Linear cutting clamp for selective laser melting substrate

Abstract

The utility model provides a linear cutting clamp for a selective laser melting substrate. Comprising a dovetail sliding groove base, a hand wheel, a lead screw, a fixing plate, a dragging plate, a rotating plate, a rotating positioning screw, a rotating adjusting screw, a rotating locking nut, a rotating limiting baffle, a sliding block, an inclination angle adjusting screw, an inclination angle locking nut, a sliding block limiting baffle, a supporting rod, a hinge, a mounting plate, a rotating shaft and a base plate. The planker is connected with a dovetail groove base through a screw rod, the rotary positioning screw is connected with the planker through an arc groove formed in the top face of the rotary plate, the rotary adjusting screw is connected with the rotary limiting baffle and makes contact with the rotary plate, and the dip angle adjusting screw penetrates through the sliding block limiting baffle to be connected with the sliding block and connected with the dip angle locking nut. The mounting plate is connected with the rotating plate through a hinge and a rotating shaft, and the base plate is connected with the mounting plate through a bolt. The cutting position of the substrate sample can be adjusted, the selective laser melting forming sample can be prevented from being overcut or undercut, and the cutting efficiency of the selective laser melting substrate sample is improved.

Description

Technical Field

[0001] The utility model patent relates to the technical field of wire cutting machine tool fixtures, and in particular to a wire cutting fixture for laser selective melting substrates. Background Art

[0002] Parts formed by laser selective melting technology are formed by spreading powder layer by layer on the substrate and stacking them by laser scanning. The substrate and the formed part need to be separated by wire cutting. At present, the traditional method of combining screws and pressure plates is often used for clamping, and the formed part is separated from the substrate after wire cutting. In actual use, after the pressure plate applies a preload, the position of the substrate shifts. It is not easy to quickly and accurately adjust the cutting position of the substrate by knocking with a rubber hammer to correct the position of the substrate and the molybdenum wire, which can easily cause damage to the substrate or the formed part. Therefore, it is necessary to provide a laser selective melting substrate cutting fixture to solve the above technical problems. Summary of the invention

[0003] The purpose of the utility model is to provide a laser selective melting substrate wire cutting fixture, which can adjust the position of the substrate and the molybdenum wire in real time to keep the relative position of the substrate and the wire cutting molybdenum wire unchanged, thereby making the cut surface of the laser selective melting substrate forming sample relatively smooth, avoiding bevel incisions, reducing auxiliary adjustment time, and improving cutting efficiency.

[0004] The solution adopted by the utility model to solve its technical problems is: a laser selective melting substrate wire cutting fixture, including a dovetail slide base, a hand wheel, a screw, a fixed plate, a drag plate, a rotating plate, a rotating positioning screw, a rotating adjustment screw, a rotating locking nut, a rotating limit baffle, a slider, an inclination adjustment screw, an inclination locking nut, a slider limit baffle, a support rod, a hinge, a mounting plate, a rotating shaft and a substrate; wherein the slider limit baffle and the rotating plate limit baffle are spatially staggered, the slider limit baffle spatial position is located above the symmetry center of the rotation limit baffle, the slider is an inverted T-shape, and the pin hole at the upper end of the slider is connected to the support rod, the mounting plate is a T-slot structure, and the size of the mounting plate is larger than the laser selective melting substrate.

[0005] The slide plate is connected to the dovetail groove base screw, the front end of the screw rod is threadedly connected to the handwheel, the rotation positioning screw is connected to the slide plate through the open arc groove on the top surface of the rotating plate, the rotation limit baffle is symmetrically fixedly installed on the front wall of the slide plate, the rotation adjustment screw is connected to the rotation limit baffle and contacts the rotating plate, the slider is slidably connected to the rotating plate, the slider limit baffle is centrally installed at the countersunk head on the front wall of the rotating plate, the inclination adjustment screw passes through the slider limit baffle and connects the slider, the inclination adjustment screw is connected to the inclination locking nut, one end of the support rod is connected to the slider pin hole, the other end of the support rod is hinged to the mounting plate, the mounting plate is connected to the rotating plate through a hinge and a rotating shaft, and the base plate is connected to the mounting plate through bolts.

[0006] Compared with the related art, the laser selective melting substrate wire cutting fixture provided by the utility model has the following beneficial effects: when wire cutting the formed sample on the laser selective melting substrate, the substrate position can be quickly and accurately adjusted through the fixture, so that the wire cutting molybdenum wire and the substrate are kept horizontally and vertically, the inclination of the cutting surface is reduced, the damage of the substrate and the sample is avoided, and the cutting accuracy and efficiency of the substrate formed sample are improved. BRIEF DESCRIPTION OF THE DRAWINGS

[0007] Figure 1 A schematic diagram of the structure of a laser selective melting substrate wire cutting fixture provided by the utility model;

[0008] Figure 2 It is a partial schematic diagram of the installation of the substrate of the utility model;

[0009] Figure 3 This is a partial cross-sectional view of the internal structure of the slider connection of the utility model.

[0010] The numbers in the figure include: 1. base, 2. hand wheel, 3. screw, 4. fixed plate, 5. drag plate, 6. rotating plate, 7. rotating positioning screw, 8. rotating adjustment screw, 9. rotating locking nut, 10. rotating limit baffle, 11. slider, 12. inclination adjustment screw, 13. inclination locking nut, 14. slider limit baffle, 15. support rod, 16. hinge, 17. mounting plate, 18. rotating shaft, 19. base plate. DETAILED DESCRIPTION

[0011] In this utility model, for the convenience of description, the relative positions of various components are described according to the attached Figure 1 The layout is described in detail, such as: the position relationship of top, bottom, left, right, front, back, inside, outside, etc. is based on the instructions attached Figure 1 Determined by the layout direction.

[0012] Embodiment 1, a laser selective melting substrate wire cutting fixture, the screw rod 3 is connected between the drag plate 5 and the base 1, one end of the screw rod 3 is threadedly connected to the handwheel 2, the rotation positioning screw 7 is connected to the drag plate 5 through the open arc groove on the top surface of the rotating plate 6, the rotation limit baffle 10 is symmetrically installed on the front wall of the drag plate 5, the rotation adjustment screw 8 is connected to the rotation limit baffle 10 and contacts the rotating plate 6, the slider 11 is slidably connected to the rotating plate 6, the slider limit baffle 14 is centrally installed at the countersunk head of the front wall of the rotating plate 6, the inclination adjustment screw 12 passes through the slider limit baffle 14 to connect the slider 11, the inclination adjustment screw 12 is connected to the inclination locking nut 13, one end of the support rod 15 is connected to the pin hole of the slider 11, the other end of the support rod 15 is hinged to the mounting plate 17, the mounting plate 17 is connected to the rotating plate 6 through the hinge 16 and the rotating shaft 18, and the substrate 19 is connected to the mounting plate 17 through bolts.

[0013] In practical operation, adjust the wire-cut molybdenum wire and the two guide rails of the wire-cut machine tool to be parallel to each other, fix the base 1 on the wire-cut guide rail with countersunk screws, fix the base plate 19 to the mounting plate 17 with screws, turn the handwheel 2, adjust the horizontal position of the molybdenum wire and the base plate 19, loosen the rotation positioning screw 7, and the top surface of the rotating plate 6 rotates along the open arc groove along the rotation positioning screw 7. The rotating adjustment screw 8 drives the rotating plate 6 to rotate so that the left and right sides of the base plate 19 are consistent with the position of the molybdenum wire, apply a pre-tightening force to the rotation positioning screw 7 to fix the rotating plate 8, and rotate the locking nut 9 to lock the rotation adjustment screw 8. Adjust the longitudinal horizontal position of the molybdenum wire and the substrate 19, rotate the inclination adjustment screw 12 to drive the slider 11 to move forward and backward, the slider 11 drives the support rod 15 to move forward and backward, and the mounting plate 17 rotates along the rotating shaft 18 to make the upper and lower sides of the substrate 19 consistent with the wire-cut molybdenum wire. At the same time, the inclination locking nut 13 is synchronously locked to make the substrate horizontal and longitudinal directions The state is in a horizontal state with the wire-cut molybdenum wire, so that the formed sample on the substrate 19 and the molybdenum wire always remain parallel and not overcut at the cutting position.

[0014] The above description is only an embodiment of the present invention, and does not limit the patent scope of the present invention. Any equivalent structure or equivalent process transformation made by using the contents of the specification and drawings of the present invention, or directly or indirectly applied in other related technical fields, are also included in the patent protection scope of the present invention.

Claims

1. A laser selective melting substrate wire cutting fixture, comprising: A base (1), a hand wheel (2), a screw rod (3), a fixed plate (4), a carriage (5), a rotating plate (6), a rotating positioning screw (7), a rotating adjustment screw (8), a rotating locking nut (9), a rotating limit baffle (10), a slider (11), an inclination adjustment screw (12), an inclination locking nut (13), a slider limit baffle (14), a support rod (15), a hinge (16), a mounting plate (17), a rotating shaft (18), and a base plate (19); wherein the carriage (5) is connected to the dovetail groove base (1) by a screw rod (3), one end of the screw rod (3) is threadedly connected to the hand wheel (2), the rotating positioning screw (7) is connected to the carriage (5) through an open arc groove on the top surface of the rotating plate (6), and the front of the carriage (5) A rotation limit baffle (10) is symmetrically mounted on the wall, a rotation adjustment screw (8) is connected to the rotation limit baffle (10) and contacts the rotation plate (6), a slider (11) is slidably connected to the rotation plate (6), a slider limit baffle (14) is centrally mounted at the countersunk head of the front wall of the rotation plate (6), an inclination adjustment screw (12) passes through the slider limit baffle (14) and is connected to the slider (11), the inclination adjustment screw (12) is connected to the inclination locking nut (13), one end of a support rod (15) is connected to a pin hole of the slider (11), the other end of the support rod (15) is hingedly connected to a mounting plate (17), the mounting plate (17) is connected to the rotation plate (6) through a hinge (16) and a rotating shaft (18), and a base plate (19) is connected to the mounting plate (17) through a bolt.

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