Upper die of circuit board testing mechanism
By setting the snap ring, spring and elastic ball in the upper mold of the circuit board test mechanism, and using magnetic adsorption to enhance the stability of the plug and connecting pipe, the problem of shaking of the upper mold of the circuit board test mechanism is solved and the stability of the test is improved and precision.
Patent Information
- Application Number
- CN202323548532.2
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2023-12-26
- Publication Date
- 2025-01-03
- Estimated Expiration
- 2033-12-26
AI Technical Summary
The existing circuit board test mechanism is used to affect the test effect of the circuit board due to the shaking between the upper mold and the lower mold.
A circuit board test mechanism upper mold is designed, and the insertion is further enhanced by setting a snap ring, a spring and an elastic ball between the plug column and the connecting tube to increase friction, and setting a magnetic adsorption between the plug plate and the magnet plate. Stability between column and connection tube.
By increasing the friction and stability between the plug and the connecting tube, the stability of the upper and lower molds of the test mechanism during testing is ensured, thereby improving the detection accuracy and reliability of the circuit board.
Smart Images

Figure CN222299740U_ABST
Abstract
Description
Technical Field
[0001] The utility model belongs to the technical field related to circuit board testing, and in particular relates to an upper die of a circuit board testing mechanism. Background Art
[0002] The names of circuit boards include: ceramic circuit board, alumina ceramic circuit board, aluminum nitride ceramic circuit board, circuit board, PCB board, aluminum substrate, high-frequency board, thick copper board, impedance board, PCB, ultra-thin circuit board, ultra-thin circuit board, printed (copper etching technology) circuit board, etc. Circuit boards make circuits miniaturized and intuitive, and play an important role in the mass production of fixed circuits and the optimization of electrical appliance layout. When testing circuit boards, a circuit board testing mechanism upper mold is required. The existing circuit board testing mechanism upper mold is mainly composed of a testing mechanism upper mold body, connecting blocks, plug columns, connecting columns, and other components. The existing circuit board testing mechanism upper mold may shake with the circuit board testing mechanism lower mold when in use, thereby affecting the test of the circuit board, so a circuit board testing mechanism upper mold is indispensable. Summary of the invention
[0003] The utility model aims to provide an upper mold for a circuit board testing mechanism, so as to solve the problem in the above background technology that the upper mold for the existing circuit board testing mechanism may shake with the lower mold of the circuit board testing mechanism during use, thereby affecting the test of the circuit board.
[0004] To achieve the above purpose, the utility model provides the following technical solutions: a circuit board testing mechanism upper mold, comprising
[0005] A test mechanism upper mold body and connection blocks arranged at left and right sides of the front portion of the test mechanism upper mold body;
[0006] A connecting column is provided at the lower end of the connecting block;
[0007] A plug post is provided at the lower end of the connection block and located at the inner side of the connection post;
[0008] A connecting pipe is provided at the lower end of the plug post and at an external position of the plug post;
[0009] A placement hole is provided on the inner side of the connecting tube, a magnet plate is inlaid inside the placement hole, a clamping plate is provided at the lower end of the plug column, a first placement groove is provided inside the lower end of the clamping plate, a magnetic plate is inlaid inside the first placement groove, a clamping ring is installed at the outer position of the plug column, a second placement groove is provided at the inner position of the clamping ring, a spring is installed inside the second placement groove, and an elastic ball is provided at the outer position of the spring. The friction between the plug column and the connecting tube is increased by the coordinated arrangement of the clamping ring, the spring and the elastic ball, and the stability between the plug column and the connecting tube is further enhanced by the arrangement of the clamping plate, the magnet plate and the magnetic plate.
[0010] Preferably, there are three clamping rings in total, and the three clamping rings are a hollow annular structure.
[0011] Preferably, the inner diameter of the clamping ring is equal to the outer diameter of the plug post, and the clamping ring and the plug post are connected by plugging.
[0012] Preferably, the clamping ring and the plug post are fixed by welding, and the clamping ring and the plug post are both made of stainless steel.
[0013] Preferably, a connecting plate is provided at the upper end of the plug post and at the lower end of the connecting block, and a through hole is provided at an inner position of the connecting plate.
[0014] Preferably, a connecting hole is provided inside the lower end of the connecting block and at a position corresponding to the through hole, and internal threads are provided at inner wall positions of the through hole and the connecting hole.
[0015] Preferably, a fastening nut is provided inside the through hole and the connecting hole and at the lower end of the connecting plate, and an external thread is provided at the outer wall of the fastening nut.
[0016] Preferably, the fastening nut is connected to the internal threads of the inner walls of the through hole and the connecting hole through the external threads of the outer wall, so that the connecting plate is fixed to the lower end of the connecting block, and the plug is further fixed to the lower end of the connecting block.
[0017] Compared with the prior art, the utility model provides a circuit board testing mechanism upper mold, which has the following beneficial effects:
[0018] In the upper mold of the circuit board testing mechanism, when using the upper mold of the circuit board testing mechanism, first insert the upper mold body of the testing mechanism into the connecting tube at the upper end of the lower mold body of the testing mechanism through the plug post. When the plug post enters the inside of the connecting tube, the elastic balls around the outer clamping ring of the plug post will squeeze the inner wall of the connecting tube under the elastic force of the spring. At the same time, the magnetic plate inside the clamping plate at the lower end of the plug post will be adsorbed by the magnet plate when it contacts the magnet plate inside the connecting tube. When the circuit board is tested, the driving cylinder will drive the supporting top plate to move backward to lift the mounting plate so that the mounting plate moves upward, thereby driving the lower mold body of the testing mechanism and the upper mold body of the testing mechanism to move upward at the same time. When the lower mold body contacts the bottom side of the ICT circuit board, the bottom side of the ICT circuit board will be detected. Conversely, the lower mold body of the test mechanism and the upper mold body of the test mechanism move downward at the same time, and the upper mold body of the test mechanism contacts the bottom upper side of the ICT circuit board and detects the upper side of the ICT circuit board. The data is then transmitted and displayed on the display screen of the external control panel. The friction between the plug post and the connecting tube is increased by the coordination of the retaining ring, spring and elastic ball, and the stability between the plug post and the connecting tube is further enhanced by the setting of the retaining plate, magnet plate and magnetic plate, so that the upper mold body of the test mechanism and the lower mold body of the test mechanism become more stable during testing. BRIEF DESCRIPTION OF THE DRAWINGS
[0019] Figure 1 It is a schematic diagram of the overall structure of the upper mold of the circuit board testing mechanism of the utility model.
[0020] Figure 2 This is a structural schematic diagram of a side view of a circuit board testing mechanism of the utility model.
[0021] Figure 3 It is a structural schematic diagram of a top view model of a circuit board testing mechanism of the utility model.
[0022] Figure 4 It is a schematic diagram of the enlarged structure of the upper mold clamping ring of the circuit board testing mechanism of the utility model.
[0023] Figure 5 It is a schematic diagram of the enlarged structure of the interior of the upper die connecting tube of the circuit board testing mechanism of the utility model.
[0024] Figure 6 It is a schematic diagram of the enlarged structure of the interior of the upper mold clamping ring of the circuit board testing mechanism of the utility model.
[0025] Figure 7 It is a schematic diagram of the enlarged structure of the upper mold connecting plate of the circuit board testing mechanism of the utility model.
[0026] Figure 8 It is a structural schematic diagram of the upper mold practical diagram of the circuit board testing mechanism of the utility model.
[0027] In the figure: 1. upper mold body of the test mechanism; 2. connecting block; 3. plug-in column; 4. connecting column; 5. clamping plate; 6. clamping ring; 7. elastic ball; 8. connecting pipe; 9. magnet plate; 10. magnetic plate; 11. placement hole; 12. first placement slot; 13. spring; 14. second placement slot; 15. connecting plate; 16. output device; 17. top plate of the test mechanism; 18. supporting column; 19. lower mold body of the test mechanism; 20. mounting plate; 21. bottom plate; 22. supporting top plate; 23. supporting sliding limit plate; 24. driving cylinder. DETAILED DESCRIPTION
[0028] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.
[0029] The utility model provides Figure 1-8 The circuit board test mechanism upper mold shown in the figure is a circuit board test mechanism upper mold, comprising a test mechanism upper mold body 1 and connection blocks 2 arranged at the left and right sides of the front part of the test mechanism upper mold body 1; a connection column 4 is arranged at the lower end of the connection block 2; a plug column 3 is arranged at the lower end of the connection block 2 and located at the inner side of the connection column 4; a connection tube 8 is arranged at the lower end of the plug column 3 and located at the outer position of the plug column 3; a placement hole 11 is arranged on the inner side of the connection tube 8, a magnet plate 9 is embedded in the placement hole 11, a clamping plate 5 is arranged at the lower end of the plug column 3, and the clamping plate 5 A first placement groove 12 is provided inside the lower end, a magnetic plate 10 is inlaid inside the first placement groove 12, a retaining ring 6 is installed at the external position of the plug column 3, a second placement groove 14 is provided at the internal position of the retaining ring 6, a spring 13 is installed inside the second placement groove 14, and an elastic ball 7 is provided at the outer position of the spring 13. The friction between the plug column 3 and the connecting tube 8 is increased by the coordinated setting of the retaining ring 6, the spring 13 and the elastic ball 7, and the setting of the retaining plate 5, the magnet plate 9 and the magnetic plate 10 further enhances the stability between the plug column 3 and the connecting tube 8.
[0030] like Figure 1 , Figure 4 , Figure 5 , Figure 6 and Figure 8As shown, in order to enhance the stability between the plug post 3 and the connecting tube 8, when using the upper mold of the circuit board test mechanism, first insert the upper mold body 1 of the test mechanism into the connecting tube 8 at the upper end of the lower mold body 19 of the test mechanism through the plug post 3. When the plug post 3 enters the interior of the connecting tube 8, the elastic balls 7 around the outer retaining ring 6 of the plug post 3 will squeeze the inner wall of the connecting tube 8 under the elastic force of the spring 13. At the same time, the magnetic plate 10 inside the clamping plate 5 at the lower end of the plug post 3 will be adsorbed by the magnet plate 9 when it contacts with the magnet plate 9 inside the connecting tube 8. When the circuit board is tested, the driving cylinder 24 drives the support top plate 22 to move backward, which will lift the mounting plate 20 and make the mounting plate 20 move upward, thereby driving the lower mold body 19 of the test mechanism and the upper mold body 1 of the test mechanism to move simultaneously. When the lower mold body 19 of the test mechanism contacts the bottom side of the ICT circuit board, the bottom side of the ICT circuit board will be detected. Otherwise, the lower mold body 19 of the test mechanism and the upper mold body 1 of the test mechanism move downward at the same time. The upper mold body 1 of the test mechanism contacts the bottom upper side of the ICT circuit board and detects the upper side of the ICT circuit board. Then the data is transmitted and displayed on the display screen of the external control console. The friction between the plug post 3 and the connecting tube 8 is increased by the coordinated arrangement of the retaining ring 6, the spring 13 and the elastic ball 7. The arrangement of the retaining plate 5, the magnet plate 9 and the magnetic plate 10 further enhances the stability between the plug post 3 and the connecting tube 8, thereby making the upper mold body 1 of the test mechanism and the lower mold body 19 of the test mechanism more stable during testing.
[0031] There are three clamping rings 6 in total. The three clamping rings 6 are a hollow circular structure. The inner diameter of the clamping ring 6 is equal to the outer diameter of the plug post 3. The clamping ring 6 and the plug post 3 are connected by plugging. The clamping ring 6 and the plug post 3 are fixed by welding. The clamping ring 6 and the plug post 3 are both made of stainless steel.
[0032] like Figure 1 and Figure 4 As shown, in order to facilitate the placement of the elastic ball 7 and the spring 13, when using the upper mold of the circuit board testing mechanism, firstly put the three clamping rings 6 on the outside of the plug post 3, and then fix the clamping rings 6 and the plug post 3 by welding, so that the clamping rings 6 are fixed to the outside of the plug post 3. Through the setting of the clamping rings 6, the placement of the elastic ball 7 and the spring 13 is facilitated, so that the upper mold of the circuit board testing mechanism can be better used.
[0033] A connecting plate 15 is provided at the upper end of the plug column 3 and at the lower end of the connecting block 2, a through hole is provided at an internal position of the connecting plate 15, a connecting hole is provided inside the lower end of the connecting block 2 and at a position corresponding to the through hole, internal threads are provided on the inner walls of the through hole and the connecting hole, a fastening nut is provided inside the through hole and the connecting hole and at the lower end of the connecting plate 15, an external thread is provided on the outer wall of the fastening nut, the fastening nut is connected to the internal thread of the inner wall of the through hole and the connecting hole through the external thread of the outer wall, so that the connecting plate 15 is fixed to the lower end of the connecting block 2, and then the plug column 3 is fixed to the lower end of the connecting block 2.
[0034] like Figure 1 and Figure 7 As shown, in order to facilitate the installation and removal of the plug 3, when using the circuit board test mechanism upper mold, the plug 3 is first connected to the connecting plate 15, and then the connecting plate 15 is placed on the lower end of the connecting block 2, so that the through hole inside the connecting plate 15 is aligned with the connecting hole inside the lower end of the connecting block 2, and then the fastening nut is inserted into the through hole and the connecting hole. The fastening nut is connected with the internal thread of the through hole and the inner wall of the connecting hole through the external thread of the outer wall, so that the connecting plate 15 is fixed to the lower end of the connecting block 2, and then the plug 3 is fixed to the lower end of the connecting block 2. The setting of the connecting plate 15, the fastening nut, the through hole and the connecting hole facilitates the installation and removal of the plug 3, making the installation and removal of the plug 3 more convenient.
[0035] like Figure 1As shown, when working, a conveying device 16 is arranged below the lower mold body 1 of the testing mechanism, a lower mold body 19 of the testing mechanism is arranged at the bottom side of the conveying device 16, a mounting plate 20 is arranged at the bottom side of the lower mold body 19 of the testing mechanism, a seat plate 21 is arranged at the bottom side of the mounting plate 20, and a support column 18 is arranged near the corner position of the seat plate 21, the mounting plate 20 and the top plate 17 of the testing mechanism, the lower mold body 19 of the testing mechanism is connected with the mounting plate 2, the top plate 17 of the testing mechanism, the support column 18 and the seat plate 21 form the overall skeleton of the ICT circuit board testing mechanism together, a supporting sliding limit plate 23 is arranged near the middle position on the upper side of the seat plate 21, the upper end of the supporting sliding limit plate 23 is connected to the supporting top plate 22, a driving cylinder 24 is arranged at the rear end position of the supporting top plate 22, the front end position of the driving cylinder 24 is connected to the supporting top plate 22, and the lower side of the driving cylinder 24 is installed and connected with the seat plate 21 by screws, and the driving cylinder 24 drives the supporting top plate When 22 moves backward, it will lift the mounting plate 20 so that the mounting plate 20 moves upward, and vice versa, it will move the central movable mounting plate 20 downward. When using the upper mold of the circuit board testing mechanism, the driving cylinder 24 will lift the mounting plate 20 when driving the supporting top plate 22 to move backward, so that the mounting plate 20 moves upward, thereby driving the lower mold body 19 of the testing mechanism and the upper mold body 1 of the testing mechanism to move upward at the same time. When the lower mold body 19 of the testing mechanism contacts the bottom side of the ICT circuit board, the bottom side of the ICT circuit board will be detected. Conversely, the lower mold body 19 of the testing mechanism and the upper mold body 1 of the testing mechanism move downward at the same time, the upper mold body 1 of the testing mechanism contacts the bottom upper side of the ICT circuit board and detects the upper side of the ICT circuit board, and then transmits the data to the display screen of the external console and displays it. Through the coordinated use of the upper mold body 1 of the testing mechanism and the lower mold body 19 of the testing mechanism, the circuit board can be better tested, so that the upper mold of the circuit board testing mechanism can work better.
[0036] Finally, it should be noted that the above is only a preferred embodiment of the present invention and is not intended to limit the present invention. Although the present invention has been described in detail with reference to the aforementioned embodiments, those skilled in the art can still modify the technical solutions described in the aforementioned embodiments or make equivalent substitutions for some of the technical features therein. Any modifications, equivalent substitutions, improvements, etc. made within the spirit and principles of the present invention should be included in the protection scope of the present invention.
Claims
1. A circuit board testing mechanism upper mold, comprising A test mechanism upper mold body (1) and connection blocks (2) arranged at left and right sides of the front portion of the test mechanism upper mold body (1); A connecting column (4) is provided at the lower end of the connecting block (2); An insertion column (3) is provided at the lower end of the connection block (2) and located inside the connection column (4); A connecting pipe (8) is provided at the lower end of the plug post (3) and at an external position of the plug post (3); Features: A placement hole (11) is provided on the inner side of the connecting tube (8), a magnet plate (9) is embedded inside the placement hole (11), a clamping plate (5) is provided at the lower end of the plug post (3), a first placement groove (12) is provided inside the lower end of the clamping plate (5), a magnetic plate (10) is embedded inside the first placement groove (12), a clamping ring (6) is installed at the outer position of the plug post (3), a second placement groove (14) is provided at the inner position of the clamping ring (6), a spring (13) is installed inside the second placement groove (14), and an elastic ball (7) is provided at the outer position of the spring (13). The friction between the plug post (3) and the connecting tube (8) is increased by the coordinated arrangement of the clamping ring (6), the spring (13) and the elastic ball (7), and the arrangement of the clamping plate (5), the magnet plate (9) and the magnetic plate (10) further enhances the stability between the plug post (3) and the connecting tube (8).
2. The upper mold of a circuit board testing mechanism according to claim 1, characterized in that: A total of three clamping rings (6) are provided, and the three clamping rings (6) are a hollow annular structure.
3. The upper mold of a circuit board testing mechanism according to claim 2, characterized in that: The inner diameter of the clamping ring (6) is equal to the outer diameter of the plug post (3), and the clamping ring (6) and the plug post (3) are connected by plugging.
4. The upper mold of a circuit board testing mechanism according to claim 3, characterized in that: The clamping ring (6) and the plug post (3) are fixed by welding, and the clamping ring (6) and the plug post (3) are both made of stainless steel.
5. The upper mold of a circuit board testing mechanism according to claim 4, characterized in that: A connecting plate (15) is provided at the upper end of the plug post (3) and at the lower end of the connecting block (2), and a through hole is provided at an inner position of the connecting plate (15).
6. The upper mold of a circuit board testing mechanism according to claim 5, characterized in that: A connecting hole is provided inside the lower end of the connecting block (2) at a position corresponding to the through hole, and internal threads are provided at inner wall positions of the through hole and the connecting hole.
7. The upper mold of a circuit board testing mechanism according to claim 6, characterized in that: A fastening nut is provided inside the through hole and the connecting hole and at the lower end of the connecting plate (15), and an external thread is provided at the outer wall of the fastening nut.
8. The upper mold of a circuit board testing mechanism according to claim 7, characterized in that: The fastening nut is connected to the internal threads of the inner wall of the through hole and the connecting hole via the external threads of the outer wall, so that the connecting plate (15) is fixed to the lower end of the connecting block (2), and the plug post (3) is further fixed to the lower end of the connecting block (2).
