Glass substrate hole digging tool after laser cutting

Through the combination of water box and heating pad, the excess parts of the glass substrate after laser cutting are quickly removed by using the principle of thermal expansion and contraction, which solves the problem of difficulty in taking out excess parts of the glass substrate after laser cutting, improves processing efficiency and yield, and avoids the Problems of edge collapse and micro-cracking.

CN222327021UActive Publication Date: 2025-01-10ZHE JIANG CHANGXING HELI OPTOELECTRONIC TECH CO LTD
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Patent Information

Application Number
CN202420944039.8
Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
Filing Date
2024-05-06
Publication Date
2025-01-10
Estimated Expiration
2034-05-06

AI Technical Summary

Technical Problem

After laser cutting, it is difficult to remove excess components in the glass substrate quickly and safely, resulting in low efficiency and reduced yield, and may cause problems of edge collapse or micro-cracking.

Method used

Using the combination of a water box and a heating pad, the heat pad is used to expand the remaining area to a high temperature through the principle of thermal expansion and contraction, and the cooling water box causes the area to be removed to cool down and shrink rapidly, thereby achieving the rapid removal of excess parts of the glass substrate.

Benefits of technology

The efficiency and yield of the glass substrate holes are improved, the problems of edge collapse and micro-cracking are avoided, and the processing quality of glass substrate after laser cutting is improved.

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Abstract

The utility model discloses a hole digging tool for a glass substrate after laser cutting, which relates to the field of glass substrate processing and comprises a base, a vertical plate is fixedly mounted on the rear portion of the base, two fixing blocks are symmetrically mounted on the front portion of the vertical plate, a first lead screw is rotatably connected between the two fixing blocks, and a second lead screw is rotatably connected between the first lead screw and the vertical plate. And a sliding block is in threaded connection with the outer portion of the first lead screw, a first motor is fixedly installed on one side of one fixing block, an output shaft of the first motor is fixedly connected with the first lead screw, and a second motor is fixedly installed on the rear portion of the sliding block. According to the hole digging tool for the glass substrate after laser cutting, the mode that a reserved area is heated to reach a high-temperature state so as to be expanded, and an area needing to be removed is rapidly cooled to a low-temperature state so as to be shrunk is adopted, the principle of thermal expansion and cold contraction is adopted, redundant glass at the hole digging position can be rapidly taken out, efficiency is improved, and the production cost is reduced. And meanwhile, the problems of edge breakage, micro-cracking and the like of the glass cannot be caused by taking out, and the yield is improved.
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Description

Technical Field

[0001] The utility model relates to the field of glass substrate processing, in particular to a tool for digging holes in a glass substrate after laser cutting. Background Art

[0002] As more and more glass is used in consumer electronics, the requirements for glass processing become higher. More products require holes to be drilled in the glass. If you want to drill holes in the glass, especially in thin glass, the traditional CNC precision engraving method will greatly reduce the yield and efficiency of the glass. Therefore, almost all glass manufacturers are looking for laser cutting and drilling solutions. Lasers with high peak power and high energy density can vaporize the glass instantly, and then cooperate with motion control to cut the required holes at the specified position. Glass laser cutting has the advantages of small taper, high precision, small edge collapse, no consumables, maintenance-free, and easy integration for automated production. For thin glass materials, the commonly used laser precision drilling laser processing methods are: laser precision drilling is to reduce the spot diameter to the micron level, thereby obtaining high laser power density, and laser drilling can be performed on almost any material. Its characteristics are that it can punch holes on hard, brittle or soft materials with small hole diameter, fast processing speed and high efficiency. However, the laser cutting line is at the micron level, and there is almost no space for stress release, so it is difficult to remove the stress. Therefore, it is difficult to remove the unwanted part from the middle of the plate after laser cutting without causing edge collapse and micro cracks. Utility Model Content

[0003] The main purpose of the utility model is to provide a tool for digging holes in a glass substrate after laser cutting, which can effectively solve the technical problems in the background technology.

[0004] In order to achieve the above purpose, the technical solution adopted by the utility model is:

[0005] A tool for digging holes in a glass substrate after laser cutting, comprising a base, a vertical plate fixedly mounted on the rear of the base, and two fixed blocks symmetrically mounted on the front of the vertical plate, a first screw rod rotatably connected between the two fixed blocks, and a slider is connected to the external thread of the first screw rod, a first motor is fixedly mounted on one side of one of the fixed blocks, an output shaft of the first motor is fixedly connected to the first screw rod, a second motor is fixedly mounted on the rear of the slider, and a second screw rod is fixedly connected to the output shaft of the second motor, a cantilever is fixedly mounted on the front of the slider, a slide seat is slidably connected to the inner side of the cantilever, a cylinder is fixedly mounted on the bottom of the slide seat, and a water box is fixedly connected to the output shaft of the cylinder, a heating pad is placed on the upper part of the base, and a groove is provided on the upper surface of the heating pad.

[0006] As a further solution of the utility model, two guide rods are fixedly connected between the two fixed blocks, and the two guide rods penetrate the sliding block.

[0007] As a further solution of the utility model, two round rods are fixedly installed on the inner side of the cantilever, and the two round rods are slidably connected to the sliding seat.

[0008] As a further solution of the utility model, a fixing seat is fixedly installed on the upper part of the cantilever near the front end, and the fixing seat is rotatably connected to the second screw rod.

[0009] As a further solution of the utility model, two pipes are symmetrically installed on the upper part of the water box, and the two pipes are a water inlet pipe and a water outlet pipe respectively.

[0010] As a further solution of the utility model, a heating wire is embedded and installed inside the heating pad, and the water box is adaptively matched with the groove.

[0011] The beneficial effects of the utility model are as follows:

[0012] By setting up a water box with a heating pad, the area to be retained is heated to a high temperature state to expand, and the area to be removed is rapidly cooled to a low temperature state to shrink. The principle of thermal expansion and contraction can be used to quickly remove excess glass at the hole location to improve efficiency. At the same time, removal will not cause edge collapse, micro-cracks and other problems to the glass, thereby improving the yield rate. BRIEF DESCRIPTION OF THE DRAWINGS

[0013] Figure 1 This is a schematic diagram of the overall structure of a tool for digging holes in a glass substrate after laser cutting according to the utility model;

[0014] Figure 2 This is a top view of a tool for digging holes in a glass substrate after laser cutting according to the utility model;

[0015] Figure 3 This is an enlarged view of a heating pad of a tool for digging holes in a glass substrate after laser cutting according to the utility model;

[0016] Figure 4 This is an enlarged view of a water box of a tool for digging holes in a glass substrate after laser cutting according to the utility model;

[0017] Figure 5 This is a top view of the internal structure of a heating pad of a tool for digging holes in a glass substrate after laser cutting according to the utility model.

[0018] In the figure: 1. base; 2. vertical plate; 3. fixed block; 4. first screw rod; 5. slider; 6. first motor; 7. second motor; 8. cantilever; 9. second screw rod; 10. slide seat; 11. cylinder; 12. water box; 13. heating pad; 14. groove; 15. water inlet pipe; 16. water outlet pipe; 17. heating wire. DETAILED DESCRIPTION

[0019] In order to make the technical means, creative features, objectives and effects achieved by the present invention easy to understand, the present invention is further described below in conjunction with specific implementation methods.

[0020] like Figure 1-Figure 5 As shown, a tool for digging holes in a glass substrate after laser cutting comprises a base 1, a vertical plate 2 is fixedly installed on the rear of the base 1, and two fixed blocks 3 are symmetrically installed on the front of the vertical plate 2, a first screw rod 4 is rotatably connected between the two fixed blocks 3, and a slider 5 is connected to the external thread of the first screw rod 4, a first motor 6 is fixedly installed on one side of one of the fixed blocks 3, the output shaft of the first motor 6 is fixedly connected to the first screw rod 4, a second motor 7 is fixedly installed on the rear of the slider 5, and the output shaft of the second motor 7 is fixedly connected to the second screw rod 9, a cantilever 8 is fixedly installed on the front of the slider 5, a slide seat 10 is slidably connected to the inner side of the cantilever 8, a cylinder 11 is fixedly installed on the bottom of the slide seat 10, and the output shaft of the cylinder 11 is fixedly connected to a water box 12, a heating pad 13 is placed on the upper part of the base 1, and a groove 14 is provided on the upper surface of the heating pad 13.

[0021] In this embodiment, two guide rods are fixedly connected between the two fixed blocks 3, and the two guide rods penetrate the slider 5;

[0022] The guide rod can play a guiding role to ensure the moving direction of the slider 5.

[0023] In this embodiment, two round rods are fixedly installed on the inner side of the cantilever 8, and the two round rods are slidably connected to the slide seat 10;

[0024] The two round rods can guide the slide 10 to prevent the slide 10 from passively rotating when the slide 10 is subjected to the rotational force of the second screw 9 .

[0025] In this embodiment, a fixing seat is fixedly installed at the upper part of the cantilever 8 near the front end, and the fixing seat is rotatably connected to the second screw rod 9;

[0026] The fixing seat can support the end of the second screw rod 9 to ensure the rotation stability of the second screw rod 9.

[0027] In this embodiment, two pipes are symmetrically installed on the upper part of the water box 12, and the two pipes are a water inlet pipe 15 and a water outlet pipe 16;

[0028] The water inlet pipe 15 and the water outlet pipe 16 can be connected to an external cooling water source pipeline, so as to exchange heat with the glass substrate through the water box 12 .

[0029] In this embodiment, a heating wire 17 is embedded in the heating pad 13, and the water box 12 is adaptively matched with the groove 14;

[0030] The heating wire 17 can heat the heating pad 13, thereby heating the glass substrate.

[0031] It should be noted that the utility model is a tool for digging holes in a glass substrate after laser cutting. When in use, a heating pad 13 and a water box 12 that are adapted to the size of the glass substrate after laser cutting are preset. The heating pad 13 is placed on the upper part of the base 1, and the glass substrate after laser cutting is placed on the upper part of the heating pad 13. At the same time, the cut disc is aligned with the groove 14, and then the external cooling water source is connected to the water inlet pipe 15 and the water outlet pipe 16 of the water box 12;

[0032] During operation, the first motor 6 drives the first screw 4 to rotate, drives the slider 5 to move horizontally, and thus drives the cylinder 11 to move. At the same time, the second motor 7 drives the second screw 9 to rotate, drives the cylinder 11 to slide through the slide 10. When the water box 12 is vertically aligned with the groove 14, the cylinder 11 moves downward to attach the water box 12 to the wafer after laser cutting of the glass substrate.

[0033] The heating wire 17 is started by an external power supply, and the heating wire 17 heats the heating pad 13, so that the glass substrate is heated. When it is heated to 40-150°C, the external cooling water source is started to supply water to the water box 12, and the water temperature is controlled at -2 to -5°C. After the cooling water circulates for a period of time, the cylinder 11 works again to push the water box 12 to apply pressure to the cut glass substrate wafer. The remaining area is heated to a high temperature state to expand it, and the area to be removed is cooled rapidly to a low temperature state to shrink it. At this time, the cylinder 11 works to push the area to be removed downward, so that it can be quickly removed.

[0034] The above shows and describes the basic principle and main features of the utility model and the advantages of the utility model. Those skilled in the art should understand that the utility model is not limited by the above embodiments. The above embodiments and descriptions are only for explaining the principle of the utility model. Without departing from the spirit and scope of the utility model, the utility model may have various changes and improvements, which fall within the scope of the utility model to be protected. The scope of protection claimed by the utility model is defined by the attached claims and their equivalents.

Claims

1. A tool for drilling holes in a glass substrate after laser cutting, comprising a base (1), characterized in that: A vertical plate (2) is fixedly mounted on the rear of the base (1), and two fixed blocks (3) are symmetrically mounted on the front of the vertical plate (2); a first screw rod (4) is rotatably connected between the two fixed blocks (3), and a slider (5) is connected to the outer thread of the first screw rod (4); a first motor (6) is fixedly mounted on one side of one of the fixed blocks (3); an output shaft of the first motor (6) is fixedly connected to the first screw rod (4); a second motor (7) is fixedly mounted on the rear of the slider (5); an output shaft of the second motor (7) is fixedly connected to a second screw rod (9); a cantilever (8) is fixedly mounted on the front of the slider (5); a slide seat (10) is slidably connected to the inner side of the cantilever (8); a cylinder (11) is fixedly mounted on the bottom of the slide seat (10); an output shaft of the cylinder (11) is fixedly connected to a water box (12); a heating pad (13) is placed on the upper part of the base (1), and a groove (14) is provided on the upper surface of the heating pad (13).

2. The tool for digging holes in a glass substrate after laser cutting according to claim 1, characterized in that: Two guide rods are fixedly connected between the two fixed blocks (3), and the two guide rods penetrate the sliding block (5).

3. The tool for digging holes in a glass substrate after laser cutting according to claim 1, characterized in that: Two round rods are fixedly mounted on the inner side of the cantilever (8), and the two round rods are slidably connected to the sliding seat (10).

4. The tool for digging holes in a glass substrate after laser cutting according to claim 1, characterized in that: A fixing seat is fixedly mounted on the upper part of the cantilever (8) near the front end, and the fixing seat is rotationally connected to the second screw rod (9).

5. The tool for digging holes in a glass substrate after laser cutting according to claim 1, characterized in that: Two pipes are symmetrically installed on the upper part of the water box (12), and the two pipes are respectively a water inlet pipe (15) and a water outlet pipe (16).

6. The tool for digging holes in a glass substrate after laser cutting according to claim 1, characterized in that: A heating wire (17) is embedded and installed inside the heating pad (13), and the water box (12) is adaptively matched with the groove (14).