inwardly in an arc line. Multiple groups of ventilation holes are evenly arranged on the side panels 5.

[0030] The heat dissipation teeth of the upper cover plate 3 are installed in contact with the vehicle body to transfer heat; the heat dissipation teeth of the lower cover plate 4 take away heat through the circulation of external air; the highest points of the upper cover plate 3 and the lower cover plate 4, the highest point of the side plate 5, and the highest points of the front mounting bracket 6 and the rear mounting bracket 7 are on the same horizontal plane, so that the upper end surface of the heat dissipation shell after splicing is flat.

[0031] The bottom end of the lower cover plate 4, the lowest point of the side plate 5, and the lowest points of the front mounting bracket 6 and the rear mounting bracket 7 are on the same horizontal plane, so that the lower end surface of the heat dissipation housing after splicing is a plane.

[0032] The mainboard 1 is used to provide power and power management for the device; data transmission and control; scalability and compatibility; hardware support and coordination; the mainboard 1 is fastened to the inside of the heat dissipation housing by screws;

[0033] The front mounting bracket 6 has a mounting hole, which is a waist-shaped hole, which is convenient for adjustment and can be fixed on the vehicle body;

[0034] Similarly, there are also mounting holes on the rear mounting bracket 7, which are waist-shaped holes, which are easy to adjust and can be fixed on the vehicle body;

[0035] The side panel 5 is designed with ventilation holes, which can form air convection on both sides to take away some of the heat in the device; the side panel 5 is installed on the front mounting bracket 6 and the rear mounting bracket 7 through mounting nails;

[0036] It should be noted that: according to the different motherboard specifications and models, the required operating temperature can be calculated to design the required heat dissipation tooth specifications to meet its heat dissipation conditions, form product modularity, and make it more applicable.

[0037] The above-mentioned embodiments only express several implementation methods of the utility model, and the description is relatively specific and detailed, but it cannot be understood as limiting the scope of the utility model patent. It should be pointed out that for ordinary technicians in this field, several modifications and improvements can be made without departing from the concept of the utility model, which all belong to the protection scope of the utility model.

Claims

1. A vehicle-mounted mainboard with a heat dissipation structure, comprising a mainboard (1), a connector (9) mounted on the mainboard (1), and a heat dissipation block (2) mounted on the bottom of the mainboard (1), characterized in that: The mainboard (1) is mounted on the inner side of the heat dissipation shell, which is enclosed by an upper cover plate (3) and a lower cover plate (4) respectively arranged at the upper and lower parts thereof, a front mounting bracket (6) and a rear mounting bracket (7) arranged at the front and rear ends thereof, and side plates (5) arranged at the left and right sides thereof. The outer sides of the upper cover plate (3) and the lower cover plate (4) are both provided with evenly arranged heat dissipation teeth. The upper and lower sides of the opposite surfaces of the front mounting bracket (6) and the rear mounting bracket (7) are provided with a plurality of groups of slide grooves arranged parallel to each other. The slide grooves located on the upper side are adapted to be slidably spliced ​​at the side edges of the upper cover plate (3), and the slide grooves located on the lower side are adapted to be slidably spliced ​​at the side edges of the lower cover plate (4). Both sides of the two groups of side plates (5) are respectively fixedly connected to the front mounting bracket (6) and the rear mounting bracket (7) by bolts, and a plurality of groups of ventilation holes are evenly arranged on the side plates (5).

2. The vehicle-mounted mainboard with a heat dissipation structure according to claim 1, characterized in that: The front mounting bracket (6) is provided with a mounting opening corresponding to the connector (9).

3. The vehicle-mounted mainboard with a heat dissipation structure according to claim 2, characterized in that: The rear mounting bracket (7) is also provided with a grounding port (8).

4. The vehicle-mounted mainboard with a heat dissipation structure according to claim 3, characterized in that: The upper ends of the front mounting bracket (6) and the rear mounting bracket (7) are bent outward at 90 degrees, and the lower ends of the front mounting bracket (6) and the rear mounting bracket (7) are bent inwardly in an arc line.

5. The vehicle-mounted mainboard with a heat dissipation structure according to claim 4, characterized in that: The highest points of the upper cover plate (3) and the lower cover plate (4), the highest points of the side plate (5), and the highest points of the front mounting bracket (6) and the rear mounting bracket (7) are on the same horizontal plane, so that the upper end surface of the heat dissipation housing after splicing is a plane.

6. The vehicle-mounted mainboard with a heat dissipation structure according to claim 5, characterized in that: The bottom end of the lower cover plate (4), the lowest point of the side plate (5), and the lowest points of the front mounting bracket (6) and the rear mounting bracket (7) are on the same horizontal plane, so that the lower end surface of the heat dissipation housing after splicing is a plane.

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