Display device and rollable electronic device

Abstract

Disclosed are a display device and a rollable electronic device, the display device including: a display panel including a substrate, a light emitting layer on a first surface of the substrate, and a wiring pad on the first surface of the substrate and adjacent to one side of the substrate; and a support member on a second surface of the substrate opposite the first surface of the substrate. The substrate includes a step portion protruding from the second surface in a thickness direction of the substrate, and the step portion overlaps the wiring pad. The display device reduces or minimizes damage to a substrate during a bonding process by including a step portion positioned on a bonding portion of the substrate.

Description

[0001] This application claims priority to and the benefit of Korean Patent Application No. 10-2023-0057519 filed in the Korean Intellectual Property Office on May 3, 2023, the disclosure of which is incorporated herein in its entirety by reference. Technical Field

[0002] Aspects of embodiments of the present disclosure relate to a display device and a rollable electronic device. Background Art

[0003] The importance of display devices has increased with the development of multimedia. As such, various types of display devices such as liquid crystal displays (LCDs) and organic light emitting diode (OLED) displays are being used. These display devices have a variety of applications, for example, in mobile electronic devices and portable electronic devices such as smartphones, smart watches, and tablet personal computers (PCs).

[0004] In recent years, display-related technologies have been developed. Instead of using rigid glass substrates, flexible materials such as plastics have been adopted or extremely thin and bendable glass substrates have been utilized. These advances have led to the development of flexible display devices that can exhibit paper-like flexibility. Such flexible display devices can be further divided into two categories: bendable display devices that can be bent without breaking; and foldable display devices that can be folded. In addition, researchers have been exploring the concept of rollable display devices that can be rolled around and / or unfolded from a roll to meet the growing demand for flexible display solutions.

[0005] The above information disclosed in this Background section is for enhancement of understanding of the background of the present disclosure and therefore it may contain information that does not constitute the prior art. Utility Model Content

[0006] One or more embodiments of the present disclosure are directed to a display device and a rollable electronic device, which may reduce or minimize damage to a substrate during a bonding process by including a step portion positioned on a bonding portion of the substrate.

[0007] One or more embodiments of the present disclosure are directed to a display device and a rollable electronic device that can optimize a lamination process using a roller by reducing or minimizing a step between bonding members.

[0008] However, the aspects and features of the present disclosure are not limited to those set forth above. The above and other aspects and features of the present disclosure will become more apparent to those of ordinary skill in the art according to the following description by reference to the detailed description and drawings of the present disclosure and / or by practicing one or more given embodiments of the present disclosure.

[0009] According to one or more embodiments of the present disclosure, a display device includes: a display panel including a substrate, a light emitting layer on a first surface of the substrate, and a wiring pad on the first surface of the substrate and adjacent to one side of the substrate; and a supporting member on a second surface of the substrate opposite to the first surface of the substrate. The substrate includes: a step portion protruding from the second surface in a thickness direction of the substrate, and the step portion overlaps the wiring pad.

[0010] In an embodiment, the substrate may further include: a bottom surface portion on the entire second surface except for the step portion, and the bottom surface portion may not overlap the wiring pad.

[0011] In an embodiment, a thickness of the bottom surface portion may be smaller than a thickness of the step portion.

[0012] In an embodiment, the bottom surface portion may be an etched portion of the substrate.

[0013] In an embodiment, the support member may include: a main portion overlapping the light emitting layer; and a protrusion portion protruding from the main portion in a direction toward the stepped portion of the substrate.

[0014] In an embodiment, the step portion may include a plurality of step portions, and the protruding portion may include a plurality of protruding portions; and the plurality of step portions and the plurality of protruding portions may be alternately positioned.

[0015] In an embodiment, the base may further include: a bottom surface portion on the entire second surface except for the step portion, and the bottom surface portion may overlap the protruding portion of the support member.

[0016] In an embodiment, a sum of thicknesses of the bottom surface portion and the support member may be greater than or equal to a thickness of the step portion.

[0017] In an embodiment, the support member may have a size larger than a size of the display panel in an extending direction of the protruding portion.

[0018] In an embodiment, in an extending direction of the protruding portion, a length of the protruding portion may be greater than a length of the step portion.

[0019] In an embodiment, the support member may further include a lower end portion below the main portion and the protruding portion; and the lower end portion may overlap the step portion and the bottom surface portion.

[0020] In an embodiment, the bottom surface of the lower end portion may be flat.

[0021] In an embodiment, a side surface of the main portion may be spaced apart from a side surface of the step portion.

[0022] In an embodiment, the support member may comprise a metal plate.

[0023] In an embodiment, the display device may further include: a connection film on the wiring pad; and a driver chip on the connection film.

[0024] In an embodiment, the stepped portion may overlap the connection film.

[0025] In an embodiment, the step portion may include a plurality of step portions; and the plurality of step portions may be spaced apart from each other.

[0026] According to one or more embodiments of the present disclosure, a rollable electronic device includes: a display device, the display device includes a display panel and a support member, the display panel includes a substrate, a light-emitting layer on one surface of the substrate, and a wiring pad on the one surface of the substrate and adjacent to one side of the substrate, the support member is on the other surface of the substrate opposite to the one surface of the substrate; and a housing having an internal space in which the display device is configured to be rolled or unfolded. The substrate includes a step portion protruding in a direction toward the support member, the support member includes a protruding portion protruding in a direction toward the step portion, and the step portion and the protruding portion are alternately positioned.

[0027] In an embodiment, the substrate may further include a bottom surface portion on the entire other surface of the substrate except for the step portion, and a sum of thicknesses of the bottom surface portion and the support member may be greater than or equal to the thickness of the step portion.

[0028] In an embodiment, in an extending direction of the protruding portion, a length of the protruding portion may be greater than a length of the step portion.

[0029] According to one or more embodiments of the present disclosure, since a step portion may be provided on a bonding portion of a substrate, damage to the substrate may be minimized or reduced during a bonding process.

[0030] According to one or more embodiments of the present disclosure, since a step between bonding members may be minimized or reduced, a display device and a rollable electronic device in which a lamination process using a roller may be optimized may be provided.

[0031] However, aspects and features of the present disclosure are not limited to those described above, and other aspects and features of the present disclosure will become more apparent from the following description with reference to the accompanying drawings. BRIEF DESCRIPTION OF THE DRAWINGS

[0032] The above and other aspects and features of the present disclosure will be more clearly understood through the following detailed description of embodiments with reference to the accompanying drawings, in which:

[0033] Figure 1is a perspective view of an electronic device according to an embodiment of the present disclosure;

[0034] Figure 2 It shows that Figure 1 A perspective view of an electronic device inserted into a housing;

[0035] Figure 3 is a plan view of a display device according to an embodiment of the present disclosure;

[0036] Figure 4 It is shown Figure 3 A plan view of the lines of the display panel;

[0037] Figure 5 yes Figure 3 a cross-sectional view of a portion of a display panel;

[0038] Figure 6 yes Figure 3 a perspective view of a bottom surface of a substrate of a display panel;

[0039] Figure 7 It is shown Figure 3 a plan view of a bottom surface of a substrate of a display panel;

[0040] Figure 8 It is along Figure 7 A cross-sectional view taken along the line X1-X1';

[0041] Fig. 9 is a perspective view of a support member according to an embodiment of the present disclosure;

[0042] Fig.10 It is shown Fig. 9 a plan view of a front surface of a support member;

[0043] Fig.11 It is along Fig.10 A cross-sectional view taken along line X2-X2';

[0044] Fig.12 It is shown Figure 6 The display panel substrate and Fig. 9 A perspective view of a joint state of a supporting member;

[0045] Fig.13 is a plan view of a display device according to an embodiment of the present disclosure;

[0046] Fig.14 It is along Fig.13 A cross-sectional view taken along line X3-X3';

[0047] Fig.15 It is along Fig.13 A cross-sectional view taken along line X4-X4';

[0048] Fig.16 It is along Fig.13 A cross-sectional view taken along line X5-X5';

[0049] Figures 17 to 19 is a cross-sectional view of a display device according to some embodiments of the present disclosure; and

[0050] Fig. 20 is a cross-sectional view of a display device according to an embodiment of the present disclosure. DETAILED DESCRIPTION

[0051] Hereinafter, the embodiments will be described in more detail with reference to the accompanying drawings in which the same reference numerals always represent the same elements. However, the present disclosure can be implemented in various different forms and should not be construed as being limited to the embodiments shown here. On the contrary, these embodiments are provided as examples so that the present disclosure will be thorough and complete, and these embodiments will fully convey the aspects and features of the present disclosure to those skilled in the art. Therefore, it is not necessary to describe the processes, elements and techniques that are fully understood by those of ordinary skill in the art to fully understand the aspects and features of the present disclosure. Unless otherwise stated, throughout the drawings and written descriptions, the same reference numerals indicate the same elements, and therefore, their redundant descriptions may not be repeated.

[0052] When a certain embodiment can be implemented differently, the specific process order may be different from the described order. For example, two processes described successively may be performed simultaneously or substantially simultaneously, or may be performed in the reverse order of the described order.

[0053] In the accompanying drawings, for clarity, the relative size, thickness and ratio of elements, layers and regions can be exaggerated and / or simplified. For ease of explanation, spatial relative terms such as "under ... ", "under ... ", "under ... ", "above ... ", "on ", etc. can be used here to describe the relationship between an element or feature and another element or feature as shown in the drawings. It will be understood that, in addition to the orientations depicted in the drawings, spatial relative terms are also intended to include different orientations of the device in use or operation. For example, if the device in the accompanying drawings is flipped, the element described as "under" or "under" or "below" other elements or features will then be oriented to "above" other elements or features. Therefore, the exemplary terms "under ... " and "under ... " can include both upper and lower orientations. The device can be oriented in addition (for example, rotated 90 degrees or at other orientations), and the spatial relative descriptors used here should be interpreted accordingly.

[0054] In the drawings, the DR1 axis, the DR2 axis, and the DR3 axis are not limited to the three axes of the rectangular coordinate system and can be interpreted in a broader sense. For example, the DR1 axis, the DR2 axis, and the DR3 axis can be perpendicular to each other or substantially perpendicular to each other, or can represent different directions that are not perpendicular to each other.

[0055] It will be understood that, although the terms "first", "second", "third", etc. may be used herein to describe various elements, components, regions, layers and / or parts, these elements, components, regions, layers and / or parts should not be limited by these terms. These terms are used to distinguish an element, a component, a region, a layer or a part from another element, another component, another region, another layer or another part. Therefore, without departing from the spirit and scope of the present disclosure, the first element, the first component, the first region, the first layer or the first part described below may be referred to as the second element, the second component, the second region, the second layer or the second part.

[0056] It will be understood that when an element or layer is referred to as being "on," "connected to," or "bound to" another element or layer, the element or layer may be directly on, directly connected to, or directly bound to the other element or layer, or there may be one or more intervening elements or layers. Similarly, when a layer, region, or element is referred to as being "electrically connected" to another layer, region, or element, the layer, region, or element may be directly electrically connected to the other layer, region, or element, and / or may be indirectly electrically connected with one or more intervening layers, regions, or elements therebetween. In addition, it will be understood that when an element or layer is referred to as being "between" two elements or two layers, the element or layer may be the only element or the only layer between the two elements or two layers, or there may also be one or more intervening elements or layers.

[0057] The terms used here are for the purpose of describing specific embodiments, and are not intended to be limitations of the present disclosure. As used here, unless the context clearly indicates otherwise, the singular form "one (kind / person)" is also intended to include plural forms. It will also be understood that when the terms "comprise", "include", "have" and their variations are used in this specification, the features, integral bodies, steps, operations, elements and / or components stated are explained, but one or more other features, integral bodies, steps, operations, elements, components and / or their groups are not excluded from existence or addition. As used here, the term "and / or" includes any combination and all combinations of one or more related listed items. For example, the statement "A and / or B" means A, B or A and B. When a statement such as "at least one (kind / person) in ... " is located after a column of elements, the entire column of elements is modified without modifying the individual elements in the column. For example, the expressions "at least one of a, b, and c" and "at least one selected from the group consisting of a, b, and c" mean only a, only b, only c, both a and b, both a and c, both b and c, all of a, b, and c, or variations thereof.

[0058] As used herein, the terms "substantially," "about," and similar terms are used as terms of approximation rather than as terms of degree, and are intended to account for the inherent deviations in measurements or calculations that one of ordinary skill in the art would recognize. In addition, when describing embodiments of the present disclosure, the use of "may" means "one or more embodiments of the present disclosure." As used herein, the term "using" and variations thereof may be considered synonymous with the term "utilizing" and variations thereof, respectively.

[0059] Unless otherwise defined, all terms (including technical and scientific terms) used herein have the same meaning as commonly understood by those of ordinary skill in the art to which the present disclosure belongs. It will also be understood that terms (such as those defined in common dictionaries) should be interpreted as having a meaning consistent with their meaning in the context of the relevant art and / or this specification, and should not be interpreted in an idealized or overly formal sense, unless explicitly defined as such herein.

[0060] Figure 1 is a perspective view of an electronic device according to an embodiment of the present disclosure. Figure 2 It shows that Figure 1 A perspective view of an electronic device inserted into a housing.

[0061] Reference Figure 1 and Figure 2 The electronic device 1 may be a rollable electronic device, and the rollable electronic device may be at least partially rolled into the housing 20 and / or unfolded from the housing 20, but the present disclosure is not limited thereto.

[0062] The electronic device 1 may include a display device 10 , a housing 20 , and a roller.

[0063] The display device 10 includes any suitable display device that provides a display screen for displaying a video or a still image. For example, the display device 10 may include a television (TV), a laptop computer, a monitor, a billboard, an Internet of Things (IoT) device, a mobile phone, a smart phone, a tablet personal computer (PC), an electronic clock, a smart watch, a watch phone, a head-mounted display (HMD), a mobile communication terminal, an electronic notepad, an e-book reader, a portable multimedia player (PMP), a navigation device, a game console, a digital camera, a video camera, etc. The display device 10 can display an image in the thickness direction (e.g., the third direction DR3).

[0064] exist Figure 1 and Figure 2 In the drawings, the first direction DR1 and the second direction DR2 cross or intersect each other. For example, the first direction DR1 and the second direction DR2 may be orthogonal to each other. The third direction DR3 crosses or intersects the first direction DR1 and the second direction DR2, and may represent a direction perpendicular to and orthogonal to the first direction DR1 and the second direction DR2. As used herein, the direction indicated by the arrows of the first direction DR1, the second direction DR2, and the third direction DR3 may be referred to as one side or the first side of the direction, and the opposite direction may be referred to as the other side or the second side of the direction. However, the directions shown in the drawings are presented as examples and are therefore relative directions, and are not limited to the directions shown or described above.

[0065] The shape of the display device 10 may be variously modified. For example, the display device 10 may have a rectangular shape that is horizontally elongated (e.g., in the first direction DR1), a rectangular shape that is vertically elongated (e.g., in the second direction DR2), a square shape, a quadrilateral shape with rounded corners, another suitable polygonal shape, or a circular shape. Figure 1 and Figure 2 It is shown that the display device 10 has a rectangular shape having a relatively long length in the first direction DR1 as a representative example.

[0066] The display device 10 may be, for example, an inorganic light emitting diode (LED) display device, an organic LED (OLED) display device, a quantum dot LED display device, a plasma display device, or a field emission display (FED) device. Hereinafter, the display device 10 may be described in more detail in the context of an OLED display device as a representative example, but the present disclosure is not limited thereto.

[0067] The display device 10 may include a display panel 100 and a support member 200 .

[0068] The display panel 100 may exhibit flexibility and may be bendable. In some embodiments, the display panel 100 may be at least partially wound around a roller to be installed in the housing 20. When the display panel 100 is raised or lowered, the display panel 100 may be inserted into the housing 20 through the opening of the housing 20 or popped out from the housing 20 by winding the display panel 100 around the roller or unwinding the display panel 100 from the roller.

[0069] The support member 200 may be disposed at one side of the display panel 100. The support member 200 may be bonded to one side of the display panel 100. The support member 200 may support the display panel 100 so that the flexible display panel 100 may be able to maintain or substantially maintain its shape when ejected outside the housing 20.

[0070] In some embodiments, the support member 200 may include a metal plate having high rigidity. For example, the support member 200 may be formed of a metal or a metal alloy. The support member 200 may include copper (Cu), aluminum (Al), stainless steel (STS) and / or a suitable alloy thereof, but the present disclosure is not limited thereto.

[0071] The support member 200 may also exhibit flexibility and may be bendable. The support member 200 may be at least partially wound around a roller to be installed in the housing 20. When the support member 200 is raised or lowered, the support member 200 may be inserted into the housing 20 through an opening of the housing 20 or popped out of the housing 20 by rolling or unrolling the support member 200 from the roller. In some embodiments, the support member 200 may have a grid shape.

[0072] The housing 20 may include an opening through which the display device 10 is inserted into or ejected from the housing 20 and an inner space for accommodating the display device 10 and the roller. The housing 20 may have a rectangular parallelepiped shape with the opening at its top surface, but the present disclosure is not limited thereto.

[0073] The roller may be disposed in the housing 20. The roller may be configured as a cylindrical member, but the present disclosure is not limited thereto. The roller may allow the display device 10 to be rolled or unfolded. As a result, Figure 2 As shown in FIG. 1 , the display device 10 can be raised from or lowered into the housing 20 .

[0074] Figure 3 is a plan view of a display device according to an embodiment of the present disclosure. For ease of explanation, Figure 3 The support member 200 is not shown.

[0075] Reference Figure 3 , the display device 10 may include a display panel 100 , a connection film COF, a driver chip DIC, and a circuit board PCB.

[0076] The display panel 100 may include a display area DA and a non-display area NDA. The display area DA may be an effective area for displaying an image. In a plan view, the display area DA may have a rectangular shape that may be similar or identical to the overall shape of the display panel 100, but the present disclosure is not limited thereto.

[0077] The display area DA may include a plurality of pixels. The pixels may be arranged along the row direction and the column direction. In a plan view, the pixels may have a rectangular shape or a square shape, but the present disclosure is not limited thereto. As another example, the pixels may have a diamond shape that is inclined relative to the edge of the display panel 100. The pixels may include pixels of multiple colors. For example, the pixels may include, but are not limited to, a first color pixel (e.g., a red pixel), a second color pixel (e.g., a green pixel), and a third color pixel (e.g., a blue pixel). The first color pixel, the second color pixel, and the third color pixel may be arranged in a stripe pattern or an RGBG pattern (e.g., pattern, is an officially registered trademark of Samsung Display Co., Ltd.) layout.

[0078] The non-display area NDA may be disposed around the display area DA (e.g., adjacent to the display area DA). The non-display area NDA may completely or partially surround the display area DA (e.g., around the periphery of the display area DA). The display area DA may have a rectangular shape, and the non-display area NDA may be disposed around four sides of the display area DA (e.g., disposed adjacent to the four sides of the display area DA). The non-display area NDA may form a frame of the display panel 100.

[0079] In the non-display area NDA, a driving circuit or device for driving the display area DA may be provided. The non-display area NDA may include a first non-display area NDA1, a second non-display area NDA2, a third non-display area NDA3, and a fourth non-display area NDA4. Figure 3 In a first non-display area NDA1 disposed around the lower side of the display panel 100 (e.g., disposed adjacent to the first long side of the display panel 100), a pad (also referred to as a "pad" or "pad") unit (e.g., a pad or pad area) may be disposed on the display substrate of the display device 10, and an external device may be mounted on a pad electrode of the pad unit. As another example, an external device may also be mounted in a second non-display area NDA2 disposed around the second long side of the display panel 100 (e.g., Figure 3The display panel 100 may be provided around the upper side thereof (eg, disposed adjacent to the second long side of the display panel 100). Examples of the external device may include a connection film COF, a driver chip DIC, a circuit board PCB, a connector, a wiring connection film, and the like.

[0080] On a first short side (eg, Figure 3 In the third non-display area NDA3 disposed around the left side of the display panel 100 (e.g., disposed adjacent to the first short side of the display panel 100), a scan driving unit (e.g., a scan driver or a scan driving circuit) SDR that may be directly formed on the display substrate of the display panel 100 may be disposed. Figure 3 Another scan driving unit (eg, another scan driver or scan driving circuit) SDR may be further disposed in a fourth non-display area NDA4 around the right side of the display panel 100 (eg, disposed adjacent to the second short side of the display panel 100).

[0081] The connection film COF may be installed in the non-display area NDA of the display panel 100. For example, the connection film COF may be installed in the first non-display area NDA1 of the display panel 100, but the present disclosure is not limited thereto. The connection film COF may be a film in which or on which wiring is installed, and may accommodate an integrated circuit (IC) such as a driver chip DIC. The connection film COF may be a flexible film.

[0082] The driver chip DIC may output signals and voltages for driving the display panel 100. The driver chip DIC may supply data voltages to data lines. The driver chip DIC may supply power voltages to power lines, and may apply gate control signals to a gate driving unit (eg, a gate driver or a gate driving circuit).

[0083] The driver chip DIC may be formed as an IC and may be mounted on the display panel 100 by a chip on glass (COG) method, a chip on plastic (COP) method, or ultrasonic bonding. Figure 3 As shown in , the driver chip DIC can be mounted on the connection film COF in a COF method.

[0084] The circuit board PCB may be mounted on the pad unit or the connection film COF of the display panel 100. Various ICs or external devices may be mounted on the circuit board PCB. The conductive lines of the circuit board PCB may be electrically connected to the pad unit of the display panel 100.

[0085] The circuit board PCB may be a flexible film such as a flexible printed circuit board (FPCB), a printed circuit board (PCB), or a chip on film.

[0086] Figure 4 It is shown Figure 3 A plan view of the lines of the display panel.

[0087] Reference Figure 3 and Figure 4 , the display panel 100 may include a plurality of lines. The lines may include a scan line SCL, a sensing signal line SSL, a data line DTL, a reference voltage line RVL, and a first power line ELVDL.

[0088] The scan lines SCL and the sensing signal lines SSL may extend in the first direction DR1. The scan lines SCL and the sensing signal lines SSL may be connected to the scan driving unit SDR. The scan driving unit SDR may include a circuit layer (eg, Figure 5 The scanning driving unit SDR may be provided in the third non-display area NDA3, but the present disclosure is not limited thereto. As another example, the scanning driving unit SDR may be provided in the fourth non-display area NDA4, or in both the third non-display area NDA3 and the fourth non-display area NDA4. The scanning driving unit SDR may be connected to the signal connection line CWL, and at least one end of the signal connection line CWL may form a pad WPD_CW in the first non-display area NDA1 or the second non-display area NDA2, and may be connected to the connection film COF.

[0089] The data line DTL and the reference voltage line RVL may extend in a second direction DR2 crossing or intersecting the first direction DR1. The first power line ELVDL may include a portion extending in the second direction DR2. The first power line ELVDL may also include a portion extending in the first direction DR1. The first power line ELVDL may have a mesh structure, but the present disclosure is not limited thereto.

[0090] The wiring pad WPD may be disposed at at least one end of each of the data line DTL, the reference voltage line RVL, and the first power line ELVDL. The wiring pad WPD may be disposed in the pad area PDA of the non-display area NDA. The wiring pad WPD_DT of the data line DTL (hereinafter, the data pad WPD_DT) may be disposed in the pad area PDA in the first non-display area NDA1. The wiring pad WPD_RV of the reference voltage line RVL (hereinafter, the reference voltage pad WPD_RV) and the wiring pad WPD_ELVD of the first power line ELVDL (hereinafter, the first power pad WPD_ELVD) may be disposed in the pad area PDA in the second non-display area NDA2. As another example, the data pad WPD_DT, the reference voltage pad WPD_RV, and the first power pad WPD_ELVD may be disposed in the same area as each other (such as in the first non-display area NDA1 as an example). The connecting film COF may be mounted on the wiring pad WPD. The connection film COF may be mounted on the wiring pad WPD via an anisotropic conductive film (ACF) or ultrasonic bonding.

[0091] Figure 5 yes Figure 3 A cross-sectional view of a portion of a display panel.

[0092] Reference Figure 5 , the display panel 100 may include a substrate 110 , a circuit layer CCL, a light emitting element layer EML, an encapsulation structure 170 , a wavelength conversion layer WLCL, a color filter layer CFL, and an overcoat layer OC.

[0093] The substrate 110 may include a transparent material. For example, the substrate 110 may include a transparent insulating material such as glass or quartz. The substrate 110 may be a rigid substrate.

[0094] However, the present disclosure is not limited thereto. As another example, the substrate 110 may include a plastic such as polyimide, and may be flexible so as to be foldable, bendable, or rollable. For example, the substrate 110 may be formed of ultra-thin glass (UTG) having a thickness of about 500 μm. In this example, when the rollable display device 10 is rolled or unfolded, the substrate 110 may also undergo rolling or unfolding.

[0095] The following will refer to Figure 6 The shape of the substrate 110 is described in more detail.

[0096] The circuit layer CCL may be disposed on the substrate 110. The circuit layer CCL may include a data metal layer forming a thin film transistor (TFT), a capacitor, and various wirings or lines, and may also include an interlayer insulating film and an organic film. Various suitable designs may be applicable to the circuit layer CCL according to the type of the display panel 100. Figure 4The layout of wirings or lines of the circuit layer CCL is described, and thus, a redundant description thereof may not be repeated.

[0097] The light emitting element layer EML may be disposed on the circuit layer CCL. The light emitting element layer EML may include a pixel electrode PXE, a pixel defining layer PDL, a light emitting layer LEL, and a common electrode CME.

[0098] The pixel electrode PXE may be a first electrode (e.g., an anode) of the LED. The pixel electrode PXE may have a stacked film structure in which a high work function material layer and a reflective material layer are stacked, and the high work function material layer includes, for example, indium tin oxide (ITO), indium zinc oxide (IZO), zinc oxide (ZnO), or indium oxide (In 2 O 3 ) or a material with a high work function such as indium tin oxide (ITO), indium zinc oxide (IZO), zinc oxide (ZnO) or indium oxide (In 2 O 3 ), the reflective material layer includes a reflective material such as silver (Ag), magnesium (Mg), aluminum (Al), platinum (Pt), lead (Pb), gold (Au), nickel (Ni), neodymium (Nd), iridium (Ir), chromium (Cr), lithium (Li), calcium (Ca) or a suitable mixture thereof or is composed of a reflective material such as silver (Ag), magnesium (Mg), aluminum (Al), platinum (Pt), lead (Pb), gold (Au), nickel (Ni), neodymium (Nd), iridium (Ir), chromium (Cr), lithium (Li), calcium (Ca) or a suitable mixture thereof. The high work function material layer may be disposed above the reflective material layer and closer to the light emitting layer LEL. The pixel electrode PXE may have a multilayer structure such as ITO / Mg, ITO / MgF, ITO / Ag or ITO / Ag / ITO, but the present disclosure is not limited thereto.

[0099] The pixel electrode PXE may include a first pixel electrode PXR, a second pixel electrode PXG, and a third pixel electrode PXB respectively disposed in the first pixel SP1, the second pixel SP2, and the third pixel SP3. The first pixel electrode PXR may overlap the first light emitting area LA1. The second pixel electrode PXG may overlap the second light emitting area LA2. The third pixel electrode PXB may overlap the third light emitting area LA3.

[0100] The pixel defining film PDL may be disposed along the boundary of each pixel SP on one surface of the substrate 110. The pixel defining film PDL may be disposed on the pixel electrode PXE and may include an opening exposing the pixel electrode PXE. The light emitting area LA and the non-light emitting area NLA may be distinguished from each other by the pixel defining film PDL and the opening of the pixel defining film PDL.

[0101] The pixel defining film PDL may include an organic insulating material such as acrylic resin, epoxy resin, phenolic resin, polyamide resin, polyimide resin, unsaturated polyester resin, polyphenylene ether resin, polyphenylene sulfide resin, or benzocyclobutene (BCB). As another example, the pixel defining film PDL may include an inorganic material.

[0102] The light-emitting layer LEL may be disposed on the pixel electrode PXE exposed by the pixel defining film PDL. The light-emitting layer LEL may be in contact with the pixel electrode PXE, as well as in contact with the side and top surfaces of the pixel defining film PDL. The light-emitting layer LEL may be continuously connected across the light-emitting area LA and the pixel SP without any distinction. The light-emitting layer LEL may be disposed on the entire or substantially the entire surface of the display panel 100 across the light-emitting area LA and the pixel SP without any distinction. Therefore, the wavelength of light emitted by the light-emitting layer LEL throughout the light-emitting area LA may be the same or substantially the same. For example, the first light-emitting area LA1, the second light-emitting area LA2, and the third light-emitting area LA3 may all emit blue light or ultraviolet (UV) light, and due to the presence of the wavelength conversion layer WLCL, the first pixel SP1, the second pixel SP2, and the third pixel SP3 may be able to display their respective colors.

[0103] As another example, the light emitting layer LEL may be provided separately for each of the light emitting areas LA defined by the pixel defining film PDL. In this case, the wavelength of light emitted by the light emitting layer LEL throughout the light emitting areas LA may be the same or substantially the same. As another example, in this case, the wavelength of light emitted by the light emitting layer LEL throughout different light emitting areas LA may be different.

[0104] In an embodiment, the display panel 100 is an OLED display panel, and the light-emitting layer LEL may include an organic layer including an organic material. The organic layer may include an organic light-emitting layer, and in some cases, may further include a hole injection layer, a hole transport layer, an electron transport layer, and / or an electron injection layer as an auxiliary layer for assisting the emission of light from the light-emitting layer LEL. As another example, in an embodiment, the display panel 100 is a micro-LED display panel or a nano-LED display panel, and the light-emitting layer LEL may include an inorganic material such as an inorganic semiconductor.

[0105] In some embodiments, the light emitting layer LEL may have a series structure including a plurality of organic light emitting layers stacked on top of each other in a thickness direction, and a charge generating layer is disposed between the plurality of organic light emitting layers. The plurality of organic light emitting layers may emit light having the same wavelength or substantially the same wavelength as each other, or light having different wavelengths from each other. At least some layers of the light emitting layer LEL in each pixel SP may be separated from corresponding layers in adjacent pixels SP by a pixel defining film PDL, or they may be connected to each other.

[0106] The common electrode CME may be disposed on the light emitting layer LEL. The common electrode CME may be continuously connected across the light emitting area LA and the pixel SP without any distinction. The common electrode CME may be a complete electrode disposed on the entire or substantially the entire surface of the display panel 100, without distinction between the light emitting areas LA or between the pixels SP. The common electrode CME may correspond to the second electrode (e.g., cathode) of the LED. The common electrode CME may include a low work function material layer including a material having a low work function such as Li, Ca, LiF, Al, Mg, Ag, Pt, Pd, Ni, AuNd, Ir, Cr, BaF, Ba or a suitable compound or mixture thereof (e.g., a mixture of Ag and Mg) or composed of a material having a low work function such as Li, Ca, LiF, Al, Mg, Ag, Pt, Pd, Ni, AuNd, Ir, Cr, BaF, Ba or a suitable compound or mixture thereof (e.g., a mixture of Ag and Mg), or may have a material having a multilayer structure such as LiF / Ca or LiF / Al. The common electrode CME may further include a transparent metal oxide layer on the low work function material layer.

[0107] The pixel electrode PXE, the light emitting layer LEL, and the common electrode CME may form a light emitting device (eg, an organic light emitting device). Light emitted by the light emitting layer LEL may be output in an upward direction through the common electrode CME.

[0108] The encapsulation structure 170 may be disposed on the common electrode CME. The encapsulation structure 170 may include at least one thin film encapsulation layer. For example, the encapsulation structure 170 may include a first inorganic film 171 , an organic film 172 , and a second inorganic film 173 .

[0109] The first inorganic film 171 may be disposed on the light emitting element layer EML. The first inorganic film 171 may include silicon nitride (SiN x ), silicon oxide (SiO x ) or silicon oxynitride (SiO x N y ).

[0110] The organic film 172 may be disposed on the first inorganic film 171. The organic film 172 may include an organic insulating material such as acrylic resin, epoxy resin, phenolic resin, polyamide resin, polyimide resin, unsaturated polyester resin, polyphenylene ether resin, polyphenylene sulfide resin, or BCB.

[0111] The second inorganic film 173 may be disposed on the organic film 172. The second inorganic film 173 may include a material that is the same as or substantially the same as that of the first inorganic film 171. For example, the second inorganic film 173 may include SiN x 、SiOx or SiO x N y .

[0112] The wavelength conversion layer WLCL may be disposed on the package structure 170. The wavelength conversion layer WLCL may include a first capping layer CAP1, a first bank layer BK1, a first wavelength conversion portion WLC1, a second wavelength conversion portion WLC2, a light transmitting portion LTU, a second capping layer CAP2, and a low refractive index layer LRL.

[0113] The first cover layer CAP1 may be disposed on the second inorganic film 173 of the encapsulation structure 170. The first cover layer CAP1 may seal the bottom surfaces of the first and second wavelength conversion portions WLC1 and WLC2 and the light-transmitting portion LTU. The first cover layer CAP1 may include an inorganic material. For example, the first cover layer CAP1 may include at least one of silicon nitride, aluminum nitride, zirconium nitride, titanium nitride, hafnium nitride, tantalum nitride, silicon oxide, aluminum oxide, titanium oxide, tin oxide, cerium oxide, and silicon oxynitride.

[0114] The first embankment layer BK1 may be disposed in the non-light emitting area NLA on the first cover layer CAP1. The first embankment layer BK1 may overlap with the pixel defining film PDL in the thickness direction. The first embankment layer BK1 may block the transmission of light. The first embankment layer BK1 may improve color reproduction by preventing or substantially preventing light intrusion and color mixing between the first light emitting area LA1, the second light emitting area LA2, and the third light emitting area LA3. In a plan view, the first embankment layer BK1 may be arranged in a grid pattern surrounding the first light emitting area LA1, the second light emitting area LA2, and the third light emitting area LA3 (e.g., around the periphery of the first light emitting area LA1, the second light emitting area LA2, and the third light emitting area LA3). The first embankment layer BK1 may include a light blocking material.

[0115] The first bank layer BK1 can separate the first wavelength conversion part WLC1, the second wavelength conversion part WLC2 and the light-transmitting part LTU from each other, so that the first wavelength conversion part WLC1, the second wavelength conversion part WLC2 and the light-transmitting part LTU correspond to the first light emitting area LA1, the second light emitting area LA2 and the third light emitting area LA3, respectively.

[0116] The first wavelength conversion portion WLC1 may be disposed in the first light emitting area LA1 on the first cover layer CAP1. The first wavelength conversion portion WLC1 may be surrounded by the first bank layer BK1 (e.g., around the periphery of the first bank layer BK1). The first wavelength conversion portion WLC1 may include a first base resin BS1, a first scatterer SCT1, and a first wavelength shifter WLS1.

[0117] The first base resin BS1 may include a suitable material having a relatively high light transmittance. The first base resin BS1 may be formed of a transparent organic material. For example, the first base resin BS1 may include at least one organic material from among epoxy resin, acrylic resin, cardo resin, and imide resin.

[0118] The first scatterer SCT1 may have a refractive index different from that of the first base resin BS1 and may form an optical interface with the first base resin BS1. For example, the first scatterer SCT1 may include a light scattering material or light scattering particles capable of scattering at least some of the transmitted light. For example, the first scatterer SCT1 may include a material such as titanium oxide (TiO 2 ), zirconium oxide (ZrO 2 ), aluminum oxide (Al x O y ),In 2 O 3 , ZnO or tin oxide (SnO 2 ) or particles of an organic material such as an acrylic resin or a polyurethane resin. The first scatterer SCT1 may scatter incident light in random directions without substantially changing a peak wavelength of the incident light, regardless of the incident direction of the incident light.

[0119] The first wavelength shifter WLS1 can convert or shift the peak wavelength of the incident light to a first peak wavelength. For example, the first wavelength shifter WLS1 can convert the blue light provided by the light emitting layer LEL into red light having a single peak wavelength of 610nm to 650nm, and can emit red light. The first wavelength shifter WLS1 may include quantum dots, quantum rods, or phosphors. Quantum dots may be particulate materials in which electrons transition from a conduction band to a valence band and thus emit light having a specific or predetermined color.

[0120] Some of the blue light provided by the light emitting element layer EML may pass through the first wavelength shifter WLS1 without being converted into red light by the first wavelength conversion portion WLC1. The blue light emitted from the light emitting element layer EML and not converted by the first wavelength conversion portion WLC1 may be blocked by the first color filter CF1 when incident on the first color filter CF1. In addition, the red light converted by the first wavelength conversion portion WLC1 from the blue light provided by the light emitting element layer EML may pass through the first color filter CF1 and be emitted outward. Therefore, the first light emitting area LA1 may emit red light.

[0121] The second wavelength conversion portion WLC2 may be disposed in the second light emitting area LA2 on the first cover layer CAP1. The second wavelength conversion portion WLC2 may be surrounded by the first bank layer BK1 (e.g., around the periphery of the first bank layer BK1). The second wavelength conversion portion WLC2 may include a second base resin BS2, a second scatterer SCT2, and a second wavelength shifter WLS2.

[0122] The second base resin BS2 may include a suitable material having a relatively high light transmittance. The second base resin BS2 may be formed of a transparent organic material. For example, the second base resin BS2 may be formed of the same or substantially the same material as the first base resin BS1, or may include any of the materials provided above as examples for the first base resin BS1.

[0123] The second scatterer SCT2 may have a refractive index different from that of the second base resin BS2, and may form an optical interface with the second base resin BS2. For example, the second scatterer SCT2 may include a light scattering material or light scattering particles capable of scattering at least some of the transmitted light. For example, the second scatterer SCT2 may be formed of a material that is the same as or substantially the same as that of the first scatterer SCT1, or may include any of the materials provided above as examples for the first scatterer SCT1. The second scatterer SCT2 may scatter incident light in random directions without substantially changing the peak wavelength of the incident light, regardless of the incident direction of the incident light.

[0124] The second wavelength shifter WLS2 can convert or shift the peak wavelength of the incident light into a second peak wavelength different from the first peak wavelength. For example, the second wavelength shifter WLS2 can convert the blue light provided by the light-emitting layer LEL into green light having a single peak wavelength of 510nm to 550nm, and can emit green light. The second wavelength shifter WLS2 may include quantum dots, quantum rods, or phosphors. The second wavelength shifter WLS2 may include one or more of the materials provided above as examples for the first wavelength shifter WLS1. The second wavelength shifter WLS2 includes quantum dots, quantum rods, or phosphors that exhibit a wavelength conversion range different from the wavelength conversion range of the first wavelength shifter WLS1.

[0125] The light-transmitting portion LTU may be disposed in the third light-emitting area LA3 on the first cover layer CAP1. The light-transmitting portion LTU may be surrounded by the first bank layer BK1 (e.g., around the periphery of the first bank layer BK1). The light-transmitting portion LTU may transmit the incident light therethrough while maintaining or substantially maintaining the peak wavelength of the incident light. The light-transmitting portion LTU may include a third base resin BS3 and a third scatterer SCT3.

[0126] The third base resin BS3 may include a suitable material having a relatively high light transmittance. The third base resin BS3 may be formed of a transparent organic material. For example, the third base resin BS3 may be formed of the same or substantially the same material as the first base resin BS1 or the second base resin BS2, or may include any of the materials provided above as examples for the first base resin BS1.

[0127] The third scatterer SCT3 may have a refractive index different from that of the third base resin BS3, and may form an optical interface with the third base resin BS3. For example, the third scatterer SCT3 may include a light scattering material or light scattering particles capable of scattering at least some of the transmitted light. For example, the third scatterer SCT3 may be formed of a material that is the same as or substantially the same as that of the first scatterer SCT1 or the second scatterer SCT2, or may include any of the materials provided above as examples for the first scatterer SCT1. The third scatterer SCT3 may scatter incident light in random directions without substantially changing the peak wavelength of the incident light, regardless of the incident direction of the incident light.

[0128] Since the wavelength conversion layer WLCL is directly disposed on the encapsulation structure 170, the display panel 100 may not require a separate substrate for accommodating the first and second wavelength conversion portions WLC1 and WLC2 and the light-transmitting portion LTU. Therefore, the first and second wavelength conversion portions WLC1 and WLC2 and the light-transmitting portion LTU may be easily aligned within the first, second and third light-emitting areas LA1, LA2 and LA3, respectively, and the thickness of the display panel 100 may be reduced.

[0129] The second cover layer CAP2 may cover the first wavelength conversion portion WLC1 and the second wavelength conversion portion WLC2, the light-transmitting portion LTU, and the first bank layer BK1. For example, the second cover layer CAP2 may seal the first wavelength conversion portion WLC1 and the second wavelength conversion portion WLC2 and the light-transmitting portion LTU, thereby preventing or substantially preventing the first wavelength conversion portion WLC1 and the second wavelength conversion portion WLC2 and the light-transmitting portion LTU from being damaged or contaminated. The second cover layer CAP2 may be formed of the same or substantially the same material as that of the first cover layer CAP1, or may include any of the materials for the first cover layer CAP1 provided above as examples.

[0130] The low refractive index layer LRL as an optical layer for recycling light passing through the first and second wavelength conversion portions WLC1, WLC2 and the light-transmitting portion LTU may improve luminous efficiency and color purity. The low refractive index layer LRL may be formed of an organic material having a low refractive index. The low refractive index layer LRL may compensate for a step formed by the first and second wavelength conversion portions WLC1, WLC2, the light-transmitting portion LTU and the first bank layer BK1.

[0131] In some embodiments, a cover layer may be additionally disposed between the low refractive index layer LRL and the color filter layer CFL.

[0132] The color filter layer CFL may include a second bank layer BK2 , first, second, and third color filters CF1 , CF2 , and CF3 , and a third capping layer CAP3 .

[0133] The second embankment layer BK2 may be disposed in the non-luminous area NLA on the low refractive index layer LRL of the wavelength conversion layer WLCL. The second embankment layer BK2 may overlap with the pixel defining film PDL and the first embankment layer BK1 in the thickness direction. The second embankment layer BK2 may block the transmission of light. The second embankment layer BK2 may improve color reproduction by preventing or substantially preventing light intrusion and color mixing between the first luminous area LA1, the second luminous area LA2, and the third luminous area LA3. In a plan view, the second embankment layer BK2 may be arranged in a grid pattern surrounding the first luminous area LA1, the second luminous area LA2, and the third luminous area LA3 (e.g., around the periphery of the first luminous area LA1, the second luminous area LA2, and the third luminous area LA3).

[0134] The first color filter CF1 may be disposed in the first light emitting area LA1 on the low refractive index layer LRL. The first color filter CF1 may be surrounded by the second bank layer BK2 (e.g., around the periphery of the second bank layer BK2). The first color filter CF1 may overlap with the first wavelength conversion portion WLC1 in the thickness direction. The first color filter CF1 may selectively transmit the first color light (e.g., red light) therethrough, and block or absorb the second color light (e.g., green light) and the third color light (e.g., blue light). For example, the first color filter CF1 may be a red color filter and may include a red colorant. The red colorant may include or consist of a red dye or a red pigment.

[0135] The second color filter CF2 may be disposed in the second light emitting area LA2 on the low refractive index layer LRL. The second color filter CF2 may be surrounded by the second bank layer BK2 (e.g., around the periphery of the second bank layer BK2). The second color filter CF2 may overlap with the second wavelength conversion portion WLC2 in the thickness direction. The second color filter CF2 may selectively transmit the second color light therethrough and block or absorb the first color light and the third color light. For example, the second color filter CF2 may be a green color filter and may include a green colorant. The green colorant may include or consist of a green dye or a green pigment.

[0136] The third color filter CF3 may be disposed in the third light emitting area LA3 on the low refractive index layer LRL. The third color filter CF3 may be surrounded by the second bank layer BK2 (e.g., around the periphery of the second bank layer BK2). The third color filter CF3 may overlap with the third wavelength conversion portion WLC3 in the thickness direction. The third color filter CF3 may selectively transmit the third color light therethrough and block or absorb the first color light and the second color light. For example, the third color filter CF3 may be a blue color filter and may include a blue colorant. The blue colorant may include or consist of a blue dye or a blue pigment.

[0137] The first color filter CF1, the second color filter CF2, and the third color filter CF3 may reduce reflection of external light from outside the display panel 100 by absorbing a portion of the incident external light. Therefore, the first color filter CF1, the second color filter CF2, and the third color filter CF3 help prevent or substantially prevent color distortion that may be caused by reflected external light.

[0138] Since the first color filter CF1, the second color filter CF2, and the third color filter CF3 are directly disposed on the low refractive index layer LRL of the wavelength conversion layer WLCL, the display panel 100 may not require a separate substrate for accommodating the first color filter CF1, the second color filter CF2, and the third color filter CF3. Therefore, the thickness of the display panel 100 may be reduced.

[0139] The third cover layer CAP3 may cover the first color filter CF1, the second color filter CF2, and the third color filter CF3. The third cover layer CAP3 may protect the first color filter CF1, the second color filter CF2, and the third color filter CF3. The third cover layer CAP3 may be formed of the same or substantially the same material as the first cover layer CAP1, or may include any one of the materials for the first cover layer CAP1 provided above as examples.

[0140] The overcoat layer OC may be disposed on the third cover layer CAP3 of the color filter layer CFL. The overcoat layer OC may be disposed across the entire display area DA or substantially the entire display area DA, and may also be disposed in a portion of the non-display area NDA. The overcoat layer OC may include an organic insulating material, and may protect components disposed in the display area DA from external influences.

[0141] Figure 6 yes Figure 3 A perspective view of a bottom surface of a substrate of a display panel. Figure 7 It is shown Figure 3 A plan view of a bottom surface of a substrate of a display panel. Figure 8 It is along Figure 7 A cross-sectional view taken along line X1-X1'.

[0142] Reference Figures 6 to 8 and Figures 1 to 4 , the substrate 110 of the display panel 100 may include a bottom surface portion ETC and a step portion NETC disposed on the bottom surface BS of the display panel 100 .

[0143] The bottom surface portion ETC may overlap with the display area DA, the non-display area NDA, and the pad area PDA in the third direction DR3. The bottom surface portion ETC may be thinner than the step portion NETC. For example, the bottom surface portion ETC may have a thickness of about 100 μm (e.g., in the third direction DR3). The bottom surface portion ETC may be an etched portion obtained by partially etching the substrate 110. The bottom surface portion ETC may not overlap with the wiring pad WPD disposed near the top surface US of the display panel 100.

[0144] Since the bottom surface portion ETC is thinner than the step portion NETC, when the display device 10 is rolled into or unfolded from the housing 20 , the display panel 100 may be flexibly rolled.

[0145] The step portion NETC may overlap with the pad area PDA in the third direction DR3. The step portion NETC may be thicker than the bottom surface portion ETC. For example, the step portion NETC may have a thickness of about 500 μm (e.g., in the third direction DR3). The step portion NETC may be an unetched portion of the substrate 110. The step portion NETC may overlap with the wiring pad WPD.

[0146] The step portion NETC may be a bonding portion for mounting the connection film COF on the wiring pad WPD. Since the step portion NETC is thicker than the bottom surface portion ETC, the substrate 110 may be prevented or substantially prevented from being damaged by high temperature and high pressure during bonding of the connection film COF.

[0147] A plurality of step portions NETC may be formed. The step portions NETC may be spaced apart from each other in the first direction DR1. The bottom surface portion ETC may be located between the step portions NETC.

[0148] Fig. 9 is a perspective view of a support member according to an embodiment of the present disclosure. Fig.10 It is shown Fig. 9 A plan view of the front surface of a support member. Fig.11 It is along Fig.10 A cross-sectional view taken along line X2-X2'.

[0149] Reference Figures 9 to 11 and Figures 1 to 4 , the supporting member 200 may include a main portion MPR, a protruding portion PRT, and a recessed portion DPR.

[0150] The main portion MPR may overlap the display area DA and the non-display area NDA in the third direction DR3. The shape of the main portion MPR may correspond to the shapes of the display area DA and the non-display area NDA.

[0151] The protrusion portion PRT may protrude from the main portion MPR. For example, the protrusion portion PRT may protrude from the main portion MPR in a direction opposite to the second direction DR2. The protrusion portion PRT may overlap the pad area PDA in the third direction DR3. A plurality of protrusion portions PRT may be formed. The protrusion portions PRT may be spaced apart from each other in the first direction DR1.

[0152] The recessed portion DPR may be disposed at one side of the main portion MPR. For example, the recessed portion DPR may be positioned at one side of the main portion MPR in a direction opposite to the second direction DR2. The recessed portion DPR may be disposed between the protruding portions PRT. A plurality of recessed portions DPR may be formed. The recessed portions DPR may be spaced apart from each other in the first direction DR1 and may be disposed between the protruding portions PRT.

[0153] Fig.12 It is shown Figure 6 The display panel substrate and Fig. 9 A perspective view of a joint state of a supporting member.

[0154] Reference Fig.12 and Figures 6 to 11, the support member 200 may be bonded to the bottom surface BS of the display panel 100. The support member 200 may include a suitable material having high rigidity and high flexibility. Therefore, when the display panel 100 is ejected from the housing 20, the support member 200 may support the display panel 100 to maintain or substantially maintain its shape. When the display panel 100 is inserted into the housing 20, the support member 200 may also be rolled up together with the display panel 100 and inserted into the housing 20.

[0155] The support member 200 may compensate for the step formed by the step portion NETC of the substrate 110, and may flatten the entire display device 10. For example, the step portion NETC of the substrate 110 may be inserted into the recessed portion DPR of the support member 200. When the display panel 100 and the support member 200 are bonded together, the step portion NETC of the substrate 110 and the protruding portion PRT of the support member 200 may be alternately arranged. The thickness of the support member 200 may be the same or substantially the same as the thickness of the step portion NETC of the substrate 110 to compensate for the step formed by the step portion NETC of the substrate 110.

[0156] The substrate 110 may include a step portion NETC, which may prevent or substantially prevent damage to the substrate 110 during bonding of an external device such as a connection film COF. Since the display device 10 includes a protruding portion PRT and a recessed portion DPR in the support member 200, a step formed by the step portion NETC may be compensated and the step portion NETC may be flattened. Therefore, a roller-based lamination process such as a roll-to-roll or roll-to-table type process may be employed to bond the display panel 100 and the support member 200 to each other, which may result in improved process efficiency and yield.

[0157] In a plan view, the support member 200 may have a size larger than that of the display panel 100. Therefore, a space for accommodating a coupling portion for coupling an external device may be additionally ensured.

[0158] In the following we will refer to Figures 13 to 16 The compensation of the step by the support member 200 and the fixation of the bonding space are described in more detail.

[0159] Fig.13 is a plan view of a display device according to an embodiment of the present disclosure. Fig.14 It is along Fig.13 A cross-sectional view taken along line X3-X3'. Fig.15 It is along Fig.13 A cross-sectional view taken along line X4-X4'. Fig.16 It is along Fig.13 A cross-sectional view taken along line X5-X5'.

[0160] Reference Figures 13 to 16 , the support member 200 may be bonded to the bottom surface BS of the display panel 100. The first end of the connection film COF may be mounted on the wiring pad WPD provided in the pad area PDA of the display panel 100. The driver chip DIC may be mounted in the middle portion of the connection film COF, and the circuit board PCB may be mounted at the second end of the connection film COF.

[0161] like Fig.15 As shown in FIG. 1 , a portion of the bottom surface portion ETC of the substrate 110 may overlap the display area DA and the non-display area NDA in the third direction DR3. Fig.16 As shown in , another portion of the bottom surface portion ETC of the substrate 110 may extend into the pad area PDA and may overlap the pad area PDA in the third direction DR3.

[0162] The step portion NETC of the substrate 110 may overlap the pad area PDA in the third direction DR3 . The wiring pad WPD may be disposed on the step portion NETC of the substrate 110 .

[0163] like Fig.15 and Fig.16 As shown in FIG. 2 , the main portion MPR of the support member 200 may overlap the display area DA and the non-display area NDA in the third direction DR3. Fig.15 As shown in FIG. 2 , the recessed portion DPR of the support member 200 may overlap the pad area PDA in the third direction DR3. Fig.16 As shown in FIG. 2 , the protrusion portion PRT of the support member 200 may overlap the pad area PDA in the third direction DR3 .

[0164] like Figures 14 to 16 As shown in , the step portion NETC of the substrate 110 may overlap with the recessed portion DPR of the support member 200 in the third direction DR3, and the bottom surface portion ETC of the substrate 110 may overlap with the protruding portion PRT of the support member 200 in the third direction DR3. The step portion NETC of the substrate 110 and the recessed portion DPR of the support member 200 may overlap with the wiring pad WPD and the connection film COF.

[0165] The thickness T1 of the bottom surface portion ETC of the substrate 110 may be smaller than the thickness T2 of the step portion NETC of the substrate 110. The thickness T3 of the protrusion portion PRT of the support member 200 may be smaller than the thickness T2 of the step portion NETC of the substrate 110. The thickness T2 of the step portion NETC of the substrate 110 may be the same as the sum of the thickness T1 of the bottom surface portion ETC of the substrate 110 and the thickness T3 of the protrusion portion PRT of the support member 200. Therefore, as Fig.15As shown in FIG. 1 , a bottom surface of the substrate 110 and a bottom surface of the support member 200 may be horizontally aligned with each other or substantially aligned with each other in the first direction DR1 and the second direction DR2 .

[0166] The display device 10 may include a step portion NETC for preventing or substantially preventing damage to the substrate 110 during bonding of an external device such as a connection film COF. Since the display device 10 includes a protruding portion PRT and a recessed portion DPR in the support member 200, a step formed by the step portion NETC may be compensated and flattened. Therefore, a roller-based lamination process such as a roll-to-roll or roll-to-table type process may be employed to bond the display panel 100 and the support member 200, thereby resulting in improved process efficiency and yield.

[0167] In a plan view, the support member 200 may have a size larger than that of the display panel 100. For example, Fig.15 and Fig.16 As shown in , one end of the support member 200 may protrude in the second direction DR2 beyond the corresponding end of the substrate 110 by a first length D1. The other end (e.g., the opposite end) of the support member 200 may protrude in the second direction DR2 beyond the corresponding end of the substrate 110 by a second length D2. In the second direction DR2, the length of the protruding portion PRT may be greater than the length of the step portion NETC. Therefore, a space for accommodating a coupling portion for coupling an external device may be additionally ensured.

[0168] Various display devices according to some embodiments of the present disclosure will be described in more detail below. Hereinafter, the same reference numerals are used to represent elements that are the same or substantially the same (or similar) as the above-mentioned elements, and therefore, their redundant descriptions may not be repeated or may be simplified, and the differences may be mainly described below.

[0169] Figures 17 to 19 is a cross-sectional view of a display device according to some embodiments of the present disclosure.

[0170] Figures 17 to 19 The display device 10 shown in FIG. Figures 14 to 16 The described display device 10 may be different in that the support member 200 may further include a lower end portion BTM.

[0171] In more detail, the supporting member 200 may include the main portion MPR, the recessed portion DPR, and the protruding portion PRT, but may further include a lower end portion BTM. The lower end portion BTM may be disposed below the main portion MPR, the recessed portion DPR, and the protruding portion PRT.

[0172] The lower end portion BTM may overlap with the main portion MPR, the recessed portion DPR, and the protruding portion PRT in the third direction DR3. The lower end portion BTM may be disposed on the entire surface or substantially the entire surface of the support member 200. The lower end portion BTM may overlap with the step portion NETC and the bottom surface portion ETC of the substrate 110 in the third direction DR3. The bottom surface of the lower end portion BTM may be flat or substantially flat.

[0173] The sum of the thickness T3' of the support member 200 (including the lower end portion BTM) and the thickness T1 of the bottom surface portion ETC of the substrate 110 may be greater than the thickness T2 of the step portion NETC of the substrate 110. Even if the sum of the thickness T3' of the support member 200 and the thickness T1 of the bottom surface portion ETC of the substrate 110 is greater than the thickness T2 of the step portion NETC of the substrate 110, the bottom surface of the display device 10 may be substantially flat due to the flat bottom surface or substantially flat bottom surface of the lower end portion BTM.

[0174] Since the display device 10 includes the protruding portion PRT, the recessed portion DPR, and the lower end portion BTM in the support member 200, similar to the above-mentioned corresponding parts, the step formed by the step portion NETC of the substrate 110 can be compensated and flattened. Therefore, a roll-based lamination process (such as a roll-to-roll or roll-to-table type process) can be adopted to bond the display panel 100 and the support member 200 to each other, resulting in improved process efficiency and yield.

[0175] Fig. 20 is a cross-sectional view of a display device according to an embodiment of the present disclosure.

[0176] Fig. 20 The display device 10 shown in FIG. Fig.15 The display device 10 shown in FIG. 1 may be different in that the side of the main portion MPR of the support member 200 may not contact the side of the step portion NETC of the substrate 110 .

[0177] In more detail, in the second direction DR2, the size of the recessed portion DPR of the support member 200 may be greater than the size of the stepped portion NETC of the substrate 110. Therefore, the second end END1 of the main portion MPR of the support member 200 may be spaced apart from the first end END2 of the stepped portion NETC of the substrate 110 by a third length D3. In other words, the side of the main portion MPR of the support member 200 may not contact the side of the stepped portion NETC of the substrate 110.

[0178] Therefore, the display device 10 may improve the accuracy of the attachment process by ensuring the attachment tolerance between the display panel 100 and the support member 200 .

[0179] The foregoing is an illustration of some embodiments of the present disclosure and should not be construed as limiting thereof. Although some embodiments have been described, it will be readily appreciated by those skilled in the art that, without departing from the spirit and scope of the present disclosure, various modifications can be made in the embodiments. It will be understood that, unless otherwise described, the description of the features or aspects in each embodiment should generally be considered to be applicable to other similar features or aspects in other embodiments. Therefore, as will be apparent to those of ordinary skill in the art, unless otherwise specifically noted, the features, characteristics and / or elements described in conjunction with the specific embodiments may be used alone or in combination with the features, characteristics and / or elements described in conjunction with other embodiments. Therefore, it will be understood that the foregoing is an illustration of various example embodiments and should not be construed as being limited to the specific embodiments disclosed herein, and that various modifications to the disclosed embodiments and other example embodiments are intended to be included in the spirit and scope of the present disclosure as defined in the appended claims and their equivalents.

Claims

1. A display device, characterized in that: The display device comprises: A display panel includes: a substrate; a light emitting layer on a first surface of the substrate; and a wiring pad on the first surface of the substrate and adjacent to one side of the substrate; and a supporting member on a second surface of the substrate opposite to the first surface of the substrate, wherein the substrate comprises: a step portion protruding from the second surface in a thickness direction of the substrate, and Wherein, the step portion overlaps the wiring pad.

2. The display device according to claim 1, characterized in that The substrate further includes: a bottom surface portion on the entire second surface except for the step portion, and The bottom surface portion does not overlap the wiring pad.

3. The display device according to claim 2, characterized in that: The thickness of the bottom surface portion is smaller than the thickness of the step portion.

4. The display device according to claim 1, characterized in that The supporting member comprises: a main portion overlapping the light emitting layer; and A protruding portion protrudes from the main portion in a direction toward the stepped portion of the substrate.

5. The display device according to claim 4, characterized in that: The step portion includes a plurality of step portions, The protruding portion includes a plurality of protruding portions, and The plurality of step portions and the plurality of protruding portions are alternately positioned.

6. The display device according to claim 4, characterized in that: The substrate further includes: a bottom surface portion on the entire second surface except for the step portion, and The bottom surface portion overlaps the protruding portion of the support member.

7. The display device according to claim 4, characterized in that: In an extending direction of the protruding portion, a length of the protruding portion is greater than a length of the step portion.

8. The display device according to claim 4, characterized in that: The support member further includes a lower end portion below the main portion and the protruding portion, and The lower end portion overlaps the step portion and the bottom surface portion.

9. The display device according to claim 4, characterized in that: Side surfaces of the main portion are spaced apart from side surfaces of the step portion.

10. A rollable electronic device, characterized in that: The rollable electronic device comprises: A display device, the display device comprising a display panel including a substrate, a light emitting layer on one surface of the substrate, and a wiring pad on the one surface of the substrate and adjacent to one side of the substrate, and a supporting member on another surface of the substrate opposite to the one surface of the substrate; and a housing having an inner space in which the display device is configured to be rolled or unfolded, wherein the base includes a stepped portion protruding in a direction toward the support member, wherein the support member includes a protruding portion protruding in a direction toward the step portion, and Wherein, the step portions and the protruding portions are positioned alternately.

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