Wafer detection marble detection platform

By using the marble main platform, linear motor and high-precision grating scale on the wafer detection platform, combined with buffer rubber pads, the vibration and positioning accuracy problems are solved, and high-precision and smooth wafer detection are achieved, which is suitable for industrial promotion.

CN222299504UActive Publication Date: 2025-01-03SHENZHEN PENGLE INTELLIGENT SYST CO LTD
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Patent Information

Application Number
CN202420823620.4
Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
Filing Date
2024-04-19
Publication Date
2025-01-03
Estimated Expiration
2034-04-19

AI Technical Summary

Technical Problem

The existing wafer detection platform has a large vibration when sliding multi-axis, lacks precise sliding positioning, has a complex structure and high installation difficulty, which limits high-precision detection and industrial promotion.

Method used

It adopts a marble main platform and vertically installed recessed plate, combined with X-axis, Y-axis, Z-axis linear motors and guide rails, and is equipped with a high-precision grating ruler and buffer rubber pads to ensure smooth operation and precise positioning.

Benefits of technology

It realizes high-precision wafer detection, reduces machine vibration, improves positioning accuracy and smooth operation, reduces installation difficulty, and is suitable for large-scale industrial applications.

✦ Generated by Eureka AI based on patent content.

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Abstract

The utility model discloses a marble detection platform for wafer detection, which comprises a marble main platform, a marble backup plate, an X-axis component, a Y-axis component and a Z-axis component, and adopts high-planeness marble as a substrate, so that compared with the traditional method adopting a frame type rack as the substrate, the wafer detection platform has the advantages that the structure is simple, and the production efficiency is high. The flatness during follow-up installation and multi-axis equipment operation can be guaranteed, a large-weight base is provided, and it can be guaranteed that equipment at the upper end is not prone to shaking and vibration during operation; the X-axis and the Y-axis of the detection platform are composed of high-precision linear motors and high-precision guide rails, so that the X-axis and the Y-axis run stably, the movement precision and the repetition precision are high, and the positioning precision reaches + / -1 [mu] m; x and Y axes of the detection platform are equipped with high-precision grating scale displacement sensors, and the positioning precision is + / -1 [mu] m; a rubber shock pad is installed at the bottom of the detection platform, overall shaking of the machine table is reduced, and a machine table motion structure operates stably.
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Description

Technical Field

[0001] The utility model relates to the technical field of wafer detection devices, in particular to a wafer detection marble detection platform. Background Art

[0002] The existing wafer inspection platforms are designed to slide on multiple axes during operation, which causes the core components to slide, resulting in large overall vibrations of the machine, which is not conducive to high-precision inspection. In addition, traditional wafer inspection platforms lack components for accurately calculating sliding dimensions, which means that the system cannot accurately locate the sliding position of the core components. Moreover, most of the original wafer inspection platforms of this type have complex structures and are extremely difficult to install, which is not conducive to large-scale industrial promotion. Utility Model Content

[0003] In order to overcome the deficiencies of the prior art, the purpose of the utility model is to provide a wafer inspection marble inspection platform to solve the technical problems mentioned in the background technology.

[0004] In order to solve the technical problem, the utility model adopts the following technical solution:

[0005] A wafer inspection marble inspection platform comprises a marble main platform, wherein the upper and lower surfaces of the marble main platform are horizontally arranged, and the upper end thereof forms an X-axis and Y-axis component installation plane; further comprises a marble backing plate, wherein the marble backing plate is vertically installed on the inner side of the marble main platform, wherein the lower end thereof is recessed to form a clearance groove, and the upper end thereof forms a Z-axis component installation plane; further comprises an X-axis component, which comprises a plurality of sets of X-axis rails and X-axis sliders arranged in parallel, wherein an X-axis linear motor is arranged between the two sets of X-axis rails in the middle, and further comprises a Y-axis component, which comprises a Y-axis slide plate, a Y-axis slide rail, a Y-axis slider, and a negative pressure inspection carrier, wherein the Y-axis slide plate is fixedly connected to the upper portion of the X-axis slider The Y-axis slide rail is arranged above the Y-axis slide plate, and the negative pressure detection platform slides in cooperation with the Y-axis slide rail through the Y-axis slider; wherein the negative pressure detection platform is used to install the unit to be detected, and a Y-axis linear motor is arranged between the negative pressure detection platform and the Y-axis slide plate; it also includes a Z-axis component, which includes a Z-axis base, a Z-axis slide rail, a Z-axis slider, a detection seat plate, and a Z-axis drive unit, wherein the Z-axis base is installed at the upper end of the marble backing plate, the Z-axis slide rail is arranged on the Z-axis base, and the detection seat plate slides in cooperation with the Z-axis slide rail through the Z-axis slider; wherein the detection seat plate is used to install the detection unit, and the Z-axis drive unit is used to drive the detection seat plate to slide relative to the Z-axis base.

[0006] Specifically, the unit to be inspected includes a negative pressure ring, a wafer carrying surface and a negative pressure mechanism, wherein the negative pressure ring is installed at the upper end of the negative pressure detection platform, the wafer carrying surface is arranged at the middle position of the upper end of the negative pressure ring, and the negative pressure mechanism is arranged on the inner side of the negative pressure ring, and is connected to the compressor by a number of air paths so that a negative pressure environment capable of adsorbing the wafer to be inspected is formed at the upper end of the negative pressure ring. The detection unit includes a high-precision microscope camera module and a conventional high-precision camera module, which are both installed on the detection base plate and arranged in parallel.

[0007] Specifically, the Z-axis driving unit includes a Z-axis motor, a Z-axis lead screw, and a lead screw slider, wherein the lead screw slider is installed on the inner side of the detection base plate.

[0008] Specifically, it also includes a high-precision distance detection component, which includes an X-axis grating scale, a Y-axis grating scale and a Z-axis grating scale. The X-axis grating scale is installed on one side of the X-axis slide rail to detect the travel distance of the Y-axis slide plate, the Y-axis grating scale is installed on one side of the Y-axis slide rail to detect the travel distance of the negative pressure detection platform, and the Z-axis grating scale is installed on one side of the Z-axis slide rail to detect the travel distance of the detection base plate.

[0009] Specifically, it also includes a buffer mechanism, which includes a plurality of shock-absorbing rubber pads equidistantly distributed below the marble main platform.

[0010] Specifically, the negative pressure ring includes a negative pressure ring cavity, an air suction hole, a ventilation pipe and an exhaust hole. The negative pressure ring cavity is formed by a depression on the inner side of the negative pressure ring. The wafer supporting surface is arranged at the upper end of the negative pressure ring cavity. The exhaust hole is arranged at the upper end surface of the negative pressure ring cavity. The exhaust hole is arranged on the side wall of the negative pressure ring and is connected with the negative pressure ring cavity. The exhaust hole is also connected with the ventilation pipe, and the ventilation pipe is connected with the air suction hole.

[0011] Specifically, the air intake holes are distributed in a circumferential array along the upper end of the annular wall of the negative pressure ring in the vertical direction, and the ventilation pipeline is an annular ventilation lumen arranged at the lower end of the annular wall of the negative pressure ring, below the air intake holes and connected to all the air intake holes.

[0012] Compared with the prior art, the beneficial effects of the present invention are:

[0013] (1) The detection platform of the utility model uses high-flatness marble as the base. Compared with the traditional frame-type frame as the base, it can ensure the flatness during subsequent installation and operation of multi-axis equipment, and provide a heavy-weight base to ensure that the upper equipment is not easy to shake or vibrate during operation;

[0014] (2) The X and Y axes of this testing platform are composed of high-precision linear motors and high-precision guide rails, which ensure smooth operation of X and Y axes, high motion accuracy and repeatability, and positioning accuracy of ±1μm;

[0015] (3) The X and Y axes of the detection platform are equipped with high-precision grating scale displacement sensors with a positioning accuracy of ±1μm;

[0016] (4) Rubber shock-absorbing pads are installed at the bottom of the testing platform to reduce the overall vibration of the machine and ensure smooth operation of the machine's motion structure. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] Figure 1 :It is a schematic diagram of the overall structure of this utility model patent Figure 1 ;

[0018] Figure 2 :It is a schematic diagram of the overall structure of this utility model patent Figure 2 ;

[0019] Figure 3 : It is a schematic diagram of the structure of the marble main platform, X-axis component and Y-axis component;

[0020] Figure 4 : It is a schematic diagram of the structure of the Z-axis components;

[0021] Figure 5 : It is a radially dissected cross-sectional view of the overall structure of the utility model patent;

[0022] Figure 6 :for Figure 5 Enlarged view of part A in the middle;

[0023] In the figure: marble main platform 10, marble backing plate 20, give way slot 201, X-axis component 1, X-axis slide rail 11, X-axis slider 12, X-axis linear motor 13, Y-axis component 2, Y-axis slider 21, Y-axis slide rail 22, Y-axis slider 23, negative pressure detection platform 24, Y-axis linear motor 25, Z-axis component 3, Z-axis base 31, Z-axis slide rail 32, Z-axis slider 33, detection seat plate 34, Z-axis drive unit 35, unit to be inspected 4. Negative pressure ring 41, wafer carrying surface 42, negative pressure mechanism 43, detection unit 5, high-precision microscope camera module 51, conventional high-precision camera module 52, Z-axis motor 351, Z-axis screw 352, screw slider 353, high-precision distance detection component 6, X-axis grating ruler 61, Y-axis grating ruler 62, Z-axis grating ruler 63, buffer mechanism 7, negative pressure ring cavity 411, suction hole 412, ventilation pipeline 413, exhaust hole 414. DETAILED DESCRIPTION

[0024] The present invention is further described below in conjunction with the accompanying drawings and specific implementation methods. It should be noted that, under the premise of no conflict, the various embodiments or technical features described below can be arbitrarily combined to form a new embodiment.

[0025] refer to Figures 1 to 6 :

[0026] The utility model discloses a wafer inspection marble inspection platform, comprising a marble main platform 10, wherein the upper and lower surfaces of the marble main platform 10 are arranged horizontally, and the upper end thereof forms an installation plane for an X-axis and a Y-axis component 2; and further comprising a marble backing plate 20, wherein the marble backing plate 20 is vertically installed on the inner side of the marble main platform 10, wherein the lower end thereof is recessed to form a recess 201, and the upper end thereof forms an installation plane for a Z-axis component 3; the recess 201 can ensure that more components can be installed on the marble main platform 10, so that the travel thereof can be longer, and the installation plane for a larger diameter can be adapted. The invention relates to a method for detecting a wafer having a diameter, and further comprises an X-axis component 1, which comprises a plurality of X-axis rails 11 and an X-axis slider 12 arranged in parallel, an X-axis linear motor 13 is arranged between the two X-axis rails 11 in the middle, and an output end of the X-axis linear motor 13 is connected to a Y-axis slider 21, and the sliding of the Y-axis slider 21 in the direction of the X-axis rails 11 is controlled by the X-axis slider 12, and further comprises a Y-axis component 2, the Y-axis component 2 comprises a Y-axis slider 21, a Y-axis rail 22, a Y-axis slider 23 and a negative pressure detection carrier 24, wherein the Y-axis slider 21 is fixedly connected to the Above the X-axis slider 12, the Y-axis slide rail 22 is arranged above the Y-axis slide plate 21, and the negative pressure detection platform 24 slides in cooperation with the Y-axis slide rail 22 through the Y-axis slider 23; wherein the negative pressure detection platform 24 is used to install the unit to be inspected 4; a Y-axis linear motor 25 is arranged between the negative pressure detection platform 24 and the Y-axis slide plate 21, and the output end of the Y-axis linear motor 25 is connected to the bottom of the negative pressure detection platform 24, and the negative pressure detection platform 24 slides on the Y-axis slide plate 21 by relying on the cooperation of the Y-axis slide rail 22 and the Y-axis slider 23. That is, sliding in the Y-axis direction, also includes a Z-axis component 3, which includes a Z-axis base 31, a Z-axis slide rail 32, a Z-axis slider 33, a detection seat plate 34, and a Z-axis drive unit 35. The Z-axis base 31 is installed on the upper end of the marble backing plate 20, the Z-axis slide rail 32 is set on the Z-axis base 31, and the detection seat plate 34 is slidably matched with the Z-axis slide rail 32 through the Z-axis slider 33; wherein the detection seat plate 34 is used to install the detection unit 5, and the Z-axis drive unit 35 is used to drive the detection seat plate 34 to slide relative to the Z-axis base 31.

[0027] Specifically, the inspection unit 4 includes a negative pressure ring 41, a wafer carrying surface 42 and a negative pressure mechanism 43, wherein the negative pressure ring 41 is installed at the upper end of the negative pressure detection platform 24, the wafer carrying surface 42 is arranged at the middle position of the upper end of the negative pressure ring 41, and the negative pressure mechanism 43 is arranged on the inner side of the negative pressure ring 41, and is connected to the compressor by a plurality of gas paths, so that the upper end of the negative pressure ring 41 forms a negative pressure ring 41 environment capable of adsorbing the wafer to be inspected, and the detection unit 5 includes a high-precision microscope camera module 51 and a conventional high-precision camera module 52, and the high-precision microscope camera module 51 and the conventional high-precision camera module 52 are both installed on the detection base plate 34 and arranged in parallel. The conventional high-precision camera module 52 and the negative pressure detection platform 24 can quickly complete the detection of semiconductor materials in a short time. The pictures collected by the camera will detect and classify various defects of semiconductor materials through self-developed algorithms. If it is necessary to detect semiconductor materials of specific particles, the high-precision microscope camera module 51 can be used for manual observation. That is, the application scenarios of the two modules are different. Daily use can basically be completed with the conventional high-precision camera module 52 (existing technology).

[0028] Specifically, the Z-axis driving unit 35 includes a Z-axis motor 351 , a Z-axis lead screw 352 , and a lead screw slider 353 , wherein the lead screw slider 353 is installed on one side of the detection base plate 34 .

[0029] Specifically, it also includes a high-precision distance detection component 6, which includes an X-axis grating ruler 61, a Y-axis grating ruler 62 and a Z-axis grating ruler 63. The X-axis grating ruler 61 is installed on one side of the X-axis slide rail 11 to detect the travel distance of the Y-axis slide 21, the Y-axis grating ruler 62 is installed on one side of the Y-axis slide rail 22 to detect the travel distance of the negative pressure detection platform 24, and the Z-axis grating ruler 63 is installed on one side of the Z-axis slide rail 32 to detect the travel distance of the detection seat plate 34. Through the above-mentioned grating rulers, in conjunction with the grating ruler reading heads on each slide rail, and then electrically connected to the system main control board, as well as in conjunction with the control of each linear motor, precise control of the sliding distance of each axis can be achieved.

[0030] Specifically, if the marble main platform 10 is placed directly on the ground, the problem of uneven ground may occur. In addition, the buffering force brought by the heavy weight components during multi-axis sliding may cause the marble main platform 10 to be unstable. At this time, the patent provides a solution, which specifically includes a buffer mechanism 7, and the buffer mechanism 7 includes a number of shock-absorbing rubber pads equidistantly distributed under the marble main platform 10. Preferably, the shock-absorbing rubber pads are arranged at the four corners of the marble main platform 10, and each shock-absorbing rubber pad is formed by bonding a number of rubber pads of equal thickness to increase the buffering force of a single shock-absorbing rubber pad.

[0031] Specifically, the negative pressure ring 41 includes a negative pressure ring cavity 411, an air suction hole 412, a ventilation pipe 413 and an exhaust hole 414. The negative pressure ring cavity 411 is formed by a depression inside the negative pressure ring 41. The wafer carrying surface 42 is arranged at the upper end of the negative pressure ring cavity 411. The exhaust hole 414 is arranged at the upper end surface of the negative pressure ring cavity 411. The exhaust hole 414 is arranged at the side wall position of the negative pressure ring 41 and is connected to the negative pressure ring cavity 411. The exhaust hole 414 is also connected to the ventilation pipe 413, and the ventilation pipe 413 is connected to the air suction hole 412.

[0032] Specifically, the air intake holes 412 are distributed in a circular array along the upper end of the annular wall of the negative pressure ring 41 in the vertical direction, and the ventilation pipeline 413 is an annular ventilation lumen arranged at the lower end of the annular wall of the negative pressure ring 41, below the air intake holes 412 and connected to all the air intake holes 412.

[0033] The above-mentioned implementation modes are only preferred implementation modes of the present invention, and cannot be used to limit the protection scope of the present invention. Any non-substantial changes and substitutions made by technicians in this field on the basis of the present invention shall fall within the scope of protection required by the present invention.

Claims

1. A wafer inspection marble inspection platform, characterized in that: include: A marble main platform, wherein the upper and lower surfaces of the marble main platform are arranged horizontally, and the upper end of the marble main platform forms an X-axis and Y-axis component installation plane; A marble backing plate, which is vertically installed on the inner side of the marble main platform, with its lower end recessed to form a clearance groove and its upper end forming a Z-axis component installation plane; The X-axis component includes a plurality of sets of X-axis slide rails and X-axis sliders arranged in parallel, and an X-axis linear motor is arranged between the two sets of X-axis slide rails in the middle; The Y-axis component includes a Y-axis slide plate, a Y-axis slide rail, a Y-axis slider and a negative pressure detection platform, wherein the Y-axis slide plate is fixedly connected to the top of the X-axis slider, the Y-axis slide rail is arranged above the Y-axis slide plate, and the negative pressure detection platform slides in cooperation with the Y-axis slide rail through the Y-axis slider; wherein the negative pressure detection platform is used to install the unit to be inspected, and a Y-axis linear motor is arranged between the negative pressure detection platform and the Y-axis slide plate; The Z-axis component includes a Z-axis base, a Z-axis slide rail, a Z-axis slider, a detection seat plate, and a Z-axis drive unit. The Z-axis base is installed on the upper end of the marble backing plate, the Z-axis slide rail is set on the Z-axis base, and the detection seat plate is slidably matched with the Z-axis slide rail through the Z-axis slider; the detection seat plate is used to install the detection unit, and the Z-axis drive unit is used to drive the detection seat plate to slide relative to the Z-axis base.

2. A wafer inspection marble inspection platform as claimed in claim 1, characterized in that: The unit to be inspected includes a negative pressure ring, a wafer carrying surface and a negative pressure mechanism, wherein the negative pressure ring is installed at the upper end of the negative pressure detection platform, the wafer carrying surface is arranged in the middle position of the upper end of the negative pressure ring, and the negative pressure mechanism is arranged on the inner side of the negative pressure ring and is connected to the compressor by a plurality of air paths so that a negative pressure environment capable of adsorbing the wafer to be inspected is formed at the upper end of the negative pressure ring. The detection unit includes a high-precision microscope camera module and a conventional high-precision camera module, which are both installed on the detection base plate and arranged in parallel.

3. A wafer inspection marble inspection platform as claimed in claim 1, characterized in that: The Z-axis driving unit comprises a Z-axis motor, a Z-axis lead screw and a lead screw slider, wherein the lead screw slider is installed on one side of the detection base plate.

4. A wafer inspection marble inspection platform as described in any one of claims 1 to 3, characterized in that: It also includes a high-precision distance detection component, which includes an X-axis grating ruler, a Y-axis grating ruler and a Z-axis grating ruler. The X-axis grating ruler is installed on one side of the X-axis slide rail to detect the travel distance of the Y-axis slide plate, the Y-axis grating ruler is installed on one side of the Y-axis slide rail to detect the travel distance of the negative pressure detection platform, and the Z-axis grating ruler is installed on one side of the Z-axis slide rail to detect the travel distance of the detection base plate.

5. A wafer inspection marble inspection platform as claimed in claim 4, characterized in that: The utility model also comprises a buffer mechanism, which comprises a plurality of shock-absorbing rubber pads which are evenly distributed below the marble main platform.

6. A wafer inspection marble inspection platform as claimed in claim 2, characterized in that: The negative pressure ring includes a negative pressure ring cavity, an air suction hole, a ventilation pipeline and an exhaust hole. The negative pressure ring cavity is formed by a depression inside the negative pressure ring. The wafer bearing surface is arranged at the upper end of the negative pressure ring cavity. The exhaust hole is arranged at the upper end surface of the negative pressure ring cavity. The exhaust hole is arranged at the side wall of the negative pressure ring and is connected with the negative pressure ring cavity. The exhaust hole is also connected with the ventilation pipeline, and the ventilation pipeline is connected with the air suction hole.

7. A wafer inspection marble inspection platform as claimed in claim 6, characterized in that: The air intake holes are distributed in a circumferential array along the upper end of the annular wall of the negative pressure ring in the vertical direction, and the ventilation pipeline is an annular ventilation lumen arranged at the lower end of the annular wall of the negative pressure ring, below the air intake holes and connected to all the air intake holes.

Citation Information

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