Machine room chip liquid cooling radiator

Abstract

The utility model discloses a machine room chip liquid cooling radiator, and relates to the field of heat radiation structures. The heat dissipation device comprises a heat dissipation device and a heat dissipation switchboard, the heat dissipation device comprises a contact point, a liquid cooling layer and a liquid circulation box, the liquid cooling layer is arranged outside the contact point and penetrates through the contact point, the liquid circulation box is arranged on one side of the liquid cooling layer, and the heat dissipation switchboard comprises a circulation box and a heat dissipation table. According to the utility model, liquid cooling heat dissipation of the radiator is realized by using the liquid cooling layer; liquid circulation is achieved through a liquid circulation box, the liquid circulation speed and path can be adjusted according to needs, and therefore the operation state of the heat dissipation system is flexibly controlled, and the adaptability and adjustability of the system are improved; and the arranged heat dissipation switchboard can be connected with a plurality of liquid circulation boxes to replace liquid in the liquid circulation boxes, so that the modular design of the system can be realized, and the maintainability and the expandability of the system are improved.

Description

Technical Field

[0001] The utility model belongs to the field of heat dissipation structures, and in particular relates to a liquid cooling radiator for chips in a computer room. Background Art

[0002] The prior art computer room chip liquid cooling radiator is a heat dissipation system used to reduce the temperature of computer equipment. It absorbs heat through liquid circulation and takes it away to keep the operating temperature of the equipment within a safe range.

[0003] The Chinese patent with application number CN202322471924.7 discloses a chip liquid cooling radiator, which relates to the field of radiator technology. It includes: a water pump, a cold head, a cold row, a water pipe and a semiconductor refrigeration film module, and the semiconductor refrigeration film module is provided with a water inlet and a water outlet; the water pipe connects the water pump, the cold head, the cold row and the semiconductor refrigeration film module in series to form a heat dissipation circuit. The semiconductor refrigeration film module includes: a heat absorption module, a semiconductor refrigeration film, a heat dissipation module and a control module, the water inlet and the water outlet are arranged on the heat absorption module, and the control module is electrically connected to the semiconductor refrigeration film to control the working state of the semiconductor refrigeration film; when the semiconductor refrigeration film is working, the two ends are respectively a cold end and a hot end, the cold end is in contact with the heat absorption module, and the hot end is in contact with the heat dissipation module to further cool the coolant flowing through the heat absorption module. The above technical solution can improve the heat dissipation power of the radiator.

[0004] However, the above device has achieved a good cooling effect in actual use, but the density of electrical appliances in the computer room is relatively high, and the computer room itself has a large amount of heat. The cooling effect of the coolant therein decreases after long-term use, so a structure in which the coolant can be replaced for cooling is required.

[0005] In view of this, the present utility model is proposed. Utility Model Content

[0006] The technical problem to be solved by the utility model is to overcome the deficiencies of the prior art and provide a liquid cooling radiator for chips in a computer room.

[0007] In order to solve the above technical problems, the basic concept of the technical solution adopted by the utility model is:

[0008] A liquid-cooled radiator for chip in a computer room, comprising a radiator and a heat dissipation switchboard, wherein the radiator comprises a contact point, a liquid cooling layer and a liquid circulation box, wherein the liquid cooling layer is arranged outside the contact point and passes through the contact point, wherein the liquid circulation box is arranged on one side of the liquid cooling layer, wherein the heat dissipation switchboard comprises a circulation box and a heat dissipation platform, wherein the circulation box is connected to the liquid circulation box, and wherein the heat dissipation platform is arranged outside the circulation box.

[0009] Optionally, a fixing seat 1 is provided outside the contact point to transfer the heat of the chip to the liquid cooling layer through the contact point.

[0010] Optionally, a rotating fan is provided outside the liquid cooling layer, and the rotating fan includes a motor. Rotating fan blades are provided outside the motor. The rotating fan blades are used to blow toward the liquid cooling layer and the contact points for auxiliary cooling, thereby achieving a cooling effect.

[0011] Optionally, a circulation interface is provided on the outside of the liquid circulation box, and a connecting pipe 1 is connected between the circulation interface and the liquid cooling layer, and the connecting pipe 1 includes at least two pipes. When in use, the fluid circulates between the liquid circulation box and the liquid cooling layer, and the circulating fluid achieves a cooling effect.

[0012] Optionally, an auxiliary plate is provided inside the liquid circulation box, a rotating ring is provided between the auxiliary plate and the bottom wall of the liquid circulation box, and the inner wall of the rotating ring is in a threaded shape. An internal motor is provided inside the liquid circulation box, and the output shaft of the internal motor is engaged with the outside of the rotating ring. When in use, the liquid does not affect the internal motor, and the internal motor is used to control the rotation of the rotating ring, and the rotation of the thread inside the rotating ring provides power for the liquid circulation of the liquid circulation box and the liquid cooling layer.

[0013] Optionally, an external motor is provided on the outside of the circulation box, and a second connecting pipe is provided between the circulation box and the liquid circulation box. A third connecting pipe is provided between the circulation box and the heat sink, and there are no less than two pipes in the second connecting pipe and the third connecting pipe, and the circulation box is used as a power to replace the liquid in the liquid circulation box, thereby achieving the effect of replacing the liquid in the liquid circulation box.

[0014] Optionally, a second fixing seat is provided outside the heat dissipation platform to reduce the temperature of the liquid circulation box.

[0015] After adopting the above technical solution, the utility model has the following beneficial effects compared with the prior art. Of course, any product implementing the utility model does not necessarily need to achieve all the advantages described below at the same time:

[0016] The radiator is liquid-cooled by using a liquid cooling layer; Flexible liquid circulation system: Liquid circulation is achieved through a liquid circulation box, and the speed and path of the liquid circulation can be adjusted as needed, so as to flexibly control the operating state of the cooling system and improve the adaptability and adjustability of the system; The cooling switchboard can be connected to multiple liquid circulation boxes to replace the liquid inside, which can realize the modular design of the system and improve the maintainability and scalability of the system; The heat dissipation table is fixedly placed on the refrigeration structure to cool down the liquid inside the circulation box, which can effectively control the temperature of the liquid circulation and further improve the heat dissipation efficiency and the stability of the system.

[0017] The specific implementation of the utility model is further described in detail below in conjunction with the accompanying drawings. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] The drawings described below are only some embodiments. For those skilled in the art, other drawings can be obtained based on these drawings without creative work. In the drawings:

[0019] Figure 1 This is a schematic diagram of the chip liquid cooling radiator structure in the computer room;

[0020] Figure 2 This is a structural diagram of the chip liquid cooling radiator in the computer room from another perspective;

[0021] Figure 3 It is a structural schematic diagram of a liquid circulation box;

[0022] In the accompanying drawings, the components represented by the reference numerals are listed as follows:

[0023] 1. Radiator; 101. Contact point; 1011. Fixed seat 1; 102. Liquid cooling layer; 103. Rotating fan; 104. Connecting pipe 1; 105. Liquid circulation box; 1051. Auxiliary plate; 1052. Rotating ring; 1053. Internal motor; 106. Circulation interface; 2. Heat dissipation switchboard; 201. Circulation box; 202. External motor; 203. Connecting pipe 2; 204. Connecting pipe 3; 205. Heat dissipation platform; 2051. Fixed seat 2.

[0024] It should be noted that these drawings and textual descriptions are not intended to limit the conceptual scope of the present invention in any way, but rather to illustrate the concept of the present invention for those skilled in the art by referring to specific embodiments. DETAILED DESCRIPTION

[0025] The utility model will now be further described in detail with reference to the accompanying drawings.

[0026] See also Figure 1-3 As shown, in this embodiment, a liquid-cooled radiator for chip in a computer room is provided, including a radiator 1 and a heat dissipation switchboard 2, the radiator 1 includes a contact point 101, a liquid cooling layer 102 and a liquid circulation box 105, the liquid cooling layer 102 is arranged outside the contact point 101 and passes through the contact point 101, the liquid circulation box 105 is arranged on one side of the liquid cooling layer 102, the heat dissipation switchboard 2 includes a circulation box 201 and a heat dissipation platform 205, the circulation box 201 is connected to the liquid circulation box 105, and the heat dissipation platform 205 is arranged outside the circulation box 201.

[0027] The radiator 1 is liquid-cooled by utilizing the liquid cooling layer 102; a flexible liquid circulation system: the circulation of liquid is realized by the liquid circulation box 105, and the speed and path of the liquid circulation can be adjusted as needed, so as to flexibly control the operating state of the cooling system and improve the adaptability and adjustability of the system; the heat dissipation switchboard 2 set up can be connected to multiple liquid circulation boxes 105 to replace the liquid inside them, so as to realize the modular design of the system and improve the maintainability and scalability of the system; the heat dissipation platform 205 is fixedly placed at the refrigeration structure for cooling, and the liquid inside the circulation box 201 is cooled, so that the temperature of the liquid circulation can be effectively controlled, and the heat dissipation efficiency and the stability of the system are further improved.

[0028] like Figure 1-2 As shown, a fixing seat 1011 is provided outside the contact point 101 of this embodiment, and the fixing seat 1011 is used to set the contact point 101 outside the chip in the computer room, so that when the contact point 101 contacts the chip, the heat of the chip is transferred to the liquid cooling layer 102 through the contact point 101.

[0029] like Figure 1-2 As shown, a rotating fan 103 is arranged outside the liquid cooling layer 102 of this embodiment. The rotating fan 103 includes a motor. A rotating fan blade is arranged outside the motor. The rotating fan blade is used to blow toward the liquid cooling layer 102 and the contact point 101 for auxiliary cooling, thereby achieving a cooling effect.

[0030] like Figure 3 As shown, a circulation interface 106 is provided on the outside of the liquid circulation box 105 of the present embodiment, and a connecting pipe 104 is connected between the circulation interface 106 and the liquid cooling layer 102, and the connecting pipe 104 includes at least two pipes. When in use, the liquids inside the two pipes flow in opposite directions. In this way, when in use, the fluid circulates between the liquid circulation box 105 and the liquid cooling layer 102, and the circulating fluid achieves a cooling effect. It should be noted that the circulating liquid is better when it has a larger specific heat capacity.

[0031] like Figure 3 As shown, the liquid circulation box 105 of this embodiment is provided with an auxiliary plate 1051 inside, and a rotating ring 1052 is provided between the auxiliary plate 1051 and the bottom wall of the liquid circulation box 105, and the inner wall of the rotating ring 1052 is in a threaded shape, and an inner motor 1053 is provided inside the liquid circulation box 105, and the output shaft of the inner motor 1053 is engaged with the outside of the rotating ring 1052, wherein the motor is arranged at the bottom of the auxiliary plate 1051 sealed from the top, so that when in use, the liquid does not affect the inner motor 1053, and the rotation of the rotating ring 1052 is controlled by the inner motor 1053, so that the threaded rotation inside the rotating ring 1052 provides power for the liquid circulation of the liquid circulation box 105 and the liquid cooling layer 102.

[0032] like Figure 1-2 As shown, the circulation box 201 of this embodiment is provided with an external motor 202 on the outside, and a connecting pipe 203 is provided between the circulation box 201 and the liquid circulation box 105. A connecting pipe 3 204 is provided between the circulation box 201 and the heat sink 205, and there are no less than two pipes in the connecting pipe 203 and the connecting pipe 3 204. When in use, the connecting pipe 203 and the connecting pipe 3 204 both have pipes at the inlet and outlet of the circulation box 201, and the circulation box 201 is used as a power to replace the liquid in the liquid circulation box 105, so as to achieve the effect of replacing the liquid in the liquid circulation box 105, wherein the liquid can be replaced at the circulation box 201.

[0033] like Figure 1-2 As shown, the heat sink 205 of this embodiment is provided with a second fixing seat 2051 on the outside. When in use, the fixing seat 2051 can be fully exposed to the outside air for cooling. The heat sink 205 can also be fixedly placed on a refrigeration structure for cooling, thereby reducing the temperature at the liquid circulation box 105.

[0034] Among them, the outsides of connecting pipe 1 104 , connecting pipe 2 203 and connecting pipe 3 204 are all provided with a heat insulation layer.

[0035] When in use, the liquid cooling layer 102 is used to achieve the liquid cooling effect of the radiator 1, and the liquid circulation is realized through the liquid circulation box 105. The heat dissipation switchboard 2 set at the same time can connect multiple liquid circulation boxes 105 to replace the liquid inside them, and the heat dissipation platform 205 can also be fixedly placed on the refrigeration structure to cool down the liquid inside the circulation box 201.

[0036] The present invention is not limited to the above-mentioned implementation modes. Anyone should be aware of the structural changes made under the inspiration of the present invention. Any technical solution that is the same or similar to the present invention falls within the protection scope of the present invention. The technology, shape, and structure that are not described in detail in the present invention are all known technologies.

Claims

1. A liquid cooling radiator for chip in a computer room, characterized in that: The invention comprises a radiator (1) and a heat dissipation main unit (2), wherein the radiator (1) comprises a contact point (101), a liquid cooling layer (102) and a liquid circulation box (105), wherein the liquid cooling layer (102) is arranged outside the contact point (101) and passes through the contact point (101), wherein the liquid circulation box (105) is arranged on one side of the liquid cooling layer (102), and the heat dissipation main unit (2) comprises a circulation box (201) and a heat dissipation platform (205), wherein the circulation box (201) is connected to the liquid circulation box (105), and wherein the heat dissipation platform (205) is arranged outside the circulation box (201).

2. A liquid cooling radiator for chip in a computer room according to claim 1, characterized in that: A fixing seat 1 (1011) is arranged outside the contact point (101).

3. The liquid cooling radiator for chip in a computer room according to claim 1, characterized in that: A rotating fan (103) is arranged outside the liquid cooling layer (102), and the rotating fan (103) comprises a motor, and rotating fan blades are arranged outside the motor.

4. The liquid cooling radiator for chip in a computer room according to claim 1, characterized in that: A circulation interface (106) is provided outside the liquid circulation box (105), and a connecting pipe (104) is connected between the circulation interface (106) and the liquid cooling layer (102), and the connecting pipe (104) includes at least two pipes.

5. The liquid cooling radiator for chip in a computer room according to claim 1, characterized in that: An auxiliary plate (1051) is provided inside the liquid circulation box (105), a rotating ring (1052) is provided between the auxiliary plate (1051) and the bottom wall of the liquid circulation box (105), and the inner wall of the rotating ring (1052) is in a threaded shape. An internal motor (1053) is provided inside the liquid circulation box (105), and the output shaft of the internal motor (1053) is engaged with the outside of the rotating ring (1052).

6. The liquid cooling radiator for chip in a computer room according to claim 1, characterized in that: An external motor (202) is arranged outside the circulation box (201), a second connecting pipe (203) is arranged between the circulation box (201) and the liquid circulation box (105), a third connecting pipe (204) is arranged between the circulation box (201) and the heat dissipation platform (205), and there are no less than two pipes inside the second connecting pipe (203) and the third connecting pipe (204).

7. The liquid cooling radiator for chip in a computer room according to claim 1, characterized in that: A second fixing seat (2051) is arranged outside the heat dissipation platform (205).

Images