Thermal expansion matched alloy and ceramic bonding mechanism

Through thermal expansion matching alloy and ceramic bonding mechanism, the movable connection and limiting mechanism are used to solve the problem of fixed type of the transmitter transducer mold and the skewed guide plate, which realizes accurate bonding and flexible adjustment of the guide plate, and improves bonding Accuracy and convenience.

CN222296659UActive Publication Date: 2025-01-03CHONGQING BOCHUANG SHENGYUAN TECH CO LTD
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Patent Information

Application Number
CN202421258062.8
Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
Filing Date
2024-06-04
Publication Date
2025-01-03
Estimated Expiration
2034-06-04

AI Technical Summary

Technical Problem

The existing alloy and ceramic bonding mold fixed type of the emission transducer limits the scope of use, and the guide plates are prone to be skewed or non-parallel during the bonding process.

Method used

A thermal expansion matching alloy and ceramic bonding mechanism is designed to achieve the accuracy of the guide plate through the movable connection between the emission mold cavity and the main body, the pressure-relieving effect of the polyfluoro block, and the limiting mechanism of the limiting pad and the limiting bar. Bonding and flexible adjustment.

Benefits of technology

It improves bonding accuracy and ease of use, can adjust and quickly disassemble according to different guide plate specifications, avoiding mold displacement and guide plate skew.

✦ Generated by Eureka AI based on patent content.

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Abstract

The utility model relates to a thermal expansion matched alloy and ceramic bonding mechanism which comprises a launching die body and further comprises two launching die cavities symmetrically arranged on the two sides of the launching die body. The poly-fluorine block is movably connected to the upper part of the emission mold main body; the number of the limiting cushion blocks is two, and the limiting cushion blocks are arranged on the corresponding emission mold cavities; the number of the limiting strips is two, and the limiting strips are movably connected to the corresponding emission mold cavities. The beneficial effects of the utility model lie in that: through the movable connection of launching mould cavity and launching mould main part, this device can be adjusted according to different guide vane specifications and can realize quick dissembling, through the spacing cushion block and the spacing block can limit the multilayer guide vane, make the position more accurate in the bonding process of multilayer guide vane, and the production efficiency is improved. And compared with traditional bonding equipment, the bonding precision and the use convenience can be greatly improved.
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Description

Technical Field

[0001] The utility model relates to the technical field of acoustic detection, in particular to an alloy and ceramic bonding mechanism with thermal expansion matching. Background Art

[0002] The transmitting transducer is an ultrasonic device that uses electrical signals to excite the acoustic vibration system and convert electrical energy into ultrasonic energy to achieve the emission of sound waves. The transmitting transducer is usually composed of materials such as piezoelectric ceramics and chip capacitors. Its working principle is to use the piezoelectric effect to make the piezoelectric ceramics vibrate, and then achieve resonance through the chip capacitor to generate ultrasonic waves. According to different functions, the transmitting transducer can be divided into three types: transmitter, receiver and transceiver.

[0003] At present, when bonding alloys and ceramics for transmitting transducers, the bonding molds are mostly fixed, that is, only one specification can be bonded, which limits the use of the mold. In addition, the molds at this stage are also prone to displacement during the bonding process, resulting in skewed or non-parallel bonding of the multi-layer guide plates.

[0004] Based on this, those skilled in the art have proposed a thermal expansion matching alloy and ceramic bonding mechanism. Utility Model Content

[0005] In view of the above problems existing in the prior art, the main purpose of the utility model is to provide an alloy and ceramic bonding mechanism with matched thermal expansion.

[0006] The technical solution of the utility model is as follows: a thermal expansion matching alloy and ceramic bonding mechanism, including a launch mold body, and also includes:

[0007] A launching mold cavity, wherein two launching mold cavities are provided and are symmetrically arranged on both sides of the launching mold body;

[0008] A polyfluorine block, wherein the polyfluorine block is movably connected above the launch mold body;

[0009] A limiting pad, wherein two limiting pads are provided and are arranged on the corresponding emission mold cavity;

[0010] The limiting bars are provided in two and are movably connected to the corresponding emission mold cavity.

[0011] Through the above-mentioned technical means, the launch mold cavity can be movably connected to the launch mold body, but there needs to be a certain friction between the two, which can be achieved by controlling the tolerance of the mating parts. The polyfluoride block is used to prevent the guide plate from directly contacting the launch mold body through the characteristics of the material, which can play a certain pressure-relieving role. The limit pads and limit strips are both used to limit the guide plate.

[0012] As a preferred embodiment, four insertion holes are symmetrically opened at both ends of the launch mold body, and two sliding rods are symmetrically fixedly connected to the adjacent sides of the two launch mold cavities, and the sliding rods are slidably connected to the corresponding insertion holes.

[0013] Through the above technical means, a tolerance fit should be set between the slide rod and the socket to avoid excessive looseness causing displacement of the launch mold body and the launch mold cavity during bonding.

[0014] As a preferred embodiment, a first step is provided at the top of the launch mold cavity, a second step is provided at the top of the launch mold cavity and on one side of the first step, and the height of the second step is lower than the height of the first step.

[0015] Through the above-mentioned technical means, because multiple guide plates are bonded together, the first layer of guide plates are directly placed on the polyfluoride block and the length is limited by the second step. The second layer of guide plates are placed on the first layer of guide plates, and their two ends are limited by contacting with the limiting pads. The third layer of guide plates are placed on the second layer of guide plates, and their two ends are limited by contacting with the limiting strips.

[0016] As a preferred implementation, a notch penetrating the structure is provided on the top of the launch mold body and above the second step, and the limit strip is used in conjunction with the notch.

[0017] Through the above technical means, the limiting strips can be conveniently placed by setting the notches, and it is also possible to choose whether to place the limiting strips according to the number of layers of the guide plates, and it can be adjusted according to different situations.

[0018] As a preferred embodiment, the size of the polyfluorine block is consistent with that of the launch mold body.

[0019] Through the above technical means, the polyfluorine block is placed on the launch mold body to ensure sufficient contact area with the guide piece.

[0020] Compared with the prior art, the advantages and positive effects of the utility model are:

[0021] The utility model flexibly connects the launch mold cavity with the launch mold body, so that the device can be adjusted according to different guide plate specifications and can be quickly disassembled. The multi-layer guide plates can be limited by the limit pads and the limit blocks, so that the position of the multi-layer guide plates during the bonding process is more accurate. Compared with traditional bonding equipment, the bonding accuracy and ease of use can be greatly improved. BRIEF DESCRIPTION OF THE DRAWINGS

[0022] Figure 1 It is an exploded view of the utility model;

[0023] Figure 2 It is a combined view of the utility model;

[0024] Figure 3 It is a first isometric view of the launch mold cavity of the utility model;

[0025] Figure 4 This is a second isometric view of the launch mold cavity of the present invention.

[0026] Legend: 1. Launching mold body; 2. Launching mold cavity; 3. Sliding rod; 4. Socket; 5. Polyfluorine block; 6. First step; 7. Second step; 8. Limiting pad; 9. Notch; 10. Limiting strip. DETAILED DESCRIPTION

[0027] In order to make the purpose, technical solutions and advantages of the embodiments of the utility model clearer, the technical solutions in the embodiments of the utility model will be clearly and completely described below in conjunction with the drawings in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments.

[0028] The present invention will be further described below with reference to the accompanying drawings and specific embodiments.

[0029] Example

[0030] like Figure 1-Figure 4 As shown, the utility model provides a thermal expansion matching alloy and ceramic bonding mechanism: comprising a launch mold body 1, and also comprising:

[0031] A launching mold cavity 2, wherein two launching mold cavities 2 are arranged symmetrically on both sides of the launching mold body 1;

[0032] A polyfluorine block 5, which is movably connected to the upper part of the launch mold body 1;

[0033] A limiting pad 8, wherein two limiting pads 8 are provided and are arranged on the corresponding emission mold cavity 2;

[0034] Limiting bars 10, two limiting bars 10 are provided and movably connected to the corresponding emission mold cavity 2;

[0035] In summary: the launch mold cavity 2 can be movably connected to the launch mold body 1, but there needs to be a certain friction between the two, which can be achieved by controlling the tolerance of the mating parts. The polyfluorine block 5 is used to prevent the guide plate from directly contacting the launch mold body 1 due to the characteristics of the material, and can play a certain pressure-relieving role. The limit pad 8 and the limit strip 10 are both used to limit the guide plate.

[0036] like Figure 1-Figure 4As shown, four insertion holes 4 are symmetrically provided at both ends of the launch mold body 1, and two sliding rods 3 are symmetrically fixedly connected to the adjacent sides of the two launch mold cavities 2, and the sliding rods 3 are slidably connected to the corresponding insertion holes 4;

[0037] In summary, a tolerance fit should be set between the slide bar 3 and the insertion hole 4 to avoid excessive looseness causing displacement of the launch mold body 1 and the launch mold cavity 2 during bonding.

[0038] like Figure 1-Figure 4 As shown, a first step 6 is provided at the top of the launch mold cavity 2, and a second step 7 is provided at the top of the launch mold cavity 2 and on one side of the first step 6, and the height of the second step 7 is lower than that of the first step 6;

[0039] In summary: because multiple guide plates are bonded together, the first layer of guide plates are directly placed on the polyfluoride block 5 and their length is limited by the second step 7. The second layer of guide plates are placed on the first layer of guide plates, and their two ends are limited by contacting with the limiting pads 8. The third layer of guide plates are placed on the second layer of guide plates, and their two ends are limited by contacting with the limiting strips 10.

[0040] like Figure 1-Figure 4 As shown, a notch 9 with a penetrating structure is provided at the top of the launch mold body 1 and above the second step 7, and a limit strip 10 is used in conjunction with the notch 9;

[0041] In summary: by providing the notch 9, the limiting strip 10 can be conveniently placed, and it can also be selected whether to place the limiting strip 10 according to the number of layers of the guide plate, and it can be adjusted according to different situations.

[0042] like Figure 1-Figure 4 As shown, the size of the polyfluorine block 5 is consistent with the launch mold body 1;

[0043] In summary: the polyfluorine block 5 is placed on the launch mold body 1 to ensure that it has sufficient contact area with the guide piece.

[0044] Working principle:

[0045] The launch mold cavity 2 is slidably connected to the launch mold body 1 through the socket 4 and the slide rod 3. The polyfluoride block 5 is used to prevent the guide plate from directly contacting the launch mold body 1 through the characteristics of the material, which can play a certain pressure-relieving role. Therefore, in actual use, the first layer of guide plates is directly placed on the polyfluoride block 5 and the length is limited by the second step 7. The second layer of guide plates is placed on the first layer of guide plates, and their two ends are limited by contacting with the limiting pads 8. The third layer of guide plates is placed on the second layer of guide plates, and their two ends are limited by contacting with the limiting strips 10. Through such an arrangement, after the bonding is completed, you only need to remove the limiting strips 10 to complete the disassembly of the guide plates, and the entire device can also be flexibly adjusted according to the different sizes of the guide plates.

[0046] Finally, it should be noted that the above-described embodiments are only used to illustrate the technical solution of the utility model, rather than to limit it. Although the utility model has been described in detail with reference to the aforementioned embodiments, those skilled in the art should understand that they can still modify the technical solutions described in the aforementioned embodiments, or replace some or all of the technical features therein with equivalents. However, these modifications or replacements do not cause the essence of the corresponding technical solutions to deviate from the scope of the technical solutions of the various embodiments of the utility model.

Claims

1. A thermal expansion matching alloy and ceramic bonding mechanism, comprising a launch mold body (1), characterized in that: Also includes: An emission mold cavity (2), wherein two emission mold cavities (2) are provided and are symmetrically arranged on both sides of the emission mold body (1); A polyfluorine block (5), the polyfluorine block (5) being movably connected above the launch mold body (1); A limiting cushion block (8), wherein two limiting cushion blocks (8) are provided and are arranged on the corresponding emission mold cavity (2); The limiting bars (10) are provided in two numbers and are movably connected to the corresponding emission mold cavity (2).

2. The thermal expansion matching alloy and ceramic bonding mechanism according to claim 1, characterized in that: Four insertion holes (4) are symmetrically provided at both ends of the emission mold body (1); two sliding rods (3) are symmetrically fixedly connected to the adjacent sides of the two emission mold cavities (2); and the sliding rods (3) are slidably connected to the corresponding insertion holes (4).

3. The thermal expansion matching alloy and ceramic bonding mechanism according to claim 1, characterized in that: The top of the emission mold cavity (2) is provided with a first step (6), the top of the emission mold cavity (2) and one side of the first step (6) is provided with a second step (7), and the height of the second step (7) is lower than the height of the first step (6).

4. The thermal expansion matching alloy and ceramic bonding mechanism according to claim 3, characterized in that: A notch (9) penetrating the structure is provided at the top of the launch mold body (1) and above the second step (7), and the limiting strip (10) is used in conjunction with the notch (9).

5. The thermal expansion matching alloy and ceramic bonding mechanism according to claim 1, characterized in that: The size of the polyfluorine block (5) is consistent with that of the launch mold body (1).