Semiconductor hot plate photoetching equipment convenient for feeding

Abstract

The utility model relates to the technical field of photoetching equipment, and discloses semiconductor hot plate photoetching equipment convenient for loading, which comprises a base, a rack fixedly mounted at the upper end of the base, a rotating motor fixedly mounted at the upper end of the base, and a fixing structure arranged in a material changing box, and comprises a bottom plate, a moving rod, a connecting plate, a clamping plate, a sliding block, a connecting rod and an L-shaped rod, a user can place the semiconductor hot plate into the material changing box, the lower end of the semiconductor hot plate is supported through the bottom plate, the inner end of the semiconductor hot plate is attached to the inner wall of the material changing box, the semiconductor hot plate can downwards extrude the bottom plate to move downwards at the moment, and the connecting plate hinged to the connecting rod can be driven to move inwards through movement of the connecting rod; and the connecting plate moves to drive a moving rod and a clamping plate to move to support and fix the side wall of the semiconductor hot plate, so that the situation that the side wall of the semiconductor hot plate needs to be manually clamped and fixed subsequently is avoided, and the feeding convenience is improved.

Description

Technical Field

[0001] The utility model relates to the technical field of photolithography equipment, in particular to a semiconductor hot plate photolithography equipment which is convenient for loading materials. Background Art

[0002] A photolithography machine is also known as a mask alignment exposure machine. In the production and processing of semiconductor hot plates, the semiconductor hot plates are usually photolithographically processed by a laser engraving head on the photolithography machine. However, the current semiconductor hot plate photolithography equipment is difficult to quickly switch to the next semiconductor hot plate for photolithography after the previous semiconductor hot plate is photolithographically processed due to the low efficiency of semiconductor hot plate material replacement, resulting in poor working efficiency of the equipment.

[0003] For example, publication number CN215833757U discloses a semiconductor hot plate lithography device that is easy to load. The device prevents the semiconductor hot plate from sliding in the material changing box by placing the semiconductor hot plate into four material changing boxes respectively, and then tightening the locking rod to drive the clamping block to clamp the outer end of the semiconductor hot plate, thereby facilitating subsequent processing work.

[0004] However, the practicality of the loading structure is poor when in use. When loading, the semiconductor hot plate needs to be placed in the material replacement concave box, and then the locking rod needs to be manually tightened to drive the clamping block to clamp the outer end of the semiconductor hot plate. It is more troublesome in actual work, thereby reducing the practicality of the loading structure. In view of this, we propose a semiconductor hot plate lithography device that is easy to load. Utility Model Content

[0005] The utility model aims to provide a semiconductor hot plate lithography device which is convenient for loading materials, so as to solve the problems raised in the above-mentioned background technology.

[0006] To achieve the above-mentioned purpose, the utility model provides the following technical solutions: a semiconductor hot plate lithography device that is convenient for loading, comprising a base, a frame is fixedly installed on the upper end of the base, a rotating motor is fixedly installed on the upper end of the base, a material changing table is fixedly installed on the upper end of the output shaft of the rotating motor, and a material changing box is arranged on all four sides of the material changing table, a processing structure is arranged at the lower end of the frame, and a fixed structure is arranged inside the material changing box, and the fixed structure comprises:

[0007] A bottom plate, the bottom plate is arranged on the inner wall of the material changing box, a moving rod is passed through the inner wall of the material changing box, a connecting plate is fixedly installed on one end of the moving rod, and a clamping plate is arranged on the other end of the moving rod;

[0008] A slider, the slider is slidably connected to the side wall of the material changing box, one end of a connecting rod is hinged on the upper side wall of the slider, the other end of the connecting rod is hinged to the lower end of the connecting plate, one end of an L-shaped rod is fixedly installed on the lower end of the base plate, the other end of the L-shaped rod is fixedly connected to the side wall of the slider, and an adjustment structure is arranged inside the moving rod.

[0009] Preferably, the adjustment structure includes an opening on the side wall of the moving rod, one end of a connecting rod is arranged inside the opening, the other end of the connecting rod is fixedly connected to the side wall of the clamping plate, a connecting port is provided on the surface of the moving rod, and a plurality of groups of bayonet ports are provided on the surface of the connecting roller, and the bayonet ports and the connecting port are penetrated and limited by a T-shaped rod.

[0010] Preferably, a slide groove is provided on the inner wall of the material changing box, a slide rod is fixedly installed on the inner wall of the slide groove, a sleeve is slidably connected to the surface of the slide rod, the side wall of the sleeve is fixedly connected to the side wall of the bottom plate, and a return spring is arranged on the surface of the slide rod.

[0011] Preferably, one end of the return spring is fixedly connected to the inner wall of the slide groove, and the other end of the return spring is fixedly connected to the side wall of the sleeve.

[0012] Preferably, the inner wall of the material changing box is provided with a moving opening adapted to the moving track of the L-shaped rod.

[0013] Preferably, a plurality of water outlets are provided at the bottom of the material changing box.

[0014] Compared with the prior art, the utility model provides a semiconductor hot plate lithography device that is easy to load, and has the following beneficial effects:

[0015] 1. The semiconductor hot plate lithography equipment which is convenient for loading is provided with a fixed structure so as to facilitate automatic fixing of the semiconductor hot plate during loading. The user puts the semiconductor hot plate into the material changing box. At this time, the semiconductor hot plate presses the bottom plate downward to move it downward, thereby driving the slider to move downward, and then driving the clamping plate to move to support and fix the side wall of the semiconductor hot plate, thereby avoiding the need to manually clamp and fix the side wall of the semiconductor hot plate in the future, thereby improving the convenience of loading.

[0016] 2. The semiconductor hot plate lithography equipment that is easy to load is equipped with an adjustment structure to facilitate the adjustment of the length of the clamping plate during clamping to a certain extent. The user can change the position of the clamping plate by selecting different bayonet holes on the surface of the connecting rod, thereby achieving more stable clamping support for semiconductor hot plates of different widths, further improving the practicality of the device. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] Figure 1 It is a schematic diagram of the three-dimensional structure of the utility model;

[0018] Figure 2 It is a partial cross-sectional three-dimensional structural schematic diagram of the material changing box of the utility model;

[0019] Figure 3 It is a schematic diagram of a partial three-dimensional structure of the adjustment structure of the utility model;

[0020] Figure 4 This is an enlarged structural diagram of part A of the utility model.

[0021] In the figure: 1. base; 2. frame; 3. fixed structure; 4. adjustment structure; 5. rotating motor; 6. material changing table; 7. material changing box; 8. processing structure; 9. slide bar; 10. sleeve; 11. return spring; 18. slide groove; 31. bottom plate; 32. moving rod; 33. connecting plate; 34. clamping plate; 35. slider; 36. connecting rod; 37. L-shaped rod; 41. opening; 42. connecting rod; 43. connecting port; 44. bayonet; 45. T-shaped rod; 12. moving port. DETAILED DESCRIPTION

[0022] like Figure 1-Figure 4 As shown, the utility model provides a technical solution: a semiconductor hot plate lithography device that is easy to load, including a base 1, a frame 2 is fixedly installed on the upper end of the base 1, a rotating motor 5 is fixedly installed on the upper end of the base 1, a material changing table 6 is fixedly installed on the upper end of the output shaft of the rotating motor 5, and a material changing box 7 is arranged on four sides of the material changing table 6, a processing structure 8 is arranged at the lower end of the frame 2, and a fixed structure 3 is arranged inside the material changing box 7, and the fixed structure 3 includes a bottom plate 31 arranged on the inner wall of the material changing box 7, a moving rod 32 is penetrated through the inner wall of the material changing box 7, a connecting plate 33 is fixedly installed on one end of the moving rod 32, and a clamping plate 34 is arranged on the other end of the moving rod 32, a slider 35 is slidably connected to the side wall of the material changing box 7, and a connecting rod 36 is hinged on the upper side wall of the slider 35 The bottom plate 31 is fixed with one end of an L-shaped rod 37, and the other end of the L-shaped rod 37 is fixedly connected to the side wall of the slider 35. An adjustment structure 4 is arranged inside the moving rod 32. A slide groove 18 is arranged on the inner wall of the material changing box 7, and a slide rod 9 is fixedly installed on the inner wall of the slide groove 18. A sleeve 10 is slidably connected to the surface of the slide rod 9. The side wall of the sleeve 10 is fixedly connected to the side wall of the bottom plate 31. A return spring 11 is arranged on the surface of the slide rod 9, and one end of the return spring 11 is fixedly connected to the inner wall of the slide groove 18, and the other end of the return spring 11 is fixedly connected to the side wall of the sleeve 10. A moving port 12 adapted to the moving trajectory of the L-shaped rod 37 is arranged on the inner wall of the material changing box 7, and a plurality of water outlets are arranged at the bottom of the material changing box 7.

[0023] Specifically, the fixing structure 3 of the technical solution of the utility model includes: a bottom plate 31 , a moving rod 32 , a connecting plate 33 , a clamping plate 34 , a sliding block 35 , a connecting rod 36 , and an L-shaped rod 37 .

[0024] In one embodiment of the present invention, a fixing structure 3 is provided to facilitate automatic fixing of the semiconductor hot plate during loading, and four sets of material changing boxes 7 are provided to facilitate loading without the need to discharge the materials again and again, thereby improving the convenience of loading, and a rotating motor 5 is provided to drive the material changing table 6 and the material changing box 7 to rotate, thereby facilitating subsequent processing work. When loading the semiconductor hot plate, the user can put the semiconductor hot plate into the material changing box 7, and the bottom plate 31 is used to support the lower end of the semiconductor hot plate, so that the inner end of the semiconductor hot plate is in contact with the inner wall of the material changing box 7, and at this time, the semiconductor hot plate will press the bottom plate 31 downward to move it downward, and the bottom plate 31 is sleeved by its side wall. The cylinder 10 moves on the surface of the slide rod 9, and the sleeve 10 stretches the reset spring 11 when moving, the bottom plate 31 moves and then drives the L-shaped rod 37 at its lower end to move, the L-shaped rod 37 moves and drives the slider 35 to move downward, the slider 35 moves and drives the connecting rod 36 to move, and the movement of the connecting rod 36 drives the connecting plate 33 hinged thereto to move inward, the connection plate 33 moves and then drives the moving rod 32 and the clamping plate 34 to move to support and fix the side wall of the semiconductor hot plate, thereby avoiding the need to manually clamp and fix the side wall of the semiconductor hot plate later, improving the convenience of loading, and preventing the semiconductor hot plate from sliding in the material replacement box 7, ensuring the firmness of the semiconductor hot plate during photolithography.

[0025] Please continue reading Figure 1-Figure 4 The adjusting structure 4 includes an opening 41 opened on the side wall of the moving rod 32, one end of a connecting rod 42 is arranged inside the opening 41, and the other end of the connecting rod 42 is fixedly connected to the side wall of the clamping plate 34, a connecting port 43 is opened on the surface of the moving rod 32, and a plurality of bayonet holes 44 are opened on the surface of the connecting roller 42, and the bayonet holes 44 and the connecting port 43 are penetrated and limited by a T-shaped rod 45. By setting the adjusting structure 4, it is convenient to adjust the length of the clamping plate 34 to a certain extent when clamping. The user can change the position of the clamping plate 34 by selecting different bayonet holes 44 on the surface of the connecting rod 42, so as to make the clamping support of semiconductor hot plates of different widths more stable, further improving the practicality of the device, and the user can insert the T-shaped rod 45 into the connecting port 43 and the bayonet holes 44 at different positions to change the position of the clamping plate 34, thereby improving the practicality of the device.

[0026] During operation, the user can fix the base 1 stably to the ground, and then adjust the work according to the width of the semiconductor heating plate. The user can change the position of the clamping plate 34 by inserting the T-bar 45 into the connecting port 43 and the bayonet 44 at different positions, and then put the semiconductor heating plate into the material replacement box 7. At this time, the semiconductor heating plate will squeeze the bottom plate 31 downward to make it move downward, and the bottom plate 31 moves on the surface of the sliding rod 9 through the sleeve 10 of its side wall, and the sleeve 10 will stretch the reset spring 11 when moving, and the bottom plate 31 moves and then drives the L-shaped rod 37 at its lower end to move, and the L-shaped rod 37 moves and drives the slider 35 to move downward, and the slider 35 moves and drives the connecting rod 36 to move, and the movement of the connecting rod 36 will drive the connecting plate 33 hinged thereto to move inward, and the movement of the connecting plate 33 drives the moving rod 32 and the clamping plate 34 to move to support and fix the side wall of the semiconductor heating plate, thereby avoiding the need to manually clamp and fix the side wall of the semiconductor heating plate in the future, and then carry out subsequent processing work.

[0027] The above generally describes the present invention in detail, but it is obvious to a person skilled in the art that some modifications or improvements can be made to the present invention. Therefore, modifications or improvements that do not deviate from the spirit of the present invention are within the scope of protection of the present invention.

Claims

1. A semiconductor hot plate lithography device that is convenient for loading, comprising a base (1), a frame (2) is fixedly mounted on the upper end of the base (1), a rotating motor (5) is fixedly mounted on the upper end of the base (1), a material changing table (6) is fixedly mounted on the upper end of the output shaft of the rotating motor (5), and material changing boxes (7) are arranged on four sides of the material changing table (6), and a processing structure (8) is arranged at the lower end of the frame (2), characterized in that: The material changing box (7) is provided with a fixed structure (3) inside, and the fixed structure (3) comprises: A bottom plate (31), the bottom plate (31) being arranged on the inner wall of the material changing box (7), a moving rod (32) penetrating the inner wall of the material changing box (7), a connecting plate (33) being fixedly mounted on one end of the moving rod (32), and a clamping plate (34) being arranged on the other end of the moving rod (32); A slider (35), the slider (35) is slidably connected to the side wall of the material changing box (7), one end of a connecting rod (36) is hinged to the upper side wall of the slider (35), the other end of the connecting rod (36) is hinged to the lower end of the connecting plate (33), one end of an L-shaped rod (37) is fixedly installed at the lower end of the bottom plate (31), the other end of the L-shaped rod (37) is fixedly connected to the side wall of the slider (35), and an adjustment structure (4) is arranged inside the moving rod (32).

2. The semiconductor hot plate lithography device that is easy to load according to claim 1, characterized in that: The adjustment structure (4) comprises an opening (41) formed on the side wall of the moving rod (32); one end of a connecting rod (42) is arranged inside the opening (41); the other end of the connecting rod (42) is fixedly connected to the side wall of the clamping plate (34); a connecting port (43) is formed on the surface of the moving rod (32); a plurality of bayonet ports (44) are formed on the surface of the connecting rod (42); the bayonet ports (44) and the connecting port (43) are interpenetrated and limited by a T-shaped rod (45).

3. The semiconductor hot plate lithography device for easy loading of materials according to claim 1, characterized in that: The inner wall of the material changing box (7) is provided with a slide groove (18), the inner wall of the slide groove (18) is fixedly installed with a slide rod (9), the surface of the slide rod (9) is slidably connected with a sleeve (10), the side wall of the sleeve (10) is fixedly connected to the side wall of the bottom plate (31), and the surface of the slide rod (9) is provided with a return spring (11).

4. The semiconductor hot plate lithography device for easy loading of materials according to claim 3, characterized in that: One end of the return spring (11) is fixedly connected to the inner wall of the slide groove (18), and the other end of the return spring (11) is fixedly connected to the side wall of the sleeve (10).

5. The semiconductor hot plate lithography device for easy loading of materials according to claim 1, characterized in that: The inner wall of the material changing box (7) is provided with a moving opening (12) adapted to the moving track of the L-shaped rod (37).

6. The semiconductor hot plate lithography device for easy loading of materials according to claim 1, characterized in that: The bottom of the material changing box (7) is provided with a plurality of water outlets.

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