Wafer stage

Abstract

The utility model provides a wafer carrying platform. The wafer carrying table comprises a wafer tray used for carrying a wafer; the tray lifting component is used for supporting the wafer tray, and the tray lifting component can enable the wafer tray to ascend or descend; the wafer lifting part is used for receiving the wafer and moving the wafer to the surface of the wafer tray; the wafer fixing part comprises a wafer supporting piece and a vacuum adsorption module; the wafer supporting piece is located on the surface of the wafer tray and used for supporting a wafer; the vacuum adsorption module is used for adsorbing and fixing the wafer after the wafer moves to the surface of the wafer tray; the vacuum adsorption module comprises a plurality of adsorption parts with different sizes, the adsorption parts with different sizes are arranged on the surface of the wafer tray, and the adsorption parts with different widths are used for adsorbing wafers with different sizes.

Description

Technical Field

[0001] The utility model relates to the technical field of semiconductor equipment, in particular to a wafer carrier. Background Art

[0002] In semiconductor equipment, a wafer stage is a device that can carry wafers. With the development of the industry, wafer stages play an increasingly important role in semiconductor equipment and are one of the essential components in semiconductor equipment. The size of the wafer stage in the related technology is fixed, and each wafer of different sizes will be set with a wafer stage corresponding to its size, that is, a semiconductor device can only match the production of wafers of one size.

[0003] When the wafer stage in the related technology is used, the process cost of the semiconductor manufacturing process will be increased. For wafers of different diameters, it is necessary to purchase a variety of semiconductor equipment that matches the wafer diameter. In addition, for wafers of different thicknesses, the semiconductor equipment needs to set matching focusing parameters. Different semiconductor equipment has different focusing parameter control ranges. If the wafer thickness is too thick, it will exceed the focusing parameter control range of the semiconductor equipment. For thicker wafers, it is necessary to use semiconductor equipment with a wider focusing parameter control range, which will also bring higher production costs. Utility Model Content

[0004] The utility model provides a wafer carrier, which can be used to absorb and fix wafers of any size, and can also assist semiconductor equipment in focusing when the wafer is too thick.

[0005] The utility model provides a wafer carrier, comprising:

[0006] Wafer tray, used to carry wafers;

[0007] A tray lifting component, used to support the wafer tray, and the tray lifting component can make the wafer tray rise or fall;

[0008] A wafer lifting component, used for receiving a wafer and moving the wafer to the surface of the wafer tray;

[0009] The wafer fixing component includes a wafer support and a vacuum adsorption module; the wafer support is located on the surface of the wafer tray, and is used to support the wafer after the wafer lifting component moves the wafer to the surface of the wafer tray; the vacuum adsorption module is used to adsorb and fix the wafer after the wafer moves to the surface of the wafer tray; the vacuum adsorption module includes a plurality of adsorption members of different sizes, the plurality of adsorption members of different sizes are arranged on the surface of the wafer tray, and the plurality of adsorption members of different widths are used to adsorb wafers of different sizes.

[0010] Optionally, the pallet lifting component comprises a plurality of pallet lifting members distributed at intervals;

[0011] The tray lifting member includes a first power unit, a support member and a slider. The slider is slidably connected to the support member and can support the wafer tray. The first power unit is used to apply power to the slider to move the slider along the support member. When the slider slides along the support member, the height of the wafer tray can be raised or lowered.

[0012] Optionally, the first power unit includes a stepper motor, the support member includes a threaded rod, the slider is threadedly connected to the threaded rod, the stepper motor is connected to one end of the support member, and the stepper motor can control the threaded rod to rotate so that the slider moves along the threaded rod.

[0013] Optionally, the wafer lifting component includes a wafer lifting member, a lifting member fixing member and a second power unit, the lifting member fixing member is used to fix the wafer lifting member to prevent the wafer lifting member from moving sideways; the top of the wafer lifting member passes through the wafer tray, and the second power unit is arranged at the bottom of the wafer lifting member, and is used to make the wafer lifting member rise or fall along the lifting member fixing member.

[0014] Optionally, the wafer lifting component includes a plurality of support columns and a bracket, one end of the support column is fixed to the bracket, and the other end of the support column passes through the wafer tray, and the power unit includes one or more lifting cylinders.

[0015] Optionally, the wafer support comprises a plurality of wafer support columns spaced apart and distributed on the surface of the wafer carrier.

[0016] Optionally, the plurality of adsorbents are respectively a plurality of annular vacuum strips with different diameters, and between any two of the annular vacuum strips, the annular vacuum strip with a larger diameter surrounds the annular vacuum strip with a smaller diameter;

[0017] The vacuum adsorption module also includes a vacuum pumping device, which is connected to the annular vacuum strip and is used to extract the gas between the annular vacuum strip and the wafer so that the annular vacuum strip adsorbs the wafer.

[0018] Optionally, the wafer fixing component further includes a plurality of wafer fixing members, and the plurality of wafer fixing members are arranged on the side of the annular vacuum strip;

[0019] The wafer fixing part is used to fix the wafer from the side, and the surface of the wafer tray is provided with a wafer fixing part through hole corresponding to the wafer fixing part, and the wafer fixing part can move along the wafer fixing part through hole.

[0020] Optionally, the wafer fixing component includes a clamp and a lifting cylinder, the lifting cylinder is fixed to the back side of the wafer tray, and the lifting cylinder is used to move the clamp along the through hole of the wafer fixing component.

[0021] Optionally, the wafer stage further comprises: a load-bearing platform and a load-bearing platform support;

[0022] The load-bearing platform support is used to support the load-bearing platform, and the load-bearing platform is used to fix the tray lifting component and the wafer lifting component.

[0023] The beneficial effects brought by the technical solution provided by the utility model are:

[0024] In the disclosed embodiment, the wafer stage includes a wafer tray and a tray lifting component. When the thickness of the wafer is too thick and the semiconductor device cannot focus on it, the tray lifting component can control the wafer tray to rise or fall, thereby adjusting the height of the wafer tray to compensate for the part of the wafer thickness that exceeds the control range of the focusing parameters of the semiconductor device, so that the same semiconductor device can focus on wafers of different thicknesses. The wafer stage also includes a wafer lifting component and a wafer fixing component. The wafer lifting component is used to receive the wafer and move the wafer to the surface of the wafer tray. For wafers of different sizes, adsorbents of different sizes are provided in the wafer fixing component. Through adsorbents of different sizes, the wafer fixing component can fix wafers of different sizes, so that the same semiconductor device can match wafers of different sizes. By adopting the wafer stage in the utility model, the same semiconductor device can match wafers of different sizes and thicknesses, which can greatly reduce the production cost brought by the production equipment. BRIEF DESCRIPTION OF THE DRAWINGS

[0025] In order to more clearly illustrate the technical solutions in the present invention or the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.

[0026] Figure 1 is a structural schematic diagram of a wafer carrier provided by an embodiment of the present disclosure;

[0027] Figure 2 is a structural schematic diagram of a pallet lifting member provided in an embodiment of the present disclosure;

[0028] Figure 3 is a bottom schematic diagram of a tray lifting member provided in an embodiment of the present disclosure;

[0029] Figure 4This is a schematic diagram of the structure of a wafer lifting component provided by an embodiment of the present disclosure.

[0030] Figure 5 It is a top view of a wafer carrier provided in an embodiment of the present disclosure.

[0031] Reference numerals:

[0032] 1: Wafer tray; 2: Tray lifting component; 3: Wafer lifting component; 4: Wafer fixing component; 5: Control unit; 6: Load-bearing platform; 7: Load-bearing platform support.

[0033] 11: tray lifting member; 111: first power unit; 112: support member; 113: slider; 114: tray lifting member fixing hole; 12: wafer support member; 121: wafer support column; 13: vacuum adsorption module; 131: adsorption member; 132: vacuum pumping device; 14: wafer lifting member; 141: support column; 142: bracket; 143: wafer lifting member through hole; 15: lifting member fixing member; 16: second power unit; 161: lifting cylinder; 17: wafer fixing member; 171: wafer fixing member through hole. DETAILED DESCRIPTION

[0034] In order to make the purpose, technical solution and advantages of the utility model clearer, the technical solution of the utility model will be clearly and completely described below in conjunction with the drawings in the utility model. Obviously, the described embodiments are part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

[0035] Figure 1 A wafer stage is provided in accordance with an embodiment of the present disclosure. Figure 1 , the wafer stage comprises:

[0036] Wafer tray 1, used for carrying wafers;

[0037] A tray lifting component 2, used for supporting the wafer tray 1, and the tray lifting component 2 can make the wafer tray 1 rise or fall;

[0038] A wafer lifting component 3 is used to receive a wafer and move the wafer to the surface of the wafer tray 1;

[0039] The wafer fixing component 4 includes a wafer support 12 and a vacuum adsorption module 13; the wafer support 12 is located on the surface of the wafer tray 1, and is used to support the wafer after the wafer lifting component 3 moves the wafer to the surface of the wafer tray 1; the vacuum adsorption module 13 is used to adsorb and fix the wafer after the wafer moves to the surface of the wafer tray 1; the vacuum adsorption module 13 includes a plurality of adsorption members 131 of different sizes, and the plurality of adsorption members 131 of different sizes are arranged on the surface of the wafer tray 1, and the plurality of adsorption members 131 of different widths are used to adsorb wafers of different sizes.

[0040] In the disclosed embodiment, the wafer stage includes a wafer tray and a tray lifting component. When the thickness of the wafer is too thick and the semiconductor device cannot focus on it, the tray lifting component can control the wafer tray to rise or fall, thereby adjusting the height of the wafer tray to compensate for the part of the wafer thickness that exceeds the control range of the focusing parameters of the semiconductor device, so that the same semiconductor device can focus on wafers of different thicknesses. The wafer stage also includes a wafer lifting component and a wafer fixing component. The wafer lifting component is used to receive the wafer and move the wafer to the surface of the wafer tray. For wafers of different sizes, adsorbents of different sizes are provided in the wafer fixing component. Through adsorbents of different sizes, the wafer fixing component can fix wafers of different sizes, so that the same semiconductor device can match wafers of different sizes. By adopting the wafer stage in the utility model, the same semiconductor device can match wafers of different sizes and thicknesses, which can greatly reduce the production cost brought by the production equipment.

[0041] In the embodiment of the present disclosure, in order to realize automatic control of the wafer carrier, the wafer carrier also includes: a control unit 5, which is used to control the tray lifting component 2 and the wafer lifting component 3 to rise or fall, and is also used to control the vacuum adsorption module 13 to adsorb or release the wafer.

[0042] It is worth noting that in the embodiments disclosed herein, the relevant control method of the wafer carrier belongs to conventional technology, and the specific structure of the wafer carrier is the innovative point that the present utility model requires to be protected.

[0043] In the embodiment of the present disclosure, the pallet lifting component 2 includes a plurality of pallet lifting members 11 that are spaced apart from each other.

[0044] Figure 2 This is a schematic diagram of the structure of a tray lifting member provided in an embodiment of the present disclosure. Figure 2The tray lifting member 11 includes a first power unit 111, a support member 112 and a slider 113. The slider 113 is slidably connected to the support member 112. The slider 113 can support the wafer tray 1. The first power unit 111 is used to apply power to the slider 113 to move the slider 113 along the support member 112. When the slider 113 slides along the support member 112, the height of the wafer tray 1 can be raised or lowered.

[0045] In the embodiment of the present disclosure, a first power unit, a support member and a slider are provided. The support member can be used to support the wafer tray. The first power unit can apply power to the slider. Through the sliding of the slider, a force is applied to lift the wafer tray, thereby moving the wafer tray.

[0046] In the embodiment of the present disclosure, the first power unit 111 includes a stepper motor, the support member 112 includes a threaded rod, the slider 113 is threadedly connected to the threaded rod, the stepper motor is connected to one end of the support member, and the stepper motor can control the rotation of the threaded rod to move the slider 113 along the threaded rod.

[0047] In the disclosed embodiment, a stepper motor is provided as the first power unit, a threaded rod is provided as a support member, and the slider is threadedly connected to the threaded rod. The stepper motor can accurately control the rotation of the threaded rod, and the rotation of the threaded rod drives the slider to move, and the wafer tray can be accurately controlled to move up and down.

[0048] In the disclosed embodiment, the tray lifting component 2 includes 4 to 6 tray lifting members 11 that are spaced apart from each other. Each tray lifting member 11 can control the lifting of the wafer tray 1 individually or simultaneously.

[0049] Figure 3 This is a bottom schematic diagram of a tray lifting member provided in an embodiment of the present disclosure. Figure 3 A plurality of pallet lifting member fixing holes 114 are arranged around the first power unit 111 , and the pallet lifting member fixing holes 114 are used to fix the pallet lifting member 11 .

[0050] It is worth noting that in the embodiments of the present disclosure, Figure 1 The wafer lifting component in the figure only shows a part of the structure.

[0051] Figure 4 A schematic diagram of the structure of a wafer lifting component provided by an embodiment of the present disclosure. Figure 4The wafer lifting component 3 includes a wafer lifting member 14, a lifting member fixing member 15 and a second power unit 16. The lifting member fixing member 15 is used to fix the wafer lifting member 14 to prevent the wafer lifting member 14 from moving sideways. The top of the wafer lifting member 14 passes through the wafer tray 1. The second power unit 16 is arranged at the bottom of the wafer lifting member 14 to make the wafer lifting member 14 rise or fall along the lifting member fixing member 15.

[0052] In the embodiment of the present disclosure, a wafer lifting member, a lifting part fixing member and a second power unit are provided, and the second power unit applies power to the wafer lifting member so that the wafer lifting member can move up and down, and the lifting part fixing member can prevent the wafer lifting member from moving sideways, thereby ensuring that the wafer lifting member can smoothly realize the up and down movement of the wafer.

[0053] In the disclosed embodiment, the wafer lifting component includes a plurality of support columns 141 and a bracket 142 , one end of the support column 141 is fixed to the bracket 142 , and the other end of the support column 141 passes through the wafer tray 1 , and the second power unit 16 includes one or more lifting cylinders 161 .

[0054] In the disclosed embodiment, a plurality of support columns are provided to penetrate the wafer tray, and one end of the support column is fixed by a bracket, so that the other ends of the plurality of support columns are at the same height, which is more conducive to lifting and lowering of the wafer.

[0055] See again Figure 1 In the disclosed embodiment, the wafer support 12 includes a plurality of wafer support columns 121 spaced apart and distributed on the surface of the wafer carrier.

[0056] In the embodiment of the present disclosure, a plurality of wafer supporting columns are provided, and the wafer supporting columns can support the wafer so as to keep the wafer level.

[0057] In the embodiment of the present disclosure, the plurality of adsorbents 131 are respectively a plurality of annular vacuum strips with different diameters, and between any two of the annular vacuum strips, the annular vacuum strip with a larger diameter surrounds the annular vacuum strip with a smaller diameter;

[0058] The vacuum adsorption module 12 further includes a vacuum pumping device 132 , which is in communication with the annular vacuum strip and is used to extract gas between the annular vacuum strip and the wafer so that the annular vacuum strip adsorbs the wafer.

[0059] In the embodiment of the present disclosure, multiple annular vacuum strips with different diameters are provided and the annular vacuum strips are controlled by a vacuum pumping device to adsorb wafers of different sizes. When the diameter of the wafer increases, annular vacuum strips with larger diameters can be additionally controlled to adsorb the wafers.

[0060] In the disclosed embodiment, the height of the wafer supporting pillar 121 is equal to the height of the vacuum strip, so as to maintain a vacuum between the vacuum strip and the wafer.

[0061] In the embodiment of the present disclosure, the wafer fixing component 4 further includes a plurality of wafer fixing members 17, and the plurality of wafer fixing members 17 are arranged on the side of the annular vacuum strip;

[0062] The wafer fixing member 17 is used to fix the wafer from the side. The surface of the wafer tray 1 is provided with a wafer fixing member through hole 171 corresponding to the wafer fixing member 17 , and the wafer fixing member 17 can move along the wafer fixing member through hole 171 .

[0063] In the disclosed embodiment, a wafer fixture is provided. When the wafer lifting component moves the wafer to the surface of the wafer tray, the wafer fixture can fix the side of the wafer to prevent the wafer from moving horizontally. At the same time, the wafer fixture is provided to achieve rough alignment of the wafer, that is, to fix the starting position of the wafer. The fixture moves along the through hole of the fixture. For wafers of different sizes, the wafer fixture on the side of the annular vacuum strip of the corresponding size is controlled to fix the wafer, and the wafer fixtures at other positions are controlled to descend to prevent the wafer fixtures at other positions from affecting the wafer lifting component to move the wafer to the surface of the wafer tray.

[0064] In the embodiment of the present disclosure, the wafer fixing member 17 includes a clamp and a lifting cylinder, the lifting cylinder is fixed to the back side of the wafer tray 1, and the lifting cylinder is used to move the clamp along the through hole of the wafer fixing member.

[0065] In the embodiment of the present disclosure, the wafer fixture can be raised or lowered by raising or lowering the clamp via a lifting cylinder.

[0066] In the embodiment of the present disclosure, the control unit 5 may include electrical appliances such as solenoid valves and anti-interference components, and the solenoid valves may be used to control the wafer lifting component 3 and the vacuum adsorption module 13 .

[0067] In the embodiment of the present disclosure, the wafer stage further includes: a load-bearing platform 6 and a load-bearing platform support 7;

[0068] The load-bearing platform support 7 is used to support the load-bearing platform 6 , and the load-bearing platform 6 is used to fix the tray lifting component 2 and the wafer lifting component 3 .

[0069] In the disclosed embodiment, a load-bearing platform is provided to fix the tray lifting member, and multiple tray lifting members are fixed on the load-bearing platform, so that one end of the tray lifting member is fixed on the load-bearing platform and the other end is fixed on the wafer tray, which is more conducive to the support effect of the tray lifting member. At the same time, the wafer lifting member can also be fixed at a section away from the wafer tray.

[0070] In the embodiment of the present disclosure, the tray lifting component 11 is fixedly connected to the load-bearing platform by fixing screws through the tray lifting component fixing holes 114, and the wafer lifting component 3 is fixedly connected to the load-bearing platform 6 by the lifting component fixing component 15. One end of the lifting component fixing component 3 is fixed on the load-bearing platform 6, and the other end is fixed on the wafer tray 1.

[0071] It is worth noting that in the embodiment of the present disclosure, the tray lifting component 2, the wafer lifting component 3 and the wafer fixing component 4 in the wafer carrier can work simultaneously, or one component can work alone.

[0072] Figure 5 A top view of a wafer carrier provided by an embodiment of the present disclosure. Figure 5 The surface of the wafer tray has a plurality of annular vacuum strips, and the side of the annular vacuum strips has a plurality of wafer fixing parts 17, and the surface of the wafer tray at the wafer fixing parts 17 has a wafer fixing part through hole 171. The surface of the wafer tray also has a wafer lifting part through hole 143, and the wafer lifting part through hole 143 has a wafer lifting part 14. In addition, the surface of the wafer is also spaced apart with a plurality of wafer supporting columns 121.

[0073] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the utility model, rather than to limit it. Although the utility model has been described in detail with reference to the aforementioned embodiments, those skilled in the art should understand that they can still modify the technical solutions described in the aforementioned embodiments, or make equivalent replacements for some of the technical features therein. However, these modifications or replacements do not deviate the essence of the corresponding technical solutions from the spirit and scope of the technical solutions of the various embodiments of the utility model.

Claims

1. A wafer stage, characterized in that: include: Wafer tray, used to carry wafers; A tray lifting component, used to support the wafer tray, and the tray lifting component can make the wafer tray rise or fall; A wafer lifting component, used for receiving a wafer and moving the wafer to the surface of the wafer tray; Wafer fixing components, including wafer supports and vacuum adsorption modules; The wafer support is located on the surface of the wafer tray, and is used to support the wafer after the wafer lifting component moves the wafer to the surface of the wafer tray; the vacuum adsorption module is used to adsorb and fix the wafer after the wafer moves to the surface of the wafer tray; the vacuum adsorption module includes a plurality of adsorption members of different sizes, and the plurality of adsorption members of different sizes are arranged on the surface of the wafer tray, and the plurality of adsorption members of different widths are used to adsorb wafers of different sizes.

2. The wafer stage according to claim 1, characterized in that: The pallet lifting component includes a plurality of pallet lifting members distributed at intervals; The tray lifting member includes a first power unit, a support member and a slider. The slider is slidably connected to the support member and can support the wafer tray. The first power unit is used to apply power to the slider to move the slider along the support member. When the slider slides along the support member, the height of the wafer tray can be raised or lowered.

3. The wafer stage according to claim 2, characterized in that: The first power unit includes a stepper motor, the support member includes a threaded rod, the slider is threadedly connected to the threaded rod, the stepper motor is connected to one end of the support member, and the stepper motor can control the threaded rod to rotate so that the slider moves along the threaded rod.

4. The wafer stage according to claim 1, characterized in that: The wafer lifting component includes a wafer lifting member, a lifting member fixing member and a second power unit. The lifting member fixing member is used to fix the wafer lifting member to prevent the wafer lifting member from moving sideways. The top of the wafer lifting member passes through the wafer tray. The second power unit is arranged at the bottom of the wafer lifting member to make the wafer lifting member rise or fall along the lifting member fixing member.

5. The wafer stage according to claim 4, characterized in that: The wafer lifting component includes a plurality of support columns and a bracket, one end of the support column is fixed to the bracket, and the other end of the support column passes through the wafer tray, and the power unit includes one or more lifting cylinders.

6. The wafer stage according to any one of claims 1 to 5, characterized in that: The wafer support member includes a plurality of wafer support columns which are spaced apart and distributed on the surface of the wafer carrier.

7. The wafer stage according to any one of claims 1 to 5, characterized in that: The plurality of adsorbents are respectively a plurality of annular vacuum strips with different diameters, and between any two of the annular vacuum strips, the annular vacuum strip with a larger diameter surrounds the annular vacuum strip with a smaller diameter; The vacuum adsorption module also includes a vacuum pumping device, which is connected to the annular vacuum strip and is used to extract the gas between the annular vacuum strip and the wafer so that the annular vacuum strip adsorbs the wafer.

8. The wafer stage according to claim 7, characterized in that: The wafer fixing component further comprises a plurality of wafer fixing members, and the plurality of wafer fixing members are arranged on the side of the annular vacuum strip; The wafer fixing part is used to fix the wafer from the side, and the surface of the wafer tray is provided with a wafer fixing part through hole corresponding to the wafer fixing part, and the wafer fixing part can move along the wafer fixing part through hole.

9. The wafer stage according to claim 8, characterized in that: The wafer fixing part comprises a clamp and a lifting cylinder, wherein the lifting cylinder is fixed on the back side of the wafer tray, and the lifting cylinder is used to move the clamp along the through hole of the wafer fixing part.

10. The wafer stage according to any one of claims 1 to 5, characterized in that: The wafer stage further comprises: a load-bearing platform and a load-bearing platform support; The load-bearing platform support is used to support the load-bearing platform, and the load-bearing platform is used to fix the tray lifting component and the wafer lifting component.

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