Glue pouring mold for circuit board structure

Abstract

The utility model discloses a glue pouring mould for a circuit board structure, which comprises a support and a cover plate, the support is provided with a positioning groove, the front end of the positioning groove is provided with an opening, and the cover plate comprises an upper cover plate and a lower cover plate which are detachably arranged on the upper wall and the lower wall of the support. A cavity with the opening is defined by the upper cover plate, the lower cover plate and the positioning groove, and the cavity is used for containing an electronic element. The number of the positioning grooves is at least one. The lower cover plate is provided with a supporting table, and the supporting table enables a gap to be formed between the bottom wall of the circuit board and the upper wall of the lower cover plate. The heat dissipation silica gel is filled between the circuit board and the upper cover plate, so that the heat dissipation silica gel is formed into a predetermined shape, then the structure is installed in the shell, the attractiveness and the integrity of the charger layout are effectively improved, meanwhile, the structure formed through glue pouring is adopted, the contact position of the PCB and the shell can be increased or decreased according to actual requirements, and the service life of the charger is prolonged. And the anti-falling effect of the charger is further improved.

Description

Technical Field

[0001] The utility model relates to the field of charger processing equipment, in particular to a glue-filling mold for a circuit board structure. Background Art

[0002] With the modular development of chargers, the circuit board is generally installed in the shell and then fixed by glue. The filled glue is heat-dissipating silicone, which can quickly dissipate heat for electronic components, thus effectively ensuring the high-power operation of the charger.

[0003] However, the direct injection molding method has problems with maintenance and poor aesthetics, which affects the disassembly and assembly of DIY enthusiasts. At the same time, the one-piece heat dissipation silicone also has the problem of poor filling, which affects the overall heat dissipation effect. Utility Model Content

[0004] The main purpose of the utility model is to propose a glue pouring mold for a circuit board structure, aiming to design a heat dissipation silicone mold, and then form a predetermined shape on the circuit board, and then install it in a shell, so as to improve the fullness of the heat dissipation silicone and make installation more convenient.

[0005] To achieve the above purpose, the utility model provides a glue-filling mold for a circuit board structure, comprising:

[0006] A bracket, wherein the bracket is provided with a positioning groove, and a front end of the positioning groove is provided with an opening;

[0007] A cover plate, the cover plate comprising an upper cover plate and a lower cover plate detachably mounted on the upper wall and the lower wall of the bracket, the upper cover plate and the lower cover plate and the positioning groove enclose a cavity provided with the opening;

[0008] The cavity is used to accommodate electronic components;

[0009] The positioning groove is provided with at least one;

[0010] The lower cover plate is provided with a support platform, and the support platform is used to provide a spacing between the bottom wall of the circuit board and the upper wall of the lower cover plate.

[0011] In the actual design, the electronic components are accommodated by the bracket, the upper cover and the lower cover. During installation, the circuit board is placed on the support table, thereby avoiding the need for special glue pouring on the end face far away from the electronic components. The circuit board and the inner wall of the lower cover fit together, thereby avoiding the problem of glue leakage. When the circuit board is fixed, the heat dissipating silicone is filled between the circuit board and the upper cover, thereby forming the heat dissipating silicone into a predetermined shape, and then the structure is installed in the shell, which effectively improves the aesthetics and completeness of the charger layout. At the same time, the glue pouring molding structure can increase or decrease the contact position between the PCB board and the shell according to actual needs, thereby improving the charger's anti-fall effect. BRIEF DESCRIPTION OF THE DRAWINGS

[0012] Figure 1 For the utility model explosion Figure 1 ;

[0013] Figure 2 For the utility model explosion Figure 2 ;

[0014] Figure 3 It is a three-dimensional schematic diagram of the utility model;

[0015] Figure 4 It is a cross-sectional view of the utility model.

[0016] In the figure,

[0017] 1 is a bracket, 10 is an opening, 11 is a positioning slot,

[0018] 21 is the lower cover plate, 22 is the upper cover plate,

[0019] 3 is a support platform, 31 is a first clamping portion, 32 is a first limiting groove,

[0020] 4 is a guide hole,

[0021] 5 is a limiting portion, 51 is a second clamping portion, 52 is a second limiting groove,

[0022] 61 is the first sealing groove, 62 is the second sealing groove,

[0023] 71 is a first sealing convex strip, 72 is a second sealing convex strip,

[0024] 81 is a guide groove, 82 is a guide convex strip,

[0025] 91 is the first limiting strip, and 92 is the second limiting strip.

[0026] 101 is a circuit board, and 102 is a secondary PCB board. DETAILED DESCRIPTION

[0027] The following will be combined with the accompanying drawings to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments of the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

[0028] It should be noted that if the embodiments of the present invention involve directional indications (such as up, down, left, right, front, back, top, bottom, inside, outside, vertical, horizontal, longitudinal, counterclockwise, clockwise, circumferential, radial, axial...), then the directional indication is only used to explain the relative position relationship, movement status, etc. between the components in a certain specific posture (as shown in the accompanying drawings). If the specific posture changes, the directional indication will also change accordingly.

[0029] In addition, if there are descriptions involving "first" or "second" etc. in the embodiments of the utility model, the descriptions of "first" or "second" etc. are only used for descriptive purposes and cannot be understood as indicating or implying their relative importance or implicitly indicating the number of the indicated technical features. Therefore, the features defined as "first" or "second" may explicitly or implicitly include at least one of the features. In addition, the technical solutions between the various embodiments can be combined with each other, but they must be based on the ability of ordinary technicians in the field to implement them. When the combination of technical solutions is contradictory or cannot be implemented, it should be deemed that such combination of technical solutions does not exist and is not within the scope of protection required by the utility model.

[0030] like Figures 1 to 4 As shown, a glue-filling mold for a circuit board structure comprises:

[0031] A bracket 1, wherein the bracket 1 is provided with a positioning groove 11, and a front end of the positioning groove 11 is provided with an opening 10;

[0032] A cover plate, the cover plate comprising an upper cover plate 22 and a lower cover plate 21 detachably mounted on the upper wall and the lower wall of the bracket 1, the upper cover plate 22 and the lower cover plate 21 and the positioning groove 11 enclose a cavity provided with the opening 10;

[0033] The cavity is used to accommodate electronic components;

[0034] The positioning groove 11 is provided with at least one;

[0035] The lower cover plate 21 is provided with a support platform 3 , and the support platform 3 is provided with a gap between the bottom wall of the circuit board and the upper wall of the lower cover plate 21 .

[0036] In the actual design, the electronic components are accommodated by the bracket 1, the upper cover plate 22 and the lower cover plate 21. During installation, the circuit board is placed on the support table 3, thereby avoiding the need for special glue pouring for the end face far away from the electronic components, wherein the circuit board and the inner wall of the lower cover plate 21 fit together, thereby avoiding the problem of glue leakage; when the circuit board is fixed, the heat dissipating silica gel is filled between the circuit board and the upper cover plate 22, thereby forming the heat dissipating silica gel into a predetermined shape, and then the structure is installed in the shell, which effectively improves the aesthetics and completeness of the charger layout. At the same time, the glue pouring molding structure can increase or decrease the contact position between the PCB board and the shell according to actual needs, thereby improving the anti-fall effect of the charger.

[0037] Specifically, the lower wall of the bracket 1 extends to the position of the support platform 3 and forms a first clamping portion 31, and forms a first limiting groove 32 with the upper wall of the support platform 3. The first limiting groove 32 is used to fix the circuit board, thereby avoiding displacement of electronic components during the movement of the mold.

[0038] In the embodiment of the utility model, the bracket 1 is provided with a guide hole 4 penetrating along its length direction, thereby reducing the weight of the mold or facilitating automated production.

[0039] Specifically, the bracket 1 has a second clamping portion 51 extending inwardly at the position of the opening 10, and the upper cover plate 22 is provided with a limiting portion 5 that cooperates with the second clamping portion 51. The limiting portion 5 and the second clamping portion 51 form a second limiting groove 52, and the second limiting groove 52 is used to clamp the secondary PCB board, thereby realizing the overall limiting of the electronic components.

[0040] In the embodiment of the utility model, the support platform 3 is arranged on three surfaces of the inner circumference of the lower cover plate 21, and the support platform 3 is distributed in a point shape, a block shape or a strip shape. Different support platforms 3 are arranged according to different actual products to stably support the circuit board.

[0041] Specifically, the lower wall and upper wall of the bracket 1 are provided with a first sealing groove 61 and a second sealing groove 62 along the positioning groove 11, and the lower cover plate 21 and the upper cover plate 22 are respectively provided with a first sealing ridge 71 and a second sealing ridge 72 that cooperate with the first sealing groove 61 and the second sealing groove 62, thereby realizing relative closure of the cavity.

[0042] In the embodiment of the present utility model,

[0043] The first sealing ridge 71 and the second sealing ridge 72 are provided with a first limiting strip 91 and a second limiting strip 92 on at least one side, so as to avoid the problem of negative pressure after the heat dissipation silicone is filled, resulting in the unsmooth opening and closing of the upper cover plate 22 and the lower cover plate 21, which can be understood as opening and closing as a fulcrum.

[0044] Specifically, the lower wall of the lower cover plate 21 and the upper wall of the upper cover plate 22 are respectively provided with guide grooves 81 and guide ridges 82 that cooperate with each other, thereby realizing the mutual stacking of the molds.

[0045] In the embodiment of the utility model, the front end of the upper cover plate 22 and the front end of the lower cover plate 21 extend out of the front end of the bracket 1 respectively, thereby facilitating the opening of the upper cover plate 22 and the lower cover plate 21 .

[0046] The above description is only a preferred embodiment of the utility model, and does not limit the patent scope of the utility model. All equivalent structural changes made by using the contents of the utility model specification and drawings under the utility model concept, or directly / indirectly used in other related technical fields are included in the patent protection scope of the utility model.

Claims

1. A glue-filling mold for a circuit board structure, characterized in that: include: A bracket, wherein the bracket is provided with a positioning groove, and a front end of the positioning groove is provided with an opening; A cover plate, the cover plate comprising an upper cover plate and a lower cover plate detachably mounted on the upper wall and the lower wall of the bracket, the upper cover plate and the lower cover plate and the positioning groove enclose a cavity provided with the opening; The cavity is used to accommodate electronic components; The positioning groove is provided with at least one; The lower cover plate is provided with a support platform, and the support platform is used to provide a spacing between the bottom wall of the circuit board and the upper wall of the lower cover plate.

2. The glue-potting mold for a circuit board structure according to claim 1, characterized in that: The lower wall of the bracket extends to the position of the support platform and forms a first clamping portion, and forms a first limiting groove with the upper wall of the support platform, and the first limiting groove is used to clamp the circuit board.

3. The glue-potting mold for a circuit board structure according to claim 1, characterized in that: The bracket is provided with a guide hole penetrating along the length direction thereof.

4. The glue-potting mold for a circuit board structure according to claim 1, characterized in that: The bracket is located at the opening and extends inwardly with a second clamping portion, the upper cover is provided with a limiting portion matched with the second clamping portion, the limiting portion and the second clamping portion form a second limiting groove, and the second limiting groove is used to clamp the auxiliary PCB board.

5. The glue-potting mold for a circuit board structure according to claim 1, characterized in that: The support platforms are arranged on three surfaces of the inner circumference of the lower cover plate, and the support platforms are distributed in a point shape, a block shape, or a strip shape.

6. The glue-potting mold for a circuit board structure according to claim 1, characterized in that: The lower wall and the upper wall of the bracket are provided with a first sealing groove and a second sealing groove along the positioning groove, and the lower cover plate and the upper cover plate are respectively provided with a first sealing convex strip and a second sealing convex strip matched with the first sealing groove and the second sealing groove.

7. The glue-potting mold for a circuit board structure according to claim 6, characterized in that: At least one side of the first sealing convex strip and the second sealing convex strip is provided with a first limiting strip and a second limiting strip.

8. The glue-potting mold for a circuit board structure according to claim 1, characterized in that: The lower wall of the lower cover plate and the upper wall of the upper cover plate are respectively provided with guide grooves and guide convex strips which cooperate with each other.

9. The glue-potting mold for a circuit board structure according to claim 1, characterized in that: The front end of the upper cover plate and the front end of the lower cover plate extend out of the front end of the bracket respectively.

Images