Gluing device for silicon controlled rectifier chip production

Abstract

The utility model relates to the technical field of chip production, in particular to a gluing device for silicon controlled rectifier chip production. In order to overcome the defects that in the prior art, due to the fact that the gluing and glue discharging effects are poor, the gluing efficiency is low, and meanwhile, the two faces of a chip cannot be glued, the following scheme is provided: the gluing device comprises a supporting frame, a glue discharging device and a glue discharging device, the material box is fixedly connected to the top of the supporting frame and used for storing the rubber material; the sliding frame is fixedly connected to one side of the supporting frame; the jacking assembly is fixedly connected to the interior of the sliding frame; the supporting arm is mounted in the sliding frame in a sliding manner; the fixing plate is fixedly connected to the top of the supporting arm; the overturning assembly is fixedly connected to one side of the fixing plate; the utility model discloses feeding equipment. According to the chip gluing device, feeding of glue materials is facilitated, the gluing efficiency is improved, the fixing clamp can be driven to turn over, and gluing treatment can be conveniently conducted on the two faces of a chip.

Description

Technical Field

[0001] This application relates to the field of chip manufacturing technology, and in particular to a coating apparatus for the production of thyristor chips. Background Technology

[0002] Glue coating equipment plays an important role in the processing of electronic products. In the processing of silicon controlled rectifier (SCR) chips, glue coating equipment is required to apply glue in order to complete the bonding and encapsulation. Therefore, glue coating equipment is needed in the chip production process.

[0003] Patent document CN219129796U discloses a chip coating device, including a coating assembly. The coating assembly includes: a fixed base with a coating stage on its top; a cylinder disposed on the top of the fixed base; a push plate fixedly connected to the output end of the cylinder; and a glue cylinder fixedly connected to the inner side wall of the push plate. During coating, pulling a plate causes a slider to pull a turntable to rotate via a connecting rod. As the turntable rotates, multiple plates are pushed outward via multiple connecting rods, placing the chip on top of the coating stage. Then, the plates are released, and the rebound force of multiple springs clamps and fixes the chip to the plate. This achieves rapid clamping and fixing of the chip, preventing chip displacement during coating and affecting normal coating. It can also coat chips of various sizes, and its simple structure makes it easy for operators to use.

[0004] However, the above-mentioned chip coating device has poor coating and dispensing effects, resulting in low coating efficiency. In addition, it cannot coat both sides of the chip. Therefore, we propose a coating device for the production of thyristor chips to solve the above problems. Utility Model Content

[0005] The purpose of this invention is to address the shortcomings of existing technologies, such as poor coating and dispensing effects, resulting in low coating efficiency and the inability to coat both sides of the chip, by proposing a coating device for the production of thyristor chips.

[0006] The coating apparatus for the production of thyristor chips provided in this application adopts the following technical solution:

[0007] A coating apparatus for the production of silicon controlled rectifier chips, comprising:

[0008] Support frame;

[0009] The material bin is fixedly connected to the top of the support frame and is used to store the adhesive material;

[0010] A sliding frame is fixedly connected to one side of the support frame;

[0011] The lifting assembly is fixedly connected inside the sliding frame;

[0012] The support arm is slidably mounted within the sliding frame;

[0013] A fixing plate is fixedly connected to the top of the support arm;

[0014] The flip-up assembly is fixedly connected to one side of the fixed plate;

[0015] A feeding device is fixedly connected to one side of the support frame;

[0016] The coating assembly is fixedly connected to one side of the support frame.

[0017] Furthermore, the lifting assembly includes an electric cylinder, which is fixedly connected to the sliding frame. The electric cylinder is equipped with a telescopic rod, which is fixedly connected to a support arm.

[0018] Furthermore, the flipping assembly includes a motor, and the output shaft of the motor is provided with a rotating shaft, which is rotatably mounted in a fixed plate. A fixing fixture is fixedly connected to the rotating shaft, and the fixing fixture is provided with a chip body.

[0019] Furthermore, the feeding device includes a pump fixedly connected to the top of the support frame, and the pump is equipped with a suction pipe and a feeding hose.

[0020] Furthermore, the coating assembly includes a mounting bracket, and two slide rails are fixedly connected inside the mounting bracket. An electric slider is provided inside the mounting bracket, and the electric slider cooperates with the two slide rails.

[0021] Furthermore, a fixed arm is fixedly connected to one side of the electric slider, and an L-shaped bracket is fixedly connected to one side of the fixed arm, with a rotating shaft rotatably mounted on the L-shaped bracket.

[0022] Furthermore, a material cylinder is fixedly connected to the rotating shaft, and the material cylinder has multiple seepage holes. A material roller is wrapped around the outside of the material cylinder, and a feed inlet is fixedly connected to one side of the material cylinder. The feeding hose is connected to the feed inlet.

[0023] In summary, this application includes at least one of the following beneficial technical effects:

[0024] 1. It facilitates the feeding of adhesive materials, improving the efficiency of adhesive application;

[0025] 2. It can drive the fixing fixture to flip, making it convenient to apply adhesive to both sides of the chip. Attached Figure Description

[0026] Figure 1 This is a front cross-sectional schematic diagram of the coating apparatus for the production of thyristor chips in an embodiment of this application;

[0027] Figure 2 This is a top view of the flip-up component of the coating apparatus for producing thyristor chips in an embodiment of this application.

[0028] Figure 3 This is a cross-sectional view of the coating component of the coating apparatus for the production of thyristor chips in an embodiment of this application;

[0029] Figure 4 This is a top view of the material cylinder and roller of the coating device for the production of thyristor chips in the embodiments of this application;

[0030] Figure 5 This is a top-down cross-sectional view of the coating device for producing thyristor chips in an embodiment of this application.

[0031] Reference numerals: 1. Support frame; 2. Material box; 3. Sliding frame; 4. Electric cylinder; 5. Support arm; 6. Fixing plate; 7. Motor; 8. Rotating shaft; 9. Fixing clamp; 10. Chip body; 11. Pump; 12. Pumping pipe; 13. Feeding hose; 14. Mounting frame; 15. Slide rail; 16. Electric slider; 17. Fixing arm; 18. Rotating shaft; 19. Material cylinder; 20. Material seepage hole; 21. Material roller; 22. Inlet. Detailed Implementation

[0032] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments of the present utility model. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments.

[0033] Example 1

[0034] The following is in conjunction with the appendix Figures 1-5 This application will be described in further detail.

[0035] The coating apparatus for the production of silicon controlled rectifier chips described in this utility model includes:

[0036] Support frame 1;

[0037] Material bin 2 is fixedly connected to the top of support frame 1 and is used to store adhesive material;

[0038] The sliding frame 3 is fixedly connected to one side of the support frame 1;

[0039] The lifting assembly is fixedly connected inside the sliding frame 3;

[0040] Support arm 5 is slidably installed inside sliding frame 3;

[0041] Fixed plate 6 is fixedly connected to the top of support arm 5;

[0042] The flip-up component is fixedly connected to one side of the fixed plate 6;

[0043] The feeding device is fixedly connected to one side of the support frame 1;

[0044] The coating assembly is fixedly connected to one side of the support frame 1.

[0045] Specifically, the lifting assembly includes an electric cylinder 4, which is fixedly connected to the sliding frame 3. The electric cylinder 4 is equipped with a telescopic rod, which is fixedly connected to the support arm 5.

[0046] Specifically, the flipping assembly includes a motor 7, and the output shaft of the motor 7 is provided with a rotating shaft 8, which is rotatably mounted in the fixed plate 6. A fixing clamp 9 is fixedly connected to the rotating shaft 8, and the fixing clamp 9 is provided with a chip body 10.

[0047] Specifically, the feeding equipment includes a pump 11 fixedly connected to the top of the support frame 1, and the pump 11 is equipped with a suction pipe 12 and a feeding hose 13.

[0048] Specifically, the coating assembly includes a mounting bracket 14, and two slide rails 15 are fixedly connected inside the mounting bracket 14. An electric slider 16 is provided inside the mounting bracket 14, and the electric slider 16 cooperates with the two slide rails 15.

[0049] Specifically, a fixed arm 17 is fixedly connected to one side of the electric slider 16, and an L-shaped bracket is fixedly connected to one side of the fixed arm 17, with a rotating shaft 18 rotatably mounted on the L-shaped bracket.

[0050] Specifically, a material cylinder 19 is fixedly connected to the rotating shaft 18, and a plurality of material seepage holes 20 are opened on the material cylinder 19. A material roller 21 is wrapped around the outside of the material cylinder 19, and a feed inlet 22 is fixedly connected to one side of the material cylinder 19. The feeding hose 13 is connected to the feed inlet 22.

[0051] The principle of the coating device for silicon controlled rectifier (SCR) chip production in this embodiment is as follows: First, the chip body 10 is placed on one side of the fixing fixture 9 to clamp and fix it. Then, the electric cylinder 4 is activated, and the hydraulic rod on the electric cylinder 4 drives the support arm 5 to move upward. The support arm 5 then drives the chip body 10 upward, moving it to one side of the material roller 21. Next, the material pump 11 is activated, drawing the adhesive from the material box 2 through the material extraction pipe 12. The adhesive is then introduced into the material cylinder 19 through the feeding hose 13. Subsequently, the adhesive in the material cylinder 19 will permeate... The adhesive seeps out through the material hole 20, allowing the adhesive to be absorbed by the material roller 21, facilitating the loading of the adhesive. Then, the electric slider 16 is activated, causing it to move to the right. The two slide rails 15 provide stable guidance for the movement of the electric slider 16. Subsequently, the electric slider 16 drives the material roller 21 to move via the fixed arm 17. The material roller 21 then performs a rolling adhesive coating process on the surface of the chip body 10, which is highly practical. At the same time, the user can activate the motor 7, causing the output shaft of the motor 7 to drive the rotating shaft 8 to rotate. The rotation of the rotating shaft 8 will cause the fixed clamp 9 to flip, facilitating the coating of adhesive on both sides of the chip body 10, which is also highly practical.

[0052] Example 2

[0053] The difference between this embodiment and embodiment one is that: a stirring assembly and a heating plate are fixedly connected inside the material bin 2, which can stir and heat the adhesive in the material bin 2, so that the adhesive can maintain its fluidity and facilitate subsequent adhesive application.

[0054] The above are all preferred embodiments of this application, and are not intended to limit the scope of protection of this application. Therefore, all equivalent changes made in accordance with the structure, shape and principle of this application should be covered within the scope of protection of this application.

Claims

1. A glue coating device for the production of thyristor chips, characterized in that: include: Support frame (1); A material box (2) is fixedly connected to the top of the support frame (1); A sliding frame (3) fixedly connected to one side of the supporting frame (1); A lifting assembly fixedly connected to the interior of the sliding frame (3); A support arm (5) is slidably mounted in the sliding frame (3); A fixing plate (6) fixedly connected to the top of the supporting arm (5); A flip assembly fixedly connected to one side of the fixing plate (6); A feeding device, fixedly connected to one side of the support frame (1); A coating component is fixedly connected to one side of the support frame (1).

2. The glue coating device for thyristor chip production according to claim 1 is characterized in that: The lifting assembly comprises an electric cylinder (4), and the electric cylinder (4) is fixedly connected to the sliding frame (3). A telescopic rod is provided on the electric cylinder (4), and the telescopic rod is fixedly connected to the support arm (5).

3. The glue coating device for thyristor chip production according to claim 2 is characterized in that: The flip assembly comprises a motor (7), and a rotating shaft (8) is provided on the output shaft of the motor (7), and the rotating shaft (8) is rotatably mounted in a fixed plate (6), and a fixing fixture (9) is fixedly connected to the rotating shaft (8), and a chip body (10) is provided on the fixing fixture (9).

4. The glue coating device for thyristor chip production according to claim 3 is characterized in that: The feeding equipment comprises a material extraction pump (11) fixedly connected to the top of the support frame (1), and a material extraction pipe (12) and a feeding hose (13) are provided on the material extraction pump (11).

5. The glue coating device for thyristor chip production according to claim 2, characterized in that: The coating assembly comprises a mounting frame (14), and two slide rails (15) are fixedly connected inside the mounting frame (14), and an electric slider (16) is arranged inside the mounting frame (14), and the electric slider (16) matches the two slide rails (15).

6. The glue coating device for thyristor chip production according to claim 5, characterized in that: One side of the electric slider (16) is fixedly connected to a fixed arm (17), and one side of the fixed arm (17) is fixedly connected to an L-shaped bracket, and a rotating shaft (18) is rotatably mounted on the L-shaped bracket.

7. The glue coating device for thyristor chip production according to claim 6, characterized in that: A material barrel (19) is fixedly connected to the rotating shaft (18), and a plurality of material infiltration holes (20) are provided on the material barrel (19). A material roller (21) is wrapped around the outside of the material barrel (19), and a feed port (22) is fixedly connected to one side of the material barrel (19), and a feeding hose (13) is connected to the feed port (22).

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