Multi-carrier matrix type ultrathin packaging lead frame

Abstract

The utility model belongs to the technical field of lead frames, and particularly relates to a multi-carrier matrix type ultrathin packaging lead frame, which comprises a device main body, a positioning groove and a movable groove are arranged on the top surface of the device main body, a mounting groove is arranged on the bottom surface of the positioning groove, a lead plate is arranged on the inner side of the mounting groove, and the movable groove is arranged on the top surface of the device main body. A chip main body is mounted on the top surface of the device main body; a fixing structure is installed on the device body and comprises a fixing frame, the fixing frame is installed on the inner side of the positioning groove, clamping grooves are formed in the four corners of the fixing frame, a sliding block is installed in the top face of the device body in a sliding mode, and a clamping block is integrally formed at one end of the sliding block; and a movable rod is rotationally mounted in the top surface of the device main body. According to the utility model, the movable rod is arranged to jack up the lead plate from the inner side of the mounting groove, so that a worker can conveniently take out the lead plate from the inner side of the mounting groove, and the disassembly and assembly convenience of the lead plate is improved.

Description

Technical Field

[0001] The utility model belongs to the technical field of lead frames, and in particular relates to a multi-carrier matrix type ultra-thin packaging lead frame. Background Art

[0002] The main function of the lead frame is to provide mechanical support for the chip and redistribute the input and output signals. Lead frames are required in most semiconductor integrated blocks and are an important basic material in the electronic information industry.

[0003] In this regard, China applied for patent number: CN202320085037.3, which discloses an integrated circuit package lead frame, including a device body, a mounting groove and a lead plate, the two sides of the device body are fixedly connected with the mounting grooves, the interior of the mounting grooves is embedded and connected with the lead plates, the surface of the lead plate is fixedly connected with the lead grooves, the front of the mounting grooves is fixedly connected with the positioning grooves, the interior of the positioning grooves is embedded and connected with the positioning plates, the interior of the positioning plates is embedded and connected with the positioning bolts, the middle part of the device body is fixedly connected with the through grooves, and the four sides of the through grooves are fixedly connected with the stabilizing members, which ensure the stability of the through grooves, and the detachable lead plates improve the flexibility of the device body. When necessary, the staff can replace the lead plates of different models, which brings convenience to the relevant staff and improves the work efficiency of the staff. The chip limiting mechanism improves the stability of the device body, and the chip can be limited and fixed to prevent the chip from falling off the device.

[0004] The lead frame can remove the lead plate from the lead slot for replacement by loosening the positioning bolts, but four groups of lead plates are provided, and one group of lead plates is fixed by two groups of positioning bolts, which makes the lead plate disassembly and assembly operation more complicated and affects the lead plate disassembly and assembly efficiency.

[0005] Therefore, in order to solve the above problems, a multi-carrier matrix type ultra-thin packaging lead frame is proposed. Utility Model Content

[0006] The purpose of the utility model is to provide a multi-carrier matrix ultra-thin packaging lead frame to solve the problem that the lead frame in the prior art mentioned in the above background technology can remove the lead plate from the lead groove for replacement by loosening the positioning bolts, but the lead plate is provided with four groups, and one group of lead plates is fixed by two groups of positioning bolts, which makes the disassembly and assembly operation of the lead plate more cumbersome, affecting the disassembly and assembly efficiency of the lead plate.

[0007] To achieve the above object, the utility model provides the following technical solution: a multi-carrier matrix type ultra-thin package lead frame, comprising: a device body, a top surface of the device body is provided with a positioning groove and a movable groove, a bottom surface of the positioning groove is provided with a mounting groove, a lead plate is placed inside the mounting groove, and a chip body is mounted on the top surface of the device body;

[0008] A fixing structure is installed on the device body, and the fixing structure includes a fixing frame, which is installed on the inner side of the positioning groove. The four corners of the fixing frame are provided with card slots. A slider is slidably installed inside the top surface of the device body, and a card block is integrally formed at one end of the slider. A movable rod is rotatably installed inside the top surface of the device body, and coil springs are fixedly connected to both sides of the middle part of the movable rod.

[0009] Preferably, a positioning structure is installed on the top surface of the device body, and the positioning structure includes a positioning ring. The positioning ring moves in the middle of the top surface of the device body through a rotating shaft, and the end of the positioning ring is threadedly connected with a bolt.

[0010] Preferably, four groups of lead plates are provided, and the four groups of lead plates are respectively installed inside the four sides of the top surface of the device body.

[0011] Preferably, the fixing frame is sleeved on the outer side of the upper end of the lead plate, the top end of the sliding block is exposed from the top surface of the device body, and the end of the clamping block is inserted into the inner side of the clamping slot.

[0012] Preferably, one end of the movable rod is exposed from the top surface of the device body via the movable groove, and the other end of the movable rod is located at the lower side of the lead plate.

[0013] Preferably, the positioning ring is located on the upper side of the chip body, and one end of the bolt is threadedly connected to the top surface of the device body.

[0014] Compared with the prior art, the beneficial effects of the utility model are:

[0015] 1. The utility model is provided with a fixing structure, the lead plate is placed inside the positioning groove, and then the fixing frame is installed inside the installation groove, so that the fixing frame is pressed on the top of the lead plate, at this time, the card block is aligned with the card groove, and then the slider is pulled, that is, the card block is driven to be inserted into the card groove, and the four groups of lead plates can be fixed on the inner sides of the four groups of positioning grooves at the same time, making the installation of the lead plate more convenient and labor-saving. When disassembling, the slider is pulled to drive the card block to be pulled out from the inside of the card groove to release the fixation of the fixing frame, and then after the fixing frame is taken out, the movable rod is pressed to make one end of the movable rod tilt up, and the movable rod can push the lead plate upward from the inner side of the installation groove when tilting, so that the lead plate tilts from the inner side of the installation groove, and the lead plate can be easily taken out from the inner side of the installation groove, which improves the convenience of disassembly and assembly of the lead plate;

[0016] 2. The utility model is provided with a positioning structure. The chip body is installed on the top surface of the device body, the positioning ring is turned over, the positioning ring is covered on the top surface of the chip body, and then the bolt is rotated to fix the positioning ring, so that the chip body is installed more tightly on the device body. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] Figure 1 It is a schematic diagram of the structure of the utility model;

[0018] Figure 2 It is a schematic diagram of the explosion of the structure of the utility model;

[0019] Figure 3 It is a schematic diagram of the structure of the installation slot of the utility model from a side view;

[0020] Figure 4 It is a schematic diagram of the front cross-section of the structure of the slider of the utility model;

[0021] Figure 5 It is a front view cross-sectional schematic diagram of the positioning structure of the utility model.

[0022] In the figure: 1. device body; 11. positioning groove; 12. mounting groove; 13. movable groove; 14. lead plate; 15. chip body; 2. fixing structure; 21. fixing frame; 22. slot; 23. slider; 24. clamping block; 25. movable rod; 26. coil spring; 3. positioning structure; 31. positioning ring; 32. bolt. DETAILED DESCRIPTION

[0023] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

[0024] See also Figure 1-5 , an embodiment provided by the utility model:

[0025] The device body 1 and the lead plate 14 used in the present application are products that can be directly purchased on the market. Their principles and connection methods are existing technologies well known to those skilled in the art, so they will not be described in detail here.

[0026] A multi-carrier matrix type ultra-thin package lead frame, comprising: a device body 1, a top surface of the device body 1 is provided with a positioning groove 11 and a movable groove 13, a bottom surface of the positioning groove 11 is provided with a mounting groove 12, a lead plate 14 is placed inside the mounting groove 12, and a chip body 15 is installed on the top surface of the device body 1;

[0027] A fixing structure 2 is installed on the device body 1, and the fixing structure 2 includes a fixing frame 21, which is installed on the inner side of the positioning groove 11, and the four corners of the fixing frame 21 are provided with card slots 22. A slider 23 is slidably installed inside the top surface of the device body 1, and a card block 24 is integrally formed at one end of the slider 23. A movable rod 25 is rotatably installed inside the top surface of the device body 1, and coil springs 26 are fixedly connected to both sides of the middle of the movable rod 25. The lead plate 14 is placed inside the positioning groove 11, and then the fixing frame 21 is installed on the inner side of the mounting groove 12, so that the fixing frame 21 is pressed on the top of the lead plate 14, and the card block 24 is aligned with the card slot 22, and then the slider 23 is pulled , that is, the card block 24 is driven to be inserted into the card slot 22, so that the four groups of lead plates 14 can be fixed on the inner sides of the four groups of positioning grooves 11 at the same time, making the installation of the lead plate 14 more convenient and labor-saving. When disassembling, the slider 23 is pulled to drive the card block 24 to be pulled out from the card slot 22, so that the fixation of the fixing frame 21 can be released. After the fixing frame 21 is taken out, the movable rod 25 is pressed to make one end of the movable rod 25 tilt up. When tilting up, the movable rod 25 can push the lead plate 14 upward from the inner side of the installation groove 12, so that the lead plate 14 tilts from the inner side of the installation groove 12, and the lead plate 14 can be easily taken out from the inner side of the installation groove 12, which improves the convenience of disassembly and assembly of the lead plate 14.

[0028] Furthermore, a positioning structure 3 is installed on the top surface of the device body 1, and the positioning structure 3 includes a positioning ring 31. The positioning ring 31 moves in the middle of the top surface of the device body 1 through a rotating shaft, and the end of the positioning ring 31 is threadedly connected with a bolt 32. The chip body 15 is installed on the top surface of the device body 1, the positioning ring 31 is flipped over, and the positioning ring 31 is covered on the top surface of the chip body 15. Then, the bolt 32 is rotated to fix the positioning ring 31, so that the chip body 15 is installed more tightly on the device body 1.

[0029] Furthermore, four groups of lead plates 14 are provided, and the four groups of lead plates 14 are respectively installed inside the four sides of the top surface of the device body 1 , and the fixing frame 21 can fix the four groups of lead plates 14 at the same time.

[0030] Furthermore, the fixing frame 21 is sleeved on the outer side of the upper end of the lead plate 14, the top of the slider 23 is exposed from the top surface of the device body 1, and the end of the clamping block 24 is inserted into the inner side of the clamping slot 22. The user can pull the slider 23 from the upper side of the device body 1, and the fixing frame 21 can be fixed on the inner side of the positioning slot 11 through the clamping block 24.

[0031] Furthermore, one end of the movable rod 25 is exposed from the top surface of the device body 1 through the movable groove 13, and the other end of the movable rod 25 is located at the lower side of the lead plate 14. Pressing one end of the movable rod 25 can drive the other end to tilt up, and the lead plate 14 can be lifted up from the inside of the mounting groove 12, so as to facilitate the removal of the lead plate 14 from the inside of the mounting groove 12, thereby improving the convenience of disassembly and assembly of the lead plate 14.

[0032] Furthermore, the positioning ring 31 is located on the upper side of the chip body 15, and one end of the bolt 32 is threadedly connected to the top surface of the device body 1. The positioning ring 31 can be fixed to the top surface of the device body 1 through the bolt 32 to provide fixation for the installation of the chip body 15 on the device body 1.

[0033] Working principle: During assembly, the lead plate 14 is placed inside the positioning groove 11, and then the fixing frame 21 is installed inside the mounting groove 12, so that the fixing frame 21 is pressed on the top of the lead plate 14. At this time, the clamping block 24 is aligned with the clamping groove 22, and then the slider 23 is pulled to drive the clamping block 24 to be inserted into the clamping groove 22, so that the four groups of lead plates 14 can be fixed on the inner sides of the four groups of positioning grooves 11 at the same time, making the installation of the lead plate 14 more convenient and labor-saving;

[0034] When disassembling, the slider 23 is pulled to drive the card block 24 to be pulled out from the card slot 22, so that the fixing of the fixing frame 21 can be released. After the fixing frame 21 is taken out, the movable rod 25 is pressed to make one end of the movable rod 25 tilt up. When the movable rod 25 tilts up, the lead plate 14 can be pushed up from the inner side of the installation slot 12, so that the lead plate 14 can be tilted from the inner side of the installation slot 12, and the lead plate 14 can be easily taken out from the inner side of the installation slot 12, which improves the convenience of disassembly and assembly of the lead plate 14;

[0035] Install the chip body 15 on the top surface of the device body 1, flip the positioning ring 31, cover the top surface of the chip body 15 with the positioning ring 31, and then rotate the bolt 32 to fix the positioning ring 31, so that the chip body 15 is installed more tightly on the device body 1.

[0036] Finally, it should be noted that the above is only a preferred embodiment of the present utility model and is not intended to limit the present utility model. Although the present utility model has been described in detail with reference to the aforementioned embodiments, it is still possible for those skilled in the art to modify the technical solutions described in the aforementioned embodiments, or to make equivalent substitutions for some of the technical features therein. Any modifications, equivalent substitutions, improvements, etc. made within the spirit and principles of the present utility model shall be included in the protection scope of the present utility model.

Claims

1. A multi-carrier matrix ultra-thin packaging lead frame, comprising: A device body (1), wherein a positioning groove (11) and a movable groove (13) are provided on the top surface of the device body (1), a mounting groove (12) is provided on the bottom surface of the positioning groove (11), a lead plate (14) is placed inside the mounting groove (12), and a chip body (15) is installed on the top surface of the device body (1); Features: A fixing structure (2) is installed on the device body (1), and the fixing structure (2) includes a fixing frame (21). The fixing frame (21) is installed on the inner side of the positioning groove (11), and the fixing frame (21) is provided with a clamping groove (22) at four corners. A slider (23) is slidably installed inside the top surface of the device body (1), and a clamping block (24) is integrally formed at one end of the slider (23). A movable rod (25) is rotatably installed inside the top surface of the device body (1), and coil springs (26) are fixedly connected to both sides of the middle of the movable rod (25).

2. The multi-carrier matrix ultra-thin packaging lead frame according to claim 1, characterized in that: A positioning structure (3) is installed on the top surface of the device body (1), and the positioning structure (3) comprises a positioning ring (31). The positioning ring (31) moves in the middle of the top surface of the device body (1) via a rotating shaft, and a bolt (32) is threadedly connected to the end of the positioning ring (31).

3. The multi-carrier matrix ultra-thin packaging lead frame according to claim 1, characterized in that: Four groups of lead plates (14) are provided, and the four groups of lead plates (14) are respectively installed inside the four sides of the top surface of the device body (1).

4. The multi-carrier matrix ultra-thin packaging lead frame according to claim 1, characterized in that: The fixing frame (21) is sleeved on the outer side of the upper end of the lead plate (14), the top end of the sliding block (23) is exposed from the top surface of the device body (1), and the end of the clamping block (24) is inserted into the inner side of the clamping slot (22).

5. The multi-carrier matrix ultra-thin packaging lead frame according to claim 1, characterized in that: One end of the movable rod (25) is exposed from the top surface of the device body (1) via the movable groove (13), and the other end of the movable rod (25) is located at the lower side of the lead plate (14).

6. The multi-carrier matrix ultra-thin packaging lead frame according to claim 2, characterized in that: The positioning ring (31) is located on the upper side of the chip body (15), and one end of the bolt (32) is threadedly connected to the top surface of the device body (1).

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