Defoaming and curing device suitable for wafer-level lens after attachment

Abstract

The utility model relates to the technical field of wafer-level lens module preparation, and discloses a defoaming and curing device suitable for wafer-level lens fitting, a round-level lens assembly is placed in a defoaming and curing box, the defoaming and curing box is provided with a vacuum port, an input end of an air exhaust mechanism is connected with the vacuum port, and an output end of the air exhaust mechanism is connected with the vacuum port. According to the wafer-level lens assembly, the bubbles in the laminating glue of the laminating layer of the wafer-level lens assembly can be extracted, so that the problem of bubbles is avoided. And a curing assembly is arranged in the defoaming curing box, so that the glue of the bonding layer can be cured, and the curing efficiency between the wafer-level lens and the photosensitive chip is improved.

Description

Technical Field

[0001] The utility model relates to the technical field of wafer-level lens module preparation, in particular to a degassing and curing device suitable for wafer-level lens lamination. Background Art

[0002] With the development of endoscope technology, more and more product structures use the bonding process of wafer-level lenses and photosensitive chips. The diversification of product structures has put higher and higher demands on the bonding process. In the actual preparation process of wafer-level lenses, various problems still exist in the products after bonding.

[0003] In the prior art, bubbles, tilting and uncured film exist after the wafer-level lens and the photosensitive chip are bonded together, which greatly reduces the preparation efficiency of the wafer-level lens module. Utility Model Content

[0004] In order to overcome the defects of the above-mentioned prior art, the purpose of the utility model is to provide a degassing and curing device suitable for wafer-level lens bonding, so as to solve the technical problems of bubbles and uncured after the wafer-level lens and photosensitive chip are bonded in the prior art.

[0005] The utility model is realized by the following technical solutions:

[0006] The utility model provides a degassing and curing device suitable for wafer-level lens after bonding, comprising an exhaust mechanism, a degassing and curing box and a wafer-level lens assembly; the wafer-level lens assembly is placed in the degassing and curing box, and a curing assembly is provided in the degassing and curing box for curing the wafer-level lens assembly; the degassing and curing box is provided with a vacuum port, and the input end of the exhaust mechanism is connected to the vacuum port; a bonding layer is provided in the wafer-level lens assembly.

[0007] Preferably, the curing assembly includes a plurality of UV curing lamps and a heating assembly; the plurality of UV curing lamps are arranged around the wafer-level lens assembly on the inner wall of the degassing and curing box, and are used to perform UV curing on the wafer-level lens; the heating assembly is arranged in the degassing and curing box, and is used to perform thermal curing on the wafer-level lens assembly.

[0008] Furthermore, the heating component includes a heating fan, a heating wire and a thermocouple, and the thermocouple is connected to the heating fan and the heating wire.

[0009] Preferably, a partition is provided in the degassing and curing box, and the wafer-level lens assembly is placed horizontally on the partition.

[0010] Furthermore, the partition is horizontally arranged in the degassing and curing box, and two ends of the partition are respectively fixed on the inner walls on both sides of the degassing and curing box.

[0011] Furthermore, the partition is made of any one of glass, acrylic or transparent ceramic.

[0012] Preferably, the wafer-level lens assembly includes a wafer-level lens and a chip, the wafer-level lens is attached to the chip by glue, and the bonding layer is the contact surface between the wafer-level lens and the chip.

[0013] Preferably, a plurality of temperature controllers are provided in the degassing and curing box for monitoring the temperature in the degassing and curing box.

[0014] Preferably, the air extraction mechanism is a vacuum pump, and the input end of the vacuum pump is connected to the vacuum port.

[0015] Furthermore, a stop valve is provided at the input end of the vacuum pump.

[0016] Compared with the prior art, the utility model has the following beneficial technical effects:

[0017] The utility model provides a degassing and curing device suitable for wafer-level lens bonding. The wafer-level lens assembly is placed in a degassing and curing box, which is provided with a vacuum port. The input end of the air extraction mechanism is connected to the vacuum port, and the bubbles in the bonding glue of the bonding layer of the wafer-level lens assembly can be extracted, thereby avoiding the problem of bubbles. A curing component is provided in the degassing and curing box, which can cure the glue of the bonding layer, thereby improving the curing efficiency between the wafer-level lens and the photosensitive chip.

[0018] Furthermore, the curing assembly includes a plurality of UV curing lamps and a heating assembly. The plurality of UV curing lamps are arranged around the inner wall of the degassing curing box around the wafer-level lens assembly for UV curing of the wafer-level lens. The heating assembly is arranged in the degassing curing box for thermal curing of the wafer-level lens assembly. For glues with different curing conditions, corresponding curing methods can be selected. The UV curing lamps are evenly arranged on the back, sides, top and bottom of the vacuum chamber to avoid the curing light beam being blocked by the optical cutoff film layer on the wafer-level lens due to irradiation in a single direction, thereby ensuring the curing rate after irradiation. The heating assembly avoids thermal stress damage to the wafer-level lens caused by drastic temperature fluctuations while ensuring uniform distribution of the heat field.

[0019] Furthermore, the heating component includes a heating fan, a heating wire and a thermocouple, and the thermocouple is connected to the heating fan and the heating wire. The entire heating process is closed-loop controlled through the feedback model of the thermocouple, thereby avoiding thermal stress damage to the wafer-level lens caused by drastic temperature fluctuations.

[0020] Furthermore, a partition is provided in the degassing and curing box, and the wafer-level lens assembly is placed horizontally on the partition. The partition is horizontally arranged in the degassing and curing box, and the two ends of the partition are respectively fixed on the inner walls on both sides of the degassing and curing box. After the bubbles are extracted, the fitting surface of the wafer-level lens and the photosensitive chip will be adaptively adjusted to a level, avoiding the problem of tilting. BRIEF DESCRIPTION OF THE DRAWINGS

[0021] Figure 1 It is a structural schematic diagram of the device in the utility model.

[0022] In the figure: 1-vacuum pump; 2-stop valve; 3-UV curing lamp; 4-shelf; 5-heating fan; 6-heating wire; 7-thermocouple; 8-bonding layer; 9-wafer-level lens; 10-chip; 11-degassing curing box; 12-temperature controller. DETAILED DESCRIPTION

[0023] In order to enable those skilled in the art to better understand the solution of the utility model, the technical solution in the embodiment of the utility model will be clearly and completely described below in conjunction with the drawings in the embodiment of the utility model. Obviously, the described embodiment is only a part of the embodiment of the utility model, not all of the embodiments. Based on the embodiment of the utility model, all other embodiments obtained by ordinary technicians in this field without creative work should fall within the scope of protection of the utility model.

[0024] It should be noted that the terms "first", "second", etc. in the specification and claims of the utility model and the above-mentioned drawings are used to distinguish similar objects, and are not necessarily used to describe a specific order or sequence. It should be understood that the data used in this way can be interchanged where appropriate, so that the embodiments of the utility model described here can be implemented in an order other than those illustrated or described here. In addition, the terms "including" and "having" and any of their variations are intended to cover non-exclusive inclusions, for example, a process, method, system, product or device that includes a series of steps or units is not necessarily limited to those steps or units clearly listed, but may include other steps or units that are not clearly listed or inherent to these processes, methods, products or devices.

[0025] The utility model is further described in detail below with reference to the accompanying drawings:

[0026] The utility model aims to provide a degassing and curing device suitable for wafer-level lens after bonding, so as to solve the technical problems of bubbles and uncured after the wafer-level lens and photosensitive chip are bonded in the prior art.

[0027] Example

[0028] See also Figure 1In one embodiment of the utility model, a degassing and curing device suitable for wafer-level lens bonding is provided, comprising an exhaust mechanism, a degassing and curing box 11 and a wafer-level lens assembly; the wafer-level lens assembly is placed in the degassing and curing box 11, and a curing assembly is provided in the degassing and curing box 11 for curing the wafer-level lens assembly; the degassing and curing box 11 is provided with a vacuum port, and the input end of the exhaust mechanism is connected to the vacuum port; a bonding layer 8 is provided in the wafer-level lens assembly.

[0029] Specifically, the curing assembly includes a plurality of UV curing lamps 3 and a heating assembly; the plurality of UV curing lamps 3 are arranged around the wafer-level lens assembly on the inner wall of the degassing and curing box 11, and are used to perform UV curing on the wafer-level lens; the heating assembly is arranged in the degassing and curing box 11, and is used to perform thermal curing on the wafer-level lens assembly.

[0030] The heating assembly includes a heating fan 5 , a heating wire 6 and a thermocouple 7 , and the thermocouple 7 is connected to the heating fan 5 and the heating wire 6 .

[0031] Specifically, a partition 4 is provided in the degassing and curing box 11 , and the wafer-level lens assembly is horizontally placed on the partition 4 .

[0032] The partition plate 4 is horizontally arranged in the degassing and curing box 11 , and two ends of the partition plate 4 are respectively fixed on the inner walls on both sides of the degassing and curing box 11 .

[0033] The partition plate 4 is made of any one of glass, acrylic or transparent ceramic.

[0034] Specifically, the wafer-level lens assembly includes a wafer-level lens 9 and a chip 10 . The wafer-level lens 9 is attached to the chip 10 by glue, and the bonding layer is the contact surface between the wafer-level lens 9 and the chip 10 .

[0035] Specifically, a plurality of temperature controllers 12 are provided in the degassing and curing box 11 for monitoring the temperature in the degassing and curing box 11 .

[0036] Specifically, the vacuum mechanism is a vacuum pump 1, and the input end of the vacuum pump 1 is connected to the vacuum port.

[0037] Wherein, a stop valve 2 is provided at the input end of the vacuum pump 1 .

[0038] In the utility model, the vacuum pump 1 is a mechanical vacuum pump / vacuum generator or other device capable of generating negative pressure. The stop valve 2 is an electromagnetically controlled stop valve, or a manual or electric stop valve for controlling the gas flow. The ultraviolet curing lamp 3 is an LED lamp / mercury arc lamp / metal halide lamp / plate-blanking lamp with a wavelength of 315-400nm / 280-315nm / 200-280nm, or other device capable of generating ultraviolet light. The shelf 4 is a horizontal shelf of glass / acrylic / transparent ceramic or other ultraviolet-transmissive shelf capable of carrying products.

[0039] The utility model provides a degassing and curing device suitable for wafer-level lens bonding. When in use:

[0040] The vacuum pump 1 is started after the product is placed in the degassing and curing box 11, and then the stop valve 2 is opened. At this time, the vacuum pump 1 can provide a negative pressure less than the atmospheric pressure to the cavity. The gas existing in the bonding surface of the wafer-level lens 9 and the chip 10 is extracted from the bonding surface. The bonding surface is subjected to plasma bombardment before bonding, so the gaps after the bubbles are extracted will be automatically filled with glue due to capillary action.

[0041] The shelf 4 ensures that after the bubbles are extracted from the bonding layer, the bonding surface between the wafer-level lens 9 and the chip 10 will be adaptively adjusted to a level.

[0042] After the above process is completed, the UV curing lamps 2 evenly arranged in the degassing curing box 11 start to light up the UV light source to UV-cure the bonding surface glue that has formed an ideal optical path, or start the heating fan 5 and the heating wire 6 for thermal curing, or first perform UV curing, and then start the heating fan 5 and the heating wire 6 for heating annealing. The selected curing method and combination sequence depend on the curing characteristics of the bonding surface glue. The feedback model of the thermocouple 7 closes the loop to control the entire heating process, avoiding thermal stress damage to the wafer-level lens caused by drastic temperature fluctuations.

[0043] In summary, the utility model provides a degassing and curing device suitable for wafer-level lens bonding. In the cavity of the device, a vacuum system and a horizontal shelf are added to avoid bubbles and poor tilting in the bonding layer between the wafer-level lens and the photosensitive chip. At the same time, after completing the above processing, the uniform ultraviolet light curing function and hot air heating system of the device can complete the last step of processing the bonding surface between the wafer-level lens and the photosensitive chip, effectively ensuring the optical performance and mechanical strength of the bonding surface, while also avoiding damage caused by thermal stress.

[0044] Finally, it should be noted that the above embodiments are only used to illustrate the technical solution of the utility model rather than to limit it. Although the utility model is described in detail with reference to the above embodiments, ordinary technicians in the relevant field should understand that the specific implementation methods of the utility model can still be modified or replaced by equivalents, and any modification or equivalent replacement that does not depart from the spirit and scope of the utility model should be included in the scope of protection of the claims of the utility model.

Claims

1. A degassing and curing device suitable for wafer-level lens bonding, characterized in that: The invention comprises an exhaust mechanism, a degassing and curing box (11), and a wafer-level lens assembly; the wafer-level lens assembly is placed in the degassing and curing box (11), a curing assembly is provided in the degassing and curing box (11), and is used to cure the wafer-level lens assembly; the degassing and curing box (11) is provided with a vacuum port, and the input end of the exhaust mechanism is connected to the vacuum port; and a bonding layer (8) is provided in the wafer-level lens assembly.

2. The degassing and curing device suitable for wafer-level lens bonding according to claim 1, characterized in that: The curing assembly comprises a plurality of ultraviolet curing lamps (3) and a heating assembly; the plurality of ultraviolet curing lamps (3) are arranged around the inner wall of a degassing and curing box (11) around the wafer-level lens assembly, and are used to perform ultraviolet curing on the wafer-level lens; the heating assembly is arranged in the degassing and curing box (11), and is used to perform thermal curing on the wafer-level lens assembly.

3. The degassing and curing device suitable for wafer-level lens bonding according to claim 2, characterized in that: The heating component comprises a heating fan (5), a heating wire (6) and a thermocouple (7), and the thermocouple (7) is connected to the heating fan (5) and the heating wire (6).

4. The degassing and curing device suitable for wafer-level lens bonding according to claim 1, characterized in that: A partition plate (4) is provided in the degassing and curing box (11), and the wafer-level lens assembly is horizontally placed on the partition plate (4).

5. The degassing and curing device for wafer-level lens bonding according to claim 4, characterized in that: The partition plate (4) is horizontally arranged in the degassing and solidifying box (11), and the two ends of the partition plate (4) are respectively fixed on the inner walls on both sides of the degassing and solidifying box (11).

6. The degassing and curing device for wafer-level lens bonding according to claim 4, characterized in that: The partition (4) is made of any one of glass, acrylic or transparent ceramic materials.

7. The degassing and curing device for wafer-level lens bonding according to claim 1, characterized in that: The wafer-level lens assembly comprises a wafer-level lens (9) and a chip (10); the wafer-level lens (9) is attached to the chip (10) by glue, and the bonding layer is the contact surface between the wafer-level lens (9) and the chip (10).

8. The degassing and curing device for wafer-level lens bonding according to claim 1, characterized in that: The degassing and solidifying box (11) is provided with a plurality of temperature controllers (12) for monitoring the temperature inside the degassing and solidifying box (11).

9. The degassing and curing device for wafer-level lens bonding according to claim 1, characterized in that: The vacuum mechanism is a vacuum pump (1), and the input end of the vacuum pump (1) is connected to a vacuum port.

10. The degassing and curing device for wafer-level lens bonding according to claim 9, characterized in that: A stop valve (2) is provided at the input end of the vacuum pump (1).

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