Lead frame based on SM-7 chip packaging

Abstract

The utility model discloses a lead frame based on SM-7 chip packaging, comprising a processing table, the center of the processing table is provided with a processing groove, four corners of the processing table are provided with adjusting push rods, the interior of the processing table is movably connected with a central positioning seat, two ends of the central positioning seat are fixedly connected with sliding blocks, and the sliding blocks are fixedly connected with the central positioning seat. Lead frame bodies are fixedly connected to the two sides of the center positioning base, positioning frames are fixedly connected to the two ends of the machining table, and material supporting top frames are arranged on the surfaces of the positioning frames. According to the utility model, through the arrangement of the processing table, the processing groove, the adjusting push rod, the central positioning seat, the sliding block, the lead frame body, the chip groove, the first side positioning seat and the second side positioning seat, the equipment can carry out more efficient continuous operation on a chip; a worker firstly places a chip needing to be packaged into the chip groove of the lead frame body, and preliminary compaction and fastening operation is carried out through the chip groove.

Description

Technical Field

[0001] The utility model belongs to the technical field of chip lead frames, and in particular relates to a lead frame based on SM-7 chip packaging. Background Art

[0002] The lead frame is an important component in chip packaging. It is used to provide a carrier for the chip and form an electrical loop between the chip and the external circuit through bonding materials to realize the input and output of the chip. The lead frame is composed of a number of packaging units arranged in an array. Each packaging unit includes a carrier and pins arranged on both sides of the carrier. In order to meet the development needs of small and thin terminal devices, each lead frame is also constantly evolving towards high integration and high density. Among various chip packaging processes, the SM-7 package has released a lot of space due to the deletion of external pins, and has better flexibility in chip layout. Based on this, the lead frame based on the SM-7 chip package has gradually occupied a large market share among various lead frames.

[0003] In this regard, China's patent application number: CN 216354184 U discloses a lead frame for chip packaging, including a frame body, a cover plate is arranged on the top of the frame body, a packaging base is arranged at the bottom of the frame body, a connecting pin is arranged on one side of the packaging base, a chip slot is arranged on the top of the packaging base, a groove is arranged on the outside of the chip slot, a fixed card slot is arranged on one side of the chip slot, a heat dissipation slot is arranged at the bottom of the packaging base, a heat dissipation plate is arranged on the top of the cover plate, a heat conductive sheet is arranged at the bottom of the heat dissipation plate, a mounting edge is arranged at the bottom of the cover plate, a raised edge is arranged at the top of the packaging base, and a foot is arranged at the bottom of the packaging base; this lead frame for chip packaging can achieve the purpose of facilitating rapid packaging while improving the heat dissipation performance of the chip by arranging the heat dissipation slot, the heat dissipation plate, the heat conductive sheet, the mounting edge, the raised edge, and the fixed card slot.

[0004] However, in the actual use process, due to the limitation of its own structure, the structure often needs manual operation for chip loading and tightening as well as loosening and unloading. Both operations are very demanding and may cause damage to the chip corners if not paid attention to. It also affects the overall processing efficiency of the equipment, making it impossible for the equipment to perform more efficient chip packaging operations and unable to meet daily use needs. Therefore, it has become an urgent problem to be solved to improve and perfect the above-mentioned problems. Utility Model Content

[0005] The purpose of the utility model is to provide a lead frame based on SM-7 chip packaging to solve the problem that the existing structure, due to the limitation of its own structure, often requires manual operation of chip loading and tightening as well as loosening and unloading during actual use. Both operations are very demanding and may cause damage to the corners of the chip if not paid attention to. It also affects the overall processing efficiency of the equipment, resulting in the inability of the equipment to perform more efficient chip packaging operations and the inability to meet daily usage needs.

[0006] To achieve the above object, the utility model provides the following technical solutions: a lead frame based on SM-7 chip packaging, comprising a processing table, a processing groove is provided in the center of the processing table, and adjustment push rods are provided at the four corners of the processing table;

[0007] A center positioning seat, the processing table is movably connected to the center positioning seat, both ends of the center positioning seat are fixedly connected to sliding blocks, and both sides of the center positioning seat are fixedly connected to the lead frame body;

[0008] Positioning frame: both ends of the processing table are fixedly connected with positioning frames, and the surface of the positioning frame is provided with a material supporting top frame.

[0009] Preferably, a contraction groove is provided inside the positioning frame, and lifting push rods are provided at the four bottom corners of the supporting top frame.

[0010] Preferably, a chip slot is provided inside the lead frame body, and a thermal conductive pad is provided on the inner bottom wall of the chip slot.

[0011] Preferably, one end of the lead frame body on the left is fixedly connected to a first side positioning seat, and one end of the lead frame body on the right is fixedly connected to a second side positioning seat.

[0012] Preferably, the first side positioning seat and the second side positioning seat cooperate with the central positioning seat to adapt to the inner two ends of the processing table.

[0013] Preferably, a center bracket is fixedly connected to the bottom end of the processing table, and side brackets are fixedly connected to both ends of the center bracket.

[0014] Compared with the prior art, the beneficial effects of the utility model are:

[0015] 1. The lead frame based on SM-7 chip packaging can make the equipment perform more efficient continuous operation on the chip through the processing table, processing groove, adjustment push rod, center positioning seat, sliding block, lead frame body, chip groove, first side positioning seat and second side positioning seat. In the actual use process, the staff first puts the chip to be packaged into the chip groove of the lead frame body, and performs preliminary compaction and tightening operation through the chip groove. At this time, by starting the adjustment push rods at the four corners of the processing table, it drives the sliding blocks at both ends of the center positioning seat to perform movement and adjustment operations inside the processing table, so that the lead frame body with the chip is quickly moved to the inside of the processing table for packaging processing operations, and the lead frame body on the other side without the chip is moved out of the processing table to perform chip loading operations. The two do not affect each other, so that the chip packaging can be quickly and continuously operated. At the same time, when the two groups of lead frame bodies are loading and unloading chips back and forth, the center positioning seat can cooperate with the first side positioning seat and the second side positioning seat to perform a rapid sealing docking operation, which greatly improves the overall processing efficiency of the equipment and reflects the practicality of the equipment design.

[0016] 2. The lead frame based on SM-7 chip packaging further improves the overall use effect of the equipment by setting a processing table, processing groove, positioning frame, material support frame, shrink groove, lifting push rod, chip groove, thermal conductive pad, center bracket and side bracket. In daily use, the lifting push rod at the bottom of the material support frame can be started to operate the material support frame from the inside of the shrink groove of the positioning frame, so that the chip fixed in the lead frame body can be quickly detached from the thermal conductive pad of the chip groove through the material support frame, so that when the lead frame body switches back and forth on the surface of the two sets of positioning frames, the chip can be quickly removed completely, which is convenient for it to better cooperate with the chip packaging processing operation at the processing table, reflecting the comprehensiveness of the equipment design. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] Figure 1 It is a three-dimensional schematic diagram of the structure of the utility model;

[0018] Figure 2 It is an overall schematic diagram of the center positioning seat structure of the utility model;

[0019] Figure 3 It is an overall schematic diagram of the positioning frame structure of the utility model;

[0020] Figure 4 For this utility model Figure 1 A magnified schematic diagram of the structure in the middle.

[0021] In the figure: 1. processing table; 2. processing groove; 3. adjustment push rod; 4. center positioning seat; 5. sliding block; 6. lead frame body; 7. positioning frame; 8. material support top frame; 9. shrinkage groove; 10. lifting push rod; 11. chip groove; 12. thermal conductive pad; 13. first side positioning seat; 14. second side positioning seat; 15. center bracket; 16. side bracket. DETAILED DESCRIPTION

[0022] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

[0023] The utility model provides a lead frame based on SM-7 chip packaging as shown in the figure, including a processing table 1, a processing groove 2 is opened in the center of the processing table 1, and adjustment push rods 3 are arranged at the four corners of the processing table 1. The bottom end of the processing table 1 is fixedly connected with a central bracket 15, and the two ends of the central bracket 15 are fixedly connected with side brackets 16. The chip to be packaged is placed in the chip groove 11 of the lead frame body 6, and a preliminary compaction and tightening operation is performed through the chip groove 11. At this time, the adjustment push rods 3 at the four corners of the processing table 1 are started to drive the sliding blocks 5 at the two ends of the center positioning seat 4 to perform a moving and adjusting operation inside the processing table 1, so that the lead frame body 6 with the chip is quickly moved to the inside of the processing table 1 for packaging processing.

[0024] A center positioning seat 4 is movably connected to the interior of the processing table 1, and sliding blocks 5 are fixedly connected to both ends of the center positioning seat 4. Lead frame bodies 6 are fixedly connected to both sides of the center positioning seat 4. A chip slot 11 is provided inside the lead frame body 6, and a thermal conductive pad 12 is provided on the inner bottom wall of the chip slot 11. One end of the left lead frame body 6 is fixedly connected to a first side positioning seat 13, and one end of the right lead frame body 6 is fixedly connected to a second side positioning seat 14. The first side positioning seat 13 and the second side positioning seat 14 cooperate with the center positioning seat 4 to adapt to the two ends inside the processing table 1. The center positioning seat 4 cooperates with the first side positioning seat 13 and the second side positioning seat 14 to perform a rapid sealing docking operation, thereby greatly improving the overall processing efficiency of the equipment.

[0025] Positioning frame 7, both ends of the processing table 1 are fixedly connected with the positioning frame 7, the surface of the positioning frame 7 is provided with a supporting frame 8, the interior of the positioning frame 7 is provided with a shrinkage groove 9, and the bottom four corners of the supporting frame 8 are provided with lifting push rods 10. The chip fixed in the lead frame body 6 is quickly detached from the thermal conductive pad 12 of the chip slot 11 through the supporting frame 8, so that when the lead frame body 6 is switched back and forth on the surfaces of the two sets of positioning frames 7, the chip can be quickly removed.

[0026] Working principle: The staff first puts the chip to be packaged into the chip slot 11 of the lead frame body 6, and performs a preliminary compaction and tightening operation through the chip slot 11. At this time, the adjustment push rods 3 at the four corners of the processing table 1 are started to drive the sliding blocks 5 at both ends of the center positioning seat 4 to move and adjust the inside of the processing table 1, so as to quickly move the lead frame body 6 with the chip to the inside of the processing table 1 for packaging and processing operations, and the lead frame body 6 on the other side without the chip is moved out of the processing table 1 to perform chip loading operations. The two do not affect each other, so that the chip packaging can be operated quickly and continuously. At the same time, the two groups of lead frame bodies 6 are loading and unloading chips back and forth. When unloading, the central positioning seat 4 can cooperate with the first side positioning seat 13 and the second side positioning seat 14 to perform a rapid sealing docking operation, which greatly improves the overall processing efficiency of the equipment. In daily use, the lifting push rod 10 at the bottom of the supporting frame 8 can be started to make it perform a top operation on the supporting frame 8 from the inside of the shrinkage groove 9 of the positioning frame 7, so that the chip fixed in the lead frame body 6 can be quickly detached from the thermal conductive pad 12 of the chip groove 11 through the supporting frame 8, so that when the lead frame body 6 switches back and forth on the surface of the two sets of positioning frames 7, it can also quickly complete the complete removal operation of the chip, which is convenient for it to better cooperate with the chip packaging processing operation at the processing table 1.

[0027] Finally, it should be noted that the above is only a preferred embodiment of the present invention and is not intended to limit the present invention. Although the present invention has been described in detail with reference to the aforementioned embodiments, those skilled in the art can still modify the technical solutions described in the aforementioned embodiments or make equivalent substitutions for some of the technical features therein. Any modifications, equivalent substitutions, improvements, etc. made within the spirit and principles of the present invention should be included in the protection scope of the present invention.

Claims

1. A lead frame based on SM-7 chip packaging, comprising a processing table (1), characterized in that: A processing groove (2) is provided at the center of the processing table (1), and adjustment push rods (3) are provided at the four corners of the processing table (1); A center positioning seat (4), the processing table (1) is movably connected to the center positioning seat (4), both ends of the center positioning seat (4) are fixedly connected to sliding blocks (5), and both sides of the center positioning seat (4) are fixedly connected to a lead frame body (6); A positioning frame (7), wherein both ends of the processing table (1) are fixedly connected with the positioning frame (7), and a material supporting top frame (8) is arranged on the surface of the positioning frame (7).

2. A lead frame based on SM-7 chip packaging according to claim 1, characterized in that: A contraction groove (9) is provided inside the positioning frame (7), and lifting push rods (10) are provided at the four corners of the bottom of the supporting top frame (8).

3. A lead frame based on SM-7 chip packaging according to claim 1, characterized in that: A chip slot (11) is provided inside the lead frame body (6), and a thermal conductive pad (12) is provided on the inner bottom wall of the chip slot (11).

4. A lead frame based on SM-7 chip packaging according to claim 1, characterized in that: One end of the lead frame body (6) on the left is fixedly connected to a first side positioning seat (13), and one end of the lead frame body (6) on the right is fixedly connected to a second side positioning seat (14).

5. A lead frame based on SM-7 chip packaging according to claim 4, characterized in that: The first side positioning seat (13) and the second side positioning seat (14) cooperate with the central positioning seat (4) to fit the two inner ends of the processing table (1).

6. A lead frame based on SM-7 chip packaging according to claim 1, characterized in that: The bottom end of the processing table (1) is fixedly connected to a central bracket (15), and both ends of the central bracket (15) are fixedly connected to side brackets (16).

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