Multilayer PCB

Abstract

The utility model relates to a multilayer PCB board, including: pad layer, signal layer, base layer and first insulation heat dissipation member, signal layer and pad layer are connected, make first placing through hole and second placing through hole communicate to form blind hole, set up the first insulation heat dissipation member in the blind hole, the first insulation heat dissipation member with signal layer movable butt joint. Each component can be arranged on the bonding pad layer and electrically connected with the signal layer, when each component starts to work, heat generated when each component works is accumulated on the signal layer, and the first insulating heat dissipation piece can absorb the heat on the signal layer and discharge the heat through the blind holes, so that accumulation of the heat on the signal layer is reduced, and the reliability of the circuit board is improved. And the failure of each component caused by high temperature is avoided, so that the working stability of the circuit is improved, and the service life of the multi-layer PCB is prolonged.

Description

Technical Field

[0001] The utility model relates to the technical field of printed circuit board manufacturing, in particular to a multi-layer PCB board. Background Art

[0002] Multilayer PCB is a key component in electronic devices. It enables electronic devices to work properly by mechanically supporting and electrically connecting electronic components.

[0003] In modern electronic devices, the integration and operating frequency of components are getting higher and higher, resulting in a large amount of heat generated by multi-layer PCB boards during operation. The existing heat dissipation structure of multi-layer PCB boards cannot dissipate this heat in a timely and effective manner. High temperature causes component failure, affects the working stability of the circuit, and reduces the service life of the PCB board. Utility Model Content

[0004] Based on this, it is necessary to provide a multi-layer PCB board.

[0005] The technical solution of the utility model to solve the above technical problems is as follows:

[0006] A multi-layer PCB board, comprising:

[0007] A pad layer, wherein a first placement through hole is formed on the pad layer;

[0008] A signal layer, wherein a first surface of the signal layer is connected to the pad layer, a second placement through hole is provided on the signal layer, and the second placement through hole is connected to the first placement through hole to form a blind hole;

[0009] A base layer connected to the second surface of the signal layer;

[0010] A first insulating heat sink is disposed in the blind hole and connected to a side wall of the blind hole.

[0011] In one embodiment, an insulating heat dissipation layer is disposed on the base layer, the insulating heat dissipation layer is connected to the second surface of the signal layer, and a plurality of first heat dissipation holes are opened on the base layer.

[0012] In one embodiment, the first heat dissipation holes are arranged on the base layer at equal intervals.

[0013] In one embodiment, the multi-layer PCB board also includes: a second insulating heat sink, a third placement through hole is opened on the pad layer, a fourth placement through hole is opened on the signal layer, a fifth placement through hole is opened on the insulating heat dissipation layer, and a sixth placement through hole is opened on the base layer. The third placement through hole, the fourth placement through hole, the fifth placement through hole and the sixth placement through hole are connected in sequence to form a through hole, the second insulating heat sink is arranged in the through hole and connected to the side wall of the through hole, and the second insulating heat sink is movably abutted against the insulating heat dissipation layer and the signal layer.

[0014] In one embodiment, a heat dissipation cavity is provided on the signal layer, and the heat dissipation cavity is provided through two ends of the signal layer.

[0015] In one embodiment, a second heat dissipation hole is formed on the first insulating heat dissipation member, and the second heat dissipation hole is communicated with the heat dissipation cavity.

[0016] In one embodiment, a third heat dissipation hole is formed on the second insulating heat dissipation member, and the third heat dissipation hole is communicated with the heat dissipation cavity.

[0017] In one embodiment, the insulating heat dissipation layer is in a fin shape.

[0018] The beneficial effects of the utility model are as follows: a multi-layer PCB board provided by the utility model connects the signal layer with the pad layer, so that the first placement through hole and the second placement through hole are connected to form a blind hole, and a first insulating heat sink is arranged in the blind hole, and the first insulating heat sink is movably abutted against the signal layer. Through the above arrangement, each component can be placed on the pad layer, and each component can be electrically connected to the signal layer. When each component starts to work, the heat generated by each component during operation is accumulated on the signal layer. The first insulating heat sink can absorb the heat on the signal layer and discharge it through the blind hole, thereby reducing the accumulation of heat on the signal layer and avoiding the failure of each component due to high temperature, thereby improving the stability of the circuit during operation and extending the service life of the multi-layer PCB board. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] In order to more clearly illustrate the technical solutions of the embodiments of the present application, the drawings required for use in the embodiments will be briefly introduced below. It should be understood that the following drawings only show certain embodiments of the present application and therefore should not be regarded as limiting the scope. For ordinary technicians in this field, other related drawings can be obtained based on these drawings without paying creative work.

[0020] Figure 1 A schematic cross-sectional structure diagram of a multi-layer PCB board according to an embodiment;

[0021] Figure 2A schematic cross-sectional structure diagram of a multi-layer PCB board according to an embodiment;

[0022] Figure 3 for Figure 2 Schematic diagram of the enlarged structure at A in FIG.

[0023] In the accompanying drawings, 10, multi-layer PCB board; 100, pad layer; 101, through hole; 102, blind hole; 103, first placement through hole; 104, third placement through hole; 200, signal layer; 201, heat dissipation cavity; 202, second placement through hole; 203, fourth placement through hole; 300, insulating heat dissipation layer; 301, fifth placement through hole; 400, base layer; 401, first heat dissipation hole; 402, sixth placement through hole; 500, first insulating heat dissipation component; 501, second heat dissipation hole; 510, second insulating heat dissipation component; 511, third heat dissipation hole; 600, power supply layer; 601, seventh placement through hole; 700, first insulating thermal conductive layer; 701, eighth placement through hole; 710, second insulating thermal conductive layer; 711, ninth placement through hole; 800, ground layer; 801, tenth placement through hole; 900, conductive component; 901, fourth heat dissipation hole. DETAILED DESCRIPTION

[0024] It should be noted that, in the absence of conflict, the embodiments and features in the embodiments of the present invention can be combined with each other. The technical solution of the present invention will be further described below in conjunction with the drawings of the embodiments of the present invention, and the present invention is not limited to the following specific implementation methods.

[0025] It should be understood that the same or similar numbers in the drawings of the embodiments correspond to the same or similar parts. In the description of the present utility model, it should be understood that if there are terms such as "upper", "lower", "front", "back", "left", "right", "top", "bottom" and the like indicating the orientation or positional relationship, they are based on the orientation or positional relationship shown in the drawings, which is only for the convenience of describing the present utility model and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation. Therefore, the terms describing the positional relationship in the drawings are only used for illustrative purposes and cannot be understood as a limitation on this patent. For ordinary technicians in this field, the specific meanings of the above terms can be understood according to specific circumstances.

[0026] In one embodiment, Figure 1As shown, a multi-layer PCB board 10 includes: a pad layer 100, a signal layer 200, a base layer 400 and a first insulating heat dissipation member 500, the pad layer 100 is provided with a first placement through hole 103, the first surface of the signal layer 200 is connected to the pad layer 100, the signal layer 200 is provided with a second placement through hole 202, the second placement through hole 202 is interconnected with the first placement through hole 101 to form a blind hole 102; the base layer 400 is connected to the second surface of the signal layer 200, the first insulating heat dissipation member 500 is arranged in the blind hole 102, and is connected to the side wall of the blind hole 102.

[0027] In this embodiment, the signal layer 200 is connected to the pad layer 100, so that the first placement through hole 103 and the second placement through hole 202 are connected to form a blind hole 102, and a first insulating heat sink 500 is arranged in the blind hole 102. The shape of the first insulating heat sink 500 is a hollow cylinder. The material of the first insulating heat sink 500 is alumina, which has extremely high electrical insulation and thermal conductivity. The outer surface of the first insulating heat sink 500 is connected to the signal layer 200, and a plurality of mounting holes are opened on the pad layer 100. Through the above arrangement, each The components are electrically connected to the signal layer 200 through each mounting hole, and each component can be placed on the pad layer 100. When each component starts to work, the heat generated by each component during operation accumulates on the signal layer 200. The first insulating heat sink 500 can absorb the heat on the signal layer 200 and discharge the heat out of the multi-layer PCB board 10 through the blind hole 102, thereby reducing the accumulation of heat on the signal layer 200 and avoiding the failure of each component due to high temperature, thereby improving the stability of the circuit during operation and extending the service life of the multi-layer PCB board 10.

[0028] In order to improve the heat dissipation effect of the multi-layer PCB board 10. In one embodiment, Figure 1 As shown, an insulating heat dissipation layer 300 is provided on the base layer 400, and the insulating heat dissipation layer 300 is connected to the second surface of the signal layer 200, and a plurality of first heat dissipation holes 401 are provided on the base layer 400. In this embodiment, the insulating heat dissipation layer 300 is made of alumina, which has extremely high electrical insulation performance and can effectively isolate the circuit to avoid short circuit. In addition, alumina has good thermal conductivity, so that the heat on the signal layer 200 can be conducted to the insulating heat dissipation layer 300, and the heat on the insulating heat dissipation layer 300 flows out of the multi-layer PCB board 10 through each first heat dissipation hole 401, reducing the accumulation of heat on the signal layer 200, thereby improving the heat dissipation effect of the multi-layer PCB board 10.

[0029] In order to improve the uniformity of heat dissipation of the multi-layer PCB. In one embodiment, Figure 1As shown, each of the first heat dissipation holes 401 is equidistantly arranged on the base layer 400. In this embodiment, by equidistantly arranged on the base layer 400, the heat on the insulating heat dissipation layer 300 can flow out from the first heat dissipation holes 401 evenly, thereby improving the uniformity of heat dissipation of the multi-layer PCB.

[0030] In order to further improve the heat dissipation effect of the multi-layer PCB board 10. In one embodiment, Figure 1 As shown, a third placement through hole 104 is opened on the pad layer 100, a fourth placement through hole 203 is opened on the signal layer 200, a fifth placement through hole 301 is opened on the insulating heat dissipation layer 300, and a sixth placement through hole 402 is opened on the base layer 400. The third placement through hole 104, the fourth placement through hole 203, the fifth placement through hole 301 and the sixth placement through hole 402 are connected in sequence to form a through hole 101; the second insulating heat dissipation component 510 is arranged in the through hole 101 and connected to the side wall of the through hole 101, and the second insulating heat dissipation component 510 is movably abutted against the insulating heat dissipation layer 300 and the signal layer 200. In this embodiment, the second insulating heat sink 510 is shaped like a hollow cylinder. The material of the second insulating heat sink 510 is alumina. Alumina has extremely high electrical insulation and thermal conductivity. When the second insulating heat sink 510 is sleeved in the through hole 101, the outer surface of the second insulating heat sink 510 abuts against the insulating heat sink layer 300 and the signal layer 200. When each component starts to work, the heat on the insulating heat sink layer 300 and the signal layer 200 is conducted to the second insulating heat sink 510, and the heat on the second insulating heat sink 510 is discharged from the multi-layer PCB board 10 through the through hole 101. Through the above arrangement, the accumulation of heat on the insulating heat sink layer 300 and the signal layer 200 can be reduced, further improving the heat dissipation effect of the multi-layer PCB board 10.

[0031] In order to reduce the heat accumulation on the signal layer 200, in one embodiment, as Figure 1 and Figure 2 As shown, a heat dissipation cavity 201 is provided on the signal layer 200, and the heat dissipation cavity 201 is arranged through both ends of the signal layer 200. In this embodiment, the heat dissipation cavity 201 can reduce the thermal resistance on the signal layer 200, so that the heat can be better conducted to the insulating heat dissipation layer 300.

[0032] In order to improve the heat dissipation effect of the first insulating heat dissipation member 500. In one embodiment, Figure 1 and Figure 2As shown, a second heat dissipation hole 501 is provided on the first insulating heat sink 500, and the second heat dissipation hole 501 is connected to the heat dissipation cavity 201. In this embodiment, when the first insulating heat sink 500 is sleeved in the blind hole 102, the second heat dissipation hole 501 is aligned with and connected to the heat dissipation cavity 201, and the heat in the heat dissipation cavity 201 can flow out of the first insulating heat sink 500 along the second through hole 101, further reducing the accumulation of heat on the signal layer 200.

[0033] In order to further improve the heat dissipation effect of the second insulating heat dissipation member 510. In one embodiment, Figure 1 and Figure 2 As shown, a third heat dissipation hole 511 is provided on the second insulating heat sink 510, and the third heat dissipation hole 511 is connected to the heat dissipation cavity 201. In this embodiment, when the second insulating heat sink 510 is sleeved in the through hole 101, the third heat dissipation hole 511 is aligned with and connected to the heat dissipation cavity 201, and the heat in the heat dissipation cavity 201 flows out of the second insulating heat sink 510 along the third through hole 101, further reducing the accumulation of heat on the signal layer 200.

[0034] In order to improve the heat dissipation effect of the insulating heat dissipation layer 300 , in one embodiment, the insulating heat dissipation layer 300 is fin-shaped. In this embodiment, the fin-shaped insulating heat dissipation layer 300 can increase the fluidity of heat, so that the heat can flow out from each first heat dissipation hole 401 better.

[0035] In order to enhance the reliability of the multilayer PCB 10 when in use. In one embodiment, Figure 2 and Figure 3As shown, the multilayer PCB board 10 further includes: a power layer 600, a first insulating heat-conducting layer 700, a second insulating heat-conducting layer 710 and a grounding layer 800, wherein the first surface of the first insulating heat-conducting layer 700 is connected to the second surface of the signal layer 200, the second surface of the first insulating heat-conducting layer 700 is connected to the first surface of the power layer 600, the second surface of the power layer 600 is connected to the first surface of the second insulating heat-conducting layer 710, the second surface of the second insulating heat-conducting layer 710 is connected to the first surface of the grounding layer 800, and the second surface of the grounding layer 800 is connected to the first surface of the insulating heat-dissipating layer 300. In this embodiment, the first insulating heat-conducting layer 700 and the second insulating heat-conducting layer 710 are both made of aluminum oxide, which has extremely high electrical insulation and thermal conductivity. The first insulating heat-conducting layer 700 and the second insulating heat-conducting layer 710 can separate the power layer 600 and the grounding layer 800, thereby preventing the power layer 600 and the grounding layer 800 from being directly connected and causing a short circuit in the multilayer PCB board 10. A first connecting portion is provided on one side of the first insulating heat-conducting layer 700, and a second connecting portion is provided on one side of the second insulating heat-conducting layer 710. The first connecting portion is connected to the second connecting portion, so that the first insulating heat-conducting layer 700 and the second insulating heat-conducting layer 710 can be conductive, so that the heat on the first insulating heat-conducting layer 700 and the second insulating heat-conducting layer 710 can be conducted to the insulating heat dissipation layer 300, so as to better dissipate the heat of the multi-layer PCB board 10.

[0036] In order to achieve mutual conduction among the signal layer 200, the power layer 600 and the ground layer 800, in one embodiment, as Figure 2 and Figure 3As shown, the multilayer PCB board 10 also includes: a conductive member 900, a seventh placement through hole 601 is opened on the power layer 600, an eighth placement through hole 701 is opened on the first insulating heat-conducting layer 700, a ninth placement through hole 711 is opened on the second insulating heat-conducting layer 710, a tenth placement through hole 801 is opened on the grounding layer 800, the third placement through hole 104, the fourth placement through hole 203, the fifth placement through hole 301, the sixth placement through hole 402, the seventh placement through hole 601, the eighth placement through hole 701, the ninth placement through hole 711 and the The tenth placement through hole 801 is connected in sequence to form a through hole 101, the conductive member 900 is arranged in the through hole 101 and connected to the side wall of the through hole 101, the conductive member 900 is movably abutted with the power layer 600, the signal layer 200, the ground layer 800, the first insulating heat-conducting layer 700, the second insulating heat-conducting layer 710 and the insulating heat-dissipating layer 300, the second insulating heat-dissipating member 510 is arranged in the conductive member 900, and the conductive member 900 is provided with a fourth heat-dissipating hole 901, and the fourth heat-dissipating hole 901 is movably aligned with the third heat-dissipating hole 511. In this embodiment, the conductive member 900 is made of copper, which has excellent electrical conductivity and thermal conductivity. The conductive member 900 is in the shape of a hollow cylinder, and the outer surface of the conductive member 900 is abutted with the side wall of the through hole 101, so that the power layer 600, the signal layer 200 and the ground layer 800 can be connected in sequence. When the first insulating heat sink 500 is disposed in the conductive member 900, the outer surface of the first insulating heat sink 500 abuts against the inner surface of the conductive member 900, the third heat dissipation hole 511 can be aligned with and connected to the fourth heat dissipation hole 901, the heat on the signal layer 200 can pass through the fourth through hole 101 and flow out from the third heat dissipation hole 511, and the heat on the signal layer 200, the first insulating thermal conductive layer 700, the second insulating thermal conductive layer 710, and the insulating heat dissipation layer 300 can be transferred to the conductive member 900, and the second insulating heat sink 510 discharges the heat on the conductive member 900 out of the multi-layer PCB board 10 through the through hole 101, thereby reducing the accumulation of heat in the multi-layer PCB board 10.

[0037] Compared with the prior art, the utility model has at least the following advantages:

[0038] The utility model provides a multi-layer PCB board, which connects a signal layer with a pad layer so that a first placement through hole and a second placement through hole are connected to form a blind hole, and a first insulating heat sink is arranged in the blind hole, and the first insulating heat sink is movably abutted against the signal layer. Through the above arrangement, each component can be placed on the pad layer, and each component is electrically connected to the signal layer. When each component starts to work, the heat generated by each component during operation is accumulated on the signal layer, and the first insulating heat sink can absorb the heat on the signal layer and discharge the heat through the blind hole, thereby reducing the accumulation of heat on the signal layer, avoiding failure of each component due to high temperature, thereby improving the stability of the circuit during operation, and extending the service life of the multi-layer PCB board.

[0039] Obviously, the above embodiments of the utility model are only examples for clearly explaining the utility model, and are not intended to limit the implementation methods of the utility model. For ordinary technicians in the relevant field, other different forms of changes or modifications can be made on the basis of the above description. It is not necessary and impossible to list all the implementation methods here. Any modifications, equivalent substitutions and improvements made within the spirit and principles of the utility model should be included in the protection scope of the claims of the utility model.

Claims

1. A multi-layer PCB board, characterized in that: include: A pad layer, wherein a first placement through hole is formed on the pad layer; A signal layer, wherein a first surface of the signal layer is connected to the pad layer, a second placement through hole is provided on the signal layer, and the second placement through hole is connected to the first placement through hole to form a blind hole; A base layer connected to the second surface of the signal layer; A first insulating heat sink is disposed in the blind hole and connected to a side wall of the blind hole.

2. The multilayer PCB board according to claim 1, characterized in that: An insulating heat dissipation layer is arranged on the base layer, the insulating heat dissipation layer is connected to the second surface of the signal layer, and a plurality of first heat dissipation holes are opened on the base layer.

3. The multilayer PCB board according to claim 2, characterized in that: The first heat dissipation holes are arranged on the base layer at equal intervals.

4. The multilayer PCB board according to claim 3, characterized in that: Also includes: A second insulating heat sink, a third placement through hole is opened on the pad layer, a fourth placement through hole is opened on the signal layer, a fifth placement through hole is opened on the insulating heat dissipation layer, and a sixth placement through hole is opened on the base layer. The third placement through hole, the fourth placement through hole, the fifth placement through hole and the sixth placement through hole are connected in sequence to form a through hole. The second insulating heat sink is arranged in the through hole and connected to the side wall of the through hole. The second insulating heat sink is movably abutted against the insulating heat dissipation layer and the signal layer.

5. The multilayer PCB board according to claim 4, characterized in that: A heat dissipation cavity is provided on the signal layer, and the heat dissipation cavity is arranged through two ends of the signal layer.

6. The multilayer PCB board according to claim 5, characterized in that: The first insulating heat sink is provided with a second heat dissipation hole, and the second heat dissipation hole is communicated with the heat dissipation cavity.

7. The multilayer PCB board according to claim 6, characterized in that: The second insulating heat sink is provided with a third heat dissipation hole, and the third heat dissipation hole is communicated with the heat dissipation cavity.

8. The multilayer PCB board according to claim 2, characterized in that: The insulating heat dissipation layer is in the shape of a fin.

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