Transfer printing substrate and slurry transfer printing system

Abstract

The utility model discloses a transfer printing substrate and a slurry transfer printing system. The transfer printing substrate comprises a substrate body and a demolding structure layer, a plurality of packing grooves which are distributed at intervals are formed in one side of the base plate body, and the packing grooves are used for being filled with slurry; and a demolding structure layer is attached to the surface of the inner wall of the filler groove, is used for being in contact with slurry and can generate vibration to remove the slurry. By the adoption of the transfer printing substrate, the filler groove can be filled with the slurry firstly, then the slurry is removed from the filler groove by controlling the demolding structure layer to generate vibration, transfer printing operation of the slurry is achieved, in this way, the service life of the transfer printing substrate can be guaranteed, and heat damage to the substrate body and the printing substrate in the slurry removing process can be avoided.

Description

Technical Field

[0001] The present application belongs to the technical field of slurry printing, and specifically relates to a transfer substrate and a slurry transfer system. Background Art

[0002] Laser transfer is considered to be the next generation technology of screen printing because of its higher printing accuracy and ability to print finer patterns. It can be widely used in the field of printed circuits to improve the miniaturization of electronic or optoelectronic devices and enhance the performance of devices.

[0003] The laser transfer template in the prior art usually has several grooves in the transfer template to fill the grooves with slurry, and then the transfer template is placed on the printing substrate, with one side of the transfer template with the grooves facing the printing substrate, and the laser is used to irradiate from the other side of the transfer template to make the slurry fall off onto the printing substrate.

[0004] However, the laser transfer template in the technology is greatly restricted by the template structure and materials. If a flexible template made of flexible materials such as the PET series is used, the roughness of the inner wall of the groove is low, which is convenient for demolding, but the service life of the flexible template is short and the cost of use is high. When rigid materials such as glass, metal, and organic glass are used to make transfer templates, materials transparent to the laser wavelength are required near the transfer groove, which limits the range of template material selection. Although the rigid material can extend the service life of the transfer template, the surface roughness of the inner wall of the groove is high and it is not convenient for demolding. When using it, the laser power needs to be increased, and the larger laser power will cause thermal damage to the template and the printed substrate. Utility Model Content

[0005] The present application aims to provide a transfer substrate and a slurry transfer system, which can solve the problem in the prior art that the laser transfer template is made of flexible materials and has a short service life, while the template material selection range is narrow when it is made of rigid materials, and thermal damage is caused to the template and the printed substrate during the slurry removal process.

[0006] In order to solve the above technical problems, this application is implemented as follows:

[0007] In the first aspect, an embodiment of the present application proposes a transfer substrate, comprising: a substrate body and a demolding structure layer; a plurality of spaced-apart filling grooves are provided on one side of the substrate body, and the filling grooves are used to fill slurry; the demolding structure layer is attached to the inner wall surface of the filling groove, and the demolding structure layer is used to contact the slurry, and the demolding structure layer can generate vibration to remove the slurry.

[0008] Optionally, the transfer substrate further includes a connecting piece, the demoulding structure layer is a deformable material layer, and the connecting piece is used to connect the deformable material layer to an energy source so as to drive the deformable material layer to deform and generate vibration through the energy source.

[0009] Optionally, the deformable material layer is a piezoelectric material layer, and the connecting member is a conductive member, and the conductive member is used to supply electricity to the piezoelectric material layer so as to cause the piezoelectric material layer to deform and generate vibration.

[0010] Optionally, the piezoelectric material layer has a thickness of 1 μm-1000 μm.

[0011] Optionally, the vibration frequency of the demolding structure layer is 20kHz-120kHz.

[0012] Optionally, the filler slot includes a slot opening and a slot bottom;

[0013] The direction from the slot opening to the slot bottom is a first direction. In a direction perpendicular to the first direction, the dimension of the filling slot on the side close to the slot opening is D1, and the dimension of the filling slot on the side close to the slot bottom is D2, satisfying: D1≥D2.

[0014] Optionally, the filling slot further includes a side wall provided between the slot opening and the slot bottom, and an angle A between the side wall and the slot bottom satisfies: A≥90°.

[0015] Optionally, along the first direction, the cross-sectional area of ​​the filling slot decreases.

[0016] Optionally, a transition portion is provided between the side wall and the groove bottom, and the transition portion is an arc structure.

[0017] Optionally, an embedding groove is provided on the inner wall of the filling groove, and the embedding groove extends from the inner wall surface of the filling groove toward the inner recess of the substrate body, and the demolding structure layer is filled into the embedding groove.

[0018] In the second aspect, an embodiment of the present application proposes a slurry transfer system, comprising: slurry, an energy source, and a transfer substrate as described in any one of the above items; the slurry is filled in the filling groove, and the energy source is connected to the demolding structure layer to drive the demolding structure layer to vibrate to remove the slurry.

[0019] Optionally, the bonding strength between the slurry and the demolding structure layer is 0.05Mpa-1Mpa. The material and use of the slurry are not limited, and it can be conductive slurry, insulating slurry, diffusion doping slurry, mask slurry, etching slurry and other slurries of different materials and uses.

[0020] In the embodiment of the present application, a plurality of spaced filling grooves are provided in the substrate body of the transfer substrate to accommodate the slurry in the filling grooves, and a demolding structure layer is attached to the inner wall surface of the filling grooves, and the demolding structure layer contacts the slurry. With the transfer substrate of the present application, the slurry can be first filled into the filling grooves, and then the demolding structure layer is controlled to vibrate so as to remove the slurry from the filling grooves, thereby realizing the transfer operation of the slurry. This can not only ensure the service life of the transfer substrate, but also avoid thermal damage to the substrate body and the printed substrate during the slurry removal process, and reduce the limitation of the substrate body by the material.

[0021] Additional aspects and advantages of the present application will be given in part in the description below, and in part will become apparent from the description below, or will be learned through the practice of the present application. BRIEF DESCRIPTION OF THE DRAWINGS

[0022] The above and / or additional aspects and advantages of the present application will become apparent and easily understood from the description of the embodiments in conjunction with the following drawings, in which:

[0023] Figure 1 is a schematic diagram of a transfer substrate according to an embodiment of the present application;

[0024] Figure 2 According to the embodiment of the present application Figure 1 The enlarged view of the part A shown in the middle circle;

[0025] Figure 3 is a schematic diagram of a transfer substrate filling slurry according to an embodiment of the present application;

[0026] Figure 4 It is a schematic diagram of a laser transfer template in the prior art;

[0027] Figure 5 is a schematic diagram of another transfer substrate according to an embodiment of the present application;

[0028] Figure 6 is a schematic diagram of another transfer substrate according to an embodiment of the present application;

[0029] Figure 7 Schematic diagram of a slurry transfer system according to an embodiment of the present application.

[0030] Reference numerals:

[0031] 100: substrate body; 110: filling groove; 111: notch; 112: groove bottom; 113: side wall; 114: transition part; 115: embedding groove; 200: demolding structure layer; 300: connecting piece; 400: slurry; 500: energy source; X: first direction. DETAILED DESCRIPTION

[0032] The embodiments of the present application will be described in detail below, and examples of the embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals throughout represent the same or similar elements or elements having the same or similar functions. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain the present application, and should not be construed as limitations on the present application. Based on the embodiments in the present application, all other embodiments obtained by ordinary technicians in the field without making creative work are within the scope of protection of the present application.

[0033] The term "first" or "second" in the specification and claims of this application may include one or more of the features explicitly or implicitly. In the description of this application, unless otherwise specified, "plurality" means two or more. In addition, "and / or" in the specification and claims means at least one of the connected objects, and the character " / " generally means that the objects connected before and after are in an "or" relationship.

[0034] In the description of the present application, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise", "axial", "radial", "circumferential" and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present application and simplifying the description, and do not indicate or imply that the referred device or element must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as a limitation on the present application.

[0035] In the description of this application, it should be noted that, unless otherwise clearly specified and limited, the terms "installed", "connected", and "connected" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection, or it can be indirectly connected through an intermediate medium, or it can be the internal communication of two components. For ordinary technicians in this field, the specific meanings of the above terms in this application can be understood according to specific circumstances.

[0036] The transfer substrate and slurry transfer system provided in the embodiments of the present application are described in detail below through specific embodiments and their application scenarios in conjunction with the accompanying drawings.

[0037] like Figure 1 and Figure 3 As shown, Figure 1 A schematic diagram of a transfer substrate according to an embodiment of the present application is shown. Figure 3A schematic diagram of a transfer substrate filled with slurry according to an embodiment of the present application is shown. According to some embodiments of the transfer substrate of the present application, the transfer substrate includes: a substrate body 100 and a demolding structure layer 200; a plurality of spaced filling grooves 110 are provided on one side of the substrate body 100, and the filling grooves 110 are used to fill the slurry 400; the demolding structure layer 200 is attached to the inner wall surface of the filling groove 110, and the demolding structure layer 200 is used to contact the slurry 400, and the demolding structure layer 200 can generate vibration to remove the slurry 400.

[0038] In the embodiment of the present application, a plurality of spaced filling grooves 110 are provided in the substrate body 100 of the transfer substrate, so as to accommodate the slurry 400 by using the filling grooves 110, and a release structure layer 200 is attached to the inner wall surface of the filling groove 110, so as to contact the slurry 400 through the release structure layer 200. With the transfer substrate of the present application, the slurry 400 can be first filled into the filling groove 110, and then the slurry 400 can be removed from the filling groove 110 by controlling the vibration of the release structure layer 200, so as to realize the transfer operation of the slurry 110, which can not only ensure the service life of the transfer substrate, but also avoid thermal damage to the substrate body 100 and the printed substrate during the removal of the slurry 400, and reduce the limitation of the substrate body 100 by the material.

[0039] It can be understood that the transfer substrate in the embodiment of the present application can print the slurry onto the printing substrate by transfer, for example, it can be used in scenarios such as printing gate lines, insulating structures, doping patterns, mask patterns, etching patterns, etc. on the surface of the battery cell.

[0040] like Figure 4 As shown, Figure 4 A schematic diagram of a laser transfer template in the prior art is shown. In the traditional transfer printing process, laser transfer technology is mainly used, and a transfer template is made of a flexible material. A groove is set in the transfer template. When in use, the slurry is filled into the groove, and then the back of the transfer template is irradiated with a laser to vaporize the part of the slurry in contact with the transfer template, so that the slurry as a whole falls off from the groove to transfer the slurry to the target substrate. However, in order to reduce the surface roughness of the transfer template using traditional laser transfer technology, it is usually necessary to use a flexible polymer material, and this transfer template has a short service life and a high cost of use. If a rigid material such as glass, metal, or plexiglass is used to make the transfer template, the surface roughness of the transfer template is high, and the laser power needs to be increased for demolding, which is easy to cause thermal damage to the template and the printed substrate.

[0041] In the transfer substrate of the embodiment of the present application, a plurality of filling grooves 110 are provided in the substrate body 100, and a demolding structure layer 200 is attached to the inner wall surface of each filling groove 110. When in use, the slurry 400 is filled into the filling groove 110, and the slurry 400 is in contact with the demolding structure layer 200. The slurry 400 can be smoothly removed by the vibration of the demolding structure layer 200. In this way, the structural limitation of the substrate body 100 can be avoided, so that the substrate body 100 can be made of a rigid material to increase the service life of the transfer substrate. In addition, the transfer substrate in the present application utilizes the vibration of the demolding structure layer 200 to remove the slurry 400, which can avoid thermal damage to the substrate body 100 and the printed substrate.

[0042] Among them, the demolding structure layer 200 and the inner wall of the filling groove 110 can be fixedly connected by bonding, nesting, etc. The specific connection method between the demolding structure layer 200 and the inner wall of the filling groove 110 can be flexibly set according to actual needs, and this application does not limit this.

[0043] In some embodiments, the substrate body 100 can be made of rigid materials such as metal, inorganic glass, ceramic, polymer material, etc. For example, it can be made of metal materials such as stainless steel and aluminum alloy; or glass materials such as silicate glass, borate glass, quartz glass; or ceramic materials such as alumina ceramics and zirconia ceramics; or polymer materials such as organic glass, engineering resin, polyolefin materials, etc. This helps to extend the service life of the transfer substrate and reduce the cost of use.

[0044] It is understandable that compared with the traditional laser transfer template, the material near the transfer groove needs to be transparent to the laser wavelength, which is greatly restricted by the template material. However, with the transfer substrate of the present application, the substrate body 100 is not restricted by the material, and the material selection for preparing the substrate body 100 is more flexible.

[0045] In other embodiments, the cross-sectional shape of the filling slot 110 may be a regular shape such as a trapezoid, triangle, semicircle, semi-ellipse, rectangle, polygon, etc., or an irregular shape formed by a combination of one or more regular shapes. The specific structure of the filling slot 110 may be flexibly set according to actual needs, and the present application does not impose any restrictions thereon.

[0046] Alternatively, if Figure 1 As shown, the transfer substrate further includes a connector 300, the demoulding structure layer 200 is a deformable material layer, and the connector 300 is used to connect the deformable material layer to an energy source so as to drive the deformable material layer to deform and generate vibration through the energy source.

[0047] In the embodiment of the present application, the demolding structure layer 200 is set as a deformable material layer, and the deformable material layer is connected to the energy source by using the connecting member 300, so that the energy source provides energy to the deformable material layer, thereby driving the deformable material layer to undergo periodic deformation and generate vibration.

[0048] Exemplarily, the deformable material layer can be made of magnetostrictive material, and accordingly, the energy source can be a device that can generate a magnetic field; or the deformable material layer can be made of piezoelectric material, and accordingly, the energy source can be a power source; or the deformable material layer can be made of photodeformable material, and accordingly, the energy source can be a light-emitting device; or the deformable material layer can be made of ultrasonic vibration material, and accordingly, the energy source can be an ultrasonic generating device.

[0049] Of course, the deformable material layer can also be made of other types of materials that can produce periodic deformation, and the energy source is compatible with the deformable material layer. Those skilled in the art can design it according to actual needs, and the embodiments of the present application are not limited to this.

[0050] Alternatively, if Figure 1 As shown, the deformable material layer is a piezoelectric material layer, and the connecting member 300 is a conductive member, which is used to supply electricity to the piezoelectric material layer so as to deform the piezoelectric material layer to generate vibration.

[0051] In an embodiment of the present application, the deformable material layer is set as a piezoelectric material layer, and conductive parts are set at both ends of the piezoelectric material layer so that the piezoelectric material layer is energized by the conductive parts. The piezoelectric material layer will vibrate under the action of the piezoelectric effect, thereby achieving the removal of the slurry 400.

[0052] In some embodiments, the piezoelectric material layer can be made of piezoelectric materials such as piezoelectric inorganic materials, piezoelectric polymers, and piezoelectric composite materials. For example, it can be made of ceramic materials or single crystals such as lead magnesium niobate (PMN), lead magnesium niobate-lead titanate (PMN-PT), lead lanthanum zirconate titanate (PLZT), and barium zirconate titanate (Ba-PZT); or it can be made of piezoelectric polymers such as polyvinylidene fluoride (PVDF) and its copolymers, polyvinyl fluoride, polyvinyl chloride, poly-γ-methyl-L-glutamate and nylon-11; or it can be made of a piezoelectric composite material composed of a piezoelectric inorganic material and a piezoelectric polymer.

[0053] In a specific application, the deformable material layer is set as a piezoelectric material layer, and the connecting member 300 can be a conductive member such as a wire. A voltage can be applied to both ends of the piezoelectric material layer through the wire, and the piezoelectric material layer changes in size in the direction of the applied voltage. When the voltage is removed, the size of the piezoelectric material layer recovers. Therefore, when an AC voltage is applied, the size of the piezoelectric material layer in the direction of the applied voltage will undergo an alternating change of "deformation-recovery-deformation-recovery...", thereby causing the piezoelectric material layer to vibrate at a high frequency. The vibration of the piezoelectric material layer can be used to separate the slurry 400 from the piezoelectric material layer, and then fall off from the filling groove 110 to the printed substrate.

[0054] It should be noted that, by applying a voltage to both ends of the piezoelectric material layer to make the piezoelectric material layer vibrate, the vibration state of the piezoelectric material layer can be adjusted by controlling the frequency, waveform and other parameters of the applied AC voltage. For example, the piezoelectric material layer can be made to vibrate continuously or generate pulse vibration. The specific vibration state of the piezoelectric material layer can be flexibly set according to actual needs, and the embodiments of the present application do not limit this.

[0055] Alternatively, if Figure 1 As shown, the thickness H of the piezoelectric material layer is: 1 μm-1000 μm. In the embodiment of the present application, the thickness range of the piezoelectric material layer is set to ensure that the piezoelectric material layer can be deformed and vibrate after being energized, so as to achieve the removal of the slurry 400. At the same time, it also avoids the piezoelectric material layer being too thick and occupying more space in the filling slot 110.

[0056] Exemplarily, the thickness of the piezoelectric material layer can be set to any value such as 1 μm, 5 μm, 10 μm, 50 μm, 100 μm, 300 μm, 500 μm, 800 μm, 1000 μm, or a range between any two values.

[0057] The thickness H of the piezoelectric material layer refers to the distance between the side of the piezoelectric material layer facing the inner wall surface of the filling slot 110 and the side of the piezoelectric material layer facing away from the filling slot 110. It is understandable that the thickness of the piezoelectric material layer at different positions in the filling slot 110 can be set to be the same or different, and can be flexibly set according to actual needs, and the embodiment of the present application does not limit this.

[0058] Optionally, the vibration frequency of the demolding structure layer 200 is 20 kHz-120 kHz.

[0059] In the embodiment of the present application, the vibration frequency of the demolding structure layer 200 is set so that the slurry 400 can be removed from the filling tank 110 by the vibration of the demolding structure layer 200, while preventing the vibration frequency from being too high to affect the structure of the slurry 400.

[0060] Exemplarily, the vibration frequency of the release structure layer 200 can be set to any value such as 20 kHz, 30 kHz, 50 kHz, 80 kHz, 100 kHz, 110 kHz, 120 kHz, or a range between any two values.

[0061] Alternatively, if Figure 1 and Figure 5 As shown, the filling slot 110 includes a slot opening 111 and a slot bottom 112; the direction from the slot opening 111 to the slot bottom 112 is a first direction X, and perpendicular to the first direction X, the size of the filling slot 110 on the side close to the slot opening 111 is D1, and the size of the filling slot 110 on the side close to the slot bottom 112 is D2, satisfying: D1≥D2.

[0062] In the embodiment of the present application, the dimension D1 of the filling groove 110 on the side close to the groove opening 111 is set to be greater than or equal to the dimension D2 on the side close to the groove bottom 112 so that the slurry 400 can be more easily released from the groove opening 111 of the filling groove 110 .

[0063] The size of the filling slot 110 refers to the distance between two side walls 113 that are opposite to each other along a direction perpendicular to the first direction X among the side walls around the filling slot 110 .

[0064] Alternatively, if Figure 1 As shown, the filling slot 110 further includes a side wall 113 disposed between the slot opening 111 and the slot bottom 112 , and the included angle between the side wall 113 and the slot bottom 112 is A, satisfying: A ≥ 90°.

[0065] In the embodiment of the present application, the angle between the side wall 113 and the groove bottom 112 is set to be greater than or equal to 90° to avoid the slurry 400 from gathering at the junction between the side wall 113 and the groove bottom 112, thereby facilitating the removal of the slurry 400 from the filling groove 110.

[0066] It is understandable that if the angle between the side wall 113 and the bottom 112 is less than 90°, that is, there is an acute angle between the side wall 113 and the bottom 112, the angle between the side wall 113 and the bottom 112 will have a certain restrictive effect on the slurry 400 during the removal of the slurry 400, affecting the smooth removal of the slurry 400.

[0067] Exemplarily, the angle A between the side wall 113 and the groove bottom 112 can be set to any angle such as 90°, 100°, 120°, 130°, 135°, 150°, 175°, or a range between any two angles.

[0068] Alternatively, if Figure 1 As shown, along the first direction X, the cross-sectional area of ​​the filling groove 110 decreases gradually.

[0069] In the embodiment of the present application, the cross-sectional area of ​​the filling groove 110 is gradually reduced along the first direction X, that is, the internal dimensions of the filling groove 110 change evenly, which is more conducive to the slurry 400 escaping from the filling groove 110 .

[0070] Exemplarily, the filling groove 110 can be set as a common trapezoidal groove, a right-angled trapezoidal groove, an isosceles trapezoidal groove, a conical groove, etc. Of course, the filling groove 110 can also be set as a groove of other shape structures, which is not limited in the embodiment of the present application.

[0071] Alternatively, if Figure 1 and Figure 2 As shown, a transition portion 114 is provided between the side wall 113 and the groove bottom 112 , and the transition portion 114 is an arc structure.

[0072] In the embodiment of the present application, a transition portion 114 with an arc structure is provided between the side wall 113 and the groove bottom 112, which not only facilitates the processing and manufacturing of the filling groove 110, but also reduces the aggregation of the slurry 400 at the junction of the side wall 113 and the groove bottom 112, thereby facilitating the removal of the slurry 400 and the demolding structure layer 200.

[0073] Alternatively, if Figure 6 As shown, Figure 6 A schematic diagram of another transfer substrate of an embodiment of the present application is shown; an embedding groove 115 is provided on the inner wall of the filling groove 110, and the embedding groove 115 extends from the inner wall surface of the filling groove 110 toward the inside of the substrate body 100, and the demolding structure layer 200 is filled into the embedding groove 115.

[0074] In the embodiment of the present application, an embedding groove 115 is provided on the inner wall of the filling groove 110. The embedding groove 115 extends from the inner wall surface of the filling groove 110 toward the substrate body 100, so that the demolding structure layer 200 is at least partially embedded in the embedding groove 115, so as to increase the bonding force between the demolding structure layer 200 and the substrate body 100, thereby improving the overall service life of the transfer substrate.

[0075] It should be noted that embedding grooves 115 can be respectively provided on the side walls 113 and the bottom 112 of the filling groove 110 to increase the bonding force between the demolding structure layer 200 and the substrate body 100. The specific structure of the embedding groove 115 can be flexibly set according to actual needs, and the embodiment of the present application does not limit this.

[0076] Alternatively, if Figure 7 As shown, Figure 7The schematic diagram of the slurry transfer system of the embodiment of the present application is shown. The embodiment of the present application also provides a slurry transfer system, including: slurry 400, energy source 500, and the transfer substrate of the above embodiment; the slurry 400 is filled in the filling groove 110, and the energy source 500 is connected to the demolding structure layer 200 to drive the demolding structure layer 200 to vibrate to remove the slurry 400.

[0077] In the embodiment of the present application, a plurality of spaced filling grooves 110 are provided in the substrate body 100 of the transfer substrate, so as to accommodate the slurry 400 by using the filling grooves 110, and a demolding structure layer 200 is attached to the inner wall surface of the filling grooves 110, so as to contact the slurry 400 through the demolding structure layer 200. During the transfer process, the slurry 400 can be first filled into the filling grooves 110, and then the demolding structure layer 200 can be controlled to vibrate so as to remove the slurry 400 from the filling grooves 110, so as to realize the transfer of the slurry 400 to the printing substrate, which is simple and convenient to operate, and can avoid being restricted by the substrate body 100. At the same time, the demolding is realized by the effect of vibration, and damage to the substrate body 100 and the printing substrate can also be avoided.

[0078] Specifically, the energy source 500 is connected to the demolding structure layer 200 so as to provide energy to the demolding structure layer 200 , thereby driving the demolding structure layer 200 to vibrate, and the slurry 400 falls off from the filling groove 110 under the action of the vibration.

[0079] Among them, the energy source 500 may include a device that can provide energy such as light, electricity, sound, magnetism, and electromagnetic waves. The type of the energy source 500 matches the structure and material of the demolding structure layer 200 and can be flexibly selected according to actual design needs.

[0080] Optionally, the bonding strength between the slurry 400 and the release structure layer 200 is 0.05 MPa-1 MPa.

[0081] In the embodiment of the present application, a range of bonding strength between the slurry 400 and the demolding structure layer 200 is set so that the slurry 400 can be more easily removed from the filling groove 110. At the same time, the transfer substrate of the present application utilizes the vibration effect of the demolding structure layer 200 to achieve the removal of the slurry 400, which is less restricted by the bonding strength between the slurry 400 and the demolding structure layer 200, and can be used for transfer printing of different types of slurries 400, with wider adaptability.

[0082] Exemplarily, the bonding strength between the slurry 400 and the release structure layer 200 can be set to any value such as 0.05 MPa, 0.06 MPa, 0.07 MPa, 0.08 MPa, 0.09 MPa, 1 MPa, or a range between any two values.

[0083] It can be understood that the use of the transfer substrate of the embodiment of the present application can reduce the limitations on the material and use of the slurry. In actual applications, the slurry can be a conductive slurry, an insulating slurry, a diffusion doping slurry, a mask slurry, an etching slurry and other slurries of different materials and uses. The specific slurry can be flexibly selected according to the actual application scenario, and there is no limitation on this.

[0084] In some embodiments, the slurry transfer system of the present application can be applied not only to transfer printing of slurry 400 with lower viscosity, for example, the viscosity of slurry 400 is less than 5Pa·s, but also to transfer printing of slurry 400 with higher viscosity, for example, the viscosity of slurry 400 can be set to be greater than or equal to 5Pa·s. In addition, compared with traditional laser transfer, slurry 400 with low boiling point can be selected in the present application, for example, the boiling point of slurry 400 is less than or equal to 85°C; the organic carrier content of slurry 400 is less than or equal to 20wt%.

[0085] It is understandable that in the conventional laser transfer process, laser is mainly used to irradiate the substrate so that the slurry 400 falls off from the filling groove 110. In order to ensure that the slurry 400 can fall off smoothly from the filling groove 110, it is usually necessary to have certain requirements on the viscosity of the slurry 400. The viscosity of the slurry 400 cannot be too high, generally between 1-5 Pa·s. After the slurry 400 is filled into the filling groove 110, the bonding strength between the slurry 400 and the substrate cannot be too large, so that the slurry 400 can be smoothly removed from the filling groove 110 by laser irradiation.

[0086] The transfer substrate in the embodiment of the present application mainly utilizes the vibration of the demolding structure layer 200 attached to the inner wall surface of the filling groove 110 to achieve the removal of the slurry 400. It is less restricted by the viscosity of the slurry 400 and can be used not only for the transfer of slurries 400 with lower viscosity, but also for the transfer of slurries 400 with higher viscosity, and has stronger adaptability.

[0087] In the description of this specification, the description with reference to the terms "one embodiment", "some embodiments", "illustrative embodiments", "examples", "specific examples", or "some examples" means that the specific features, structures, materials, or characteristics described in conjunction with the embodiment or example are included in at least one embodiment or example of the present application. In this specification, the schematic representation of the above terms does not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials, or characteristics described may be combined in any one or more embodiments or examples in a suitable manner.

[0088] Although the embodiments of the present application have been shown and described, those skilled in the art will appreciate that various changes, modifications, substitutions and variations may be made to the embodiments without departing from the principles and spirit of the present application, and that the scope of the present application is defined by the claims and their equivalents.

Claims

1. A transfer substrate, characterized in that: include: Substrate body and demoulding structure layer; One side of the substrate body is provided with a plurality of filling grooves arranged at intervals, the filling grooves are used to fill the slurry; the inner wall surface of the filling groove is attached with the demolding structure layer, the demolding structure layer is used to contact with the slurry, and the demolding structure layer can generate vibration to remove the slurry.

2. The transfer substrate according to claim 1, characterized in that The transfer substrate further includes a connecting piece, the demoulding structure layer is a deformable material layer, and the connecting piece is used to connect the deformable material layer to an energy source so as to drive the deformable material layer to deform and generate vibration through the energy source.

3. The transfer substrate according to claim 2, characterized in that The deformable material layer is a piezoelectric material layer, and the connecting member is a conductive member. The conductive member is used to supply electricity to the piezoelectric material layer so as to cause the piezoelectric material layer to deform and generate vibration.

4. The transfer substrate according to claim 3, characterized in that: The thickness of the piezoelectric material layer is 1 μm-1000 μm.

5. The transfer substrate according to claim 1, characterized in that The vibration frequency of the demoulding structure layer is: 20kHz-120kHz.

6. The transfer substrate according to claim 1, characterized in that The filler groove comprises a groove opening and a groove bottom; The direction from the slot opening to the slot bottom is a first direction. In a direction perpendicular to the first direction, the dimension of the filling slot on the side close to the slot opening is D1, and the dimension of the filling slot on the side close to the slot bottom is D2, satisfying: D1≥D2.

7. The transfer substrate according to claim 6, characterized in that The filling slot also includes a side wall arranged between the slot opening and the slot bottom, and the angle between the side wall and the slot bottom is A, satisfying: A≥90°.

8. The transfer substrate according to claim 7, characterized in that: Along the first direction, the cross-sectional area of ​​the filling slot decreases.

9. The transfer substrate according to claim 7, characterized in that: A transition portion is provided between the side wall and the groove bottom, and the transition portion is in an arc structure.

10. The transfer substrate according to any one of claims 1 to 9, characterized in that: The inner wall of the filling groove is provided with an embedding groove, and the embedding groove extends from the inner wall surface of the filling groove toward the inner recess of the substrate body, and the demolding structure layer is filled into the embedding groove.

11. A slurry transfer system, characterized in that: include: Slurry, energy source, and the transfer substrate according to any one of claims 1 to 10; The slurry is filled in the filling groove, and the energy source is connected to the demolding structure layer to drive the demolding structure layer to vibrate so as to remove the slurry.

12. The slurry transfer system according to claim 11, characterized in that: The bonding strength between the slurry and the demoulding structure layer is 0.05Mpa-1Mpa.

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