Rotary adsorption device capable of being used for warped wafer

Abstract

The utility model belongs to the technical field of wafer rotary adsorption devices used in semiconductor processing, and particularly relates to a rotary adsorption device capable of being used for warped wafers, which comprises a driving motor, a vacuum chuck connecting seat, a vacuum chuck and a flexible outer ring, and the flexible outer ring is divided into a mounting ring part and an adsorption edge part which are connected together. And the mounting ring part of the flexible outer ring is clamped into the mounting ring part clamping ring groove of the vacuum chuck in an interference fit manner. According to the utility model, through the arrangement of the vacuum chuck with the vacuum adsorption channel and the flexible outer ring, after negative pressure is generated at the vacuum adsorption channel, the adsorption edge part of the flexible outer ring is stably attached to the peripheral position of the bottom surface of the wafer and the wafer is adsorbed; and the absorption of the warped wafer is not influenced by the concave-convex formed in the middle of the surface of the wafer, so that the normal wafer and the warped wafer can be stably absorbed, and the wafer is prevented from falling off and being damaged when the wafer is driven to rotate.

Description

Technical Field

[0001] The utility model belongs to the technical field of wafer rotation adsorption devices used in semiconductor processing, in particular to a rotation adsorption device which can be used for warping wafers. Background Art

[0002] At present, in the advanced semiconductor monolithic process technology, it is often necessary to use a vacuum chuck to absorb the wafer and drive the wafer to rotate. For some warped wafers, the middle part of the surface of the warped wafer has a bump that cannot adhere well to the surface of the vacuum chuck, which makes the vacuum chuck itself unable to reliably and stably absorb the warped wafer. At this time, driving the warped wafer to rotate is likely to cause the warped wafer to fall and be damaged. Utility Model Content

[0003] In view of the above problems, the purpose of the present invention is to provide a rotating adsorption device that can be used for warping wafers.

[0004] The purpose of this utility model is achieved through the following technical solutions:

[0005] A rotary adsorption device that can be used for warping wafers is applied to a process chamber of semiconductor processing equipment and a rack located at the lower side of the process chamber, and includes a drive motor, a vacuum suction cup connecting seat and a vacuum suction cup. The housing of the drive motor is arranged on the rack at the lower side of the process chamber, and the vacuum suction cup is located in the process chamber. The drive end of the drive motor extends into the process chamber and is connected to the lower end of the vacuum suction cup connecting seat. The upper part of the vacuum suction cup connecting seat is connected to the bottom surface of the vacuum suction cup, and a vacuum adsorption channel is provided on the top surface of the vacuum suction cup. The utility model also includes a flexible outer ring, which is divided into a mounting ring portion and an adsorption edge portion connected together, a mounting ring clamping groove is provided at the peripheral position on the top surface of the vacuum suction cup, and the vacuum adsorption channel is located on the top surface of the vacuum suction cup inside the mounting ring clamping groove, the mounting ring portion of the flexible outer ring is clamped into the mounting ring clamping groove by interference fit, and the adsorption edge portion of the flexible outer ring extends from the mounting ring clamping groove and is used to fit with the peripheral position on the bottom surface of the wafer.

[0006] The adsorption edge of the flexible outer ring is in a circular shape, the inner peripheral edge of the adsorption edge of the flexible outer ring is connected to the mounting ring of the flexible outer ring, and the height position of the outer peripheral edge of the adsorption edge of the flexible outer ring is higher than the height position of the inner peripheral edge of the adsorption edge of the flexible outer ring.

[0007] The inner circumference of the mounting ring portion of the flexible outer ring abuts against the inner circumference of the mounting ring portion clamping ring groove by interference fit, and an upper limit stop edge is extended toward the outer periphery from the upper portion of the inner circumference of the mounting ring portion clamping ring groove, and the upper limit stop edge blocks the upper end of the mounting ring portion of the flexible outer ring located in the mounting ring portion clamping ring groove from the upper side, and the lower end of the mounting ring portion of the flexible outer ring abuts against the bottom surface of the mounting ring portion clamping ring groove.

[0008] The outer peripheral surface of the mounting ring portion clamping ring groove is in the shape of an annular inclined surface which gradually slopes downward from the outside to the inside.

[0009] An annular waterproof protrusion groove is provided on the outer peripheral position of the top surface of the vacuum suction cup connecting seat, and an annular waterproof protrusion A is provided on the bottom surface of the vacuum suction cup corresponding to the annular waterproof protrusion groove, and the end surface of the annular waterproof protrusion A away from the vacuum suction cup abuts against the bottom surface of the annular waterproof protrusion groove.

[0010] An annular waterproof protrusion B is convexly provided on the bottom surface of the vacuum suction cup and on the outer side of the vacuum suction cup connecting seat.

[0011] The utility model also includes a waterproof cover arranged in the process cavity, the waterproof cover is located above the driving motor, a boss portion is protruding from the middle of the top surface of the waterproof cover, and a through hole is opened in the center of the boss portion of the waterproof cover for the lower end of the vacuum suction cup connecting seat to pass through.

[0012] A waterproof baffle extending downward is provided at the outer peripheral position of the upper part of the vacuum suction cup connecting seat, and the boss portion of the waterproof cover is located on the inner side of the waterproof baffle.

[0013] A ventilation gap is provided between the boss portion of the waterproof cover and the inner side surface of the waterproof baffle edge, a protective gas passage channel is provided inside the waterproof cover, the protective gas passage channel is connected to a plurality of protective gas input channels connected to the space below the waterproof cover, the protective gas passage channel is also connected to a plurality of protective gas output channels, the openings of each of the protective gas output channels away from the protective gas passage channel are all located on the top surface of the boss portion of the waterproof cover and are connected to the ventilation gap.

[0014] A plurality of sealing rings are arranged between the top surface of the vacuum suction cup connecting seat and the bottom surface of the vacuum suction cup.

[0015] The advantages and positive effects of the utility model are:

[0016] 1. The utility model is provided with a vacuum suction cup having a vacuum suction channel and a flexible outer ring. After starting an external vacuum pumping device and generating negative pressure in the vacuum suction channel, the suction edge of the flexible outer ring can be stably attached to the outer peripheral position on the bottom surface of the wafer to adsorb the wafer. The adsorption of the warped wafer is not affected by the unevenness formed in the middle of the surface. The utility model can stably adsorb both normal wafers and warped wafers, and avoid the wafer from falling and being damaged when the wafer is driven to rotate.

[0017] 2. The utility model installs the flexible outer ring by inserting the mounting ring portion of the flexible outer ring into the mounting ring groove through interference fit, which can realize convenient disassembly and assembly of the flexible outer ring, shorten the assembly time, and has no complex technical requirements for the assemblers. It is also not easy for the wafer adsorbed by the flexible outer ring to jump at the end during rotation, thereby ensuring the reliability of the wafer manufacturing process.

[0018] 3. The utility model has good overall waterproof sealing effect, which can ensure stable and reliable operation of the device and a long service life. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] Figure 1 It is a schematic diagram of the overall use state of the utility model;

[0020] Figure 2 It is a schematic diagram of the overall external structure of the utility model;

[0021] Figure 3 It is a schematic diagram of the disassembled structure of the flexible outer ring, vacuum suction cup and vacuum suction cup connecting seat of the utility model;

[0022] Figure 4 for Figure 1 A magnified image of point A;

[0023] Figure 5 for Figure 1 The enlarged view of point B;

[0024] Figure 6 for Figure 1 Enlarged view of point C.

[0025] In the figure: 1 is a driving motor, 2 is a vacuum suction cup connection seat, 201 is an annular waterproof protrusion groove, 202 is a waterproof retaining edge, 3 is a vacuum suction cup, 301 is a vacuum adsorption channel, 302 is a mounting ring clamping ring groove, 303 is an upper limit retaining edge, 304 is an annular waterproof protrusion A, 305 is an annular waterproof protrusion B, 4 is a flexible outer ring, 401 is a mounting ring, 402 is an adsorption edge, 5 is a waterproof cover, 501 is a protective gas through hole, 502 is a protective gas input hole, 503 is a protective gas output hole, 6 is a sealing ring, and 7 is a pipe joint;

[0026] 001 is the process chamber, 002 is the nozzle, and 003 is the wafer. DETAILED DESCRIPTION

[0027] The following is combined with Figure 1-6 The utility model is further described in detail.

[0028] A rotating adsorption device that can be used for warping wafers, such as Figure 1-6 As shown, a process chamber 001 applied to semiconductor processing equipment and a rack located at the lower side of the process chamber 001, the rack supports the process chamber 001. The rotary adsorption device that can be used for warping wafers in this embodiment includes a drive motor 1, a vacuum suction cup connection seat 2 and a vacuum suction cup 3. The housing of the drive motor 1 is arranged on the rack at the lower side of the process chamber 001. The vacuum suction cup 3 is located in the process chamber 001. The drive end of the drive motor 1 extends into the process chamber 001 and is connected to the lower end of the vacuum suction cup connection seat 2. The upper part of the vacuum suction cup connection seat 2 is connected to the bottom surface of the vacuum suction cup 3. A vacuum adsorption channel 301 is provided on the top surface of the vacuum suction cup 3. In this embodiment, the arrangement structure of the vacuum adsorption channel 301 adopts the existing technology. A vacuum suction channel that is respectively connected to the vacuum adsorption channel 301 and the external vacuum pumping device is also formed between the vacuum suction cup 3 and the vacuum suction cup connection seat 2. The arrangement method of the vacuum suction channel is also the existing technology. In this embodiment, the driving motor 1 is a commercial product, and a motor product with a hollow driving shaft can be selected to facilitate the passage of the pipeline connected to the vacuum channel and the external vacuum device; the installation and fixing structure of the driving motor 1 is also the existing technology. The driving end of the driving motor 1 drives the vacuum suction cup connecting seat 2 and the vacuum suction cup 3 to rotate together in the process chamber 001.

[0029] like Figure 3 and Figure 4As shown, the rotating adsorption device that can be used for warping wafers in this embodiment also includes a flexible outer ring 4, which is divided into a mounting ring portion 401 and an adsorption edge portion 402 connected together. In this embodiment, the flexible outer ring 4 including the mounting ring portion 401 and the adsorption edge portion 402 is an integrated structure, and can be made of materials commonly used for flexible sealing rings in the prior art, such as rubber materials. A mounting ring clamping ring groove 302 is provided at the peripheral position on the top surface of the vacuum suction cup 3, and the vacuum adsorption channel 301 is located on the top surface of the vacuum suction cup 3 inside the mounting ring clamping ring groove 302. The mounting ring portion 401 of the flexible outer ring 4 is clamped into the mounting ring clamping ring groove 302 by interference fit, and the adsorption edge portion 402 of the flexible outer ring 4 extends from the mounting ring clamping ring groove 302 and is used to fit with the peripheral position on the bottom surface of the wafer 003. After the adsorption edge 402 of the flexible outer ring 4 is attached to the outer peripheral position on the bottom surface of the wafer 003, after the external vacuum device is started and negative pressure is generated at the vacuum adsorption channel 301, the adsorption edge 402 of the flexible outer ring 4 is stably attached to the outer peripheral position on the bottom surface of the wafer 003 and adsorbs the wafer 003. For the warped wafer, the adsorption is not affected by the concave and convex formed in the middle of the surface, so that the normal wafer and the warped wafer can be stably adsorbed, and the wafer 003 is prevented from falling and being damaged when the wafer 003 is driven to rotate. The flexible outer ring 4 is installed by inserting the mounting ring 401 of the flexible outer ring 4 into the mounting ring groove 302 through interference fit, so that the flexible outer ring 4 can be conveniently disassembled and assembled, the assembly time is shortened, there is no complex technical requirement for the assembler, and it is not easy for the wafer 003 adsorbed by the flexible outer ring 4 to jump at the end during the rotation process, so as to ensure the reliability of the wafer manufacturing process.

[0030] Specifically, if Figure 3 and Figure 4 As shown, in this embodiment, the adsorption edge portion 402 of the flexible outer ring 4 is in a circular shape, and the inner peripheral edge of the adsorption edge portion 402 of the flexible outer ring 4 is connected to the mounting ring portion 401 of the flexible outer ring 4. The height position of the outer peripheral edge of the adsorption edge portion 402 of the flexible outer ring 4 is higher than the height position of the inner peripheral edge of the adsorption edge portion 402 of the flexible outer ring 4. The manufacturing and processing is easy, and the bonding and adsorption effect on the warped wafer can be better guaranteed.

[0031] Specifically, if Figure 4As shown in the figure, in this embodiment, the inner circumference of the mounting ring portion 401 of the flexible outer ring 4 abuts against the inner circumference of the mounting ring portion snap ring groove 302 through interference fit, and an upper limit stop edge 303 is provided on the upper part of the inner circumference of the mounting ring portion snap ring groove 302 to extend toward the outer circumference, and the upper limit stop edge 303 blocks the upper end of the mounting ring portion 401 of the flexible outer ring 4 located in the mounting ring portion snap ring groove 302 from the upper side, and the lower end of the mounting ring portion 401 of the flexible outer ring 4 abuts against the bottom surface of the mounting ring portion snap ring groove 302. The upper limit stop edge 303 and the bottom surface of the mounting ring portion snap ring groove 302 respectively limit the mounting ring portion 401 of the flexible outer ring 4 in the upper and lower directions. The outer circumference of the mounting ring portion snap ring groove 302 is in the shape of an annular inclined surface that gradually slopes downward from the outside to the inside, so that the mounting ring portion 401 of the flexible outer ring 4 is easily embedded in the mounting ring portion snap ring groove 302 during installation.

[0032] Specifically, if Figure 5 As shown, in this embodiment, an annular waterproof protrusion groove 201 is provided at the outer peripheral position on the top surface of the vacuum suction cup connection seat 2, and an annular waterproof protrusion A 304 is provided on the bottom surface of the vacuum suction cup 3 at a position corresponding to the annular waterproof protrusion groove 201, and the end surface of the annular waterproof protrusion A 304 away from the vacuum suction cup 3 abuts against the bottom surface of the annular waterproof protrusion groove 201; an annular waterproof protrusion B 305 is provided on the bottom surface of the vacuum suction cup 3 and on the outer side of the vacuum suction cup connection seat 2. In the semiconductor monolithic advanced process technology, as Figure 1 As shown, there is usually a nozzle 002 set in the process chamber 001 to spray liquid on the wafer 003, so it is necessary to pay attention to waterproofing the connection between the vacuum suction cup connection seat 2 and the vacuum suction cup 3, so as to avoid affecting the adsorption and rotation effect of the rotating adsorption device. The annular waterproof protrusion B 305 is set to block the liquid on the outside of the vacuum suction cup connection seat 2 to prevent the liquid from entering between the top surface of the vacuum suction cup connection seat 2 and the bottom surface of the vacuum suction cup 3; the annular waterproof protrusion A 304 and the annular waterproof protrusion groove 201 are used to further prevent the liquid from entering the inner side between the top surface of the vacuum suction cup connection seat 2 and the bottom surface of the vacuum suction cup 3 to affect the vacuum channel, so as to ensure the reliable operation of the rotating adsorption device.

[0033] Specifically, if Figure 5 As shown, in this embodiment, a plurality of sealing rings 6 are arranged between the top surface of the vacuum suction cup connection seat 2 and the bottom surface of the vacuum suction cup 3. The arrangement of each sealing ring 6 in this embodiment adopts the existing technology, and is also used to prevent external liquid from entering between the top surface of the vacuum suction cup connection seat 2 and the bottom surface of the vacuum suction cup 3, and can ensure the sealing effect of the vacuum suction channel arranged between the vacuum suction cup connection seat 2 and the vacuum suction cup 3 arranged inside.

[0034] Specifically, if Figure 1 , Figure 2 and Figure 6 As shown, the rotary adsorption device for warping wafers in this embodiment also includes a waterproof cover 5 arranged in the process chamber 001. The waterproof cover 5 is located above the drive motor 1. A boss portion is convexly provided in the middle of the top surface of the waterproof cover 5. A through hole is provided in the center of the boss portion of the waterproof cover 5 for the lower end of the vacuum suction cup connecting seat 2 to pass through. The installation structure of the waterproof cover 5 in the process chamber 001 adopts the existing technology to prevent most of the liquid from reaching the drive motor 1. A waterproof baffle 202 extending downward is provided at the outer peripheral position of the upper part of the vacuum suction cup connecting seat 2, and the boss portion of the waterproof cover 5 is located on the inner side of the waterproof baffle 202. There is a ventilation gap between the boss of the waterproof cover 5 and the inner side of the waterproof baffle 202. An annular protective gas passage duct 501 is provided inside the waterproof cover 5. The protective gas passage duct 501 is connected to a plurality of protective gas input ducts 502 connected to the space below the waterproof cover 5. The protective gas passage duct 501 is also connected to a plurality of protective gas output ducts 503. The openings of each protective gas output duct 503 away from the protective gas passage duct 501 are all located on the top surface of the boss of the waterproof cover 5 and are connected to the ventilation gap. In this embodiment, the arrangement structures of the protective gas passage duct 501, the protective gas input duct 502 and the protective gas output duct 503 all adopt the existing technology; the openings of the protective gas input duct 502 are respectively provided with pipe joints 7, which are used to connect the pipeline connected to the external protective gas source, and the protective gas can be nitrogen. During processing, the external protective gas source is turned on to input protective gas into the protective gas input channel 502. The protective gas passes through the protective gas channel 501 and the protective gas output channel 503 and is discharged from the boss part of the waterproof cover 5. Then, the protective gas flows out from the ventilation gap between the boss part of the waterproof cover 5 and the inner side surface of the waterproof baffle 202, so that the ventilation gap has a positive pressure to form a pneumatic seal, which can effectively prevent the mist formed by part of the liquid in the process cavity 001 during operation from flowing to the drive motor 1, thereby further protecting the service life of the drive motor 1.

Claims

1. A rotating adsorption device for warping a wafer, applied to a process chamber (001) of a semiconductor processing equipment and a frame located at the bottom of the process chamber (001), comprising a driving motor (1), a vacuum suction cup connecting seat (2) and a vacuum suction cup (3), wherein the housing of the driving motor (1) is arranged on the frame at the bottom of the process chamber (001), the vacuum suction cup (3) is located in the process chamber (001), the driving end of the driving motor (1) extends into the process chamber (001) and is connected to the lower end of the vacuum suction cup connecting seat (2), the upper part of the vacuum suction cup connecting seat (2) is connected to the bottom surface of the vacuum suction cup (3), and a vacuum adsorption channel (301) is provided on the top surface of the vacuum suction cup (3), characterized in that: It also includes a flexible outer ring (4), the flexible outer ring (4) is divided into a mounting ring portion (401) and an adsorption edge portion (402) connected together, a mounting ring portion snap ring groove (302) is provided at an outer peripheral position on the top surface of the vacuum suction cup (3), the vacuum adsorption channel (301) is located on the top surface of the vacuum suction cup (3) inside the mounting ring portion snap ring groove (302), the mounting ring portion (401) of the flexible outer ring (4) is snapped into the mounting ring portion snap ring groove (302) by interference fit, and the adsorption edge portion (402) of the flexible outer ring (4) extends from the mounting ring portion snap ring groove (302) and is used to fit with the outer peripheral position on the bottom surface of the wafer.

2. The rotating adsorption device for warping wafers according to claim 1, characterized in that: The adsorption edge portion (402) of the flexible outer ring (4) is in the shape of a circular ring, the inner peripheral edge of the adsorption edge portion (402) of the flexible outer ring (4) is connected to the mounting ring portion (401) of the flexible outer ring (4), and the height position of the outer peripheral edge of the adsorption edge portion (402) of the flexible outer ring (4) is higher than the height position of the inner peripheral edge of the adsorption edge portion (402) of the flexible outer ring (4).

3. The rotating adsorption device for warping wafers according to claim 1, characterized in that: The inner circumference of the mounting ring portion (401) of the flexible outer ring (4) abuts against the inner circumference of the mounting ring portion snap ring groove (302) by interference fit, and an upper limit stop edge (303) is provided at the upper part of the inner circumference of the mounting ring portion snap ring groove (302) extending toward the outer circumference, and the upper limit stop edge (303) blocks the upper end of the mounting ring portion (401) of the flexible outer ring (4) located in the mounting ring portion snap ring groove (302) from the upper side, and the lower end of the mounting ring portion (401) of the flexible outer ring (4) abuts against the bottom surface of the mounting ring portion snap ring groove (302).

4. The rotating adsorption device for warping wafers according to claim 3, characterized in that: The outer peripheral surface of the mounting ring portion clamping ring groove (302) is in the shape of an annular inclined surface that gradually slopes downward from the outside to the inside.

5. The rotating adsorption device for warping wafers according to claim 1, characterized in that: An annular waterproof protrusion groove (201) is provided at an outer peripheral position on the top surface of the vacuum suction cup connecting seat (2), and an annular waterproof protrusion A (304) is provided on the bottom surface of the vacuum suction cup (3) at a position corresponding to the annular waterproof protrusion groove (201), and the end surface of the annular waterproof protrusion A (304) away from the vacuum suction cup (3) abuts against the bottom surface of the annular waterproof protrusion groove (201).

6. The rotating adsorption device for warping a wafer according to claim 1, characterized in that: An annular waterproof protrusion B (305) is provided on the bottom surface of the vacuum suction cup (3) and on the outer side of the vacuum suction cup connecting seat (2).

7. The rotating adsorption device for warping wafers according to claim 1, characterized in that: It also includes a waterproof cover (5) arranged in the process chamber (001), the waterproof cover (5) is located above the drive motor (1), a boss portion is protruding in the middle of the top surface of the waterproof cover (5), and a through hole is opened in the center of the boss portion of the waterproof cover (5) for the lower end of the vacuum suction cup connecting seat (2) to pass through.

8. The rotating adsorption device for warping wafers according to claim 7, characterized in that: A waterproof baffle (202) extending downward is provided at the outer periphery of the upper portion of the vacuum suction cup connecting seat (2), and the boss portion of the waterproof cover (5) is located on the inner side of the waterproof baffle (202).

9. The rotating adsorption device for warping a wafer according to claim 8, characterized in that: A ventilation gap is provided between the boss portion of the waterproof cover (5) and the inner side surface of the waterproof baffle (202); a protective gas passageway (501) is provided inside the waterproof cover (5); the protective gas passageway (501) is connected to a plurality of protective gas input passageways (502) connected to the space below the waterproof cover (5); the protective gas passageway (501) is also connected to a plurality of protective gas output passageways (503); the openings of each of the protective gas output passageways (503) away from the protective gas passageway (501) are located on the top surface of the boss portion of the waterproof cover (5) and are connected to the ventilation gap.

10. The rotating adsorption device for warping wafers according to claim 1, characterized in that: A plurality of sealing rings (6) are provided between the top surface of the vacuum suction cup connecting seat (2) and the bottom surface of the vacuum suction cup (3).

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