Silicon component etching groove
By introducing ultrasonic devices and heating devices into the etching groove of silicon components, the problem of bubble influence in wet etching is solved, the etching uniformity and effect are improved, and the service life of the equipment is extended.
Patent Information
- Application Number
- CN202420798194.3
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-04-17
- Publication Date
- 2025-01-07
- Estimated Expiration
- 2034-04-17
AI Technical Summary
In the existing wet etching equipment, bubbles adhere to the surface of silicon components, resulting in poor etching uniformity and affecting the etching effect.
An etching tank of silicon component including an ultrasonic device is designed. The ultrasonic device generates vibrations through a water tank and an ultrasonic vibration box, which is transferred to the etching liquid to eliminate air bubbles, and ensures the uniform concentration of the etching liquid through a heating device and a bubble device. temperature.
Effectively eliminate air bubbles, improve the uniformity of surface etching of silicon components, improve the etching effect, and extend the service life of the equipment by using corrosion-resistant materials and liquid level protectors.
Smart Images
Figure CN222320195U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to the technical field of silicon component cleaning equipment, in particular to a silicon component etching groove. Background Art
[0002] Semiconductor silicon component products include silicon ingots, silicon barrels, silicon disks, silicon rings, silicon tubes, etc. These silicon components are mainly used to carry or participate in the manufacturing process of semiconductor wafers. The wet etching process is a key step in the processing of semiconductor silicon components. The principle of wet etching is to use chemical methods to remove pollutants attached to the surface of silicon components. Wet etching can make the surface of the parts reach a higher degree of cleanliness.
[0003] In industrial production, a dedicated wet etching device is used for etching process. The wet etching device includes an etching tank for carrying etching liquid. The silicon component is mounted on a tooling and immersed in the etching liquid in the etching tank to achieve surface etching and cleaning.
[0004] In the prior art, in order to improve the etching efficiency, a bubbling device is set in the etching tank to promote the self-circulation of the etching solution in the tank, ensure uniform concentration, and improve the etching efficiency. However, bubbles will adhere to the surface of the silicon component, resulting in poor etching uniformity and affecting the overall etching effect. Utility Model Content
[0005] The problem to be solved by the utility model is how to eliminate bubbles in the etching solution and improve the uniformity of wet etching of silicon parts.
[0006] In order to solve the above problems, the utility model provides a silicon component etching groove, including a bottom plate and side plates arranged around the bottom plate, the bottom plate and the side plates together form a groove body with a top opening, a bubbling device is provided in the groove body, an ultrasonic device is provided under the bottom plate, the ultrasonic device includes a water tank and an ultrasonic vibration box arranged in the water tank, the bottom plate covers the top opening of the water tank, and there is a gap between the top of the ultrasonic vibration box and the bottom plate.
[0007] Compared with the prior art, the silicon component etching groove of the utility model has an ultrasonic device, which can play a defoaming role in the silicon component etching process, thereby eliminating the influence of bubbles on etching, improving the etching uniformity of the workpiece surface, and improving the etching effect; because the etching liquid has a strong corrosive effect, the utility model arranges the ultrasonic device outside the groove body, and uses water as the medium to transmit the vibration generated by the ultrasonic vibration box, which can effectively avoid corrosion of the ultrasonic device and extend the service life of the equipment.
[0008] Furthermore, a plurality of ultrasonic vibrators arranged in an array are provided in the ultrasonic vibration box. This structure can make each part of the ultrasonic vibration box generate uniform ultrasonic vibration, thereby ensuring the defoaming effect of the etching liquid in the tank body.
[0009] Furthermore, the power of the ultrasonic device is greater than 20W / cm 2 , the ultrasonic frequency is 20~40KHz. There will be energy attenuation in the ultrasonic vibration transmission process. In order to ensure the defoaming effect, the ultrasonic device needs to have a large power.
[0010] Furthermore, a heating device is provided in the tank body, which can heat the etching liquid in the tank body to the process temperature to ensure the etching effect.
[0011] Furthermore, the heating device is a heating coil arranged on both sides of the tank body. Such a heating device can heat the etching liquid efficiently.
[0012] Furthermore, a liquid level protector is provided in the tank body. The liquid level protector can monitor the liquid level in the tank body, and can realize a power-off protection function when the liquid level is too low, so as to prevent the heating device from drying out after the etching liquid is emptied.
[0013] Furthermore, the bubbling device comprises an air outlet coil arranged at the bottom of the tank body, and the air outlet coil is provided with a plurality of air outlet holes. The bubbling device guides bubbles from the air outlet holes to promote the circulation of the etching solution in the tank body, and ensures uniform concentration and temperature of the etching solution.
[0014] Furthermore, a drain port is provided at the lower portion of the side plate, and a drain valve is provided on the drain port. The drain port and the drain valve are provided to facilitate drainage and replacement.
[0015] Furthermore, the silicon component etching tank also includes a support platform, the bottom of the support platform is connected to the top of the side plate, and the middle of the support platform is hollowed out to form a channel connected to the tank body. The support platform provides an installation position for other parts of the etching device, which facilitates the overall layout of the device.
[0016] Furthermore, the bottom plate, the side plate and the support platform are made of PVC. The etching groove is made of PVC material with good corrosion resistance to prevent the etching solution from corroding and damaging the etching groove. BRIEF DESCRIPTION OF THE DRAWINGS
[0017] Figure 1 The structure of the etching groove of the silicon component in the embodiment of the utility model Figure 1 .
[0018] Figure 2 The structure of the etching groove of the silicon component in the embodiment of the utility model Figure 2 .
[0019] Figure 3 It is a horizontal cross-sectional view of the etching groove of the silicon component in the embodiment of the utility model.
[0020] Figure 4It is a perspective view of an ultrasonic device in an embodiment of the present utility model.
[0021] Description of reference numerals:
[0022] 11-bottom plate, 12-side plate, 13-trough body, 14-support platform, 2-air outlet coil, 3-heating coil, 4-liquid discharge port, 5-ultrasonic device, 51-water tank, 52-ultrasonic vibration box, 53-ultrasonic vibrator, 54-support bar. DETAILED DESCRIPTION
[0023] In order to make the purpose, technical scheme and advantages of the embodiments of the utility model clearer, the technical scheme in the embodiments of the utility model will be clearly and completely described below in conjunction with the drawings in the embodiments of the utility model. Obviously, the described embodiments are part of the embodiments of the utility model, not all of the embodiments. Generally, the components of the embodiments of the utility model described and shown in the drawings here can be arranged and designed in various different configurations.
[0024] It should be noted that similar symbols and letters denote similar items in the following drawings, and therefore, once an item is defined in one drawing, it does not require further definition and explanation in the subsequent drawings.
[0025] In the description of the present utility model, it should be noted that the terms "upper", "lower", "left", "right", "inner", "outer", "front", "back" and the like indicate positions or positional relationships based on the positions or positional relationships shown in the accompanying drawings, or are the positions or positional relationships in which the utility model product is usually placed when in use, and are only for the convenience of describing the present utility model and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific position, be constructed and operated in a specific position, and therefore cannot be understood as a limitation on the present utility model. The drawings of the embodiments of the present utility model are provided with a coordinate system XYZ, wherein the positive direction of the X-axis represents the front, the reverse direction of the X-axis represents the back, the positive direction of the Y-axis represents the right, the reverse direction of the Y-axis represents the left, the positive direction of the Z-axis represents the top, and the reverse direction of the Z-axis represents the bottom.
[0026] In the description of the present invention, it should be noted that, unless otherwise clearly specified and limited, the terms "installation", "setting", "connection", etc. should be understood in a broad sense. For example, "connection" can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection, or it can be an indirect connection through an intermediate medium, or it can be the internal communication of two components. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.
[0027] The preferred embodiments of the present invention are described below in conjunction with the accompanying drawings. It should be understood that the preferred embodiments described herein are only used to illustrate and explain the present invention, and are not used to limit the present invention.
[0028] Combination Figures 1 to 4 As shown, an embodiment of the utility model provides a silicon component etching groove, which is used to contain etching liquid and provide a space for etching silicon components. The etching groove includes a bottom plate 11 and a side plate 12 arranged around the bottom plate 11. The bottom plate 11 and the side plate 12 are surrounded to form a groove body 13 with an open top. In this embodiment, the groove body 13 is in the shape of a rectangular parallelepiped. In other embodiments, the groove body 13 can also be in other shapes.
[0029] Combination Figure 1 and Figure 2 As shown, a support platform 14 is provided at the top of the etching tank, the bottom of the support platform 14 is connected to the top of the side plate 12, and the middle of the support platform 14 is hollowed out to form a channel connected to the tank body 13. Other parts can be installed on the support platform 14 to facilitate the overall layout of the silicon component etching device.
[0030] A drain port 4 is provided at the lower part of the side plate 12, and the drain port 4 is connected to the tank body 13 for draining the etching liquid in the tank body 13. Preferably, a drain valve (not shown) is provided on the drain port 4, and the drain operation can be performed as needed.
[0031] Preferably, the bottom plate 11, the side plate 12 and the supporting platform 14 are all made of PVC, which has good corrosion resistance and can prevent the etching solution from corroding and damaging the etching groove.
[0032] Combination Figure 2 and Figure 3 The tank body 13 of the etching tank is provided with a bubbling device and a heating device. The bubbling device is used to introduce bubbles into the etching liquid to make the liquid in the tank body 13 flow and mix, thereby improving the uniformity of the etching liquid. The heating device is used to heat the etching liquid to make the etching liquid reach the process temperature and improve the etching effect.
[0033] In this embodiment, the bubbling device is an outlet coil 2 disposed at the bottom of the tank body 13, and a plurality of outlet holes are disposed on the outlet coil 2. One end of the outlet coil 2 is connected to an external gas source through the side plate 12. The gas source is generally a nitrogen source, and nitrogen is input into the outlet coil 2. Bubbles are blown out from the outlet holes to promote the circulation of the etching solution in the tank body 13, so that the concentration and temperature of the etching solution are uniform, thereby ensuring the uniformity of etching of the silicon component.
[0034] In this embodiment, the heating device is two groups of heating coils 3, and the two groups of heating coils 3 are respectively arranged on the left and right sides of the trough body 13. The heating coils 3 located in the trough body 13 are L-shaped, and their vertical sections extend from the top of the trough body 13 to the bottom of the trough body 13, and the horizontal sections are arranged at the bottom of the trough body 13 along the front-to-back direction. This structure can make the heating coils 3 have a larger contact area with the etching liquid, thereby ensuring the heating efficiency.
[0035] Furthermore, in order to improve safety, a liquid level protector (not shown in the figure) is provided in the tank body 13. The liquid level protector is used to monitor the liquid level in the tank body 13. When the liquid level is too low, a power-off protection function can be implemented to prevent the heating device from drying out after the etching liquid is drained.
[0036] Combination Figure 1 and Figure 4 As shown, the etching tank includes an ultrasonic device 5 for ultrasonically defoaming the etching liquid. Since the etching liquid is highly corrosive, the ultrasonic device 5 should not be directly arranged in the tank body 13. In this embodiment, the ultrasonic device 5 is arranged below the bottom plate 11 of the tank body 13. The ultrasonic device 5 includes a water tank 51 and an ultrasonic vibration box 52 arranged in the water tank 51. The bottom plate 11 covers the top opening of the water tank 51. There is a gap between the top of the ultrasonic vibration box 52 and the bottom plate 11. Two support bars 54 are also provided in the water tank 51 for supporting and fixing the ultrasonic vibration box 52. A plurality of ultrasonic vibrators 53 arranged in an array are arranged in the ultrasonic vibration box 52, so that each part of the ultrasonic vibration box 52 can generate uniform ultrasonic vibration.
[0037] There will be energy attenuation in the ultrasonic vibration transmission process. In order to ensure the defoaming effect, the ultrasonic device 5 needs to have a large power. In a specific embodiment, the power of the ultrasonic device 5 is greater than 20W / cm 2 , the ultrasonic frequency is 20~40KHz.
[0038] When the ultrasonic device 5 is in use, the water tank 51 is filled with water, and the mechanical energy generated by the ultrasonic vibration box 52 is transmitted to the bottom of the tank 13 through the water as a medium, and then transmitted to the etching liquid through the bottom plate 11 to eliminate the bubbles in the etching liquid. Since the ultrasonic device 5 plays a defoaming role, the influence of bubbles on etching can be avoided, the etching uniformity of the workpiece surface can be improved, and the etching effect can be improved.
[0039] Finally, it should be noted that the above embodiments are only used to illustrate the technical solution of the utility model, rather than to limit it. Although the utility model has been described in detail with reference to the aforementioned embodiments, ordinary technicians in the field should understand that they can still modify the technical solutions recorded in the aforementioned embodiments, or replace some or all of the technical features therein with equivalents. However, these modifications or replacements do not make the essence of the corresponding technical solutions deviate from the scope of the technical solutions of the embodiments of the utility model.
Claims
1. A silicon component etching groove, characterized in that: The invention comprises a bottom plate (11) and a side plate (12) arranged around the bottom plate (11); the bottom plate (11) and the side plate (12) together form a trough body (13) with an opening at the top; a bubbling device is arranged in the trough body (13); an ultrasonic device (5) is arranged below the bottom plate (11); the ultrasonic device (5) comprises a water tank (51) and an ultrasonic vibration box (52) arranged in the water tank (51); the bottom plate (11) covers the top opening of the water tank (51); a gap is formed between the top of the ultrasonic vibration box (52) and the bottom plate (11); the bubbling device comprises an air outlet coil (2) arranged at the bottom of the trough body (13); a plurality of air outlet holes are arranged on the air outlet coil (2).
2. The silicon component etching groove according to claim 1, characterized in that: The ultrasonic vibration box (52) is provided with a plurality of ultrasonic vibrators (53) arranged in an array.
3. The silicon component etching groove according to claim 1, characterized in that: The power of the ultrasonic device (5) is greater than 20W / cm 2 , the ultrasonic frequency is 20~40KHz.
4. The silicon component etching groove according to claim 1, characterized in that: A heating device is provided in the tank body (13).
5. The silicon component etching groove according to claim 4, characterized in that: The heating device is a heating coil (3) arranged on both sides of the tank body (13).
6. The silicon component etching groove according to claim 4, characterized in that: A liquid level protector is arranged in the tank body (13).
7. The silicon component etching groove according to claim 1, characterized in that: A liquid discharge port (4) is provided at the lower portion of the side plate (12), and a liquid discharge valve is provided on the liquid discharge port (4).
8. The silicon component etching groove according to any one of claims 1 to 7, characterized in that: It also comprises a supporting platform (14), the bottom of the supporting platform (14) is connected to the top of the side plate (12), and the middle of the supporting platform (14) is hollowed out to form a channel connected to the trough body (13).
9. The silicon component etching groove according to claim 8, characterized in that: The bottom plate (11), the side plate (12) and the supporting platform (14) are made of PVC.