Wafer processing structure capable of preventing film from falling off

Abstract

The wafer processing structure capable of preventing the film from falling off comprises a bearing material belt used for bearing wafers, a plurality of wafer bearing areas are arranged on the bearing material belt, and the upper surface of the material belt used for bearing the wafers is in a smooth mirror surface shape to form a mirror surface type wafer bearing part capable of reducing friction. The wafer bearing area comprises a plurality of distributed wafer adhesion bodies, the plurality of distributed wafer adhesion bodies are used as distributed point position adhesion wafer execution bodies, and the distributed point position adhesion is combined with the mirror surface type wafer bearing part to form the wafer bearing structure for preventing the film from falling off.

Description

Technical Field

[0001] The utility model relates to semiconductor preparation technology, in particular to wafer processing auxiliary equipment, specifically, to a wafer processing structure for preventing film from falling off. Background Art

[0002] During the wafer preparation process, in some cases the wafer will be coated before processing. During processing, due to the friction in the wafer bearing area of ​​the processing equipment, the wafer will be moved during processing, and the film covering the wafer will fall off, affecting product quality.

[0003] Therefore, it is necessary to provide a wafer processing structure that prevents film from falling off to solve the above problems. Utility Model Content

[0004] The utility model aims to provide a wafer processing structure capable of preventing film from falling off.

[0005] The utility model achieves the above-mentioned purpose through the following technical solutions:

[0006] A wafer processing structure for preventing film from falling off, comprising a carrying belt for carrying wafers, a plurality of wafer carrying areas being arranged on the carrying belt, and an upper surface of the belt for carrying wafers being in a smooth mirror-like shape, forming a mirror-like wafer carrying portion for reducing friction;

[0007] The wafer carrying area includes a plurality of distributed wafer adhesive bodies, which are used as distributed point-to-point adhesive wafer actuators. The distributed point-to-point adhesive is combined with a mirror-type wafer carrying part to form a wafer carrying structure that prevents film peeling.

[0008] Furthermore, the surface roughness of the mirror-type wafer supporting part is Ry<0.5.

[0009] Furthermore, the plurality of distributed wafer adhesive bodies at least include a first step adhesive portion, a second adhesive portion, and a third step adhesive portion.

[0010] Furthermore, the first step bonding portion includes at least a group of first step bonding areas which are centrally symmetrical.

[0011] Furthermore, the second step adhesive portion includes at least one second step adhesive area.

[0012] Furthermore, the third step adhesive portion includes at least a group of third step adhesive areas which are symmetrical in the upper and lower directions.

[0013] Furthermore, the first step adhesive portion, the second adhesive portion, and the third step adhesive portion are all fan-shaped.

[0014] Furthermore, the first step adhesive portion, the second adhesive portion, and the third step adhesive portion are all 45° sector-shaped bodies.

[0015] Furthermore, the carrier tape has adhesive body setting grooves corresponding to the first step adhesive portion, the second step adhesive portion, and the third step adhesive portion, and the surfaces of the first step adhesive portion, the second step adhesive portion, and the third step adhesive portion are 0.2-0.3mm higher than the mirror wafer carrier portion.

[0016] Compared with the prior art, the utility model uses mirror-type wafer support and combined distributed point adhesion to effectively avoid the film covering the wafer from falling off due to friction during wafer processing, thereby ensuring the quality of wafer processing. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] Figure 1 It is one of the structural schematic diagrams of the utility model.

[0018] Figure 2 This is the second structural diagram of the present utility model. DETAILED DESCRIPTION

[0019] Example:

[0020] See also Figure 1-2 , this embodiment is a wafer processing structure for preventing film from falling off, comprising a carrying tape 1 for carrying wafers, a plurality of wafer carrying areas 100 are arranged on the carrying tape 1, and an upper surface 200 of the tape for carrying wafers is smooth and mirror-like, forming a mirror-like wafer carrying portion for reducing friction;

[0021] The wafer carrying area 100 includes a plurality of distributed wafer adhesive bodies 101, which are used as distributed point-to-point adhesive wafer actuators. The distributed point-to-point adhesive is combined with a mirror-type wafer carrying part to form a wafer carrying structure that prevents film peeling.

[0022] The surface roughness of the mirror-type wafer supporting part is Ry<0.5.

[0023] The plurality of dispersed wafer adhesive bodies 101 at least include a first step adhesive portion 2 , a second step adhesive portion 3 , and a third step adhesive portion 4 .

[0024] The first step bonding portion 2 includes at least a group of first step bonding areas 21 which are centrally symmetrical.

[0025] The second step adhesive portion 3 includes at least one second step adhesive area 31 .

[0026] The third step adhesive portion 4 at least includes a group of third step adhesive areas 41 which are symmetrical in vertical direction.

[0027] The first stepped adhesive portion 2 , the second stepped adhesive portion 3 , and the third stepped adhesive portion 4 are all fan-shaped.

[0028] The first step adhesive portion 2, the second adhesive portion 3, and the third step adhesive portion 4 are all 45° sector-shaped bodies.

[0029] The carrier tape 1 has adhesive body setting grooves corresponding to the first step adhesive part 2, the second step adhesive part 3, and the third step adhesive part 4. The surfaces of the first step adhesive part 2, the second step adhesive part 3, and the third step adhesive part 4 are 0.2-0.3mm higher than the mirror wafer carrier.

[0030] Compared with the prior art, the utility model uses mirror-type wafer support and combined distributed point adhesion to effectively avoid the film covering the wafer from falling off due to friction during wafer processing, thereby ensuring the quality of wafer processing.

[0031] The above are only some embodiments of the present invention. For those skilled in the art, several modifications and improvements can be made without departing from the inventive concept of the present invention, which all belong to the protection scope of the present invention.

Claims

1. A wafer processing structure for preventing film from falling off, characterized in that: It includes a carrying belt for carrying wafers, a plurality of wafer carrying areas are arranged on the carrying belt, and the upper surface of the belt for carrying wafers is in a smooth mirror shape, forming a mirror-type wafer carrying part that reduces friction; The wafer carrying area includes a plurality of distributed wafer adhesive bodies, which are used as distributed point-to-point adhesive wafer actuators. The distributed point-to-point adhesive is combined with a mirror-type wafer carrying part to form a wafer carrying structure that prevents film peeling.

2. The wafer processing structure for preventing film from falling off according to claim 1, characterized in that: The surface roughness of the mirror-type wafer supporting part is Ry<0.

5.

3. The wafer processing structure for preventing film from falling off according to claim 2, characterized in that: A plurality of distributed wafer adhesive bodies at least include a first step adhesive portion, a second adhesive portion, and a third step adhesive portion.

4. The wafer processing structure for preventing film from falling off according to claim 3, characterized in that: The first step bonding portion includes at least a group of first step bonding areas which are centrally symmetrical.

5. The wafer processing structure for preventing film from falling off according to claim 4, characterized in that: The second step adhesive portion includes at least one second step adhesive area.

6. The wafer processing structure for preventing film from falling off according to claim 5, characterized in that: The third step adhesive portion includes at least a group of third step adhesive areas which are symmetrical in vertical direction.

7. The wafer processing structure for preventing film from falling off according to claim 6, characterized in that: The first step adhesive portion, the second adhesive portion, and the third step adhesive portion are all fan-shaped.

8. The wafer processing structure for preventing film from falling off according to claim 6, characterized in that: The first step adhesive portion, the second adhesive portion, and the third step adhesive portion are all 45° sector-shaped bodies.

9. A wafer processing structure for preventing film from falling off according to claim 7 or 8, characterized in that: The carrier tape is provided with adhesive body setting grooves corresponding to the first step adhesive part, the second step adhesive part, and the third step adhesive part. The surfaces of the first step adhesive part, the second step adhesive part, and the third step adhesive part are 0.2-0.3mm higher than the mirror wafer carrier part.

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