Sound production unit based on flat vibrating diaphragm

By adopting a sandwich-structured hard-soft composite layer and an FPC circuit board design, the problems of low efficiency and sensitivity of planar diaphragm headphones have been solved, achieving cost reduction and performance improvement.

CN222321766UActive Publication Date: 2025-01-07CHENGDU SHUIYUEYU TECHNOLOGY CO LTD
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Patent Information

Application Number
CN202323584125.7
Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
Filing Date
2023-12-27
Publication Date
2025-01-07
Estimated Expiration
2033-12-27

AI Technical Summary

Technical Problem

Planar magnetic headphones have low efficiency and sensitivity. Traditional diaphragm manufacturing is costly and has poor control over thickness and uniformity, resulting in low yield.

Method used

A sandwich-structured rigid-soft composite layer is used as the diaphragm, an FPC circuit board is used instead of polyester film, and the copper foil circuit trace design is optimized to improve the diaphragm thickness and uniformity and reduce production costs.

Benefits of technology

This improved the yield rate of the diaphragm, reduced production costs, and enhanced the transducer efficiency and sensitivity of the headphones, thereby improving sound quality.

✦ Generated by Eureka AI based on patent content.

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Abstract

The utility model relates to the technical field of isomagnetic earphones, in particular to a sounding unit based on a flat diaphragm, which comprises two magnet pole plates, isometric planar diaphragms are arranged between the two magnet pole plates in parallel, and the planar diaphragms are soft and hard composite layers with sandwich structures. The vibrating diaphragm is made of the soft and hard composite layer with the sandwich structure, so that the thickness and the uniformity of the vibrating diaphragm can be controlled to improve the yield of the vibrating diaphragm and reduce the production cost, the transduction efficiency of the planar vibrating diaphragm can be improved, and the sensitivity of the earphone can be improved.
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Description

Technical Field

[0001] The utility model relates to the technical field of isomagnetic earphones, in particular to a sound-generating unit based on a flat diaphragm. Background Art

[0002] Planar diaphragm headphones, also known as isomagnetic headphones, are different from dynamic and electrostatic headphones in their working principle, and are very similar to planar diaphragm speakers. They mainly embed a flat voice coil into a thin diaphragm. The magnets are concentrated on one or both sides of the diaphragm, and the diaphragm vibrates in the magnetic field formed by it. Both planar diaphragm headphones and electrostatic headphones can achieve linear diaphragm movement without the problem of split vibration. Planar diaphragm headphones can also withstand greater input power and have lower distortion under high sound pressure. However, the working efficiency and sensitivity of this planar diaphragm headphone are low. Utility Model Content

[0003] The utility model provides a sound generating unit based on a flat diaphragm type, aiming to solve the problems of low working efficiency and low sensitivity existing in a flat diaphragm earphone.

[0004] The embodiment of the present application provides a flat diaphragm-based sound unit, including two magnetic pole plates, between which a flat diaphragm of equal size is arranged in parallel, and the flat diaphragm is a soft and hard composite layer of a sandwich structure.

[0005] In some embodiments of the present invention, the above-mentioned planar diaphragm includes two hard board electric plate rings, and a membrane component of the same size as the hard board electric plate ring is arranged between the two hard board electric plate rings. The membrane component includes a connected thin film layer and a soft board electric plate ring, and the two sides of the soft board electric plate ring are respectively conductively connected to the two hard board electric plate rings.

[0006] In some embodiments of the present invention, the hard board circuit ring is a ring-shaped PCB circuit board, the film layer is a PU film, and the soft board circuit ring is a ring-shaped FPC circuit board.

[0007] In some embodiments of the present invention, a first copper foil circuit and a second copper foil circuit are respectively provided on the front and back sides of the FPC circuit board, and the outer diameter of the longest straight line distance between the first copper foil circuit and the second copper foil circuit is smaller than the inner diameter of the hard board circuit circle.

[0008] In some embodiments of the present invention, one end of the first copper foil circuit extends outward in a serpentine shape and is connected to a rigid board circuit circle, and one end of the second copper foil circuit extends outward in a serpentine shape and is connected to another rigid board circuit circle.

[0009] In some embodiments of the present invention, a copper foil positive electrode and a copper foil negative electrode are symmetrically arranged on the same side surface of any hard board circuit. The copper foil positive electrode is electrically connected to the first copper foil circuit through a first connection point, and the copper foil negative electrode is electrically connected to the second copper foil circuit through a second connection point.

[0010] In some embodiments of the utility model, the first copper foil circuit and the second copper foil circuit are respectively arranged with copper foil routing circuits, and the copper foil routing circuits include multiple parallel rectangular spiral circuits and extension segment circuits, one ends of the multiple rectangular spiral circuits are connected, and one end of the extension segment circuit is connected to one end of the rectangular spiral circuit.

[0011] Compared with the prior art, the beneficial effects of the utility model are:

[0012] The traditional flat diaphragm unit uses a single polyester film layer and is made into a diaphragm through a vacuum evaporation circuit. However, the preparation cost of the diaphragm is relatively high, and the thickness and uniformity of the diaphragm are poorly controlled, which not only results in a low yield rate, but also makes the headphones made of the diaphragm have low working efficiency and sensitivity. In this application, a diaphragm is made of a soft and hard composite layer with a sandwich structure, which can not only control the thickness and uniformity of the diaphragm to improve the yield rate of the diaphragm and reduce production costs, but also improve the transduction efficiency of the flat diaphragm and enhance the sensitivity of the headphones.

[0013] Other features and advantages of the utility model will be described in the following description, and partly become apparent from the description, or understood by implementing the embodiments of the utility model. The purpose and other advantages of the utility model can be realized and obtained by the structures specifically pointed out in the written description, claims, and drawings. BRIEF DESCRIPTION OF THE DRAWINGS

[0014] In order to more clearly illustrate the technical solutions of the embodiments of the utility model, the drawings required for use in the embodiments will be briefly introduced below. It should be understood that the following drawings only show certain embodiments of the utility model and therefore should not be regarded as limiting the scope. For ordinary technicians in this field, other relevant drawings can be obtained based on these drawings without paying creative work.

[0015] Figure 1 It is an exploded view of the sound unit;

[0016] Figure 2 It is a schematic diagram of the structure of the first copper foil circuit on the front side of the flexible circuit board circle;

[0017] Figure 3 It is a schematic diagram of the structure of the second copper foil circuit on the reverse side of the flexible circuit board circle;

[0018] Figure 4It is a circuit routing diagram of the first copper foil circuit or the second copper foil circuit.

[0019] Markings in the figure: 100 - magnetic pole plate; 200 - flat diaphragm; 201 - hard board electric plate ring; 202 - thin film layer; 203 - soft board electric plate ring; 204 - first copper foil circuit; 205 - first connection point; 206 - second copper foil circuit; 207 - second connection point; 208 - copper foil routing circuit. DETAILED DESCRIPTION

[0020] In order to make the purpose, technical scheme and advantages of the embodiment of the utility model clearer, the technical scheme in the embodiment of the utility model will be clearly and completely described below in conjunction with the drawings in the embodiment of the utility model. Obviously, the described embodiment is a part of the embodiment of the utility model, rather than all the embodiments. The components of the embodiment of the utility model generally described and shown in the drawings here can be arranged and designed in various different configurations. Therefore, the following detailed description of the embodiment of the utility model provided in the drawings is not intended to limit the scope of the utility model for protection, but merely represents the selected embodiment of the utility model. Based on the embodiments in the utility model, all other embodiments obtained by ordinary technicians in this field without making creative work belong to the scope of protection of the utility model.

[0021] It should be noted that similar reference numerals and letters represent similar items in the following drawings, so once an item is defined in one drawing, it does not need to be further defined and explained in subsequent drawings. At the same time, in the description of the present utility model, the terms "first", "second", etc. are only used to distinguish the description and cannot be understood as indicating or implying relative importance.

[0022] Example

[0023] See also Figure 1 It is an exploded diagram of the sound unit. The embodiment of the present application provides a sound unit based on a flat diaphragm, including two magnetic pole plates 100, between which an equal-sized flat diaphragm 200 is arranged in parallel, and the flat diaphragm 200 is a soft-hard composite layer of a sandwich structure.

[0024] Furthermore, the above-mentioned planar diaphragm 200 includes two hard board electric plate circles 201, and a membrane component of the same size as the hard board electric plate circle 201 is arranged between the two hard board electric plate circles 201. The membrane component includes a connected thin film layer 202 and a soft board electric plate circle 203, and the two sides of the soft board electric plate circle 203 are conductively connected to the two hard board electric plate circles 201 respectively.

[0025] In some other embodiments, the above-mentioned hard board circuit 201 is a circular PCB circuit board, the film layer 202 is a PU film, and the soft board circuit 203 adopts a circular FPC circuit board. FPC is a highly flexible flexible printed circuit board made of polyimide or polyester film as a substrate. Its thickness is very thin, and the double-sided printed FPC flexible circuit board can reach a thickness of about 0.1 mm. On the one hand, the present application uses FPC flexible circuit boards instead of polyester films of traditional flat diaphragms, which not only improves the yield rate and reduces production costs, but also avoids the problems of unstable coating quality, high equipment costs and environmental pollution that may be caused by the vacuum evaporation process. On the other hand, the membrane assembly is arranged between the two magnetic pole plates 100. Due to its thin thickness, the membrane assembly has a large vibration amplitude in the magnetic field formed by it, which can not only improve the energy conversion efficiency of the flat diaphragm 200, but also improve the sensitivity of the headphones.

[0026] See also Figure 2 , Figure 3 and Figure 4 , Figure 2 It is a schematic diagram of the structure of the first copper foil circuit 204 in the front side of the flexible circuit board circle 203; Figure 3 is a schematic diagram of the structure of the second copper foil circuit 206 on the reverse side of the flexible circuit board circle 203; Figure 4 It is an enlarged view of the structure of the first copper foil circuit 204 or the second copper foil circuit 206, and a schematic diagram of the circuit in which the copper foil wiring circuit 208 is arranged. The first copper foil circuit 204 and the second copper foil circuit 206 are respectively arranged on the front and back sides of the FPC circuit board, and the outer diameter of the longest straight line distance between the first copper foil circuit 204 and the second copper foil circuit 206 is smaller than the inner diameter of the hard board circuit ring 201.

[0027] Preferably, one end of the first copper foil circuit 204 extends outward in a serpentine shape and is connected to the hard board circuit 201, and one end of the second copper foil circuit 206 extends outward in a serpentine shape and is connected to another hard board circuit 201. The serpentine wiring structure between the PCB circuit and the FPC circuit board in the membrane assembly (i.e., the first copper foil circuit 204 or the second copper foil circuit 206) is specially designed to effectively reduce distortion, reduce split vibration, and improve magnet compliance.

[0028] Furthermore, a copper foil positive electrode and a copper foil negative electrode are symmetrically arranged on the same side surface of any hard board circuit 201. The copper foil positive electrode is electrically connected to the first copper foil circuit 204 through the first connection point 205, and the copper foil negative electrode is electrically connected to the second copper foil circuit 206 through the second connection point 207.

[0029] Preferably, the first copper foil circuit 204 and the second copper foil circuit 206 are respectively provided with a copper foil wiring circuit 208, and the copper foil wiring circuit 208 includes a plurality of parallel rectangular spiral circuits and an extension circuit, one end of the plurality of rectangular spiral circuits is connected, and one end of the extension circuit is connected to one end of the rectangular spiral circuit. The present application can not only effectively reduce distortion and improve unit sensitivity by optimizing the FPC circuit board wiring method, but also greatly improve the sound quality of products (such as headphones or speakers, etc.) using the design.

[0030] The above description is only the preferred embodiment of the utility model, and is not intended to limit the utility model. For those skilled in the art, the utility model can have various modifications and changes. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the utility model shall be included in the protection scope of the utility model.

[0031] The above is only a specific implementation of the utility model, but the protection scope of the utility model is not limited thereto. Any technician familiar with the technical field can easily think of changes or substitutions within the technical scope disclosed by the utility model, which should be included in the protection scope of the utility model. Therefore, the protection scope of the utility model should be based on the protection scope of the claims.

Claims

1. A flat diaphragm-based sound unit, characterized in that: include: two magnet pole plates; An equal-sized planar diaphragm is arranged in parallel between the two magnetic pole plates; the planar diaphragm is a soft-hard composite layer of a sandwich structure; Among them, the planar diaphragm includes two hard board electric plate circles, and a membrane component of the same size as the hard board electric plate circle is arranged between the two hard board electric plate circles. The membrane component includes a connected thin film layer and a soft board electric plate circle, and the two sides of the soft board electric plate circle are respectively conductively connected to the two hard board electric plate circles.

2. The flat-panel diaphragm sound generating unit according to claim 1, characterized in that: The hard board circuit ring is a ring-shaped PCB circuit board, the film layer is a PU film, and the soft board circuit ring adopts a ring-shaped FPC circuit board.

3. The flat-panel diaphragm sound generating unit according to claim 2, characterized in that: The front and back sides of the FPC circuit board are respectively provided with a first copper foil circuit and a second copper foil circuit, and the outer diameter of the longest straight line distance between the first copper foil circuit and the second copper foil circuit is smaller than the inner diameter of the hard board circuit ring.

4. The flat-panel diaphragm sound generating unit according to claim 3, characterized in that: One end of the first copper foil circuit extends outward in a serpentine shape and is connected to the rigid board circuit circle, and one end of the second copper foil circuit extends outward in a serpentine shape and is connected to another rigid board circuit circle.

5. The flat-panel diaphragm sound generating unit according to claim 4, characterized in that: A copper foil positive electrode and a copper foil negative electrode are symmetrically arranged on the same side surface of any of the hard board circuits. The copper foil positive electrode is electrically connected to the first copper foil circuit through a first connection point, and the copper foil negative electrode is electrically connected to the second copper foil circuit through a second connection point.

6. The flat-diaphragm sound generating unit according to claim 4 or 5, characterized in that: The first copper foil circuit and the second copper foil circuit are respectively arranged with copper foil routing circuits, and the copper foil routing circuits include a plurality of parallel rectangular spiral circuits and extension segment circuits, one ends of the plurality of rectangular spiral circuits are connected, and one end of the extension segment circuit is connected to one end of the rectangular spiral circuit.