Wafer carrier and horizontal heat treatment furnace

Abstract

The utility model discloses a wafer carrier and a horizontal heat treatment furnace, which are used for placing wafers and placing the wafers in accommodating grooves on a carrying paddle, the wafer carrier is provided with a plurality of wafer fixing groove groups, one wafer fixing groove group is used for placing one wafer, and the other wafer fixing groove group is used for placing the other wafer. The plurality of wafer fixing groove groups are sequentially arranged in the length direction of the wafer carrier; the wafer fixing groove sets are arranged in the length direction of the wafer carrier in an inclined mode, the multiple wafer fixing groove sets are inclined in the same direction, and the slope of the wafer fixing groove sets ranges from 1 degree to 2 degrees. Through the above design, the adjacent wafers are prevented from being collided and attached, more wafers are placed, and the production efficiency is improved.

Description

Technical Field

[0001] The present application relates to the field of wafer production technology, and in particular to a wafer carrier and a horizontal heat treatment furnace. Background Art

[0002] The prior art mostly uses a wafer carrier to load wafers, and then places the wafer carrier on a carrying paddle, which extends into a horizontal heat treatment furnace. A wafer carrier usually has 50 groups of wafer fixing slots. Usually, when designing a wafer carrier, a certain space is reserved for the slot width of the wafer fixing slot group according to the thickness of the processed wafer, because a slot width that is too narrow will cause the wafer to get stuck and be difficult to remove.

[0003] Moreover, since the horizontal heat treatment furnace has a horizontal structure, the wafers need to be placed vertically on the wafer carrier. Affected by the vibration of the conveying device, the flow of process gas, and the vibration of the vacuum pump, when the wafer carrier is full of wafers, two adjacent wafers are very likely to come into contact, bump, and stick to each other, resulting in damage to the wafers or the thickness of the film deposited at the contact position is significantly thinner, resulting in deposition failure. Therefore, how to ensure that adjacent wafers do not bump or stick to each other while allowing the wafer carrier to process enough wafers has become a problem that technical personnel in this field urgently need to solve. Utility Model Content

[0004] The purpose of this application is to provide a wafer carrier and a horizontal heat treatment furnace to prevent adjacent wafers from colliding and sticking to each other, and to place more wafers to improve production efficiency.

[0005] The present application discloses a wafer carrier, which is used to install wafers and place them in a receiving groove on a carrying paddle. The wafer carrier is provided with a plurality of wafer fixing groove groups, one group of the wafer fixing groove groups is used to place one wafer, and the plurality of the wafer fixing groove groups are arranged in sequence along the length direction of the wafer carrier; and the wafer fixing groove groups are inclined in the length direction of the wafer carrier, and the plurality of the wafer fixing groove groups are inclined in the same direction, and the slope of the wafer fixing groove groups is 1-2°.

[0006] Optionally, the wafer carrier comprises a bottom frame, a first side frame and a second side frame, wherein the first side frame and the second side frame are arranged opposite to each other and are respectively connected to two sides of the bottom frame in the width direction; when the wafer carrier is placed on the carrying paddle, the bottom frame abuts against the bottom of the receiving groove, and the first side frame and the second side frame abut against the tops of the groove walls on both sides of the receiving groove respectively;

[0007] The wafer fixing groove group includes a bottom groove, a first side groove and a second side groove. The bottom groove is arranged on a side of the bottom frame facing the first side frame and the second side frame, the first side groove is arranged on a side of the first side frame facing the second side frame, and the second side groove is arranged on a side of the second side frame facing the first side frame. The bottom groove, the first side groove and the second side groove cooperate to fix the wafer simultaneously.

[0008] Optionally, taking the inclination direction of the wafer fixing groove group as the first direction, the first side frame includes a first cross bar, a first left connecting rod and a first right connecting rod; the first left connecting rod and the first right connecting rod are respectively located on both sides of the first cross bar in the first direction, one end of the first left connecting rod is connected to the first cross bar, and the other end is connected to the bottom frame, and one end of the first right connecting rod is connected to the first cross bar, and the other end is connected to the bottom frame;

[0009] The second side frame comprises a second cross bar, a second left connecting rod and a second right connecting rod; the second left connecting rod and the second right connecting rod are respectively located on both sides of the second cross bar in the first direction, one end of the second left connecting rod is connected to the second cross bar, and the other end is connected to the bottom frame, and one end of the second right connecting rod is connected to the second cross bar, and the other end is connected to the bottom frame;

[0010] The first side groove is arranged on a side of the first crossbar facing the second crossbar; the second side groove is arranged on a side of the second crossbar facing the first crossbar;

[0011] The wafer carrier also includes a first raising portion and a second raising portion, the first raising portion is arranged on the first left connecting rod, and the second raising portion is arranged on the second left connecting rod; when the wafer carrier is placed on the carrying paddle, the first left connecting rod abuts against the top of the groove wall of the accommodating groove through the first raising portion, and the second left connecting rod abuts against the top of the groove wall of the accommodating groove through the second raising portion; so that the wafer fixing groove group is inclined along the length direction of the wafer carrier.

[0012] Optionally, along the opposite direction of the first direction, the depth of the bottom groove on the bottom frame increases sequentially.

[0013] Optionally, along the opposite direction of the first direction, the width of the bottom groove on the bottom frame increases sequentially.

[0014] Optionally, a frosted layer is provided on a side of the first elevated portion away from the first left connecting rod; and a frosted layer is provided on a side of the second elevated portion away from the second left connecting rod.

[0015] Optionally, the wafer carrier further includes two first hanging ears and two second hanging ears, wherein one of the first hanging ears is connected to a side of the first left connecting rod away from the second left connecting rod, and the other first hanging ear is connected to a side of the first right connecting rod away from the second right connecting rod; one of the second hanging ears is connected to a side of the second left connecting rod away from the first left connecting rod, and the other second right connecting rod is connected to a side of the second right connecting rod away from the first right connecting rod;

[0016] The interiors of the two first hanging ears are hollow to form channels, and the axes of the channels of the two first hanging ears are located on the same straight line. The interiors of the two second hanging ears are hollow to form channels, and the axes of the channels of the two second hanging ears are located on the same straight line.

[0017] Optionally, the bottom groove is divided into a first part and a second part which are connected, the second part is located on the side of the first part close to the bottom of the bottom groove, the direction from the second part toward the first part is the second direction, and the width of the first part gradually increases along the second direction.

[0018] Optionally, a first threaded column is provided on a side of the first raised portion close to the first left connecting rod, a first threaded through hole is provided on the first left connecting rod, and the first raised portion is connected to the first left connecting rod via the first threaded column and the first threaded through hole;

[0019] A second threaded column is provided on one side of the second raised portion close to the second left connecting rod, a second threaded through hole is provided on the second left connecting rod, and the second raised portion is connected to the second left connecting rod via the second threaded column and the second threaded through hole.

[0020] The present application also discloses a horizontal heat treatment furnace, which includes a furnace body, a carrier paddle and a wafer carrier, wherein the wafer carrier is placed on the carrier paddle, and the carrier paddle extends into the furnace body.

[0021] Compared with the existing wafer carrier solutions, the wafer fixing slot groups in the wafer carrier of the present application are inclined in the same direction. Therefore, after placing the wafer on the wafer fixing slot group, the wafer can be tilted in one direction based on its own gravity, ensuring that adjacent wafers will not collide or stick to each other during the process of being placed in the horizontal heat treatment furnace, during the process of being treated in the horizontal heat treatment furnace, and when being taken out of the horizontal heat treatment furnace, and will not be damaged. Moreover, the slope is 1-2°, which can ensure that enough wafer fixing slot groups can be set on the wafer carrier on the basis of ensuring that the wafer will tilt, so as to place more wafers and improve production efficiency. BRIEF DESCRIPTION OF THE DRAWINGS

[0022] The included drawings are used to provide a further understanding of the embodiments of the present application, which constitute a part of the specification, are used to illustrate the implementation methods of the present application, and together with the text description, explain the principles of the present application. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without creative work. In the drawings:

[0023] Figure 1 is a schematic diagram of a horizontal heat treatment furnace according to an embodiment of the present application;

[0024] Figure 2 is a schematic diagram of a wafer carrier according to an embodiment of the present application;

[0025] Figure 3 is a schematic diagram of a raising portion according to an embodiment of the present application;

[0026] Figure 4 is a schematic diagram of a bottom tank according to an embodiment of the present application;

[0027] Figure 5 It is a schematic diagram of an adjustable raising portion according to an embodiment of the present application.

[0028] Among them, 10, horizontal heat treatment furnace; 20, furnace body; 30, carrier paddle; 31, accommodating groove; 40, wafer; 100, wafer carrier; 110, bottom frame; 120, first side frame; 121, first cross bar; 122, first left connecting rod; 123, first right connecting rod; 130, second side frame; 131, second cross bar; 132, second left connecting rod; 133, second right connecting rod; 210, first raised part; 220, second raised part; 230, frosted layer; 310, first hanging ear; 320, second hanging ear; 400, wafer fixing groove group; 410, bottom groove; 411, first part; 412, second part; 420, first side groove; 430, second side groove; 511, first threaded column; 512, first threaded through hole; 521, second threaded column; 522, second threaded through hole. DETAILED DESCRIPTION

[0029] It should be understood that the terms used herein, the specific structures and functional details disclosed are only for describing specific embodiments and are representative, but the present application can be implemented in many alternative forms and should not be construed as being limited to only the embodiments described herein.

[0030] In the description of this application, the terms "first" and "second" are used for descriptive purposes only and should not be understood as indicating relative importance or implicitly indicating the number of technical features indicated. Therefore, unless otherwise specified, features defined as "first" and "second" may explicitly or implicitly include one or more of the features; "plurality" means two or more. The term "including" and any variation thereof means non-exclusive inclusion, and one or more other features, integers, steps, operations, units, components and / or combinations thereof may exist or be added.

[0031] In addition, terms indicating orientation or positional relationships, such as “center,” “lateral,” “up,” “down,” “left,” “right,” “vertical,” “horizontal,” “top,” “bottom,” “inside,” and “outside,” are described based on the orientation or relative positional relationships shown in the accompanying drawings and are merely simplified descriptions for the convenience of describing the present application. They do not indicate that the devices or elements referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as limitations on the present application.

[0032] In addition, unless otherwise clearly specified and limited, the terms "installed", "connected", and "connected" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection, or it can be indirectly connected through an intermediate medium, or it can be internally connected between two components. For ordinary technicians in this field, the specific meanings of the above terms in this application can be understood according to specific circumstances.

[0033] The present application is described in detail below with reference to the accompanying drawings and optional embodiments.

[0034] Figure 1 Schematic diagram of a horizontal heat treatment furnace according to an embodiment of the present application. Figure 1 As shown, the present application discloses a horizontal heat treatment furnace 10 for performing vapor deposition on a wafer 40. The horizontal heat treatment furnace 10 includes a furnace body 20, a carrier paddle 30 and a plurality of wafer carriers 100. The wafer 40 is placed on the wafer carrier 100, and the wafer carrier 100 is placed on the carrier paddle 30. The carrier paddle 30 extends into the furnace body 20.

[0035] The present application mainly improves the wafer carrier 100. For the wafer carrier 100, the present application provides the following designs:

[0036] Figure 2 is a schematic diagram of a wafer carrier according to an embodiment of the present application. Figure 2As shown, the present application discloses a wafer carrier 100, which is used to install a wafer 40 and place it in a receiving groove 31 on a carrying paddle 30, and a plurality of wafer fixing groove groups 400 are arranged on the wafer carrier 100, and a group of the wafer fixing groove groups 400 is used to place one wafer 40, and the plurality of wafer fixing groove groups 400 are arranged in sequence along the length direction of the wafer carrier 100; and the wafer fixing groove groups 400 are inclined in the length direction of the wafer carrier 100, and the plurality of wafer fixing groove groups 400 are inclined in the same direction, and the slope of the wafer fixing groove groups 400 is 1-2°.

[0037] In short, the present application tilts the wafer fixing groove group 400 by tilting the wafer carrier 100 when the wafer carrier 100 is placed on the carrying paddle 30. Since the wafer fixing groove group 400 in the wafer carrier 100 of the present application is tilted in the same direction, after the wafer 40 is placed on the wafer fixing groove group 400, the wafer 40 can be tilted in one direction on the basis of its own gravity, ensuring that the wafer 40 will not collide or stick to the adjacent wafers 40 during the process of being placed in the horizontal heat treatment furnace 10, during the process of being treated in the horizontal heat treatment furnace 10, and when being taken out of the horizontal heat treatment furnace 10, and will not damage the wafer 40. And because the slope of the wafer fixing groove group 400 on the wafer carrier is 1-2°, on the basis of ensuring that the wafer 40 will tilt, it can also be ensured that enough wafer fixing groove groups 400 can be set on the wafer carrier 100 to place more wafers 40 and improve production efficiency.

[0038] The wafer carrier 100 includes a bottom frame 110, a first side frame 120 and a second side frame 130, wherein the first side frame 120 and the second side frame 130 are arranged opposite to each other and are respectively connected to both sides of the bottom frame 110 in the width direction; when the wafer carrier 100 is placed on the carrying paddle 30, the bottom frame 110 abuts against the bottom of the accommodating groove 31, and the first side frame 120 and the second side frame 130 abut against the top of the two side groove walls of the accommodating groove 31 respectively.

[0039] The wafer fixing groove group 400 includes a bottom groove 410, a first side groove 420 and a second side groove 430. The bottom groove 410 is arranged on the side of the bottom frame 110 facing the first side frame 120 and the second side frame 130, the first side groove 420 is arranged on the side of the first side frame 120 facing the second side frame 130, and the second side groove 430 is arranged on the side of the second side frame 130 facing the first side frame 120. The bottom groove 410, the first side groove 420 and the second side groove 430 cooperate to fix the wafer 40 at the same time, that is, the bottom of the wafer 40 extends into the bottom groove 410, the left side of the wafer 40 extends into the first side groove 420, and the right side of the wafer 40 extends into the second side groove 430.

[0040] Among them, a group of wafer fixing groove groups 400 may include two bottom grooves 410, and the two bottom grooves 410 are respectively arranged on the two side frames connecting the bottom frame 110 and the first side frame 120 and the second side frame 130, to ensure that the bottom plate of the wafer 40 has sufficient support. When the wafer 40 is placed in the wafer fixing groove group 400, the two sides of the wafer 40 are respectively located in the first side groove 420 and the second side groove 430, which can avoid that all the force of the wafer 40 is applied to the bottom groove 410, thereby improving the stability of fixing the wafer 40.

[0041] Figure 3 is a schematic diagram of a padding portion of an embodiment of the present application, combined with Figure 2-3 As shown, Figure 3 The direction indicated by the middle arrow represents the first direction, with the inclination direction of the wafer fixing groove group 400 as the first direction, and the first side frame 120 includes a first cross bar 121, a first left connecting rod 122 and a first right connecting rod 123; the first left connecting rod 122 and the first right connecting rod 123 are respectively located on both sides of the first cross bar 121 in the first direction, one end of the first left connecting rod 122 is connected to the first cross bar 121, and the other end is connected to the bottom frame 110, and one end of the first right connecting rod 123 is connected to the first cross bar 121, and the other end is connected to the bottom frame 110.

[0042] The second side frame 130 includes a second cross bar 131, a second left connecting rod 132 and a second right connecting rod 133; the second left connecting rod 132 and the second right connecting rod 133 are respectively located on both sides of the second cross bar 131 in the first direction, one end of the second left connecting rod 132 is connected to the second cross bar 131, and the other end is connected to the bottom frame 110, one end of the second right connecting rod 133 is connected to the second cross bar 131, and the other end is connected to the bottom frame 110; the first side groove 420 is arranged on the side of the first cross bar 121 facing the second cross bar 131; the second side groove 430 is arranged on the side of the second cross bar 131 facing the first cross bar 121.

[0043] The first left connecting rod 122 , the first right connecting rod 123 , the second left connecting rod 132 , and the second right connecting rod 133 are all L-shaped.

[0044] The present application can make the bottom of the first right connecting rod 123, the bottom of the second right connecting rod 133 and the position of the bottom frame 110 close to the first right connecting rod 123 and the second right connecting rod 133 thinner, so that the entire wafer carrier 100 is tilted when placed on the carrying paddle 30, thereby causing the wafer fixing groove group 400 to tilt.

[0045] Of course, the entire wafer carrier 100 can also be tilted when placed on the carrying paddle 30 by increasing the thickness below the first left connecting rod 122 and the second left connecting rod 132, thereby causing the wafer fixing slot group 400 to tilt. Preferably, the present application takes the example of adding a padding portion below the first left connecting rod 122 and the second left connecting rod 132 for explanation, specifically:

[0046] The wafer carrier 100 also includes a first raised portion 210 and a second raised portion 220, wherein the first raised portion 210 is arranged on the first left connecting rod 122, and the second raised portion 220 is arranged on the second left connecting rod 132; when the wafer carrier 100 is placed on the carrying paddle 30, the first left connecting rod 122 abuts against the top of the groove wall of the accommodating groove 31 through the first raised portion 210, and the second left connecting rod 132 abuts against the top of the groove wall of the accommodating groove 31 through the second raised portion 220; so that the wafer fixing groove group 400 is inclined along the length direction of the wafer carrier 100.

[0047] Compared with the solution of setting an inclined wafer fixing groove group 400 on the wafer carrier 100, the present application does not need to open an inclined groove on the wafer carrier 100, and the processing is simpler. Instead, the wafer carrier 100 is tilted by raising one end in the length direction, so that the wafer carrier 100 is tilted and the wafer fixing groove group 400 is tilted, which can ensure that the slope of the wafer fixing groove group 400 is consistent, and the slope of each groove in the wafer fixing groove group 400 is consistent.

[0048] Since the wafer carrier 100 is placed on the carrying paddle 30 at an angle, in order to ensure that the wafer carrier 100 can be placed on the carrying paddle 30 stably, the present application also improves the first padding portion 210 and the second padding portion 220. The first padding portion 210 is provided with a frosted layer 230 on the side away from the first left connecting rod 122; the second padding portion 220 is provided with a frosted layer 230 on the side away from the second left connecting rod 132. That is, when the wafer carrier 100 is placed on the carrying paddle 30, the first padding portion 210 and the second padding portion 220 are provided with a frosted layer 230 on the side in contact with the carrying paddle 30 to ensure that the wafer carrier 100 has sufficient friction on the carrying paddle 30 to prevent sliding.

[0049] Furthermore, the wafer carrier 100 also includes two first hanging ears 310 and two second hanging ears 320, one of the first hanging ears 310 is connected to the side of the first left connecting rod 122 away from the second left connecting rod 132, and the other first hanging ear 310 is connected to the side of the first right connecting rod 123 away from the second right connecting rod 133; one of the second hanging ears 320 is connected to the side of the second left connecting rod 132 away from the first left connecting rod 122, and the other second right connecting rod 133 is connected to the side of the first right connecting rod 123 away from the first right connecting rod 123.

[0050] The interiors of the two first hanging ears 310 are hollow to form channels, and the channels of the two first hanging ears 310 have the same axis, that is, the axes of the channels on the two first hanging ears 310 are located on the same straight line. The interiors of the two second hanging ears 320 are hollow to form channels, and the channels of the two second hanging ears 320 have the same axis, that is, the axes of the channels on the two second hanging ears 320 are located on the same straight line.

[0051] In this way, when taking and placing the wafer carrier 100, two long rods can be passed through the two first hanging ears 310 and the two second hanging ears 320 respectively, so that multiple wafer carriers 100 can be taken off from the carrying paddle 30 at the same time, thereby improving production efficiency.

[0052] Figure 4is a schematic diagram of a bottom tank according to an embodiment of the present application, such as Figure 4 As shown, Figure 4 The direction indicated by the middle arrow is the second direction, and the dotted line represents the horizontal line. The bottom groove 410 is divided into a first part 411 and a second part 412 that are connected. The second part 412 is located on the side of the first part 411 close to the bottom of the bottom groove 410. The direction of the second part 412 toward the first part 411 is the second direction, and the width of the first part 411 gradually increases along the second direction.

[0053] In simple terms, the bottom groove 410 is divided into two parts, the upper part is the first part 411 and the lower part is the second part 412, the groove width of each part of the second part 412 remains consistent, and the groove width of the first part 411 gradually increases along the second direction; in this way, when the wafer 40 is placed on the bottom groove 410, the sharp part at the groove mouth of the bottom groove 410 will not contact the wafer 40, and the wafer 40 will not be scratched.

[0054] Moreover, since the wafer carrier 100 is tilted to tilt the wafer 40 fixing groove, the bottom groove 410 at a position closer to one end of the first raised portion 210 and the second raised portion 220 will be higher from the horizontal plane, and the wafer 40 placed at this position will also be higher, which makes it difficult to load into the horizontal heat treatment furnace 10. Therefore, the present application will increase the depth of the bottom groove 410 on the bottom frame 110 in the opposite direction of the first direction. So that the bottom of each bottom groove 410 is on the same horizontal plane. In this way, when the wafer 40 is placed on the bottom groove 410, it can be ensured that all wafers 40 on the entire wafer 40 carrier have the same height. Moreover, along the opposite direction of the first direction, the width of the bottom groove 410 on the bottom frame 110 increases in sequence. In this way, it can be avoided that the slope of the wafer 40 placed on the bottom groove 410 changes due to the deepening of the bottom groove 410, so that each wafer 40 on the same wafer carrier 100 has the same inclination angle.

[0055] Figure 5 Schematic diagram of an adjustable heightening portion according to an embodiment of the present application. Figure 5 As shown, in order to improve the adaptability of the wafer carrier 100 so as to adapt to wafers 40 of more sizes, the present application provides a first threaded column 511 on the side of the first raised portion 210 close to the first left connecting rod 122, and a first threaded through hole 512 is provided on the first left connecting rod 122, and the first raised portion 210 is connected to the first left connecting rod 122 via the first threaded column 511 and the first threaded through hole 512.

[0056] A second threaded column 521 is provided on one side of the second raised portion 220 close to the second left connecting rod 132 , a second threaded through hole 522 is provided on the second left connecting rod 132 , and the second raised portion 220 is connected to the second left connecting rod 132 via the second threaded column 521 and the second threaded through hole 522 .

[0057] In this way, the inclination angle of the wafer fixing groove group 400 can be adjusted by adjusting the depth of the first threaded column 511 entering the first threaded through hole 512, and adjusting the depth of the second threaded through hole 521 entering the second threaded through hole 522. There is no need to produce multiple sets of wafer carriers 100 with different inclination angles, thereby saving production costs.

[0058] It should be noted that the inventive concept of the present application can form a large number of embodiments, but the length of the application document is limited and it is impossible to list them one by one. Therefore, under the premise of no conflict, the embodiments or technical features described above can be arbitrarily combined to form new embodiments. After the embodiments or technical features are combined, the original technical effects will be enhanced.

[0059] The above content is a further detailed description of the present application in combination with specific optional implementation methods, and it cannot be determined that the specific implementation of the present application is limited to these descriptions. For ordinary technicians in the technical field to which the present application belongs, several simple deductions or substitutions can be made without departing from the concept of the present application, which should be deemed to fall within the scope of protection of the present application.

Claims

1. A wafer carrier, used for mounting a wafer and placing it in a receiving slot on a carrying paddle, characterized in that: The wafer carrier is provided with a plurality of wafer fixing groove groups, one group of the wafer fixing groove groups is used to place one wafer, and the plurality of the wafer fixing groove groups are arranged in sequence along the length direction of the wafer carrier; and the wafer fixing groove groups are inclined toward the length direction of the wafer carrier, and the plurality of the wafer fixing groove groups are inclined in the same direction, and the slope of the wafer fixing groove groups is 1-2°.

2. The wafer carrier according to claim 1, characterized in that: The wafer carrier comprises a bottom frame, a first side frame and a second side frame, wherein the first side frame and the second side frame are arranged opposite to each other and are respectively connected to two sides of the bottom frame in a width direction; when the wafer carrier is placed on the carrying paddle, the bottom frame abuts against the bottom of the receiving groove, and the first side frame and the second side frame abut against the top of the groove walls on both sides of the receiving groove respectively; The wafer fixing groove group includes a bottom groove, a first side groove and a second side groove. The bottom groove is arranged on a side of the bottom frame facing the first side frame and the second side frame, the first side groove is arranged on a side of the first side frame facing the second side frame, and the second side groove is arranged on a side of the second side frame facing the first side frame. The bottom groove, the first side groove and the second side groove cooperate to fix the wafer simultaneously.

3. The wafer carrier according to claim 2, characterized in that: Taking the inclination direction of the wafer fixing groove group as the first direction, the first side frame includes a first crossbar, a first left connecting rod and a first right connecting rod; the first left connecting rod and the first right connecting rod are respectively located on both sides of the first crossbar in the first direction, one end of the first left connecting rod is connected to the first crossbar, and the other end is connected to the bottom frame, and one end of the first right connecting rod is connected to the first crossbar, and the other end is connected to the bottom frame; The second side frame comprises a second cross bar, a second left connecting rod and a second right connecting rod; the second left connecting rod and the second right connecting rod are respectively located on both sides of the second cross bar in the first direction, one end of the second left connecting rod is connected to the second cross bar, and the other end is connected to the bottom frame, and one end of the second right connecting rod is connected to the second cross bar, and the other end is connected to the bottom frame; The first side groove is arranged on a side of the first crossbar facing the second crossbar; the second side groove is arranged on a side of the second crossbar facing the first crossbar; The wafer carrier also includes a first raising portion and a second raising portion, the first raising portion is arranged on the first left connecting rod, and the second raising portion is arranged on the second left connecting rod; when the wafer carrier is placed on the carrying paddle, the first left connecting rod abuts against the top of the groove wall of the accommodating groove through the first raising portion, and the second left connecting rod abuts against the top of the groove wall of the accommodating groove through the second raising portion; so that the wafer fixing groove group is inclined along the length direction of the wafer carrier.

4. The wafer carrier according to claim 3, characterized in that: Along the opposite direction of the first direction, the depth of the bottom groove on the bottom frame increases sequentially.

5. The wafer carrier according to claim 4, characterized in that: Along the opposite direction of the first direction, the width of the bottom groove on the bottom frame increases sequentially.

6. The wafer carrier according to claim 3, characterized in that: A frosted layer is provided on a side of the first raised portion away from the first left connecting rod; and a frosted layer is provided on a side of the second raised portion away from the second left connecting rod.

7. The wafer carrier according to claim 3, characterized in that: The wafer carrier further includes two first hanging ears and two second hanging ears, wherein one of the first hanging ears is connected to a side of the first left connecting rod away from the second left connecting rod, and the other first hanging ear is connected to a side of the first right connecting rod away from the second right connecting rod; one of the second hanging ears is connected to a side of the second left connecting rod away from the first left connecting rod, and the other second right connecting rod is connected to a side of the second right connecting rod away from the first right connecting rod; The interiors of the two first hanging ears are hollow to form channels, and the axes of the channels of the two first hanging ears are located on the same straight line. The interiors of the two second hanging ears are hollow to form channels, and the axes of the channels of the two second hanging ears are located on the same straight line.

8. The wafer carrier according to claim 2, characterized in that: The bottom groove is divided into a first part and a second part which are connected. The second part is located on the side of the first part close to the bottom of the bottom groove. The direction from the second part toward the first part is the second direction. The width of the first part gradually increases along the second direction.

9. The wafer carrier according to claim 3, characterized in that: A first threaded column is disposed on one side of the first raised portion close to the first left connecting rod, a first threaded through hole is disposed on the first left connecting rod, and the first raised portion is connected to the first left connecting rod via the first threaded column and the first threaded through hole; A second threaded column is provided on one side of the second raised portion close to the second left connecting rod, a second threaded through hole is provided on the second left connecting rod, and the second raised portion is connected to the second left connecting rod via the second threaded column and the second threaded through hole.

10. A horizontal heat treatment furnace, characterized in that: The horizontal heat treatment furnace comprises a furnace body, a carrier paddle and a plurality of wafer carriers as described in any one of claims 1 to 9, wherein the wafer carriers are placed on the carrier paddle, and the carrier paddle extends into the furnace body.

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