Heat dissipation device for electronic equipment and electronic equipment

Abstract

The utility model relates to the technical field of heat dissipation of electronic equipment, in particular to a heat dissipation device for electronic equipment, which comprises a first cover piece, a second cover piece and a heat dissipation device, a second cover member connected to the first cover member to form a flow space through which the cooling fluid flows; the turbulent flow piece is arranged in the flowing space and is connected with the first cover piece and the second cover piece respectively; and the additional turbulent flow structure is arranged in the flowing space and comprises a first turbulent flow part arranged between the first cover piece and the turbulent flow piece and / or a second turbulent flow part arranged between the second cover piece and the turbulent flow piece. The utility model further relates to electronic equipment. According to some exemplary embodiments of the utility model, the additional turbulent flow structure is additionally arranged on the turbulent flow piece in the flowing space of the cooling fluid in the heat dissipation device, so that the contact area between the cooling fluid and the internal structure of the heat dissipation device is increased, the cooling fluid can take away more heat and form turbulent flow beneficial to heat dissipation, and the heat dissipation efficiency is improved. Therefore, the heat dissipation effect is improved.

Description

Technical Field

[0001] The utility model relates to the technical field of heat dissipation of electronic equipment, in particular to a heat dissipation device for electronic equipment and an electronic equipment. Background Art

[0002] With the rapid development of electronic technology, power modules represented by inverters and current converters are increasingly tending towards high power and miniaturization. These power modules will generate a large amount of heat when working. If the heat cannot be removed in a timely and effective manner, the temperature of the device will rise sharply, which will not only reduce the working efficiency, but also may cause device failure, seriously affecting the reliability and service life of the power module. Therefore, higher and higher requirements are put forward for the heat dissipation technology of such power modules as electronic equipment. To this end, the heat dissipation device of the prior art usually sets a spoiler with a specific shape in the flow space of the cooling fluid, which is used to increase the contact area with the cooling fluid on the one hand, and to form turbulence of the cooling fluid on the other hand, so as to take away as much heat as possible. However, due to the molding process and other reasons, this spoiler leaves a lot of partial space to allow the cooling fluid to flow directly to a certain extent. These partial spaces may reduce the heat dissipation efficiency and cannot meet the stringent heat dissipation requirements of power modules with high power density.

[0003] Therefore, there is still a practical need for further improvement in the structure of heat dissipation devices for electronic devices. Utility Model Content

[0004] In view of this, an object of the present invention is to provide an improved heat dissipation device for electronic equipment and an improved electronic equipment, so as to at least solve at least part of the problems in the prior art and / or overcome other possible disadvantages not mentioned herein.

[0005] According to a first aspect of the utility model, a heat dissipation device for an electronic device is provided, the heat dissipation device comprising: a first cover member, the first cover member being configured to be connected to the electronic device to receive heat from the electronic device; a second cover member, the second cover member being configured to be located on a side of the first cover member facing away from the electronic device in an assembled state and being connected to the first cover member to form a flow space for a cooling fluid to flow through; and a spoiler member arranged in the flow space, the spoiler member being configured to be respectively connected to the first cover member and the second cover member in an assembled state; and an additional spoiler structure arranged in the flow space, the additional spoiler structure comprising a first spoiler portion arranged between the first cover member and the spoiler and / or a second spoiler portion arranged between the second cover member and the spoiler.

[0006] According to an optional embodiment of the present utility model, the first spoiler is configured as a protrusion extending from the first cover toward the spoiler.

[0007] According to an optional embodiment of the present invention, the second spoiler is configured as a protrusion extending from the second cover toward the spoiler.

[0008] According to an optional embodiment of the present utility model, the first spoiler is formed integrally with the first cover.

[0009] According to an optional embodiment of the present invention, the second spoiler is formed integrally with the second cover.

[0010] According to an optional embodiment of the present invention, the second spoiler is connected to a connecting portion between the spoiler and the first cover.

[0011] According to an optional embodiment of the present invention, the first spoiler is configured as a cylinder with a diameter of 1 mm to 1.5 mm.

[0012] According to an optional embodiment of the present invention, the second spoiler is configured as a cylinder with a diameter of 1 mm to 1.5 mm.

[0013] According to an optional embodiment of the present utility model, the spoiler is configured as a wave-shaped spoiler having a plurality of concave cavities.

[0014] According to an optional embodiment of the present invention, the spoiler has a plurality of arrangements extending along a width direction perpendicular to the flow direction of the cooling fluid, and the arrangements are staggered in the flow direction of the cooling fluid.

[0015] According to an optional embodiment of the present invention, the spoiler is a stamped metal part.

[0016] According to an optional embodiment of the present invention, the cooling fluid is cooling liquid.

[0017] According to an optional embodiment of the present invention, the first cover member, the spoiler and the second cover member are fixedly connected by brazing.

[0018] According to an optional embodiment of the present utility model, the additional spoiler structure is located in at least a portion of the concave cavity of the spoiler.

[0019] According to an optional embodiment of the present utility model, the additional spoiler structure is staggered in the flow direction of the cooling fluid.

[0020] According to an optional embodiment of the present utility model, the additional spoiler structures are arranged in a width direction perpendicular to a flow direction of the cooling fluid.

[0021] According to an optional embodiment of the present utility model, the additional spoiler structure is made of metal material.

[0022] According to an optional embodiment of the present utility model, the additional spoiler structure is configured to be spaced apart from two opposite side edge sections of the spoiler that bound the concave cavity in the concave cavity.

[0023] According to an optional embodiment of the present utility model, the additional spoiler structure is configured to occupy at least two-thirds of the height of the cavity.

[0024] According to an optional embodiment of the present utility model, the heat dissipation device further includes a flow blocking portion provided in a connection area between the first cover member and the second cover member.

[0025] According to an optional embodiment of the utility model, the heat dissipation device has an inlet area and an outlet area for cooling fluid to enter and exit the flow space, wherein the number and / or density of the additional spoiler structures in the outlet area is greater than that in the inlet area.

[0026] According to an optional embodiment of the present utility model, the electronic device has a heat-generating component, and the additional spoiler structure is located at least in a heat-generating area where the heat-generating component is located.

[0027] According to an optional embodiment of the present utility model, the baffle portion is configured to protrude from the first cover toward the flow space.

[0028] According to an optional embodiment of the present utility model, the baffle portion is configured as a baffle strip extending in the flow direction of the cooling fluid.

[0029] According to an optional embodiment of the present utility model, the baffle portion has a shape adapted to a cavity formed in a connection area between the first cover member and the second cover member.

[0030] According to an optional embodiment of the present utility model, the baffle portion is formed integrally with the first cover member.

[0031] According to an optional embodiment of the present utility model, the baffle portion extends through the entire flow space in the flow direction of the cooling fluid.

[0032] According to a second aspect of the present invention, an electronic device is provided. The electronic device comprises the heat dissipation device for electronic device provided by any optional embodiment of the first aspect.

[0033] According to an optional embodiment of the present invention, the electronic device is configured as an inverter or a DCDC converter.

[0034] According to certain exemplary embodiments of the utility model, by adding an additional spoiler structure to the spoiler in the flow space of the cooling fluid inside the heat dissipation device, the contact area between the cooling fluid and the internal structure of the heat dissipation device is increased, which helps the cooling fluid to take away more heat and form turbulence that is beneficial to heat dissipation, thereby improving the heat dissipation effect. BRIEF DESCRIPTION OF THE DRAWINGS

[0035] The present invention will be described in more detail below with reference to the accompanying drawings, so that the principles, features and advantages of the present invention can be better understood. The accompanying drawings include:

[0036] Figure 1 A schematic perspective view of an electronic device having a heat dissipation device according to an exemplary embodiment of the present utility model is shown;

[0037] Figure 2 Shown along Figure 1 A schematic cross-sectional view taken along the cutting line AA shown;

[0038] Figure 3 An exploded view of a heat dissipation device according to an exemplary embodiment of the present utility model is shown;

[0039] Figure 4 Shows Figure 3 B is a partial enlarged view shown;

[0040] Figure 5 Shown along Figure 1 A cutaway perspective view of the heat sink taken along the cutting line AA, wherein the electronic device is not shown;

[0041] Figure 6 Shows Figure 5 The enlarged view of the C part is shown;

[0042] Figure 7 Shows Figure 6 A simplified diagram of the invention, wherein no additional spoiler structure is shown;

[0043] Figure 8 Shows Figure 6 A simplified diagram of a first spoiler portion of the additional spoiler structure is shown;

[0044] Fig. 9 Shows Figure 6 A simplified diagram of a second spoiler portion of the additional spoiler structure is shown;

[0045] Fig.10 Shows Figure 6 A simplified diagram of a first spoiler and a second spoiler of an additional spoiler structure is shown;

[0046] Fig.11A perspective view showing a first cover of a heat dissipation device according to an exemplary embodiment of the present utility model; and

[0047] Fig.12 Shows Figure 5 A partial enlarged view of D is shown.

[0048] Reference numerals:

[0049] 2000: electronic device; 2001: heat-generating component; 1000: heat dissipation device; 101: flow space; 102: inlet area; 103: outlet area; 104: heat-generating area; 10: connection area; 20: cavity; 100: first cover; 200: second cover; 300: spoiler; 310: concave cavity; 311: side section; 301: connection part; 400: additional spoiler structure; 410: first spoiler; 420: second spoiler; 500: baffle; x: length direction; y: width direction; z: thickness direction; R: flow direction. DETAILED DESCRIPTION

[0050] In order to make the technical problems, technical solutions and beneficial technical effects to be solved by the present invention more clearly understood, the present invention will be further described in detail in conjunction with the accompanying drawings and multiple exemplary embodiments. It should be understood that the specific embodiments described herein are only used to explain the present invention, rather than to limit the scope of protection of the present invention, and that the various embodiments may share the same view or multiple views for description, but all features appearing in the same view cannot be interpreted as features that must be possessed by an embodiment.

[0051] First, for ease of understanding, the description in the background technology section of the utility model can be reviewed or recalled. One of the purposes of the utility model is to provide a heat dissipation device for an electronic device, the heat dissipation device comprising: a first cover member, the first cover member is configured to be connected to the electronic device to receive heat from the electronic device; a second cover member, the second cover member is configured to be located on the side of the first cover member away from the electronic device in an assembled state and connected to the first cover member to form a flow space for a cooling fluid to flow through; and a spoiler member provided in the flow space, the spoiler member is configured to be connected to the first cover member and the second cover member respectively in an assembled state; and an additional spoiler structure provided in the flow space, the additional spoiler structure comprising a first spoiler portion provided between the first cover member and the spoiler member and / or a second spoiler portion provided between the second cover member and the spoiler member. Thus, by adding an additional spoiler structure to the spoiler member in the flow space of the cooling fluid inside the heat dissipation device, the contact area between the cooling fluid and the internal structure of the heat dissipation device is increased, which helps the cooling fluid to take away more heat and form turbulence that is conducive to heat dissipation, thereby improving the heat dissipation effect.

[0052] Exemplary embodiments of the present utility model will be described below with reference to the accompanying drawings.

[0053] Figure 1 A schematic three-dimensional diagram of an electronic device 2000 having a heat dissipation device 1000 according to an exemplary embodiment of the utility model is shown. Here, the electronic device 2000 can be configured as an inverter, for example, for converting the direct current output by the battery pack of an electric vehicle into the alternating current required by the motor. The electronic device 2000 can also be configured as a DCDC converter, for example, for converting the low-voltage direct current generated by the battery stack of a hydrogen fuel cell system into high-voltage direct current. Optionally, the electronic device 2000 can also be configured as other electronic devices or power modules that require heat dissipation or cooling. Figure 1 As shown in the exemplary embodiment, the electronic device 2000 is closely attached to the heat sink 1000, especially welded, so as to transfer the heat generated by the electronic device 2000 when working to the heat sink 1000, whereby the cooling fluid flowing inside the heat sink 1000 takes away the heat, thereby achieving the effect of cooling the electronic device 2000. Here, the cooling fluid is a liquid or gas that has a cooling effect, but is preferably a coolant. Figure 1 The flow direction R of the cooling fluid is shown by way of example. Figure 1 The xyz coordinate system is also exemplarily provided in the following figures as a reference, wherein x represents the length direction of the heat sink 1000, y represents the width direction of the heat sink 1000, and z represents the thickness direction of the heat sink 1000. In the simplified example, the flow direction R of the cooling fluid coincides with the length direction x of the heat sink 1000, and the heat dissipation direction of the heat from the electronic device 2000 in the vertical direction coincides with the thickness direction z of the heat sink 1000.

[0054] Figure 2 Shown along Figure 1 Schematic cross-sectional view of the section line AA shown. Figure 2 As shown, the heat dissipation device 1000 includes a first cover 100 and a second cover 200. In the assembled state, the first cover 100 is connected to the electronic device 2000 to absorb the heat generated by it, and the second cover 200 is connected to the first cover 100 to form a flow space 101 for the cooling fluid to flow through. The heat dissipation device 1000 also includes a spoiler 300 located in the flow space 101, and the spoiler 300 is respectively connected to the first cover 100 and the second cover 200 to form a fixed structure. Preferably, the first cover 100, the spoiler 300 and the second cover 200 are fixedly connected by brazing, which is not only conducive to improving the overall strength of the heat dissipation device 1000, but also ensures the sealing of the flow space to avoid leakage of the cooling fluid.

[0055] Figure 3 FIG. 1 shows an exploded view of a heat dissipation device 1000 according to an exemplary embodiment of the present utility model. Figure 3 Combination Figure 2 As shown, the heat dissipation device 100 further includes an additional spoiler structure 400 disposed in the flow space 101. Figure 3 The first spoiler 410 is exemplarily provided between the first cover 100 and the spoiler 300. Figure 3 In an embodiment not shown, the additional spoiler structure 400 may also include a second spoiler portion 420 disposed between the second cover 200 and the spoiler 300 (for this, see the following description). Fig. 9 and Fig.10 By adding an additional spoiler structure 400 between the first cover 100 and the spoiler 300 and / or between the second cover 200 and the spoiler 300, the contact area with the cooling fluid can be significantly increased, forming a favorable turbulence, thereby enhancing the heat dissipation effect.

[0056] Figure 4 Shows Figure 3 B is a partial enlarged view shown; Figure 5 Shown along Figure 1 The cutaway perspective view of the heat dissipation device 1000 cut along the cutting line AA is shown, wherein the electronic device 2000 is not shown; Figure 6 Shows Figure 5 The enlarged view of the C part is shown; Figure 7 Shows Figure 6 A simplified diagram of the invention, wherein the additional spoiler structure 400 is not shown; Figure 8 Shows Figure 6 A simplified diagram of the invention, wherein a first spoiler 410 of the additional spoiler structure 400 is shown; Fig. 9 Shows Figure 6 A simplified diagram showing a second spoiler 420 of the additional spoiler structure 400; Fig.10 Shows Figure 6 4 , which shows a first spoiler 410 and a second spoiler 420 of an additional spoiler structure 400 .

[0057] like Figure 3 and Figure 4 As shown, the spoiler 300 is preferably constructed as a wavy spoiler extending in the entire flow space 101. The wavy spoiler may have multiple arrangements along the width direction y, and these arrangements are staggered in the flow direction R of the cooling fluid (i.e., the length direction x of the heat sink 1000). To achieve this arrangement, for example, a metal plate with a high thermal conductivity can be stamped, but due to the limitations of the stamping process, the spoiler 300 itself cannot form a particularly high-density spoiler shape, but has a shape such as Figure 7 The plurality of concave cavities 310 shown in FIG. Figure 7 The yz plane shown may have a width of about 3 mm and a height of about 3 mm. As described in the background art, such a space that allows the cooling fluid to flow directly through without any obstruction will greatly reduce the heat dissipation efficiency. Figures 8 to 10 As shown, the first spoiler 410 and / or the second spoiler 420 of the additional spoiler structure 400 may be located in at least part of the concave cavities 310 of the spoiler 300, thereby increasing the contact area with the cooling fluid in the concave cavities 310 and improving the heat dissipation efficiency. Corresponding to the arrangement of the concave cavities 310, the additional spoiler structure 400 is preferably also arranged in a staggered manner in the flow direction R of the cooling fluid and arranged in the width direction y. In order to better transfer heat, the additional spoiler structure 400 is preferably also made of a metal material.

[0058] like Figure 8 As shown, the first spoiler 410 is configured as a protrusion extending from the first cover 100 toward the spoiler 300. Here, since the first cover 100 is directly connected to the heat-generating electronic device 2000, the first spoiler 410 can fully absorb the heat transferred from the first cover 100 and make the cooling fluid flowing through form turbulence, thereby enhancing the heat dissipation effect. Preferably, the first spoiler 410 is formed integrally with the first cover 100, for example, the first spoiler 410 can be directly welded to the first cover 100, or the first cover 100 itself forms these first spoilers 410 through a cold forging process, so as to reduce the assembly links and improve the connection strength and heat transfer performance between the first spoiler 410 and the first cover 1100. Further preferably, the first spoiler 410 is configured as a cylinder with a diameter of 1 mm to 1.5 mm. This structure similar to a pin not only has a simple manufacturing process, but also is conducive to forming a stable turbulence. Optionally, the first spoiler 410 may also have a cross section other than a circle, such as an ellipse, a diamond, a teardrop, etc. Figure 8 It can also be seen that the first spoiler 410 as an additional spoiler structure 400 occupies at least two-thirds of the height of the cavity 310 and is spaced apart from the two opposite side sections 311 of the spoiler 300 that limit the cavity 310 within the cavity 310. The gap formed thereby facilitates the cooling fluid to pass through and contact the first spoiler 410 and the spoiler 300 at the same time, thereby advantageously taking away more heat. Figure 8Two optional configurations of the first spoiler 410 are shown by way of example, that is, the first spoiler 410 may be connected to the spoiler 300 or may not be connected to the spoiler 300. Here, from the vertical heat transfer direction (that is, the thickness direction z), the heat generated by the electronic device 2000 during operation is transferred from top to bottom through the first cover 100 to the inside of the heat dissipation device 1000. Specifically, the heat is first conducted from the first cover 100 to the first spoiler 410 connected thereto, and then diffused downward from the first spoiler 410 to the coolant. Therefore, even if the first spoiler 410 is not connected to the spoiler 300, that is, the first spoiler 410 is only suspended on the first cover 100, since the first spoiler 410 is directly connected to the first cover 100 close to the heat source, it can still achieve a good heat dissipation effect.

[0059] like Fig. 9 As shown, similar to the first spoiler 410 , the second spoiler 420 is configured as a protrusion extending from the second cover 200 toward the spoiler 300 and is preferably integrally formed with the second cover 200 , and may also have a shape and molding method similar to the first spoiler 410 . Fig. 9 The figure also exemplarily shows two optional configurations of the second spoiler 420, that is, the second spoiler 420 may be connected to the spoiler 300 or may not be connected to the spoiler 300. However, unlike the first spoiler 410, since the spoiler 300 itself is connected to the first cover 100, the spoiler 300 often also absorbs a large amount of heat from the electronic device 2000. Therefore, the second spoiler 420 is preferably connected to the connecting portion 301 where the spoiler 300 is connected to the first cover 100, so that the heat absorbed therein can be further transferred to the cooling fluid, thereby improving the heat dissipation efficiency.

[0060] Fig.10 The configuration in which the first spoiler 410 and the second spoiler 420 as the additional spoiler structure 400 are simultaneously located in the multiple concave cavities 310 of the spoiler 300 is shown. In an optional embodiment, the second spoiler 420 can also be provided between the second cover 200 and the spoiler 300 by welding to the spoiler 300 (particularly the connecting portion 301 connecting the spoiler 300 and the first cover 100).

[0061] Fig.11 A perspective view of a first cover 100 of a heat dissipation device 1000 according to an exemplary embodiment of the present utility model is shown; Fig.12 Shows Figure 5 A partial enlarged view of D is shown.

[0062] like Fig.11As shown, the heat sink 1000 has an inlet area 102 and an outlet area 103 for the cooling fluid to enter and exit the flow space 101. Here, compared with the inlet area 102, the number and / or density of the additional spoiler structure 400 in the outlet area 103 is greater. That is to say, fewer and sparse additional spoiler structures 400 are arranged in the inlet area 102, or even no additional spoiler structure 400 is arranged at all, and it is sufficient to use only the spoiler heat dissipation effect of the spoiler 300 itself. In contrast, since the cooling fluid flowing through the outlet area 103 has absorbed a lot of heat in the inlet area 102 and the middle area, the cooling fluid itself has a higher temperature at this time, so the heat transfer temperature difference is small and the heat dissipation difficulty is large. By adding an additional spoiler structure 400 in the outlet area 103, the heat dissipation of the rear section of the heat sink 1000 can be strengthened in a targeted manner to improve the problem of uneven heat dissipation.

[0063] exist Fig.11 The dashed lines schematically show Figure 2 The heat-generating areas 104 where the heat-generating components 2001 (such as heat sources such as chips) of the electronic device 2000 shown are located, and the additional spoiler structure 400 is preferably located at least in these heat-generating areas 104. This is because the heat of the heat-generating components 2001 is concentrated and the heat dissipation requirement is higher. By adding the additional spoiler structure 400 in the corresponding heat-generating areas 104, targeted heat dissipation can be achieved, thereby improving the overall heat dissipation effect.

[0064] like Fig.11 Combination Figure 5 and Fig.12 As shown, the heat sink 1000 further includes a baffle 500 disposed in the connection region 10 between the first cover 100 and the second cover 200. Here, the baffle 500 is preferably configured to protrude from the first cover 100 toward the flow space 101, and is further preferably configured to be a baffle bar extending through the entire flow space 101 in the flow direction R of the cooling fluid. Fig.12 As shown in the exemplary embodiment, the baffle 500 is formed integrally with the first cover 100 and preferably has a shape adapted to the cavity 20 formed in the connection area 10 between the first cover 100 and the second cover 200. Here, the baffle 500 has a triangular cross-section as an example. Thus, the baffle 500 blocks the unimpeded flow of the cooling fluid in the cavity 20 formed in the connection area 10, thereby extending the flow path of the cooling fluid and increasing the contact area of ​​the cooling fluid, thereby making full use of the limited cooling fluid for heat dissipation, and further improving the heat dissipation efficiency of the heat dissipation device 1000.

[0065] exist Fig.12In the exemplary embodiment shown, the baffle 500 and the first spoiler 410 as the additional spoiler structure 400 are integrally formed on the first cover 100, which simplifies the manufacturing process to a certain extent. Fig.12 and Figure 6 Combination Figure 5 It can also be seen that the staggered arrangement of the additional spoiler structures 400 in the flow direction R of the cooling fluid (that is, the length direction x of the heat sink 1000) forms a tortuous flow path for the cooling fluid and generates turbulence when passing through the structural gaps, thereby enhancing the heat exchange between the cooling fluid and the various wall surfaces of the heat sink 1000, thereby improving the heat dissipation efficiency.

[0066] Other advantages and alternative embodiments of the present invention are obvious to those skilled in the art. Therefore, the present invention is not limited to the specific details, representative structures and exemplary embodiments shown and described in its broader sense. Various modifications and substitutions can be made by those skilled in the art without departing from the basic spirit and scope of the present invention.

Claims

1. A heat dissipation device for electronic equipment, characterized in that: The heat dissipation device (1000) comprises: A first cover member (100), the first cover member (100) being configured to be connected to the electronic device (2000) to receive heat from the electronic device (2000); a second cover member (200), the second cover member (200) being configured to be located on a side of the first cover member (100) facing away from the electronic device (2000) in an assembled state and connected to the first cover member (100) to form a flow space (101) for a cooling fluid to flow through; and a spoiler (300) disposed in the flow space (101), the spoiler (300) being configured to be respectively connected to the first cover (100) and the second cover (200) in an assembled state; and An additional spoiler structure (400) is provided in the flow space (101), wherein the additional spoiler structure (400) comprises a first spoiler portion (410) provided between the first cover member (100) and the spoiler (300) and / or a second spoiler portion (420) provided between the second cover member (200) and the spoiler (300).

2. The heat dissipation device for electronic equipment according to claim 1, characterized in that: The first spoiler (410) is configured as a protrusion extending from the first cover (100) toward the spoiler (300); and / or The second spoiler (420) is configured as a protrusion extending from the second cover (200) toward the spoiler (300).

3. The heat dissipation device for electronic equipment according to claim 2, characterized in that: The first spoiler (410) is formed integrally with the first cover (100); and / or The second spoiler (420) is formed integrally with the second cover (200); and / or The second spoiler (420) is connected to the connecting portion (301) between the spoiler (300) and the first cover (100); and / or The first spoiler (410) is configured as a cylinder having a diameter of 1 mm to 1.5 mm; and / or The second spoiler (420) is configured as a cylinder having a diameter of 1 mm to 1.5 mm.

4. The heat dissipation device for electronic equipment according to any one of claims 1 to 3, characterized in that: The spoiler (300) is configured as a wave-shaped spoiler having a plurality of concave cavities (310); and / or The spoiler (300) has a plurality of arrangements extending along a width direction (y) perpendicular to a flow direction (R) of the cooling fluid, and the arrangements are staggered in the flow direction (R) of the cooling fluid; and / or The spoiler (300) is a stamped metal part; and / or The cooling fluid is a cooling liquid; and / or The first cover member (100), the spoiler (300) and the second cover member (200) are fixedly connected by brazing.

5. The heat dissipation device for electronic equipment according to claim 4, characterized in that: The additional spoiler structure (400) is located in at least a portion of the cavity (310) of the spoiler (300); and / or The additional spoiler structure (400) is arranged in a staggered manner in the flow direction (R) of the cooling fluid; and / or The additional spoiler structures (400) are arranged in a width direction (y) perpendicular to the flow direction (R) of the cooling fluid; and / or The additional spoiler structure (400) is made of metal material.

6. The heat dissipation device for electronic equipment according to claim 5, characterized in that: The additional spoiler structure (400) is configured to be spaced apart from two opposite side sections (311) of the spoiler (300) that bound the concave cavity (310) within the concave cavity (310); and / or The additional spoiler structure (400) is configured to occupy at least two-thirds of the height of the cavity (310); and / or The heat dissipation device (1000) further comprises a flow blocking portion (500) provided in a connection area (10) between the first cover member (100) and the second cover member (200); and / or The heat dissipation device (1000) has an inlet area (102) and an outlet area (103) for cooling fluid to enter and exit the flow space (101), wherein the number and / or density of the additional spoiler structures (400) in the outlet area (103) is greater than that in the inlet area (102); and / or The electronic device (2000) has a heat generating component (2001), and the additional spoiler structure (400) is located at least in a heat generating area (104) where the heat generating component (2001) is located.

7. The heat dissipation device for electronic equipment according to claim 6, characterized in that: The flow blocking portion (500) is configured to protrude from the first cover member (100) toward the flow space (101); and / or The baffle portion (500) is configured as a baffle strip extending in the flow direction (R) of the cooling fluid; and / or The baffle (500) has a shape adapted to a cavity (20) formed in a connection area (10) between the first cover member (100) and the second cover member (200).

8. The heat dissipation device for electronic equipment according to claim 7, characterized in that: The baffle (500) is formed integrally with the first cover (100); and / or The baffle (500) extends through the entire flow space (101) in the flow direction (R) of the cooling fluid.

9. An electronic device, characterized in that: The electronic device (2000) comprises the heat dissipation device for electronic devices according to any one of claims 1 to 8.

10. The electronic device according to claim 9, characterized in that: The electronic device (2000) is configured as an inverter or a DCDC converter.

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