Handheld control equipment capable of adjusting temperature

Abstract

The utility model discloses a hand-held control device capable of adjusting temperature, the hand-held control device comprises a housing, a TEC semiconductor material, a control circuit and a heat conduction structure, the control circuit is arranged in the housing, the TEC semiconductor material is arranged in the housing and is electrically connected with the control circuit, and the heat conduction structure is arranged between the TEC semiconductor material and the housing. Refrigeration and heating can be manually or automatically switched, the mouse can adapt to the environment temperature, the body feeling comfort is improved, internal heating and refrigerating devices can be adaptively braked and adjusted according to the set temperature so as to keep the temperature of the mouse constant, the temperature comfort is improved, and the problems that fingers are stiff at the low temperature and the hand sweats and slips at the high temperature in summer are solved. Especially for scenes with high requirements on operation of electronic sports rats, the use effect and experience are improved.

Description

Technical Field

[0001] The utility model discloses a control device, in particular to a handheld control device capable of adjusting temperature, belonging to the technical field of electronic equipment products. Background Art

[0002] A mouse is an input device used for computer operations. It is usually used to control cursor movement and selection operations. Modern mice usually have left and right buttons and a scroll wheel. Some also have additional buttons and functions, such as side buttons, adjustable DPI (dots per inch) settings, etc. The mouse detects movement on the surface through a sensor and converts it into corresponding actions on the computer. It is one of the indispensable tools for computer users to perform various tasks, such as browsing the web, editing documents, playing games, etc.

[0003] A VR controller is an input device specifically designed for virtual reality (VR) experiences. They are typically a pair of handheld devices used to interact and control a virtual environment.

[0004] As representatives of handheld control devices, mice and VR controllers have been widely used in people's lives. In addition to mice and VR controllers, there are other handheld control devices, such as remote controls, game controllers, touch pens, etc.

[0005] The development of handheld control devices in the prior art mainly focuses on the convenience of operation and more precise use. However, when the temperature is low in winter and high in summer, any handheld control device will easily cause discomfort to the user due to the influence of the body temperature. For example, at low temperatures, the user's fingers will become stiff, thereby affecting work efficiency. In summer, the hands are prone to heat and sweat due to high temperatures. Whether it is due to physical discomfort or slipping caused by sweat on the user's hands, it will affect the use effect and make the user experience bad. Summary of the invention

[0006] In view of the above-mentioned shortcomings of the handheld control devices in the prior art that easily cause a bad user experience when the weather is cold or hot, the utility model provides a handheld control device capable of adjusting temperature, wherein a TEC semiconductor material is arranged inside the handheld control device, and the Peltier effect of the TEC semiconductor material is utilized to realize cooling and heating. When the weather is cold or hot, the handheld control device can realize heating or cooling, providing a better user experience.

[0007] The utility model solves the technical problem by adopting the following technical solution: a handheld control device capable of adjusting temperature, the handheld control device comprising a shell, a TEC semiconductor material, a control circuit and a heat conduction structure, the control circuit is arranged in the shell, the TEC semiconductor material is arranged in the shell and is electrically connected to the control circuit, and the heat conduction structure is arranged between the TEC semiconductor material and the shell.

[0008] The technical solution adopted by the utility model to solve its technical problems further includes:

[0009] One side of the TEC semiconductor material is attached to the heat conduction structure, and the other side is attached to the heat dissipation structure.

[0010] The heat dissipation structure comprises a heat dissipation bracket, heat dissipation fins and a fin fixing frame, the heat dissipation fins are fixedly mounted on the fin fixing frame, the fin fixing frame is fixedly mounted on the heat dissipation bracket, and the heat dissipation bracket is fixedly mounted in the shell.

[0011] A fan is installed on the heat dissipation bracket, the fan is arranged corresponding to the heat dissipation fins, and an air inlet and an air outlet are opened on the shell.

[0012] The air inlet and the air outlet are both opened at the bottom of the shell, and the air inlet and the air outlet are arranged opposite to each other.

[0013] An air guide plate is fixedly arranged on the heat dissipation bracket.

[0014] The shell comprises a bottom shell and a surface shell, the bottom shell and the surface shell are mounted together, and a foot pad is mounted at the bottom of the bottom shell.

[0015] A control board is fixedly installed in the shell, a control circuit is arranged on the control board, and buttons are installed on the control board.

[0016] The control panel is provided with a charging interface, a battery is provided in the housing, and a photoelectric module or a mouse ball is provided on the control panel.

[0017] The heat conduction structure adopts a heat conducting sheet.

[0018] The beneficial effects of the utility model are as follows: the utility model utilizes the Peltier effect of TEC semiconductor materials to achieve cooling and heating, and transfers the temperature to the surface of the mouse or VR handle through a set of heat conduction mechanisms, and the contact position with the palm to achieve heating and cooling, so that the user's experience is better. The utility model can manually or automatically switch cooling and heating to adapt to the ambient temperature and increase physical comfort. It can also adaptively adjust the internal heating and cooling devices according to the set temperature to maintain a constant mouse temperature, increase temperature comfort, and improve problems such as stiff fingers at low temperatures and sweaty hands in high temperatures in summer, especially in scenarios where e-sports mice have high requirements for operation, which improves the use effect and experience.

[0019] The utility model will be further described below in conjunction with the accompanying drawings and specific implementation methods. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] Figure 1 It is a schematic diagram of the three-dimensional structure of the utility model.

[0021] Figure 2 It is a schematic diagram of the structure of the utility model in the exploded state.

[0022] In the figure, 1- bottom shell, 2- top shell, 3- mouse wheel, 4- air inlet, 5- air outlet, 6- control panel, 7- button, 8- charging port, 9- photoelectric module, 10- battery, 11- heat sink bracket, 12- air guide plate, 13- fan, 14- heat sink fin, 15- fin fixing frame, 16- heat conductive sheet, 17- TEC semiconductor material, 18- foot pad. DETAILED DESCRIPTION

[0023] This embodiment is a preferred implementation mode of the utility model. Other embodiments whose principles and basic structures are the same or similar to those of this embodiment are within the protection scope of the utility model.

[0024] The utility model mainly protects a handheld control device that can adjust the temperature. It can manually switch between cooling and heating to adapt to the ambient temperature and increase physical comfort. It can also adaptively adjust the internal heating and cooling devices according to the set temperature to keep the temperature of the handheld control device constant, increase temperature comfort, and improve problems such as stiff fingers in low temperatures and sweaty hands in high temperatures in summer. It improves the use effect and experience, especially in scenarios where high operating requirements are placed on e-sports mice.

[0025] The utility model mainly includes a shell, a TEC semiconductor material 17, a control circuit and a heat conduction structure. The control circuit is arranged in the shell, and the TEC semiconductor material 17 is arranged in the shell and is electrically connected to the control circuit. The TEC semiconductor material 17 is controlled by the control circuit to work so as to achieve cooling or heating. The heat conduction structure is arranged between the TEC semiconductor material 17 and the shell. The cold air or heat generated by the TEC semiconductor material 17 can be conducted to the shell through the heat conduction structure to stabilize the body temperature of the handheld control device.

[0026] The present invention is described in detail below using a mouse as a specific example. When implemented, the structure of the present invention can also be applied to a VR handle, a remote controller, a game handle, a touch pen, and the like.

[0027] In this embodiment, the housing includes a bottom housing 1 and a top housing 2, which are mounted together to form a housing. A foot pad 18 is mounted at the bottom of the bottom housing 1, which can make the mouse slide more smoothly and reduce the wear on the bottom housing 1 during use.

[0028] A control board 6 is fixedly mounted on the bottom shell 1, and a control circuit is arranged on the control board 6. A button 7 is mounted on the control board 6. The number and installation position of the buttons 7 can be specifically set according to actual needs. In this embodiment, the buttons 7 include a left button, a right button, a middle button, and a side button, etc. When the structure of the utility model is used in other products, the number and position of the buttons are set according to the specific product. In this embodiment, a charging interface 8 is mounted on the control board 6, and the utility model can be charged. A battery 10 is mounted in the housing, and the utility model is powered by the battery 10. In this embodiment, the battery 10 is a lithium battery.

[0029] In this embodiment, the mouse adopts a photoelectric mouse structure, that is, a photoelectric module 9 is installed on the control board 6, and the cursor operation can be controlled by the photoelectric module 9. In specific implementation, the utility model can also be applied to a mechanical mouse, that is, a mouse ball is installed in the mouse, and the cursor movement is controlled by the mouse ball.

[0030] In this embodiment, the mouse adopts a three-button mouse structure, that is, a mouse wheel 3 is installed on the control panel 6. When a two-button mouse is adopted, the mouse wheel may not be provided.

[0031] In this embodiment, the TEC semiconductor material 17 is a Thermoelectric Cooler semiconductor material, also known as a Peltier cooler. The TEC semiconductor material 17 is composed of two different types of semiconductor materials, usually an N-type semiconductor and a P-type semiconductor. When current passes through the connection between the N-type semiconductor material and the P-type semiconductor material, the thermoelectric effect causes one side to become colder and the other side to become hotter. In this embodiment, the TEC semiconductor material 17 can be made of bismuth telluride, indium selenide, or thallium selenide.

[0032] In this embodiment, the heat conduction structure uses a heat conductive sheet 16, and the heat conductive sheet 16 is preferably made of a deformable material so that it can better fit the heat conductive sheet 16 and the inner wall of the surface shell 2. In specific implementation, thermal conductive silicone grease material or other materials with good thermal conductivity can be used.

[0033] One side of the TEC semiconductor material 17 is attached to the heat conduction structure, and the other side is attached to the heat dissipation structure. When the TEC semiconductor material 17 works in the cooling state, the heat generated by it can be dissipated through the heat dissipation structure. When the TEC semiconductor material 17 works in the heating state, the cold air generated by it can be dissipated through the heat dissipation structure.

[0034] In this embodiment, the heat dissipation structure includes a heat dissipation bracket 11, heat dissipation fins 14 and a fin fixing frame 15. The heat dissipation fins 14 are fixedly mounted on the fin fixing frame 15, and the fin fixing frame 15 is fixedly mounted on the heat dissipation bracket 11, that is, the heat dissipation fins 14 are fixedly mounted on the heat dissipation bracket 11 through the fin fixing frame 15, and the TEC semiconductor material 17 is mounted together with the fin fixing frame 15. In specific implementation, the fin fixing frame 15 may not be set, and the TEC semiconductor material 17 may be directly mounted together with the heat dissipation fins 14.

[0035] In this embodiment, a fan 13 is installed on the heat dissipation bracket 11. The fan 13 is arranged corresponding to the heat dissipation fins 14 to accelerate the heat dissipation or cooling of the heat dissipation fins 14. An air inlet 4 and an air outlet 5 are provided on the outer shell for internal air circulation. In this embodiment, the air inlet 4 and the air outlet 5 are both provided at the bottom of the bottom shell 1 to reduce the impact on the user. The air inlet 4 and the air outlet 5 are arranged relative to each other.

[0036] In this embodiment, an air guide plate 12 is fixedly provided on the heat dissipation bracket 11 , and the air guide plate 12 allows the air entering from the air inlet 4 to pass through the heat dissipation fins 14 more smoothly, which is more conducive to the heat dissipation or cooling of the heat dissipation fins 14 .

[0037] When the utility model is in use, when a direct current passes through a galvanic couple (i.e., TEC semiconductor material 17) composed of two different semiconductor materials, one end of the galvanic couple absorbs heat and the other end releases heat. The TEC semiconductor material 17 is composed of a pair of N-type and P-type semiconductors, which are connected by electrodes to form a cold end and a hot end. Under the action of an external electric field, the heat generated by the current in the semiconductor is transferred from one end of the TEC semiconductor material 17 to the other end, thereby generating a "hot" side and a "cold" side on the TEC semiconductor material 17. The change in the direction of the current will cause the hot and cold end faces of the TEC semiconductor material 17 to switch. Therefore, the TEC semiconductor material 17 can be cooled or heated, and can be switched freely.

[0038] During cooling: the mouse or VR handle is powered by an external power supply or a built-in battery, and the circuit passes through the TEC semiconductor material 17. When the DC current passes through the positive and negative electrodes of the PN, the surface of the TEC semiconductor material 17 absorbs heat and cools down. The low temperature surface is transferred to the mouse shell and the palm position through a set of heat conducting sheets 16 to achieve cooling. The bottom hot end is connected to another set of heat dissipation structures to transfer the heat generated by the TEC semiconductor material 17 to the heat dissipation fins 14, and then the fan 13 increases the heat dissipation fins 14 to exchange heat with the air, and achieves rapid heat dissipation through the designed air duct.

[0039] When heating: through the N-type and P-type principles of the TEC semiconductor material 17, the direction of the DC current is switched, and the cold end and the hot end of the cooling surface are switched to achieve heating, and then transferred to the mouse shell and the palm position through a set of heat conduction mechanisms to achieve heating.

[0040] There are two ways to switch between cooling and heating:

[0041] (a) Manual switching: Manual switching is achieved by switching the direction of the DC current through the switch control circuit.

[0042] (b) Automatic switching: Add a set of temperature control circuits inside the shell, collect temperature through NTC to monitor the surface temperature of the mouse in real time, and preset the temperature threshold in the control circuit. The control circuit controls the switching to achieve the switching between cooling and heating, so as to achieve constant temperature of the mouse.

[0043] The utility model uses the Peltier effect of TEC semiconductor materials to achieve cooling and heating, and transfers the temperature to the surface of the mouse or VR handle through a set of heat conduction mechanisms, and the contact position with the palm to achieve heating and cooling, so that the user's experience is better. The utility model can manually or automatically switch cooling and heating to adapt to the ambient temperature and increase physical comfort. It can also adaptively adjust the internal heating and cooling devices according to the set temperature to maintain a constant mouse temperature, increase temperature comfort, and improve problems such as stiff fingers at low temperatures and sweaty hands in high temperatures in summer. In particular, it improves the use effect and experience in scenarios where e-sports mice have high requirements for operation.

Claims

1. A handheld control device capable of adjusting temperature, characterized in that: The handheld control device comprises a housing, a TEC semiconductor material (17), a control circuit and a heat conduction structure, wherein the control circuit is arranged in the housing, the TEC semiconductor material (17) is arranged in the housing and is electrically connected to the control circuit, and the heat conduction structure is arranged between the TEC semiconductor material (17) and the housing.

2. The handheld control device capable of adjusting temperature according to claim 1, characterized in that: One side of the TEC semiconductor material (17) is bonded to the heat conduction structure, and the other side is bonded to the heat dissipation structure.

3. The handheld control device capable of adjusting temperature according to claim 2, characterized in that: The heat dissipation structure comprises a heat dissipation bracket (11), heat dissipation fins (14) and a fin fixing frame (15); the heat dissipation fins (14) are fixedly mounted on the fin fixing frame (15); the fin fixing frame (15) is fixedly mounted on the heat dissipation bracket (11); and the heat dissipation bracket (11) is fixedly mounted in the housing.

4. The handheld control device capable of adjusting temperature according to claim 3, characterized in that: A fan (13) is installed on the heat dissipation bracket (11), and the fan (13) is arranged corresponding to the heat dissipation fins (14). An air inlet (4) and an air outlet (5) are provided on the outer shell.

5. The handheld control device capable of adjusting temperature according to claim 4, characterized in that: The air inlet (4) and the air outlet (5) are both provided at the bottom of the housing, and the air inlet (4) and the air outlet (5) are arranged opposite to each other.

6. The handheld control device capable of adjusting temperature according to claim 3, characterized in that: An air guide plate (12) is fixedly arranged on the heat dissipation bracket (11).

7. The handheld control device capable of adjusting temperature according to claim 1, characterized in that: The outer shell comprises a bottom shell (1) and a surface shell (2), the bottom shell (1) and the surface shell (2) being mounted together, and a foot pad (18) being mounted at the bottom of the bottom shell (1).

8. The handheld control device capable of adjusting temperature according to claim 1, characterized in that: A control panel (6) is fixedly mounted in the housing, a control circuit is arranged on the control panel (6), and a button (7) is mounted on the control panel (6).

9. The handheld control device capable of adjusting temperature according to claim 8, characterized in that: The control panel (6) is provided with a charging interface (8), a battery (10) is provided in the housing, and a photoelectric module (9) or a mouse ball is provided on the control panel (6).

10. The handheld temperature-adjustable control device according to claim 1, characterized in that: The heat conduction structure adopts a heat conducting sheet (16).

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