Circuit board and heat dissipation device for circuit board

Abstract

The utility model relates to the technical field of circuit boards, and discloses a circuit board and a heat dissipation device used for the circuit board. The circuit board assembly comprises a substrate, a top layer fixedly arranged above the substrate, a plurality of components fixedly arranged on the top layer, cooling fins fixedly arranged in the substrate and extending out of the left side and the right side of the substrate, and installation assemblies arranged on the front side and the rear side of the substrate, and a heat conduction material is added in the substrate. The heat dissipation device comprises a bottom plate, heat dissipation boxes arranged above the bottom plate in a sliding mode and located on the left side and the right side of the substrate, and fans fixedly arranged on the front side and the rear side of the heat dissipation boxes, and heat dissipation fins are inserted into heat dissipation grooves and located in the heat dissipation boxes. The circuit board provided by the utility model has the beneficial effects of rapid heat dissipation and dust accumulation prevention, and solves the problem that the temperature is easy to be too high when the circuit board works in a closed and high-temperature environment. And when the fan blows air, dust is also blown to the circuit board, and when too much dust is accumulated for a long time in the past, the circuit board is easy to break down.

Description

Technical Field

[0001] The utility model relates to the technical field of circuit boards, in particular to a circuit board and a heat dissipation device used for the circuit board. Background Art

[0002] Circuit board, also known as printed circuit board, is one of the important components of the electronics industry and is the carrier for the electrical connection of electronic components. Almost every electronic device, from electronic watches and calculators to computers, communication electronic equipment, and military weapon systems, as long as there are electronic components such as integrated circuits, must use circuit boards to make electrical connections between various components.

[0003] Existing circuit boards are usually set up as an integral structure, and the heat dissipation performance is relatively average. When the circuit board works in a closed and high temperature environment, it is easy to cause the problem of overheating. Existing heat dissipation devices for circuit boards usually use fans for heat dissipation. When the fan is directly aimed at the circuit board for heat dissipation, the fan will blow dust onto the circuit board when blowing. If the dust accumulates too much in the long run, it will cause the circuit board to easily malfunction. Utility Model Content

[0004] The purpose of the utility model is to provide a circuit board and a heat dissipation device for the circuit board to solve the problems raised in the above background technology.

[0005] To achieve the above-mentioned purpose, the utility model provides the following technical solutions: a circuit board and a heat dissipation device for the circuit board, comprising a circuit board assembly and a heat dissipation device, characterized in that: the circuit board assembly comprises a substrate, a top layer fixedly arranged above the substrate, a plurality of components fixedly arranged on the top layer, heat sinks fixedly arranged inside the substrate and extending out of the left and right sides of the substrate, and a mounting assembly arranged on the front and back sides of the substrate, a heat-conducting material is added inside the substrate, the heat dissipation device comprises a bottom plate, a heat dissipation box slidably arranged above the bottom plate and located on the left and right sides of the substrate, and a fan fixedly arranged on the front and back sides of the heat dissipation box, the substrate is connected to the bottom plate through the mounting assembly, a heat dissipation groove is opened on a side wall of the heat dissipation box facing the substrate, and the heat dissipation fin is inserted into the heat dissipation groove and is located inside the heat dissipation box.

[0006] Preferably, the mounting assembly includes a mounting plate located below the substrate, a splicing block fixedly disposed on a side of the mounting plate away from the substrate, and a fixing plate fixedly disposed on the splicing block, and the mounting plate and the fixing plate are fixedly connected to the substrate and the bottom plate respectively by screws.

[0007] Preferably, the installation assembly also includes a buckle, a slot matching the buckle is provided on the top wall of the splicing block, a receiving groove penetrating the bottom wall is provided on the side wall of the splicing block away from the base plate, the buckle is located inside the receiving groove and is rotatably connected to the splicing block through a rotating shaft, an iron sheet is fixedly provided on the side wall of the receiving groove close to the base plate, and magnets are fixedly provided on the front and rear side walls of the buckle.

[0008] Preferably, a slide bar is fixedly provided below the heat dissipation box, a slide groove matching the slide bar is provided on the top wall of the bottom plate, and the slide bar is inserted into the slide groove to be slidably connected with the bottom plate.

[0009] Preferably, an anti-slip strip is fixedly provided below the slide bar, the width of the anti-slip strip is greater than the width of the slide bar, an anti-slip groove penetrating the slide groove and matching the anti-slip strip is opened inside the bottom plate, and the anti-slip strip is inserted into the anti-slip groove and slidably connected to the bottom plate.

[0010] Preferably, a ventilation slot is provided on a wall of the heat dissipation box away from the base plate.

[0011] Preferably, the thermally conductive material is one of aluminum oxide and silicon nitride, and the heat sink is one of aluminum sheet and copper sheet.

[0012] The beneficial effects of the utility model are as follows: when the utility model is used, the heat sink is first slid to move it to the edge of the bottom plate to make room for the installation of the substrate, the fixing plate is fixedly connected to the bottom plate by screws, and then the substrate is fixedly connected to the mounting plate by screws to complete the installation of the substrate, the heat sink is slid to move toward the substrate, the heat sink is inserted into the heat sink groove and is located inside the heat sink, and the fan is started to blow air to the heat sink to dissipate heat, which plays a role in rapid heat dissipation, and because the heat sink extends out of the left and right sides of the substrate and the heat sink is located inside the heat sink, the heat sink will not be blown directly to the components when blowing air to dissipate heat, which plays a role in preventing dust The function of stacking; when multiple circuit boards need to be installed, place another mounting plate on top of the mounting plate, insert the buckle on another splicing block into the slot on the splicing block and snap it together with the splicing block to complete the splicing of the mounting plate, and fix another substrate with another mounting plate to complete the installation of multiple circuit boards, and then insert the heat sinks on multiple substrates into the corresponding heat sinks to dissipate heat for multiple circuit boards at the same time; in summary, the utility model has the beneficial effects of rapid heat dissipation and dust accumulation prevention, and solves the problem of overheating when the circuit board is working in a closed and high temperature environment. When the fan blows air, it will also blow dust onto the circuit board. If too much dust accumulates over time, it will cause the circuit board to easily malfunction. BRIEF DESCRIPTION OF THE DRAWINGS

[0013] Attached Figure 1 It is a front view of the utility model;

[0014] Attached Figure 2 It is a schematic diagram of the structure of the utility model;

[0015] Attached Figure 3 It is a schematic diagram of the movement of the heat dissipation component of the utility model.

[0016] In the figure: substrate 1, top layer 2, components 3, heat sink 4, bottom plate 5, heat sink 6, fan 7, heat sink 8, mounting plate 9, splicing block 10, fixing plate 11, buckle 12, slot 13, receiving slot 14, magnet 15, slide bar 16, slide slot 17, anti-slip strip 18, anti-slip slot 19, ventilation slot 20. DETAILED DESCRIPTION

[0017] The technical solutions in the embodiments of the present invention will be described clearly and completely below in conjunction with the accompanying drawings in the embodiments of the present invention.

[0018] like Figure 1-3As shown, the utility model discloses a circuit board and a heat dissipation device for the circuit board, including a circuit board assembly and a heat dissipation device, wherein the circuit board assembly includes a substrate 1, a top layer 2 fixedly arranged above the substrate 1, a plurality of components 3 fixedly arranged on the top layer 2, a heat sink 4 fixedly arranged inside the substrate 1 and extending out of the left and right sides of the substrate 1, and a mounting assembly arranged on the front and back sides of the substrate 1, wherein a heat conductive material is added inside the substrate 1, and the heat dissipation device includes a bottom plate 5, a heat sink 6 slidably arranged above the bottom plate 5 and located on the left and right sides of the substrate 1, and a fan 7 fixedly arranged on the front and back sides of the heat sink 6, wherein the substrate 1 is connected to the bottom plate 5 through the mounting assembly, and a heat sink 8 is provided on a side wall of the heat sink 6 facing the substrate 1, and the heat sink 4 is inserted into the heat sink 8 and located inside the heat sink 6. When the utility model is used, first slide the heat sink 6 to move it to the edge of the bottom plate 5 to make room for the installation of the substrate 1, fix the fixing plate 11 to the bottom plate 5 by screws, and then fix the substrate 1 to the mounting plate 9 by screws to complete the installation of the substrate 1, slide the heat sink 6 to move it toward the substrate 1, insert the heat sink 4 into the heat sink 8 and locate it inside the heat sink 6, start the fan 7 to blow air to the heat sink 4 to dissipate heat, which plays a role in rapid heat dissipation. Since the heat sink 4 extends out of the left and right sides of the substrate 1 and the heat sink 4 is located inside the heat sink 6, when the heat sink is blowing air to dissipate heat, it will not be blown directly to the components 3, which plays a role in preventing dust accumulation. ; When multiple circuit boards need to be installed, place another mounting plate 9 on top of the mounting plate 9, insert the plug 12 on another splicing block 10 into the slot 13 on the splicing block 10 and snap it together with the splicing block 10 to complete the splicing of the mounting plate 9, and fix another substrate 1 to another mounting plate 9 to complete the installation of multiple circuit boards, and then insert the heat sink 4 on multiple substrates 1 into the corresponding heat sink 8 to dissipate heat for multiple circuit boards at the same time; In summary, the utility model has the beneficial effects of rapid heat dissipation and preventing dust accumulation, and solves the problem of overheating when the circuit board works in a closed and high temperature environment. When the fan 7 blows air, it will also blow dust onto the circuit board. If too much dust accumulates over time, it will cause the circuit board to easily malfunction.

[0019] Preferably, the mounting assembly includes a mounting plate 9 located below the substrate 1, a splicing block 10 fixedly arranged on the side of the mounting plate 9 away from the substrate 1, and a fixing plate 11 fixedly arranged on the splicing block 10, and the mounting plate 9 and the fixing plate 11 are respectively fixedly connected to the substrate 1 and the bottom plate 5 by screws. Since the mounting plate 9 and the fixing plate 11 are respectively fixedly connected to the substrate 1 and the bottom plate 5 by screws, it is convenient to disassemble and assemble the substrate 1 and the mounting plate 9.

[0020] Preferably, the installation assembly also includes a buckle 12, a slot 13 matching the buckle 12 is provided on the top wall of the splicing block 10, a receiving groove 14 penetrating the bottom wall is provided on the side wall of the splicing block 10 away from the substrate 1, the buckle 12 is located inside the receiving groove 14 and is rotatably connected to the splicing block 10 through a rotating shaft, an iron sheet is fixedly provided on the side wall of the receiving groove 14 close to the substrate 1, and magnets 15 are fixedly provided on the front and rear side walls of the buckle 12. Since the top wall of the splicing block 10 is provided with a slot 13 matching the plug buckle 12, the plug buckle 12 is located inside the accommodating groove 14 and is rotatably connected to the splicing block 10 through a rotating shaft, when multiple circuit boards need to be installed, the plug buckle 12 is rotated out of the accommodating groove 14 and inserted into the slot 13 on another splicing block 10 to be buckled and connected thereto, so that multiple installations can be spliced, which facilitates the installation of multiple circuit boards; since an iron sheet is fixedly provided on the side wall of the accommodating groove 14 close to the substrate 1, magnets 15 are fixedly provided on the front and rear side walls of the plug buckle 12, when the plug buckle 12 is located inside or outside the accommodating groove 14, the magnet 15 will be magnetically connected to the iron sheet inside the accommodating groove 14, which prevents the plug buckle 12 from swinging at will.

[0021] Preferably, a slide bar 16 is fixedly arranged below the heat dissipation box 6, and a slide groove 17 matching the slide bar 16 is provided on the top wall of the bottom plate 5, and the slide bar 16 is inserted into the slide groove 17 and slidably connected with the bottom plate 5. Since the slide bar 16 is inserted into the slide groove 17 and slidably connected with the bottom plate 5, it is convenient for the heat dissipation box 6 to slide.

[0022] Preferably, an anti-slipping strip 18 is fixedly arranged below the slide bar 16, and the width of the anti-slipping strip 18 is greater than the width of the slide bar 16. An anti-slipping groove 19 that penetrates the slide groove 17 and matches the anti-slipping strip 18 is provided inside the bottom plate 5, and the anti-slipping strip 18 is inserted into the anti-slipping groove 19 and slidably connected to the bottom plate 5. Since the anti-slipping strip 18 is inserted into the anti-slipping groove 19 and slidably connected to the bottom plate 5, it plays a role in preventing the slide bar 16 from falling off the bottom plate 5.

[0023] Preferably, a ventilation slot 20 is provided on a side wall of the heat dissipation box 6 away from the substrate 1. Since the ventilation slot 20 is provided on a side wall of the heat dissipation box 6 away from the substrate 1, the air circulation is accelerated.

[0024] Preferably, the thermal conductive material is one of aluminum oxide and silicon nitride, and the heat sink 4 is one of aluminum sheet and copper sheet. Since the thermal conductive material is one of aluminum oxide and silicon nitride, and the heat sink 4 is one of aluminum sheet and copper sheet, the thermal conductivity is improved and the heat is quickly transferred to the heat sink 4.

[0025] The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention. Any modifications, equivalent substitutions, improvements, etc. made within the spirit and principles of the present invention shall be included in the protection scope of the present invention.

Claims

1. A circuit board and a heat dissipation device for the circuit board, comprising a circuit board assembly and a heat dissipation device, characterized in that: The circuit board assembly comprises a substrate (1), a top layer (2) fixedly arranged above the substrate (1), a plurality of components (3) fixedly arranged on the top layer (2), a heat sink (4) fixedly arranged inside the substrate (1) and extending out of the left and right sides of the substrate (1), and a mounting assembly arranged on the front and rear sides of the substrate (1); a heat-conducting material is added inside the substrate (1); the heat dissipation device comprises a bottom plate (5), a heat sink (6) slidably arranged above the bottom plate (5) and located on the left and right sides of the substrate (1); and a fan (7) fixedly arranged on the front and rear sides of the heat sink (6); the substrate (1) is connected to the bottom plate (5) via the mounting assembly; a heat sink (8) is provided on a side wall of the heat sink (6) facing the substrate (1); and the heat sink (4) is inserted into the heat sink (8) and located inside the heat sink (6).

2. A circuit board and a heat dissipation device for the circuit board according to claim 1, characterized in that: The mounting assembly comprises a mounting plate (9) located below the base plate (1), a splicing block (10) fixedly arranged on a side of the mounting plate (9) away from the base plate (1), and a fixing plate (11) fixedly arranged on the splicing block (10); the mounting plate (9) and the fixing plate (11) are respectively fixedly connected to the base plate (1) and the bottom plate (5) by means of screws.

3. A circuit board and a heat dissipation device for the circuit board according to claim 2, characterized in that: The mounting assembly further comprises a buckle (12); a slot (13) matching the buckle (12) is provided on the top wall of the splicing block (10); a receiving groove (14) penetrating the bottom wall is provided on a side wall of the splicing block (10) away from the base plate (1); the buckle (12) is located inside the receiving groove (14) and is rotatably connected to the splicing block (10) via a rotating shaft; an iron sheet is fixedly provided on a side wall of the receiving groove (14) close to the base plate (1); and magnets (15) are fixedly provided on both the front and rear side walls of the buckle (12).

4. A circuit board and a heat dissipation device for the circuit board according to claim 3, characterized in that: A sliding bar (16) is fixedly arranged below the heat dissipation box (6), and a sliding groove (17) matching the sliding bar (16) is provided on the top wall of the bottom plate (5), and the sliding bar (16) is inserted into the sliding groove (17) to be slidably connected with the bottom plate (5).

5. A circuit board and a heat dissipation device for the circuit board according to claim 4, characterized in that: An anti-slip strip (18) is fixedly arranged below the slide bar (16), and the width of the anti-slip strip (18) is greater than that of the slide bar (16). An anti-slip groove (19) penetrating the slide groove (17) and matching the anti-slip strip (18) is provided inside the bottom plate (5), and the anti-slip strip (18) is inserted into the anti-slip groove (19) and is slidably connected to the bottom plate (5).

6. A circuit board and a heat dissipation device for the circuit board according to claim 5, characterized in that: A ventilation slot (20) is provided on a wall of the heat dissipation box (6) which is away from the base plate (1).

7. A circuit board and a heat dissipation device for the circuit board according to claim 6, characterized in that: The thermal conductive material is one of aluminum oxide and silicon nitride, and the heat sink (4) is one of aluminum sheet and copper sheet.

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