Chip grabbing manipulator

Abstract

The utility model relates to the technical field of mechanical arms, and discloses a chip grabbing mechanical arm which comprises a base, a telescopic arm, a lifting arm and a vacuum adsorption head, the telescopic arm comprises a first arm and a second arm, the ends, close to each other, of the first arm and the second arm are hinged, the other end of the first arm is rotationally connected with the base, and the other end of the second arm is fixedly connected with the lifting arm. The lifting arm is a vertically arranged sliding rail, a movable seat is arranged on the vacuum adsorption head, a sliding rail groove is formed in the movable seat and matched with the sliding rail, a cavity is formed in the movable seat, the top end of the vacuum adsorption head is installed in the cavity in an up-down sliding mode, and a spring is arranged in the cavity and used for driving the vacuum adsorption head to stretch out and reset; and a handle is arranged on the movable seat. According to the utility model, the vacuum adsorption head is arranged in the cavity in a sliding manner, and the force of pressing the chip by the vacuum adsorption head can be reduced through buffering of the spring, so that the chip is prevented from being damaged due to overlarge pressing force when the chip is picked up; the bottom of the vacuum adsorption head is also provided with a silica gel protection head, and the silica gel protection head is made of a soft material and can protect the chip.

Description

Technical Field

[0001] The utility model relates to the technical field of manipulators, in particular to a chip grabbing manipulator. Background Art

[0002] A chip is an integrated circuit, or IC for short, also known as a microchip or semiconductor chip. It is a small planar circuit made by connecting multiple microelectronic components such as transistors, resistors, capacitors, etc. through wires and miniaturizing them. It is widely used in computers, mobile phones, televisions, automotive electronics, medical equipment and other fields.

[0003] When producing some circuit boards with chips, workers need to manually solder multiple chips on the circuit board substrate. In this work, the chip needs to be taken out and placed in the position where it needs to be soldered, and then each pin needs to be soldered. Since the chip is small in size and has many protruding pins, it is inconvenient for workers to pick it up by hand and it is easy to damage the pins. Therefore, a vacuum adsorption manipulator is often used to adsorb and pick up the chip. The vacuum adsorption manipulator used in this process includes a base, a telescopic arm, a lifting arm and a vacuum adsorption head. One end of the telescopic arm is rotatably connected to the base, and the other end is rotatably connected to the lifting arm. The worker holds the vacuum adsorption head and moves it above the chip, and moves it down to contact the top of the chip to suck it up. After moving to the welding position, it moves down to release the chip. In the process of pressing down the vacuum adsorption head to absorb the chip, the force is difficult to control. When the force is large, the chip is easily damaged. Utility Model Content

[0004] 1. Technical Problems Solved

[0005] The technical problem to be solved by the utility model is that the downward pressure is not well controlled when sucking chips, resulting in chip damage, so a chip grabbing manipulator with a buffer mechanism is provided.

[0006] 2. Technical Solution

[0007] In order to solve the above technical problems, the technical solution provided by the utility model is: a chip grabbing robot, including a base, a telescopic arm, a lifting arm and a vacuum adsorption head, the telescopic arm includes arm one and arm two, the ends of the two close to each other are hinged to each other, the other end of arm one is rotatably connected to the base, and the other end of arm two is rotatably connected to the lifting arm, the lifting arm is a vertically arranged slide rail, a moving seat is provided on the vacuum adsorption head, the moving seat is provided with a slide rail groove, and cooperates with the slide rail, a cavity is provided on the moving seat corresponding to the vacuum adsorption head, the top end of the vacuum adsorption head is slidably installed in the cavity up and down, a spring is provided in the cavity, which is used to drive the vacuum adsorption head to extend and reset; a handle is provided on the moving seat, and the handle is held when in use.

[0008] Furthermore, a limit block is provided on the outer wall of the vacuum adsorption head, and a limit slide groove is correspondingly provided on the inner wall of the cavity, and the limit block is slidably arranged in the limit slide groove.

[0009] Furthermore, a silicone protective head is installed at the bottom of the vacuum adsorption head, and the silicone protective head contacts the top surface of the chip when the chip is adsorbed.

[0010] Furthermore, a connecting boss is provided at the bottom of the vacuum adsorption head, and the top of the silicone protective head is sleeved on the outside of the connecting boss.

[0011] Furthermore, a limiting sealing ring is provided on the top of the silicone protective head, and the limiting sealing ring is in close contact with the bottom surface of the vacuum adsorption head. A threaded fixing cap is sleeved on the outside of the silicone protective head. A thread is provided on the outer wall of the bottom end of the vacuum adsorption head and cooperates with the threaded fixing cap. A through hole is provided on the threaded fixing cap, and the silicone protective head can pass through the through hole, and the diameter of the limiting sealing ring is larger than the diameter of the through hole.

[0012] Furthermore, a vacuum adsorption pipe joint is provided on the top of the vacuum adsorption head. The vacuum adsorption pipe joint is a hard tube, and the top of the vacuum adsorption pipe joint extends to the top of the movable seat.

[0013] Furthermore, an air guide tube is connected to the vacuum adsorption tube joint, and a vacuum pump is connected to the air guide tube through the air guide tube. The vacuum pump is fixed on the base, and a plurality of limit cards are provided on the telescopic arm for fixing the air guide tube.

[0014] Furthermore, a vacuum pump switch is provided on the handle.

[0015] 3. Beneficial Effects

[0016] The advantages of the utility model compared with the prior art are:

[0017] 1. The vacuum adsorption head of the utility model is slidably arranged in the cavity. The spring buffer can reduce the force of the vacuum adsorption head pressing the chip, thereby avoiding excessive pressure when picking up the chip and damaging the chip;

[0018] 2. The utility model also has a silicone protective head at the bottom of the vacuum adsorption head, which is soft and can protect the chip. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] Figure 1 It is a structural schematic diagram of a chip grabbing manipulator of the utility model.

[0020] Figure 2 yes Figure 1 Enlarged view of part A.

[0021] Figure 3 It is a schematic diagram of the longitudinal section structure of a moving seat and a vacuum adsorption head of a chip grabbing manipulator of the utility model.

[0022] Figure 4 It is the explosive intention of the vacuum adsorption head and the silicone protective head of the chip grabbing manipulator of the utility model.

[0023] As shown in the figure: 1. Base; 2. Telescopic arm; 3. Lifting arm; 4. Vacuum adsorption head; 5. Arm one; 6. Arm two; 8. Moving seat; 9. Slide groove; 10. Cavity; 11. Spring; 12. Handle; 13. Limit block; 14. Limit slide groove; 15. Silicone protective head; 16. Connecting boss; 17. Limit sealing ring; 18. Threaded fixing cap; 19. Vacuum adsorption pipe joint; 20. Air guide pipe; 21. Vacuum pump; 22. Vacuum pump switch. DETAILED DESCRIPTION

[0024] In order to make the technical problems, technical solutions and beneficial effects to be solved by the present invention more clearly understood, the present invention is further described in detail below in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain the present invention and are not used to limit the present invention.

[0025] In the description of the present utility model, it should be understood that the terms "upper", "lower", "front", "back", "left", "right", "top", "bottom", "inside", "outside", etc. indicate positions or positional relationships based on the positions or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present utility model and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the present utility model. In addition, the terms "first", "second", etc. are only used for descriptive purposes, and cannot be understood as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Therefore, features defined as "first", "second", etc. may explicitly or implicitly include one or more of the features. In the description of the present utility model, unless otherwise specified, "multiple" means two or more.

[0026] In the description of the present invention, it should be noted that, unless otherwise clearly specified and limited, the term "connection" should be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, or an integral connection. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0027] Embodiment 1: Combining with Figure 1 .

[0028] A chip grabbing robot comprises a base 1, a telescopic arm 2, a lifting arm 3 and a vacuum adsorption head 4. The telescopic arm 2 comprises an arm 1 5 and an arm 2 6, and the ends of the two arms close to each other are hinged to each other. The other end of the arm 1 5 is rotatably connected to the base 1, and the other end of the arm 2 6 is rotatably connected to the lifting arm 3. The lifting arm 3 is a vertically arranged slide rail. A moving seat 8 is provided on the vacuum adsorption head 4. The moving seat 8 is provided with a slide rail groove 9 and cooperates with the slide rail. A cavity 10 is provided on the moving seat 8 corresponding to the vacuum adsorption head 4. The top end of the vacuum adsorption head 4 is slidably installed in the cavity 10 up and down. A spring 11 is provided in the cavity 10 for driving the vacuum adsorption head 4 to extend and reset. A handle 12 is provided on the moving seat 8, and the handle 12 is held when in use.

[0029] A limiting block 13 is disposed on the outer wall of the vacuum adsorption head 4 , and a limiting slide groove 14 is correspondingly disposed on the inner wall of the cavity 10 , and the limiting block 13 is slidably disposed in the limiting slide groove 14 .

[0030] A vacuum adsorption head placement position is provided on the welding workbench. When not in use, the vacuum adsorption head 4 is located on the vacuum adsorption head placement position to prevent it from obstructing welding. The slide rail is used when the vacuum adsorption head 4 is placed in the vacuum adsorption head placement position.

[0031] When in use, hold the handle 12 and pull it upwards to drive the vacuum adsorption head away from the workbench, then pull the handle 12 to drive the vacuum adsorption head 4 to move above the chip, press down to contact the top surface of the chip to absorb the chip; move it above the welding position and release the chip from below. If the force is too great when pressing down to pick up the chip, the spring 11 will compress and absorb energy to avoid crushing the chip. When lifting, the spring 11 releases the vacuum adsorption head 4 to reset.

[0032] Embodiment 2: Combining with Figure 3 , 4 .

[0033] A silicone protective head 15 is installed at the bottom of the vacuum adsorption head 4. When the chip is adsorbed, the silicone protective head 15 contacts the top surface of the chip.

[0034] The bottom of the vacuum adsorption head 4 is provided with a connecting boss 16 , and the top of the silicone protective head 15 is sleeved on the outside of the connecting boss 16 .

[0035] A limiting sealing ring 17 is provided at the top of the silicone protective head 15. The limiting sealing ring 17 and the silicone protective head 15 are an integrated structure. The limiting sealing ring 17 is in close contact with the bottom surface of the vacuum adsorption head 4. A threaded fixing cap 18 is sleeved on the outside of the silicone protective head 15. A thread is provided on the outer wall of the bottom end of the vacuum adsorption head 4 and cooperates with the threaded fixing cap 18. A through hole is provided on the threaded fixing cap 18, and the silicone protective head 15 can pass through the through hole, and the diameter of the limiting sealing ring 17 is larger than the diameter of the through hole.

[0036] The silicone protective head 15 is made of soft material and can protect the chip from being scratched by the vacuum adsorption head 4. The silicone protective head 15 is detachably connected to the vacuum adsorption head 4, and the silicone protective head 15 is installed and fixed by matching the threaded fixing cap 18 with the thread at the bottom of the vacuum adsorption head 4. The limiting sealing ring 17 at the top of the silicone protective head 15 is in sealing contact with the bottom of the vacuum adsorption head 4, thereby preventing air leakage from here when vacuuming.

[0037] Embodiment 3: Combining with Figure 1 , 2 .

[0038] A vacuum adsorption pipe joint 19 is provided on the top of the vacuum adsorption head 4 . The vacuum adsorption pipe joint 19 is a hard pipe, the top of which extends to the top of the moving seat 8 , and a spring is sleeved on the outside of the vacuum adsorption pipe joint 19 .

[0039] The vacuum adsorption pipe joint 19 is connected to an air duct 20 (part of the air duct 20 is omitted in the figure), and is connected to a vacuum pump 21 through the air duct 20. The vacuum pump 21 is fixed on the base 1. The air duct 20 is a hose. A plurality of limit cards are provided on the telescopic arm 2 for fixing the air duct 20.

[0040] The handle 12 is provided with a vacuum pump switch 22 .

[0041] Setting the vacuum adsorption pipe joint 19 as a hard pipe can prevent the vacuum adsorption pipe joint 19 from bending during the extension and retraction of the vacuum adsorption head 4, thereby affecting the adsorption. The air guide pipe 20 is a soft pipe to prevent it from affecting the extension and retraction of the telescopic arm 2. The vacuum pump switch 22 is electrically connected to the vacuum pump 21 through a wire, and the wire is also fixed to the telescopic arm 2 through a limit card.

[0042] During the specific implementation of the utility model, the handle 12 is held and pulled upward to drive the vacuum adsorption head off the workbench, and then the handle 12 is pulled to drive the vacuum adsorption head 4 to move above the chip, and the top surface of the chip is pressed downward (the spring compression is felt, that is, it is pressed into place), and the vacuum pump switch 22 is turned to suck air to suck up the chip; it is lifted and then moved above the welding position, and the lower moving seat reversely turns the vacuum pump switch 22 to stop suction to release the chip, and then the vacuum adsorption head 4 is placed on the vacuum adsorption head placement position for welding.

[0043] The above description of the utility model and its implementation methods is not restrictive. The drawings show only one implementation method of the utility model, and the actual structure is not limited thereto. In short, if ordinary technicians in this field are inspired by it and design structural methods and embodiments similar to the technical solution without creativity without departing from the purpose of the invention of the utility model, they should all fall within the protection scope of the utility model.

Claims

1. A chip grabbing manipulator, comprising a base (1), a telescopic arm (2), a lifting arm (3) and a vacuum adsorption head (4), wherein the telescopic arm (2) comprises an arm 1 (5) and an arm 2 (6), the ends of the two arms close to each other are hinged to each other, the other end of the arm 1 (5) is rotatably connected to the base (1), and the other end of the arm 2 (6) is rotatably connected to the lifting arm (3), and the lifting arm (3) is a vertically arranged slide rail, characterized in that: A moving seat (8) is provided on the vacuum adsorption head (4), a slide rail groove (9) is provided on the moving seat (8) and cooperates with the slide rail, a cavity (10) is provided on the moving seat (8) corresponding to the vacuum adsorption head (4), the top end of the vacuum adsorption head (4) is slidably installed in the cavity (10) up and down, and a spring (11) is provided in the cavity (10) for driving the vacuum adsorption head (4) to extend and reset; The movable seat (8) is provided with a handle (12), and the handle (12) is held by hand during use.

2. The chip grabbing robot according to claim 1, characterized in that: A limiting block (13) is provided on the outer wall of the vacuum adsorption head (4), and a limiting sliding groove (14) is correspondingly provided on the inner wall of the cavity (10), and the limiting block (13) is slidably arranged in the limiting sliding groove (14).

3. The chip grabbing robot according to claim 1, characterized in that: A silica gel protective head (15) is installed at the bottom of the vacuum adsorption head (4), and the silica gel protective head (15) contacts the top surface of the chip when the chip is adsorbed.

4. The chip grabbing robot according to claim 2, characterized in that: The bottom of the vacuum adsorption head (4) is provided with a connecting boss (16), and the top of the silicone protective head (15) is sleeved on the outside of the connecting boss (16).

5. The chip grabbing robot according to claim 4, characterized in that: A limiting sealing ring (17) is provided at the top of the silicone protective head (15), and the limiting sealing ring (17) is in close contact with the bottom surface of the vacuum adsorption head (4). A threaded fixing cap (18) is sleeved on the outside of the silicone protective head (15), and a thread is provided on the outer wall of the bottom end of the vacuum adsorption head (4) and cooperates with the threaded fixing cap (18). A through hole is provided on the threaded fixing cap (18), and the silicone protective head (15) can pass through the through hole, and the diameter of the limiting sealing ring (17) is greater than the diameter of the through hole.

6. The chip grabbing robot according to claim 1, characterized in that: A vacuum adsorption pipe joint (19) is provided at the top of the vacuum adsorption head (4); the vacuum adsorption pipe joint (19) is a hard pipe, the top of which extends to the top of the movable seat (8).

7. The chip grabbing robot according to claim 6, characterized in that: The vacuum adsorption pipe joint (19) is connected to an air guide pipe (20), and is connected to a vacuum pump (21) via the air guide pipe (20); the vacuum pump (21) is fixed on the base (1); and a plurality of limit clips are provided on the telescopic arm (2) for fixing the air guide pipe (20).

8. The chip grabbing robot according to claim 7, characterized in that: The handle (12) is provided with a vacuum pump switch (22).

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