Optical signal transmission device

By setting up multiple direct modulation lasers and multi-core fiber ferrule connectors in parallel, combining lenses and semiconductor refrigerators, the problem of low integration of existing optical modules is solved, and optical signal transmission with high bandwidth and low power consumption is achieved, improving optical signal transmission with high bandwidth and low power consumption The integration and versatility of optical modules are achieved.

CN222321553UActive Publication Date: 2025-01-07SHENZHEN GIGALIGHT TECH
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Patent Information

Application Number
CN202420227644.3
Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
Filing Date
2024-01-31
Publication Date
2025-01-07
Estimated Expiration
2034-01-31

AI Technical Summary

Technical Problem

The existing O-band DWDM optical modules have low integration, especially 25G bandwidth optical modules that use coaxial or BOX device packaging, which consumes a large power and cannot meet the high bandwidth requirements.

Method used

By setting four 25G bandwidth direct modulation lasers in parallel, a 100G bandwidth O-band DWDM optical module is formed in four carriers parallel, and optical signal transmission is achieved using multi-core fiber ferrule connectors, and optical transmitters and receivers are integrated on the circuit board. , combining lenses, semiconductor refrigerators and photon counters to improve the integration of optical modules.

Benefits of technology

The integration of four 25G bandwidth O-band DWDM optical modules into a 100G bandwidth optical module is realized, which improves the integration and versatility of the optical module, reduces power consumption and space usage, and reduces costs.

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Abstract

The utility model relates to an optical signal transmission device. The optical signal transmission device comprises an optical transmitter, a connector and an optical receiver. The light emitter comprises four direct modulation lasers which are arranged in parallel; the output end of each direct modulation laser is connected with one end of the connector, and the other end of the connector is connected with the optical receiver. The four direct modulation lasers with the 25G bandwidth can be arranged in parallel to form the four-carrier parallel O-band DWDM optical module with the 100G bandwidth, so that the four direct modulation lasers can be integrated in one O-band DWDM optical module, and the integration level of the O-band DWDM optical module can be improved.
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Description

Technical Field

[0001] The present application relates to the field of communication technology, and in particular to an optical signal transmission device. Background Art

[0002] With the development of communication technology, optical signal transmission devices have emerged, such as optical transceiver modules (abbreviated as optical modules). Optical modules are used to realize the conversion of optical and electrical signals. Optical modules include a transmitting end and a receiving end. The transmitting end is used to convert electrical signals into optical signals, and the receiving end is used to convert optical signals into electrical signals.

[0003] Current optical modules include 25G bandwidth O-band DWDM (Dense Wavelength Division Multiplexing) optical modules. However, current optical modules have the problem of low integration. Utility Model Content

[0004] Based on this, it is necessary to provide an optical signal transmission device that can improve the integration of optical modules in order to solve the above technical problems.

[0005] In a first aspect, the present application provides an optical signal transmission device, which includes: an optical transmitter, a connector and an optical receiver; the optical transmitter includes four directly modulated lasers arranged in parallel; the output end of each directly modulated laser is connected to one end of the connector, and the other end of the connector is connected to the optical receiver.

[0006] In one embodiment, the optical signal transmission device also includes a first optical fiber component and a second optical fiber component, the first optical fiber component includes four first optical fiber channels, and the second optical fiber component includes four second optical fiber channels; the output end of each directly modulated laser is connected to one end of the connector through the corresponding first optical fiber channel, and the other end of the connector is connected to the optical receiver through the corresponding second optical fiber channel.

[0007] In one of the embodiments, the optical transmitter further includes: four lenses arranged in parallel; each of the lenses is arranged on the optical path of the laser light beam output by the corresponding directly modulated laser; and each laser light beam output by the directly modulated laser is coupled to the corresponding first optical fiber channel through the lens.

[0008] In one of the embodiments, the optical transmitter further comprises: four semiconductor refrigerators arranged in parallel; each of the directly modulated lasers and each of the lenses are arranged on the upper surface of the corresponding semiconductor refrigerator.

[0009] In one of the embodiments, the optical transmitter further includes: four photon counters; each of the photon counters is arranged at a preset position on the reverse optical path corresponding to the directly modulated laser.

[0010] In one of the embodiments, the optical signal transmission device further includes a heat dissipation substrate, and the optical transmitter is disposed on an upper surface of the heat dissipation substrate.

[0011] In one embodiment, the optical receiver includes: four photoelectric converters arranged in parallel and four signal amplifiers arranged in parallel; the other end of the connector is connected to the input end of each of the photoelectric converters, and the output end of each of the photoelectric converters is connected to the corresponding signal amplifier.

[0012] In one embodiment, the optical signal transmission device further includes: a circuit board; the optical transmitter is arranged on a first surface of the circuit board, and the optical receiver is arranged on a second surface of the circuit board, and the first surface and the second surface are opposite surfaces of the circuit board.

[0013] In one of the embodiments, the circuit board includes a voltage reducer and a control unit; the voltage reducer is connected to each directly modulated laser in the optical transmitter; the control unit is connected to each directly modulated laser; and the control unit controls each directly modulated laser to start or shut down.

[0014] In one embodiment, the connector includes a combiner, a splitter and an optical amplifier; the output end of each directly modulated laser in the optical transmitter is connected to the input end of the combiner, the output end of the combiner is connected to the input end of the optical amplifier, the output end of the optical amplifier is connected to the input end of the splitter, and the output end of the splitter is connected to the optical receiver.

[0015] The above-mentioned optical signal transmission device includes: an optical transmitter, a connector and an optical receiver; the optical transmitter includes four directly modulated lasers arranged in parallel; the output end of each directly modulated laser is connected to one end of the connector, and the other end of the connector is connected to the optical receiver. Since the present application can form a four-carrier parallel 100G bandwidth O-band DWDM optical module by setting four 25G bandwidth directly modulated lasers in parallel, the four directly modulated lasers can be integrated into one O-band DWDM optical module, thereby improving the integration of the O-band DWDM optical module. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] In order to more clearly illustrate the technical solutions in the embodiments of the present application or the related technologies, the drawings required for use in the embodiments or the related technical descriptions are briefly introduced below. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.

[0017] FIG1 is a schematic diagram of the structure of an optical signal transmission device in one embodiment;

[0018] FIG2 is a schematic diagram of the structure of an optical signal transmission device including a first optical fiber assembly and a second optical fiber assembly in one embodiment;

[0019] FIG3 is a schematic diagram of wiring of a circuit board in one embodiment;

[0020] FIG4 is a schematic diagram of a hardware circuit of a circuit board in one embodiment;

[0021] FIG. 5 is a schematic diagram of an application of a connector in an embodiment.

[0022] Description of reference numerals:

[0023] Optical signal transmission device: 1; optical transmitter: 11; connector: 12; optical receiver: 13; directly modulated laser: 111; first optical fiber assembly: 14; second optical fiber assembly: 15; lens: 112; semiconductor refrigerator: 113; heat dissipation substrate: 16; circuit board: 17; location of positive and negative bonding pads of semiconductor refrigerator TEC: 1131; location of corresponding bonding pads on the circuit board: 1132. DETAILED DESCRIPTION

[0024] In order to make the purpose, technical solution and advantages of the present application more clearly understood, the present application is further described in detail below in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain the present application and are not used to limit the present application.

[0025] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by technicians in the technical field to which this application belongs; the terms used herein are only for the purpose of describing specific embodiments and are not intended to limit this application; the terms "including" and "having" in the specification and claims of this application and the above-mentioned figure descriptions and any variations thereof are intended to cover non-exclusive inclusions.

[0026] In the description of the present invention, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise", "axial", "radial", "circumferential" and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the referred device or element must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as a limitation on the present invention.

[0027] In addition, the terms "first" and "second" are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Therefore, the features defined as "first" and "second" may explicitly or implicitly include at least one of the features. In the description of the present utility model, the meaning of "plurality" is at least two, such as two, three, etc., unless otherwise clearly and specifically defined.

[0028] In the present invention, unless otherwise clearly specified and limited, the terms "installed", "connected", "connected", "fixed" and the like should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium, it can be the internal connection of two elements or the interaction relationship between two elements, unless otherwise clearly defined. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0029] In the present utility model, unless otherwise clearly specified and limited, a first feature being "above" or "below" a second feature may mean that the first and second features are in direct contact, or the first and second features are in indirect contact through an intermediate medium. Moreover, a first feature being "above", "above" or "above" a second feature may mean that the first feature is directly above or obliquely above the second feature, or simply means that the first feature is higher in level than the second feature. A first feature being "below", "below" or "below" a second feature may mean that the first feature is directly below or obliquely below the second feature, or simply means that the first feature is lower in level than the second feature.

[0030] It should be noted that when an element is referred to as being "fixed to" or "disposed on" another element, it may be directly on the other element or there may be a central element. When an element is considered to be "connected to" another element, it may be directly connected to the other element or there may be a central element at the same time. The terms "vertical", "horizontal", "upper", "lower", "left", "right" and similar expressions used herein are for illustrative purposes only and are not intended to be the only implementation method.

[0031] Reference to "embodiments" herein means that a particular feature, structure, or characteristic described in conjunction with the embodiments may be included in at least one embodiment of the present application. The appearance of the phrase in various locations in the specification does not necessarily refer to the same embodiment, nor is it an independent or alternative embodiment that is mutually exclusive with other embodiments. It is explicitly and implicitly understood by those skilled in the art that the embodiments described herein may be combined with other embodiments.

[0032] With the development of communication technology, optical signal transmission devices have emerged, such as optical transceiver modules (abbreviated as optical modules). Optical modules are used to realize the conversion of optical and electrical signals. Optical modules include a transmitting end and a receiving end. The transmitting end is used to convert electrical signals into optical signals, and the receiving end is used to convert optical signals into electrical signals.

[0033] Currently, the DWDM (Dense Wavelength Division Multiplexing) optical modules for the O-band (1260~1360nm, O-band) only include 25G bandwidth O-band DWDM optical modules. However, the 25G bandwidth O-band DWDM optical modules are packaged in coaxial or BOX devices, which have low integration and consume more power than 100G bandwidth O-band DWDM optical modules. Therefore, the current optical modules have the problem of low integration.

[0034] Based on this, the present application provides an optical signal transmission device capable of improving the integration of optical modules.

[0035] In one embodiment, an optical signal transmission device is provided, as shown in FIG1 . FIG1 is a schematic diagram of the structure of an optical signal transmission device in one embodiment, and the optical signal transmission device 1 includes: an optical transmitter 11, a connector 12 and an optical receiver 13; the optical transmitter 11 includes four directly modulated lasers 111 arranged in parallel; the output end of each directly modulated laser 111 is connected to one end of the connector 12, and the other end of the connector 12 is connected to the optical receiver 13.

[0036] The optical signal transmission device 1 includes an optical transmitter 11, a connector 12 and an optical receiver 13. The optical transmitter 11 is used to transmit a laser beam. The optical transmitter 11 includes four parallel directly modulated lasers (Directly Modulated Laser, DML) 111. The directly modulated laser 111 may include but is not limited to a DFB laser (Distributed Feedback Laser), etc. It should be noted that the bandwidth of each directly modulated laser 111 is 25G. In this way, four parallel directly modulated lasers can constitute a four-carrier parallel 100G bandwidth O-band DWDM optical module. The connector 12 is used to transmit the optical signal corresponding to the laser beam. The connector 12 may include but is not limited to an MPO12 connector or an MT ferrule (Multi-fiber ferrule), etc. The MT ferrule is a multi-core plastic ferrule with high density and small volume, which is used to achieve precise physical docking of optical fibers. The optical receiver 13 is used to receive the optical signal corresponding to the laser beam and convert the optical signal into an electrical signal.

[0037] In the embodiment of the present application, the output end of each directly modulated laser 111 in the optical transmitter 11 is connected to one end of the connector 12, and the other end of the connector 12 is connected to the optical receiver 13. Based on this, the optical transmitter 11 can transmit the laser light beam output by each directly modulated laser 111 to the connector 12, and then transmit the laser light beam in the connector 12 to the optical receiver 13, so that the laser light beam can be photoelectrically converted through the optical receiver 13 to obtain an electrical signal corresponding to the laser light beam.

[0038] In the above optical signal transmission device, the optical signal transmission device includes: an optical transmitter, a connector and an optical receiver; the optical transmitter includes four directly modulated lasers arranged in parallel; the output end of each directly modulated laser is connected to one end of the connector, and the other end of the connector is connected to the optical receiver. Since the present application can form a four-carrier parallel 100G bandwidth O-band DWDM optical module by setting four 25G bandwidth directly modulated lasers in parallel, the four directly modulated lasers can be integrated into one O-band DWDM optical module, thereby improving the integration of the O-band DWDM optical module.

[0039] In one embodiment, the optical signal transmission device also includes a first optical fiber component and a second optical fiber component, the first optical fiber component includes four first optical fiber channels, and the second optical fiber component includes four second optical fiber channels; the output end of each directly modulated laser is connected to one end of the connector through the corresponding first optical fiber channel, and the other end of the connector is connected to the optical receiver through the corresponding second optical fiber channel.

[0040] As shown in FIG. 2, FIG. 2 is a schematic diagram of the structure of an optical signal transmission device including a first optical fiber assembly and a second optical fiber assembly in an embodiment. The optical signal transmission device 1 also includes a first optical fiber assembly 14 and a second optical fiber assembly 15. The first optical fiber assembly 14 is an optical fiber array assembly at the light transmission (TX, transport) end. The first optical fiber assembly 14 is connected between the optical transmitter 11 and the connector 12. The first optical fiber assembly 14 includes four first optical fiber channels; the second optical fiber assembly 15 is an optical fiber array assembly at the light receiving (RX, receive) end. The second optical fiber assembly 15 is connected between the connector 12 and the optical receiver 13 (not shown in FIG. 2), and the second optical fiber assembly 15 includes four second optical fiber channels. In the embodiment of the present application, the output end of each directly modulated laser is connected to one end of the connector 12 through the first optical fiber channel corresponding to the directly modulated laser in the first optical fiber assembly 14, and the other end of the connector 12 is connected to the optical receiver 13 through the corresponding second optical fiber channel in the second optical fiber assembly 15. The use of the first optical fiber assembly 14 and the second optical fiber assembly 15 can improve the consistency of the 4-way emission light power.

[0041] In one embodiment, the optical transmitter further includes: four lenses arranged in parallel; each lens is arranged on the optical path of the laser beam output by the corresponding directly modulated laser; and each laser beam output by the directly modulated laser is coupled to the corresponding first optical fiber channel through the lens.

[0042] In the embodiment of the present application, as shown in FIG2 , the optical transmitter 11 further includes four parallel lenses 112, each lens 112 being arranged on the optical path of the laser beam output by the corresponding directly modulated laser 111; the laser beam output by each directly modulated laser 111 is coupled to the corresponding first optical fiber channel in the first optical fiber assembly 14 through the lens 112. The lens may be a glass lens or a silicon lens, etc. The lens is used to couple the divergent light emitted by the laser into convergent light, and the optical path can be shortened by coupling the 4-channel single lens, saving the layout space.

[0043] In one of the embodiments, the optical transmitter further includes: four semiconductor refrigerators arranged in parallel; each directly modulated laser and each lens are arranged on the upper surface of the corresponding semiconductor refrigerator.

[0044] In the embodiment of the present application, as shown in FIG2 , the optical transmitter 11 also includes four semiconductor refrigerators 113 arranged in parallel, and each directly modulated laser 111 and each lens 112 are arranged on the upper surface of the corresponding semiconductor refrigerator 113. Among them, the semiconductor refrigerator 113 is used to dissipate heat and adjust the wavelength of the optical transmitter. Each two adjacent channels in the four channels use an independent semiconductor refrigerator (Thermo Electric Cooler, TEC) for wavelength adjustment. For example, the interval between adjacent semiconductor refrigerators can be set to be greater than 0.5 mm, so that the semiconductor refrigerator is combined with a large-size heat dissipation substrate to ensure that the semiconductor refrigerators of each channel work stably and do not affect each other, while ensuring the consistency of heat dissipation and wavelength adjustment of the DWDM light source.

[0045] In one embodiment, the optical transmitter further includes: four photon counters; each photon counter is arranged at a preset position on the reverse optical path corresponding to the directly modulated laser.

[0046] In the embodiment of the present application, the optical transmitter also includes four photon counters (Micro Photon Devices, MPDs), each of which is arranged at a preset position on the reverse optical path of the corresponding directly modulated laser, that is, the photon counter is arranged in the reverse direction of the optical path of the corresponding directly modulated laser. The preset position can be set according to actual needs. The embodiment of the present application does not limit the preset position. The photon counter is used to monitor whether the corresponding directly modulated laser is emitting light normally in the forward direction. If the photon counter detects that the directly modulated laser is not emitting light normally in the forward direction, the user can be prompted to replace the directly modulated laser in time.

[0047] In one embodiment, as shown in FIG. 2 , the optical signal transmission device 1 further includes a heat dissipation substrate 16 , and the optical transmitter 11 is disposed on an upper surface of the heat dissipation substrate 16 .

[0048] In this embodiment, the optical transmitter includes four parallel directly modulated lasers, four parallel lenses, four parallel semiconductor refrigerators and four photon counters, and can integrate four 25G bandwidth O-band DWDM optical modules, so as to obtain a four-carrier parallel 100G bandwidth O-band DWDM optical module, that is, four 25G bandwidth O-band DWDM optical modules can be integrated into one four-carrier parallel 100G bandwidth O-band DWDM optical module, so as to improve the integration of the O-band DWDM optical module.

[0049] In one embodiment, the optical receiver includes: four photoelectric converters arranged in parallel and four signal amplifiers arranged in parallel; the other end of the connector is connected to the input end of each photoelectric converter, and the output end of each photoelectric converter is connected to the corresponding signal amplifier.

[0050] The optical receiver includes four photoelectric converters arranged in parallel and four signal amplifiers arranged in parallel. The photoelectric converter is used to convert the optical signal corresponding to the laser beam into an electrical signal. Exemplarily, the photoelectric converter can be a photodiode (PD); the signal amplifier is used to amplify the electrical signal. Exemplarily, the signal amplifier can be a transimpedance amplifier (TIA). The other end of the connector is connected to the input end of each photoelectric converter, and the output end of each photoelectric converter is connected to the corresponding signal amplifier. Exemplarily, there is a corresponding relationship between the second optical fiber channel and the photoelectric converter. The other end of the connector can be connected to the input end of each photoelectric converter through the corresponding second optical fiber channel in the second optical fiber assembly (FA), so that the optical signal corresponding to the laser beam is transmitted to the corresponding photoelectric converter through the second optical fiber channel corresponding to the second optical fiber assembly. The photoelectric converter converts the optical signal corresponding to the laser beam into a smaller photocurrent signal, and amplifies the photocurrent signal into a resolvable electrical signal through the signal amplifier connection, thereby completing the signal transmission process of the light receiving end.

[0051] In this embodiment, the optical receiver includes four photoelectric converters arranged in parallel and four signal amplifiers arranged in parallel. Photoelectric conversion can be performed through the four photoelectric converters arranged in parallel, and signal amplification can be performed through the four signal amplifiers arranged in parallel, so as to accurately transmit signals at the light receiving end.

[0052] In one embodiment, the optical signal transmission device further includes: a circuit board; the optical transmitter is arranged on the first surface of the circuit board, and the optical receiver is arranged on the second surface of the circuit board, and the first surface and the second surface are opposite surfaces of the circuit board.

[0053] In the embodiment of the present application, as shown in FIG2 , the optical signal transmission device 1 further includes a circuit board 17, the optical transmitter 11 is disposed on the first surface of the circuit board 17, and the optical receiver 13 (not shown in FIG2 ) is disposed on the second surface of the circuit board 17, and the first surface and the second surface are two opposite surfaces of the circuit board 17. The circuit board may include but is not limited to a PCB board, a PCBA (Printed Circuit Board Assembly) board, and the like.

[0054] In addition, as shown in FIG. 3 , FIG. 3 is a schematic diagram of the wiring of a circuit board in an embodiment, wherein 1131 is the location of the positive and negative wiring pads of the semiconductor cooler TEC, and 1132 is the location of the corresponding wiring pads on the circuit board. The embodiment of the present application can also design a wiring adapter board to transfer the wiring of the semiconductor cooler (Thermo Electric Cooler, TEC) to the edge of the circuit board, thereby saving the layout space of the circuit board. Exemplarily, each directly modulated laser is set on the corresponding semiconductor cooler TEC, and the light-emitting point is slightly higher than the wiring position of the circuit board to avoid the wiring gold wire blocking the light path, so that according to the location 1131 of the positive and negative wiring pads of the semiconductor cooler TEC and the location 1132 of the corresponding wiring pads on the circuit board, the positive and negative wiring of the semiconductor cooler TEC is transferred to the wiring board, and the arrow in FIG. 3 is the wiring direction. The wiring adapter board is on the same horizontal plane as the semiconductor cooler TEC, and is placed in front and behind, and is used to transfer the wiring direction to avoid the gold wire blocking the light path.

[0055] In this embodiment, the optical signal transmission device also includes a circuit board; the optical transmitter is arranged on the first surface of the circuit board, and the optical receiver is arranged on the second surface of the circuit board. The first surface and the second surface are opposite surfaces of the circuit board. By arranging the optical transmitter and the optical receiver on two surfaces of the same circuit board, the space of the optical module is greatly reduced, thereby improving the integration and versatility of the O-band DWDM optical module, saving the number and space of optical modules, and reducing the cost and power consumption of the optical signal transmission device.

[0056] In one embodiment, the circuit board includes a voltage reducer and a control unit; the voltage reducer is connected to each directly modulated laser in the optical transmitter; the control unit is connected to each directly modulated laser; and the control unit controls each directly modulated laser to start or shut down.

[0057] In an embodiment of the present application, as shown in FIG4 , FIG4 is a schematic diagram of a hardware circuit of a circuit board in an embodiment, and the circuit board includes a voltage step-down DC-DC (Direct Current) and a control unit MCU (Microcontroller Unit), the voltage step-down DC-DC is connected to each directly modulated laser DML in the optical transmitter, the control unit MCU is connected to each directly modulated laser DML, and the control unit MCU controls each directly modulated laser DML to start or shut down.

[0058] Exemplarily, in combination with Figure 4, the optical signal transmission device in the embodiment of the present application can be a 100G O-band DWDM optical module, which is an optoelectronic converter and an electro-optical converter, wherein the electrical port side of the above-mentioned optical module is modulated with 4x25G NRZ (non-return-to-zero code, Non-Return-to-Zero), and the optical port side is modulated with 4x25G NRZ, using an MPO interface, and the above-mentioned optical module adopts a QSFP28 PSM4 packaging method. The circuit board includes a step-down DC-DC, which can step down the power supply voltage in the QSFP28 CON (Quad Small Form-factor Pluggable 28 connector, 100G four-channel small hot-pluggable connector) to a target voltage, and use the target voltage to power the clock and data recovery module (DML Driver+ CDR, Directly Modulated Laser Driver Clock and Data Recovery) in the driver of the four-channel (4CH) directly modulated laser and the clock and data recovery module (TIA+CDR, Transimpedance Amplifier Clock and Data Recovery) in the transimpedance amplifier. Exemplarily, the power supply voltage in the QSFP28 CON can be 3.3V, and the target voltage can be 2.7V, 1.7V, or 1.6V.

[0059] Among them, the driver DML Driver of the directly modulated laser includes a four-channel 4CH clock and data recovery module CDR and a four-channel 4CH directly modulated laser DML LD, and the COB (Chip on Board) includes a 4x25G DML DWDM, a 4x25G photodiode PD, a four-channel 4CH transimpedance amplifier TIA and a four-channel 4CH clock and data recovery module CDR.

[0060] The control unit MCU is connected to the QSFP28 CON through the I2C communication protocol. The control unit MCU can provide digital diagnosis and monitoring functions of the I2C management interface, and can realize the initialization operation and coordination between the control units, and realize the temperature sampling and feedback control of the four parallel-arranged semiconductor coolers (TEC) in the TOSA (Transmitter Optical Subassembly).

[0061] In addition, the 100G O-band DWDM optical module can also realize signal processing, including: the HOST (server connected to the device) side can transmit electrical signals and enter the DML Driver + CDR at a rate of 4x 25G NRZ for signal linear equalization, clock recovery and driving DML devices; the transimpedance amplifier TIA can convert the photocurrent into a voltage signal with a certain swing amplitude through automatic gain control, and then amplify the signal, and do some optimization processing on the voltage signal, and finally output the amplified and optimized voltage signal to the HOST side.

[0062] In this embodiment, the circuit board includes a voltage reducer and a control unit. By designing the voltage reducer and the control unit, four parallel directly modulated lasers can be accurately driven and controlled, thereby improving the consistency of the emitted optical power.

[0063] In one embodiment, the connector includes a combiner, a splitter and an optical amplifier; the output end of each directly modulated laser in the optical transmitter is connected to the input end of the combiner, the output end of the combiner is connected to the input end of the optical amplifier, the output end of the optical amplifier is connected to the input end of the splitter, and the output end of the splitter is connected to the optical receiver.

[0064] In an embodiment of the present application, as shown in FIG5 , FIG5 is an application diagram of a connector in an embodiment, the connector includes a multiplexer (MUX), a demultiplexer (DEMUX), and an optical amplifier (SOA). The output end of each directly modulated laser DML in the optical transmitter is connected to the input end of the multiplexer MUX, the output end of the multiplexer MUX is connected to the input end of the optical amplifier SOA, the output end of the optical amplifier SOA is connected to the input end of the demultiplexer DEMUX, and the output end of the demultiplexer DEMUX is connected to the optical receiver. Among them, the multiplexer can also be called an optical multiplexer, and the multiplexer MUX is a 16-channel O-band DWDM MUX; the demultiplexer can also be called an optical demultiplexer, and the demultiplexer DEMUX is a 16-channel O-band DWDM DEMUX. Based on this, assuming that a 400G O-band signal needs to be transmitted, four 100G QSFP28 O-band DWDM optical modules can be used for signal transmission. For example, the optical signals output by each directly modulated laser DML in the optical transmitter can be combined and transmitted in one optical fiber through a combiner MUX, and the optical amplifier SOA is used to amplify the optical signal combined in one optical fiber, and then the amplified optical signal or light wave is transmitted to the demultiplexer DEMUX, and then the combined optical signal is separated by the demultiplexer DEMUX to obtain the optical signal corresponding to each directly modulated laser DML, and the separated optical signals corresponding to each directly modulated laser DML are transmitted to the optical receiver.

[0065] In this embodiment, the connector includes a combiner, a splitter and an optical amplifier; the output end of each directly modulated laser in the optical transmitter is connected to the input end of the combiner, the output end of the combiner is connected to the input end of the optical amplifier, the output end of the optical amplifier is connected to the input end of the splitter, and the output end of the splitter is connected to the optical receiver. Through the coordinated use of the combiner, the splitter and the optical amplifier, the optical signal can be transmitted over a long distance of at least 80km when the optical signal is transmitted over a long distance.

[0066] The technical features of the above embodiments may be combined arbitrarily. To make the description concise, not all possible combinations of the technical features in the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0067] The above embodiments only express several implementation methods of the present application, and the descriptions thereof are relatively specific and detailed, but they cannot be understood as limiting the scope of the present application. It should be pointed out that, for a person of ordinary skill in the art, several variations and improvements can be made without departing from the concept of the present application, and these all belong to the protection scope of the present application. Therefore, the protection scope of the present application shall be subject to the attached claims.

Claims

1. An optical signal transmission device, characterized in that: The optical signal transmission device comprises: an optical transmitter, a connector and an optical receiver; the optical transmitter comprises four directly modulated lasers arranged in parallel; the output end of each directly modulated laser is connected to one end of the connector, and the other end of the connector is connected to the optical receiver.

2. The device according to claim 1, characterized in that The optical signal transmission device also includes a first optical fiber component and a second optical fiber component, the first optical fiber component includes four first optical fiber channels, and the second optical fiber component includes four second optical fiber channels; the output end of each directly modulated laser is connected to one end of the connector through the corresponding first optical fiber channel, and the other end of the connector is connected to the optical receiver through the corresponding second optical fiber channel.

3. The device according to claim 2, characterized in that The optical transmitter further comprises: four lenses arranged in parallel; each of the lenses is arranged on the optical path of the laser beam outputted by the corresponding directly modulated laser; and each laser beam outputted by the directly modulated laser is coupled to the corresponding first optical fiber channel through the lens.

4. The device according to claim 3, characterized in that The optical transmitter further comprises: four semiconductor refrigerators arranged in parallel; each of the directly modulated lasers and each of the lenses are arranged on the upper surface of the corresponding semiconductor refrigerator.

5. The device according to claim 1, characterized in that The optical transmitter further comprises: four photon counters; each of the photon counters is arranged at a preset position on the reverse optical path corresponding to the directly modulated laser.

6. The device according to claim 1, characterized in that The optical signal transmission device further includes a heat dissipation substrate, and the optical transmitter is arranged on an upper surface of the heat dissipation substrate.

7. The device according to any one of claims 1 to 6, characterized in that: The optical receiver includes: four photoelectric converters arranged in parallel and four signal amplifiers arranged in parallel; the other end of the connector is connected to the input end of each of the photoelectric converters, and the output end of each of the photoelectric converters is connected to the corresponding signal amplifier.

8. The device according to claim 1, characterized in that The optical signal transmission device further includes: a circuit board; the optical transmitter is arranged on a first surface of the circuit board, the optical receiver is arranged on a second surface of the circuit board, and the first surface and the second surface are opposite surfaces of the circuit board.

9. The device according to claim 8, characterized in that The circuit board includes a voltage reducer and a control unit; the voltage reducer is connected to each directly modulated laser in the optical transmitter; the control unit is connected to each directly modulated laser; and the control unit controls each directly modulated laser to start or shut down.

10. The device according to claim 1, characterized in that The connector includes a combiner, a splitter and an optical amplifier; the output end of each directly modulated laser in the optical transmitter is connected to the input end of the combiner, the output end of the combiner is connected to the input end of the optical amplifier, the output end of the optical amplifier is connected to the input end of the splitter, and the output end of the splitter is connected to the optical receiver.