Solar silicon wafer drying device and solar silicon wafer laser cutting and splitting equipment

Abstract

The utility model discloses a solar silicon wafer drying device and solar silicon wafer laser cutting and splitting equipment, the solar silicon wafer drying device comprises a conveying mechanism, a mounting cover, a fan and a heating structure, the conveying mechanism is used for conveying a solar silicon wafer; the mounting cover is provided with an air inlet, an air outlet and an air duct connected between the air inlet and the air outlet, the mounting cover is arranged on the upper side of the conveying mechanism, and the air outlet faces the conveying mechanism; the fan is arranged on the mounting cover and used for driving airflow to enter the air duct from the air inlet and then be exhausted from the air outlet; the heating structure is arranged in the air duct and used for heating airflow flowing through the air duct. According to the technical scheme, the solar silicon wafer drying device can improve the drying efficiency of solar silicon wafers.

Description

Technical Field

[0001] The utility model relates to the technical field of solar silicon wafer processing, in particular to a solar silicon wafer drying device and solar silicon wafer laser cutting and splitting equipment. Background Art

[0002] The global energy transformation is an inevitable trend. The scale of the photovoltaic market will accelerate and production capacity will further expand. In the process of producing and processing solar silicon wafers, solar silicon wafers are usually cut. Since water is needed to rinse the solar silicon wafers during the cutting process, water stains will remain on the surface of the cut solar silicon wafers. At present, the usual method is to place the cut solar silicon wafers in a drying furnace for drying. The current drying furnace generally uses infrared lamps for heating to achieve the drying effect. However, the method of using infrared lamps to release heat to achieve drying is inefficient and difficult to meet production needs. Utility Model Content

[0003] The main purpose of the utility model is to provide a solar silicon wafer drying device, aiming to improve the drying efficiency of solar silicon wafers.

[0004] To achieve the above purpose, the solar silicon wafer drying device proposed by the utility model comprises:

[0005] A conveying mechanism for conveying solar silicon wafers;

[0006] A mounting cover having an air inlet, an air outlet, and an air duct connected between the air inlet and the air outlet, wherein the mounting cover is disposed on the upper side of the conveying mechanism, and the air outlet faces the conveying mechanism;

[0007] a fan, disposed on the mounting cover, for driving airflow from the air inlet into the air duct and then discharged from the air outlet; and

[0008] A heating structure is arranged in the air duct, and the heating structure is used to heat the airflow flowing through the air duct.

[0009] Optionally, the air inlet and the air outlet are arranged opposite to each other; and / or, the fan is arranged at the air inlet.

[0010] Optionally, the mounting cover is provided with a plurality of the air inlets, and the plurality of the air inlets are spaced apart in the conveying direction of the conveying mechanism; the solar silicon wafer drying device comprises a plurality of the fans, and a corresponding fan is provided at each of the air inlets.

[0011] Optionally, the solar silicon wafer drying device further comprises a temperature sensor, a detection end of the temperature sensor extends into the air duct and is located between the heating structure and the air outlet.

[0012] Optionally, the solar silicon wafer drying device includes a plurality of the temperature sensors, which are spaced apart along the conveying direction of the conveying mechanism and are arranged one-to-one with the plurality of fans. The heating structure is in the shape of a long strip extending along the conveying direction of the conveying mechanism or a heating structure is provided at a position corresponding to each fan in the air duct.

[0013] Optionally, the air duct has a tapered section, and a small end of the tapered section is connected to the air outlet.

[0014] Optionally, the conveying mechanism comprises a frame, a driving member, a conveyor belt and at least two rollers, the frame has a supporting plane, the rollers are arranged on opposite sides of the supporting plane, the conveyor belt is sleeved on the rollers at both ends of the frame and is partially located above the supporting plane, the driving member is mounted on the frame and is drivingly connected to at least one of the rollers;

[0015] The frame is provided with an air extraction channel and a plurality of suction ports connected to the air extraction channel and penetrating the support plane, the plurality of suction ports are spaced apart along the conveying direction of the conveyor belt, the conveyor belt is provided with a plurality of through holes, the plurality of through holes are spaced apart along the length direction of the conveyor belt and correspond to the positions of the suction ports;

[0016] The through hole is in the shape of a long strip extending along the length direction of the conveyor belt or the through hole is a round hole.

[0017] Optionally, the conveying mechanism includes two conveying belts arranged in parallel, the two conveying belts are arranged at an interval between each other, and the mounting cover is arranged above the two conveying belts.

[0018] The utility model also proposes a solar silicon wafer laser cutting and splitting device, comprising a machine base, a splitting device, a feeding device and the solar silicon wafer drying device as mentioned above, wherein the splitting device, the feeding device and the solar silicon wafer drying device are all arranged on the machine base, the solar silicon wafer drying device is located between the splitting device and the feeding device, the splitting device is used to separate silicon wafers, the solar silicon wafer drying device is used to dry the silicon wafers split by the splitting device, and the feeding device is used to feed the silicon wafers dried by the solar silicon wafer drying device.

[0019] Optionally, the solar silicon wafer laser cutting and splitting equipment also includes a loading device and a loading and conveying device, both of which are arranged on the machine base, the loading device is used for loading silicon wafers to be cut, the loading and conveying device is located between the loading device and the splitting device, and the loading and conveying device is used for receiving the silicon wafers to be cut transported by the loading device and then transporting them to the splitting device for cutting processing.

[0020] The technical solution of the utility model is to transport silicon wafers through a conveying mechanism, and the installation shell is provided with an air inlet, an air outlet and an air duct connecting the air inlet and the air outlet, and the air outlet is directed toward the conveying mechanism, a heating structure is arranged in the air duct to heat the airflow flowing through the air duct, and a fan is arranged in the installation cover to drive the external airflow to flow into the air duct and then be discharged from the air outlet. In this way, the flow of airflow is accelerated by the fan, so that the airflow heated by the heating mechanism quickly flows from the air outlet to the silicon wafers on the conveying mechanism, and the hot air flow can also heat and dry the silicon wafers while blowing water droplets off the surface of the silicon wafers, thereby improving the drying efficiency of solar silicon wafers, which is conducive to improving the production efficiency of solar silicon wafers. BRIEF DESCRIPTION OF THE DRAWINGS

[0021] In order to more clearly illustrate the embodiments of the utility model or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the utility model. For ordinary technicians in this field, other drawings can be obtained based on the structures shown in these drawings without paying creative work.

[0022] Figure 1 This is a schematic structural diagram of an embodiment of a solar silicon wafer drying device of the utility model;

[0023] Figure 2 for Figure 1 A cross-sectional view of a solar silicon wafer drying device;

[0024] Figure 3 for Figure 1 Partial structural diagram of solar silicon wafer drying device;

[0025] Figure 4 for Figure 3 Exploded diagram of the conveying mechanism;

[0026] Figure 5 It is a structural schematic diagram of an embodiment of the solar silicon wafer laser cutting and splitting equipment of the utility model.

[0027] Description of Figure Numbers:

[0028] 100, solar silicon wafer drying device; 10, conveying mechanism; 11, conveyor belt; 111, through hole; 12, frame; 121, suction port; 13, driving member; 14, roller; 20, mounting cover; 21, air inlet; 22, air outlet; 23, air duct; 30, fan; 40, heating structure; 50, temperature sensor; 70, base; 71, loading device; 72, loading and conveying device; 73, first imaging device; 74, alternating transport device; 75, splitting device; 76, second imaging device; 77, unloading device; 78, unloading and conveying device; 80, silicon wafer

[0029] The realization of the purpose, functional features and advantages of the utility model will be further explained in conjunction with embodiments and with reference to the accompanying drawings. DETAILED DESCRIPTION

[0030] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments of the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

[0031] It should be noted that if the embodiments of the present invention involve directional indications (such as up, down, left, right, front, back...), the directional indications are only used to explain the relative position relationship, movement status, etc. between the components under a certain specific posture (as shown in the accompanying drawings). If the specific posture changes, the directional indication will also change accordingly.

[0032] In addition, if there are descriptions involving "first", "second", etc. in the embodiments of the utility model, the descriptions of "first", "second", etc. are only used for descriptive purposes and cannot be understood as indicating or implying their relative importance or implicitly indicating the number of technical features indicated. Therefore, the features defined as "first" and "second" may explicitly or implicitly include at least one of the features. In addition, the meaning of "and / or" appearing in the full text is to include three parallel solutions. Taking "A and / or B" as an example, it includes solution A, or solution B, or a solution that satisfies both A and B. In addition, the technical solutions between the various embodiments can be combined with each other, but it must be based on the ability of ordinary technicians in this field to implement. When the combination of technical solutions is contradictory or cannot be implemented, it should be deemed that such a combination of technical solutions does not exist and is not within the scope of protection required by the utility model.

[0033] The utility model provides a solar silicon wafer drying device.

[0034] In the embodiment of the present utility model, Figures 1 to 4As shown, the solar silicon wafer drying device 100 includes a conveying mechanism 10 , a mounting cover 20 , a fan 30 and a heating structure 40 .

[0035] Specifically, the conveying mechanism 10 is used to convey solar silicon wafers. The mounting cover 20 has an air inlet 21, an air outlet 22, and an air duct 23 connected between the air inlet 21 and the air outlet 22. The mounting cover 20 is arranged on the upper side of the conveying mechanism 10, and the air outlet 22 faces the conveying mechanism 10. The fan 30 is arranged on the mounting cover 20, and is used to drive the airflow from the air inlet 21 into the air duct 23 and then be discharged from the air outlet 22. The heating structure 40 is arranged in the air duct 23, located between the air inlet 21 and the air outlet 22, and the heating structure 40 is used to heat the airflow flowing through the air duct 23.

[0036] The fan 30 is used to speed up the flow of air, driving the external airflow to quickly flow from the air inlet 21 into the air duct 23, and then be discharged from the air outlet 22, so as to flow to the silicon wafer 80 on the conveying mechanism 10, so as to blow water droplets off the surface of the silicon wafer 80, and the hot air flow can also heat and dry the silicon wafer 80. Among them, when the airflow flows through the heating structure 40, it can exchange heat with the heating structure 40 to take away the heat of the heating structure 40 and form a hot air flow. Driven by the fan 30, the hot air flow can quickly flow from the air outlet 22 to the conveying mechanism 10 to dry the solar silicon wafers on the conveying mechanism 10, thereby improving the drying efficiency of the solar silicon wafers.

[0037] When the solar silicon wafer drying device 100 of the technical solution of the utility model is applied to the solar silicon wafer laser cutting and splitting equipment, the conveying mechanism 10 of the solar silicon wafer drying device 100 is installed on the machine base 70, and is used to receive the silicon wafers 80 conveyed by the unloading conveying device 78. During the production process, the unloading conveying device 78 conveys the cut silicon wafers 80 to the conveying mechanism 10, and the fan 30 drives the outside to quickly flow into the air duct 23 for heating, and drives the hot air flow to quickly flow from the air outlet 22 to the conveying mechanism 10 to dry the silicon wafers 80 on the conveying mechanism 10. While improving the drying efficiency of the silicon wafers 80, the unloading conveying device 78 can directly convey the cut silicon wafers 80 to the conveying mechanism 10 of the solar silicon wafer drying device 100 for drying, so as to realize the production automation of solar silicon wafers.

[0038] The technical solution of the utility model is to transport the silicon wafer 80 through the conveying mechanism 10, and the mounting shell is provided with an air inlet 21, an air outlet 22 and an air duct 23 connecting the air inlet 21 and the air outlet 22, and the air outlet 22 is directed toward the conveying mechanism 10, and the heating structure 40 is arranged in the air duct 23 to heat the airflow flowing through the air duct 23, and the fan 30 is arranged in the mounting cover 20 to drive the external airflow to flow into the air duct 23 and then be discharged from the air outlet 22. In this way, the flow of the airflow is accelerated by the fan 30, so that the airflow heated by the heating mechanism quickly flows from the air outlet 22 to the silicon wafer 80 on the conveying mechanism 10, and the hot airflow can also heat and dry the silicon wafer 80 while blowing water droplets off the surface of the silicon wafer 80, thereby improving the drying efficiency of the solar silicon wafer, which is conducive to improving the production efficiency of the solar silicon wafer.

[0039] Furthermore, the air inlet 21 and the air outlet 22 are arranged opposite to each other. It can be understood that the air inlet 21 and the air outlet 22 are arranged on opposite sides of the mounting cover 20, so that after the airflow enters from the air inlet 21, it can quickly go to the air outlet 22 under the action of the fan 30, thereby improving the flow speed of the airflow, that is, it can improve the drying efficiency of the silicon wafer 80. Of course, in other embodiments, the air inlet 21 and the air outlet 22 can also be arranged on adjacent sides of the mounting cover 20.

[0040] Optionally, the fan 30 is disposed at the air inlet 21. Specifically, the fan blows the external airflow into the air duct 23 by blowing. As we know, the air volume is larger in the blowing method. In the embodiment, the fan 30 can blow a large amount of external airflow into the air duct 23 and then discharge it from the air outlet 22, so that the silicon wafer 80 on the conveying mechanism 10 can receive a large amount of hot airflow, thereby improving the drying efficiency of the silicon wafer 80. Of course, in other embodiments, the fan 30 is disposed at the air outlet 22.

[0041] Further, the fan 30 is installed on the outside of the installation cover 20. In this way, the fan 30 will not occupy the space of the air duct 23 and will not affect the installation of the heating structure 40.

[0042] Further, the mounting cover 20 is provided with a plurality of air inlets 21, and the plurality of air inlets 21 are spaced apart in the conveying direction of the conveying mechanism 10. The solar silicon wafer drying device 100 includes a plurality of fans 30, and a fan 30 is correspondingly provided at each air inlet 21. Specifically, the plurality of fans 30 are spaced apart along the conveying direction of the conveying mechanism 10. In the process of following the conveying mechanism 10, the solar silicon wafer can receive the hot air flow blown by the fan 30, thereby improving the drying efficiency of the solar silicon wafer. Among them, the number of air inlets 21 can be set according to the length of the conveying mechanism 10. When the conveying length of the conveying mechanism 10 is long, more air inlets 21 can be set. When the conveying length of the conveying mechanism 10 is short, fewer air inlets 21 can be set, and the number of fans 30 set corresponds to the number of air inlets 21 set. The specific number is not specifically limited in this application and can be set according to actual conditions.

[0043] Of course, in other embodiments, the installation cover 20 is only provided with one air inlet 21, and the air inlet 21 extends along the conveying direction of the conveying mechanism 10. The solar silicon wafer drying device 100 also includes a fairing and a fan 30. The fairing forms an air supply duct 23. The fairing also covers the air inlet 21, and the air supply duct 23 is connected with the air duct 23 through the air inlet 21. The fan 30 is installed at the air inlet 21 of the fairing.

[0044] It is worth noting that the heating structure 40 can be set selectively. In some embodiments, the heating structure 40 can be set corresponding to one of the multiple air inlets 21. The fan 30 without the heating structure 40 at the position corresponding to the air inlet 21 is configured to blow away the water on the surface of the silicon wafer 80 by blowing airflow, while the fan 30 with the heating structure 40 at the position corresponding to the air inlet 21 is configured to blow hot airflow to heat and dry the silicon wafer 80.

[0045] In another embodiment, the heating structure 40 is in the shape of a long strip extending along the conveying direction of the conveying mechanism 10. At this time, there is a heating structure 40 at the position corresponding to each air inlet 21, that is, each fan 30 can blow a hot air flow to blow away the water on the silicon wafer 80, and can also heat and dry the silicon wafer 80.

[0046] Furthermore, the solar silicon wafer drying device 100 also includes a temperature sensor 50, the detection end of the temperature sensor 50 extends into the air duct 23, and is located between the heating structure 40 and the air outlet 22. We know that the temperature sensor 50 can detect the current temperature. In the embodiment, the temperature sensor 50 is set, and the detection end of the temperature sensor 50 is extended into the air duct 23, and is located between the heating structure 40 and the air outlet 22, so that it can detect how many degrees Celsius the heated airflow is, and the user can judge whether the airflow temperature is too high or too low by checking the temperature detected by the temperature sensor 50. The user can make corresponding operations according to whether the temperature is too high or too low to enhance the user's experience. Of course, in other embodiments, the solar silicon wafer drying device 100 may not be provided with a temperature sensor 50.

[0047] Furthermore, the solar silicon wafer drying device 100 includes a plurality of temperature sensors 50, which are distributed at intervals along the conveying direction of the conveying mechanism 10 and are arranged one-to-one with the plurality of fans 30. The heating structure 40 is in the shape of a long strip extending along the conveying direction of the conveying mechanism 10 or a heating structure 40 is arranged in the air duct 23 at a position corresponding to each fan 30. Specifically, the detection end of each temperature sensor 50 extends into the air duct 23, and the detection end of each temperature sensor 50 is located between the heating structure 40 and the air outlet 22. The plurality of temperature sensors 50 are used to detect the temperature of the air flow blown out by the corresponding fan 30. By checking the data detected by each temperature sensor 50, it is determined whether the temperature of the air flow blown out by each fan 30 is consistent or almost the same, thereby ensuring the drying effect of the solar silicon wafer. Among them, the number of temperature sensors 50 can be set according to the conveying length of the conveying mechanism 10. When the conveying length of the conveying mechanism 10 is longer, a larger number of temperature sensors 50 can be set. When the conveying length of the conveying mechanism 10 is shorter, a smaller number of temperature sensors 50 can be set. The specific number is not specifically limited in this application and can be set according to actual conditions.

[0048] Furthermore, the air duct 23 has a tapered section, and the small end of the tapered section is connected to the air outlet 22. Specifically, we know that a smaller diameter will result in a faster flow rate. In this embodiment, the small end of the tapered end of the air duct 23 is connected to the air outlet 22, so that when the fan 30 drives the heated airflow to be discharged from the air outlet 22, the tapered setting will speed up the flow speed of the airflow, so that it can quickly flow to the silicon wafer 80 on the conveying mechanism 10 after heating, that is, the drying efficiency of the silicon wafer 80 is improved. Of course, in other embodiments, the air duct 23 is tapered in the direction from the air inlet 21 to the air outlet 22.

[0049] In some embodiments, the conveying mechanism 10 includes a frame 12, a driving frame, a conveyor belt 11 and at least two rollers 14. The mounting frame has a support plane, and pulleys are provided on opposite sides of the support plane. The conveyor belt 11 is sleeved on the rollers 14 at both ends of the mounting frame and is partially located above the support plane. The driving member 13 is mounted on the mounting frame and is connected to at least one pulley. It can be understood that the driving member 13 drives the roller 14 connected thereto to rotate, and the rotation of the roller 14 drives the conveyor belt 11 sleeved on the roller 14 to rotate on the frame 12, so as to achieve the purpose of conveying the silicon wafer 80.

[0050] Furthermore, the mounting frame is provided with an exhaust channel and a plurality of suction ports 121 connected to the exhaust channel and penetrating the support plane, the plurality of suction ports 121 are spaced apart along the conveying direction of the conveyor belt 11, and the conveyor belt 11 is provided with a plurality of through holes 111, the plurality of through holes 111 are spaced apart along the length direction of the conveyor belt 11, and correspond to the positions of the suction ports 121. Specifically, the exhaust channel is connected to the negative pressure device, and in the process of the conveying mechanism 10 conveying the silicon wafer 80, the silicon wafer 80 will block the through holes 111 on the conveyor belt 11, and the silicon wafer 80 can be fixed on the conveying mechanism 10 by exhausting air through the negative pressure device, so as to prevent the silicon wafer 80 from falling during the conveying process of the conveying mechanism 10. At the same time, there is no need to set a positioning mechanism on the conveyor belt 11 to fix the raw silicon wafer 80, thereby reducing the complexity of the structure. Of course, in other embodiments, a limiting structure is provided on the conveyor belt 11 to limit the silicon wafer 80.

[0051] Furthermore, the through hole 111 is in the shape of an elongated strip along the length direction of the conveyor belt 11 or the through hole 111 is a circular hole.

[0052] In some embodiments, the conveying mechanism 10 includes two conveyor belts 11 arranged in parallel, the two conveyor belts 11 are arranged at intervals, and the mounting cover 20 is arranged above the two conveyor belts 11. Specifically, the mounting cover 20 is located above the two conveyor belts 11 at the same time, so that when the fan 30 blows the heated airflow out of the air outlet 22, the airflow can flow to the two conveyor belts 11, that is, the hot airflow flowing out of the air outlet 22 can simultaneously dry the silicon wafers 80 on the two conveyor belts 11. In this way, there is no need to set a mounting cover 20 for each conveyor belt 11, that is, the overall structure of the solar silicon wafer drying device 100 is simplified, and the overall structural complexity of the solar silicon wafer drying device 100 is reduced. Among them, the two parallel conveyor belts 11 can be sleeved with the same roller 14, or they can be sleeved and installed on the corresponding rollers 14 respectively. When the two conveyor belts 11 are sleeved with the same roller 14, the roller 14 is in a long strip shape perpendicular to the conveying direction of the two conveyor belts 11.

[0053] Of course, in other embodiments, the solar silicon wafer drying device 100 may also be provided with two installation covers 20 , and the two installation covers 20 are provided in a one-to-one correspondence with the two conveyor belts 11 .

[0054] The utility model also provides a solar silicon wafer laser cutting and splitting device, such as Figure 5 As shown, the solar silicon wafer laser cutting and splitting device includes a machine base 70, a splitting device 75, a material unloading and conveying device 78, and a solar silicon wafer drying device 100. The specific structure of the solar silicon wafer drying device 100 refers to the above embodiment. Since the solar silicon wafer laser cutting and splitting device adopts all the technical solutions of all the above embodiments, it at least has all the beneficial effects brought by the technical solutions of the above embodiments, which will not be repeated here. Among them, the splitting device 75, the material unloading device 77 and the solar silicon wafer drying device 100 are all arranged on the machine base 70, and the solar silicon wafer drying device 100 is located between the splitting device 75 and the material unloading device 77. The splitting device 75 is used to separate silicon wafers 80, and the solar silicon wafer drying device 100 is used to dry the silicon wafers 80 split by the splitting device 75. The material unloading device 77 is used to unload the silicon wafers 80 dried by the solar silicon wafer drying device 100.

[0055] Specifically, the solar silicon wafer drying device 100 receives the silicon wafer 80 split by the splitting device 75 for drying processing, and the unloading device 77 is used to unload the silicon wafer 80 dried by the solar silicon wafer drying device 100 to realize the automation of silicon wafer splitting, drying and unloading, thereby improving the production efficiency of solar silicon wafers.

[0056] It is worth noting that the chip splitting device 75 uses laser to cut the silicon wafer.

[0057] In some embodiments, the solar silicon wafer laser cutting and splitting equipment further includes a loading device 71 and a loading and conveying device 72, both of which are arranged on a machine base 70, the loading device 71 is used to load silicon wafers 80 to be cut, the silicon wafer 80 loading and conveying device 72 is located between the loading device 71 and the splitting device 75, and the loading and conveying device 72 is used to receive the silicon wafers 80 to be cut transported by the loading device 71 and then transport them to the splitting device 75 for cutting. Specifically, the loading device 71 transports the silicon wafers 80 to be cut to the loading and conveying device 72, and the loading and conveying device 72 transports the silicon wafers 80 to be cut to the splitting device 75 for cutting, so as to realize mechanical automation and improve the production efficiency of solar silicon wafers.

[0058] In some embodiments, the solar silicon wafer laser cutting and splitting equipment further includes an alternating transport device 74, which is disposed between the loading conveyor device 72 and the unloading conveyor device 78, and is used to alternately transport silicon wafers 80 between the loading conveyor device 72 and the unloading conveyor device 78, and the splitting device 75 is located on the transport path of the alternating transport device 74. Specifically, during the production process, the loading device 71 transports the silicon wafer 80 to the loading conveyor device 72, and the loading conveyor device 72 transports the silicon wafer 80, and when the loading conveyor device 72 transports the silicon wafer 80 to the position of the alternating transport device 74. The alternating transport device 74 removes the silicon wafer 80 from the loading conveyor device 72, and transports the silicon wafer 80 through the alternating transport device 74. During the transportation process, the splitting device 75 cuts the silicon wafer 80 on the alternating transport device 74. The alternating transport device 74 transports the cut silicon wafer 80 to the unloading conveyor device 78, and the unloading conveyor device 78 transports the cut silicon wafer 80 to the conveying mechanism 10 of the solar silicon wafer drying device 100. During the process of the conveying mechanism 10 conveying the silicon wafer 80, the fan 30 of the solar silicon wafer drying device 100 blows a hot air flow to the conveying mechanism 10 to dry the silicon wafer 80 on the conveying mechanism 10.

[0059] The machine base 70 is provided with a loading position and two splitting positions. The two splitting positions are arranged at intervals, and the loading position corresponds to the position between the two splitting positions; the loading device 71 includes a loading mechanism and two loading robots. The two loading robots are installed on the loading mechanism. The two loading robots are arranged at an angle and extend in the horizontal direction. The loading mechanism is used to drive the two loading robots to rotate synchronously, so that any one loading robot moves the solar silicon wafer to be split at the loading position to one of the splitting positions, while the other loading robot moves from the other splitting position to the loading position to pick up the solar silicon wafer to be split.

[0060] Specifically, during operation, the loading mechanism drives two loading manipulators, and the loading manipulator moves the solar silicon wafer to be split at the loading position to one of the splitting positions, while the other loading manipulator moves from the other splitting position to the loading position to pick up the solar silicon wafer to be split. After the picking up is completed, the loading mechanism reverses and moves the picked up solar silicon wafer to the loading position. In this way, the loading device 71 can move a solar silicon wafer to be split to the splitting position once, and pick up another solar silicon wafer to be split, which improves the efficiency of transporting solar silicon wafers, thereby improving the splitting efficiency of the solar silicon wafer laser cutting and splitting equipment.

[0061] In some embodiments, the solar splitting device further includes a first imaging device 73, which is disposed on the machine base 70, and an imaging end of the first imaging device 73 faces the loading and conveying device 72. Specifically, the first imaging device 73 is used to photograph the silicon wafer 80 conveyed by the loading and conveying device 72, and the first imaging device 73 photographs the silicon wafer 80 conveyed by the loading and conveying device 72 to determine whether there is damage. It can be understood that the above arrangement can determine whether the silicon wafer 80 is damaged before the silicon wafer 80 is cut, so as to improve the production quality of the silicon wafer 80.

[0062] In some embodiments, the solar splitting device further includes a second imaging device 76, which is disposed on the machine base 70, and an imaging end of the second imaging device 76 faces the unloading conveying device 78. Specifically, the second imaging device 76 is used to photograph the silicon wafer 80 conveyed by the unloading conveying device 78, and the second imaging device 76 photographs the silicon wafer 80 conveyed by the unloading conveying device 78 to determine whether there is damage. It can be understood that the above-mentioned setting can determine whether the silicon wafer 80 is damaged after cutting, so as to improve the production quality of the silicon wafer 80.

[0063] It is worth noting that in this embodiment, the production method of first cutting the solar silicon wafer and then performing other subsequent processing can improve the solar energy conversion rate of the solar silicon wafer compared to the method of first processing the solar silicon wafer and then cutting it in the prior art.

[0064] The above description is only a preferred embodiment of the present invention, and does not limit the patent scope of the present invention. All equivalent structural changes made by using the contents of the present invention specification and drawings under the inventive concept of the present invention, or directly / indirectly applied in other related technical fields are included in the patent protection scope of the present invention.

Claims

1. A solar silicon wafer drying device, characterized in that: include: A conveying mechanism for conveying solar silicon wafers; A mounting cover having an air inlet, an air outlet, and an air duct connected between the air inlet and the air outlet, wherein the mounting cover is disposed on the upper side of the conveying mechanism, and the air outlet faces the conveying mechanism; A fan, arranged on the mounting cover, for driving the airflow from the air inlet into the air duct and then discharged from the air outlet; as well as A heating structure is arranged in the air duct, and the heating structure is used to heat the airflow flowing through the air duct.

2. The solar silicon wafer drying device according to claim 1, characterized in that: The air inlet is arranged opposite to the air outlet; and / or the fan is arranged at the air inlet.

3. The solar silicon wafer drying device according to claim 1, characterized in that: The installation cover is provided with a plurality of the air inlets, and the plurality of the air inlets are spaced apart in the conveying direction of the conveying mechanism. The solar silicon wafer drying device includes a plurality of the fans, and a corresponding fan is provided at each of the air inlets.

4. The solar silicon wafer drying device according to claim 3, characterized in that: The solar silicon wafer drying device also includes a temperature sensor, a detection end of which extends into the air duct and is located between the heating structure and the air outlet.

5. The solar silicon wafer drying device according to claim 4, characterized in that: The solar silicon wafer drying device includes a plurality of temperature sensors, which are spaced apart along the conveying direction of the conveying mechanism and are arranged one-to-one with the plurality of fans. The heating structure is in the shape of a long strip extending along the conveying direction of the conveying mechanism or a heating structure is provided at a position corresponding to each fan in the air duct.

6. The solar silicon wafer drying device according to claim 1, characterized in that: The air duct has a tapered section, and a small end of the tapered section is connected to the air outlet.

7. The solar silicon wafer drying device according to claim 1, characterized in that: The conveying mechanism comprises a frame, a driving member, a conveyor belt and at least two rollers, the frame having a support plane, the rollers being arranged on opposite sides of the support plane, the conveyor belt being sleeved on the rollers at both ends of the frame and being partially located above the support plane, the driving member being mounted on the frame and drivingly connected to at least one of the rollers; The frame is provided with an air extraction channel and a plurality of suction ports connected to the air extraction channel and penetrating the support plane, the plurality of suction ports are spaced apart along the conveying direction of the conveyor belt, the conveyor belt is provided with a plurality of through holes, the plurality of through holes are spaced apart along the length direction of the conveyor belt and correspond to the positions of the suction ports; The through hole is in the shape of a long strip extending along the length direction of the conveyor belt or the through hole is a round hole.

8. The solar silicon wafer drying device according to claim 7, characterized in that: The conveying mechanism comprises two conveying belts arranged in parallel, the two conveying belts are arranged at an interval, and the mounting cover is arranged above the two conveying belts.

9. A solar silicon wafer laser cutting and splitting device, characterized in that: The solar silicon wafer laser cutting and splitting equipment includes a machine base, a splitting device, a unloading device and a solar silicon wafer drying device as claimed in any one of claims 1 to 8, wherein the splitting device, the unloading device and the solar silicon wafer drying device are all arranged on the machine base, the solar silicon wafer drying device is located between the splitting device and the unloading device, the splitting device is used to separate silicon wafers, the solar silicon wafer drying device is used to dry the silicon wafers split by the splitting device, and the unloading device is used to unload the silicon wafers dried by the solar silicon wafer drying device.

10. The solar silicon wafer laser cutting and splitting device according to claim 9, characterized in that: The solar silicon wafer laser cutting and splitting equipment also includes a loading device and a loading and conveying device, both of which are arranged on the machine base, and the loading and conveying device is located between the loading device and the splitting device. The loading device is used for loading silicon wafers to be cut, and the loading and conveying device is used for receiving the silicon wafers to be cut transported by the loading device and then transporting them to the splitting device for cutting processing.

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