Electroplating equipment

Abstract

The utility model discloses electroplating equipment which comprises an electroplating mechanism and a liquid outlet piece, the electroplating mechanism comprises an electroplating bath and an electroplating assembly, the electroplating bath is used for containing electroplating liquid, a film penetrating channel is arranged on the electroplating bath, and the electroplating assembly is arranged in the electroplating bath to be at least used for plating a preset film layer on a film passing through the film penetrating channel; the liquid outlet piece is arranged in the electroplating bath and located at the position, deviating from the film penetrating channel, of the electroplating bath, a liquid inlet cavity is formed in the liquid outlet piece, and a liquid outlet used for communicating the liquid inlet cavity with the electroplating bath is formed in the liquid outlet piece; the liquid outlet piece is provided with a first area covered by the projection of the film penetrating channel in the first direction, the liquid outlet and the first area are arranged in a staggered mode, and the first direction is the direction, close to the liquid outlet piece, of the film penetrating channel. The utility model solves the problem that the existing method for introducing the plating solution into the plating bath can generate larger impact force on the film.

Description

Technical Field

[0001] The present application relates to the technical field of thin film production, and in particular to an electroplating device. Background Art

[0002] Water electroplating is an electro-ion deposition process that uses electrodes to pass current to make metal adhere to the surface of an object. In the production process of thin films (such as composite copper foil), water electroplating is required to thicken the film layer. During water electroplating, in order to maintain the concentration of the plating solution, the plating solution needs to be continuously introduced into the plating tank. Directly introducing the plating solution into the plating tank will cause the plating solution to fluctuate greatly, causing wrinkles to form on the film after entering the roller system. The existing method of introducing the plating solution into the plating tank is to set an inlet pipe at the bottom of the plating tank body, and a plurality of holes are opened on the inlet pipe. The holes are arranged along the width direction of the film and face the plating component that performs the electroplating operation on the film, that is, the plating solution is discharged from the front of the holes arranged laterally in the inlet pipe. However, the plating solution under this liquid inlet method will flow in the direction of the plating component where the film is located, and will still produce a large impact force on the film. This impact force will cause the film surface to fluctuate, and the film is prone to wrinkles when entering the roller system. Utility Model Content

[0003] The main purpose of the present application is to provide an electroplating device to solve the problem mentioned in the background art that the existing method of introducing plating solution into the electroplating tank will produce a large impact force on the film.

[0004] According to a first aspect of an embodiment of the present application, there is provided an electroplating device, comprising:

[0005] An electroplating mechanism, the electroplating mechanism comprising an electroplating tank and an electroplating component, the electroplating tank is used to contain a plating solution, the electroplating tank is provided with a transmembrane channel, the electroplating component is provided in the electroplating tank to at least plate a predetermined film layer on a thin film passing through the transmembrane channel;

[0006] A liquid outlet, the liquid outlet is arranged in the electroplating tank and located at a position of the electroplating tank that deviates from the transmembrane channel, a liquid inlet cavity is arranged in the liquid outlet, and a liquid outlet for connecting the liquid inlet cavity and the electroplating tank is arranged on the liquid outlet;

[0007] The liquid outlet has a first area covered by the projection of the transmembrane channel along a first direction, the liquid outlet is staggered with the first area, and the first direction is the direction of the transmembrane channel approaching the liquid outlet.

[0008] Further, the transmembrane channel has a width along the width direction of the film and a length along the movement direction of the film, and the area of ​​the liquid outlet member where the liquid outlet is provided is the second area, and the second area is located on at least one side of the liquid outlet member along the first direction; and / or, the second area is located on at least one side of the liquid outlet member along the width direction of the transmembrane channel; and / or, the second area is located on at least one side of the liquid outlet member along the length direction of the transmembrane channel.

[0009] Further, the transmembrane channel has a width along the width direction of the film, and the liquid outlet comprises:

[0010] A hollow box body, wherein the liquid inlet cavity is a cavity inside the hollow box body, the length of the hollow box body along the width direction of the transmembrane channel is greater than the width of the transmembrane channel and less than the width of the bottom of the electroplating tank along the width direction of the transmembrane channel, and the liquid outlet is arranged at at least one end of the hollow box body along the width direction of the transmembrane channel.

[0011] Furthermore, the hollow box body has a first end face and a second end face along the width direction of the transmembrane channel, and the liquid outlets include a plurality of liquid outlets, which are arranged on at least one of the first end face and the second end face.

[0012] Furthermore, the hollow box body comprises a rectangular hollow box body, the rectangular hollow box body is arranged at the bottom of the electroplating tank, and the length direction of the rectangular hollow box body is parallel to the width direction of the membrane-penetrating channel.

[0013] Furthermore, the electroplating tank includes a first side and a second side which are arranged opposite to each other along the length direction of the transmembrane channel, and the hollow box body includes at least two, and the at least two hollow box bodies are respectively arranged on the first side and the second side.

[0014] Furthermore, a liquid inlet channel is also provided on the liquid outlet member, and the liquid inlet channel is communicated with the liquid inlet cavity; and / or the cross-sectional area of ​​the liquid inlet channel is greater than the cross-sectional area of ​​the liquid outlet.

[0015] Furthermore, it also includes:

[0016] A liquid inlet valve is arranged on the liquid inlet channel, and is used to control the flow rate of the electroplating solution entering the liquid inlet cavity.

[0017] Furthermore, the electroplating equipment also includes:

[0018] The plating liquid conveying device is used to convey the plating liquid along the liquid inlet channel into the liquid inlet cavity.

[0019] Furthermore, the plating solution conveying device comprises:

[0020] A liquid storage tank, wherein the liquid storage tank stores electroplating liquid;

[0021] A transmission pipeline, one end of which is disposed in the liquid storage tank and the other end of which is communicated with the liquid inlet channel;

[0022] An infusion pump is arranged on the transmission pipeline.

[0023] Compared with the prior art, the technical solution of this application has at least the following technical effects:

[0024] The electroplating equipment provided in the present application inputs the plating liquid into the electroplating tank via a liquid outlet member arranged in the electroplating tank, wherein the liquid outlet member is located at a position of the electroplating tank deviating from the transmembrane channel, the liquid outlet member is provided with a liquid inlet cavity and a liquid outlet for connecting the liquid inlet cavity and the electroplating tank, the liquid outlet member has a first area covered by the projection of the transmembrane channel along a first direction, and the liquid outlet is staggered with the first area, thereby, the plating liquid will not directly flow into the direction of the transmembrane channel with the thin film during the process of coming out of the liquid outlet, thereby reducing the impact force generated on the thin film when the plating liquid enters the electroplating tank, and avoiding the film from wrinkling due to the undulation of the membrane surface under the impact of the impact force. BRIEF DESCRIPTION OF THE DRAWINGS

[0025] The drawings described herein are used to provide a further understanding of the present application and constitute a part of the present application. The illustrative embodiments of the present application and their descriptions are used to explain the present application and do not constitute an improper limitation on the present application. In the drawings:

[0026] Figure 1 A schematic diagram of the structure of an electroplating device provided in one embodiment of the utility model;

[0027] Figure 2 for Figure 1 A magnified schematic diagram of part A;

[0028] Figure 3 It is a structural schematic diagram of a hollow box;

[0029] Figure 4 for Figure 3 Side view of

[0030] Figure 5 for Figure 4 BB cross-sectional view.

[0031] The above drawings include the following reference numerals:

[0032] 10. Electroplating tank; 11. Membrane-penetrating channel; 12. First side; 13. Second side; 20. Liquid-collecting roller; 21. Anode mechanism; 22. First conductive roller; 23. Second conductive roller; 24. Tension roller; 25. Speed-regulating roller; 30. Hollow box body; 31. Liquid inlet cavity; 32. Liquid outlet; 33. First end face; 34. Second end face; 35. Liquid inlet channel; 40. Liquid storage tank; 50. Film. DETAILED DESCRIPTION

[0033] It should be noted that, in the absence of conflict, the embodiments and features in the embodiments of the present application can be combined with each other. The present application will be described in detail below with reference to the accompanying drawings and in combination with the embodiments.

[0034] It should be noted that the terms used herein are only for describing specific embodiments and are not intended to limit the exemplary embodiments according to the present application. As used herein, unless the context clearly indicates otherwise, the singular form is also intended to include the plural form. In addition, it should be understood that when the terms "comprise" and / or "include" are used in this specification, it indicates the presence of features, steps, operations, devices, components and / or combinations thereof.

[0035] Unless otherwise specifically stated, the relative arrangement, numerical expressions and numerical values ​​of the parts and steps set forth in these embodiments do not limit the scope of the present application. At the same time, it should be understood that, for ease of description, the sizes of the various parts shown in the accompanying drawings are not drawn according to the actual proportional relationship. The technology, methods and equipment known to those of ordinary skill in the relevant art may not be discussed in detail, but in appropriate cases, the technology, methods and equipment should be considered as a part of the authorization specification. In all examples shown and discussed here, any specific value should be interpreted as being merely exemplary, rather than as a limitation. Therefore, other examples of exemplary embodiments may have different values. It should be noted that similar reference numerals and letters represent similar items in the following drawings, and therefore, once a certain item is defined in an accompanying drawing, it does not need to be further discussed in subsequent drawings.

[0036] In order to reduce the impact force of the plating solution on the film 50 when the plating solution is introduced into the plating tank 10. The first embodiment of the utility model provides an electroplating device, which includes an electroplating mechanism and a liquid outlet. Figure 1 to Figure 2The electroplating mechanism includes an electroplating tank 10 and an electroplating component. The electroplating tank 10 is used to contain the electroplating solution. The electroplating tank 10 is provided with a transmembrane channel 11. The electroplating component is provided in the electroplating tank 10 to at least be used to plate a predetermined film layer on the thin film 50 passing through the transmembrane channel 11. The liquid outlet is provided in the electroplating tank 10 and is located at a position of the electroplating tank 10 deviating from the transmembrane channel 11. The liquid outlet is provided with a liquid inlet cavity 31, and the liquid outlet is provided with a liquid outlet 32 ​​for connecting the liquid inlet cavity 31 and the electroplating tank 10. The liquid outlet has a first area covered by the projection of the transmembrane channel 11 along a first direction, and the liquid outlet 32 ​​is staggered with the first area. The first direction is the direction of the transmembrane channel 11 close to the liquid outlet, that is, Figure 1 and Figure 2 The liquid outlet 32 ​​is staggered with the first region to prevent the electroplating solution flowing out of the liquid outlet 32 ​​and entering the electroplating tank 10 from directly rushing to the membrane-penetrating channel 11 of the film 50, thereby reducing the impact force on the film 50 during the process of the electroplating solution rushing into the electroplating tank 10.

[0037] It can be seen that the electroplating equipment provided in this embodiment inputs the plating liquid into the electroplating tank 10 through the liquid outlet member provided in the electroplating tank 10, wherein the liquid outlet member is located at a position of the electroplating tank 10 deviating from the transmembrane channel 11, and the liquid outlet member is provided with a liquid inlet cavity 31 and a liquid outlet 32 ​​for connecting the liquid inlet cavity 31 and the electroplating tank 10, and the liquid outlet member has a first area covered by the projection of the transmembrane channel 11 along the first direction, and the liquid outlet 32 ​​is staggered with the first area. Therefore, when the plating liquid comes out of the liquid outlet 32, it will not directly flow into the direction of the transmembrane channel 11 having the thin film 50, thereby reducing the impact force generated on the thin film 50 when the plating liquid enters the electroplating tank 10, and avoiding the film 50 from wrinkling due to the undulation of the membrane surface under the impact of the impact force.

[0038] In this embodiment, if Figure 1 As shown, the electroplating equipment further includes a plurality of liquid accumulation rollers 20, which are arranged at the notch of the electroplating tank 10 in pairs and form a film-penetrating channel 11 for the film 50 to pass through. Figure 1 and Figure 2As shown, the electroplating tank 10 includes a first side 12 and a second side 13 which are arranged oppositely along the length direction of the transmembrane channel 11, and there are four liquid accumulation rollers 20, of which two liquid accumulation rollers 20 are arranged oppositely at the notch of the first side 12 of the electroplating tank 10, and the other two liquid accumulation rollers 20 are arranged oppositely at the notch of the second side 13 of the electroplating tank 10. The liquid accumulation rollers 20 respectively located at the first side 12 and the second side 13 are equivalent to raising the groove depth of the electroplating tank 10, thereby raising the liquid level of the electroplating solution between the liquid accumulation rollers 20 on both sides, and forming the transmembrane channel 11 for the thin film 50 to pass through the electroplating tank 10. In the process of the film 50 passing from the two liquid accumulation rollers 20 on the first side 12 to the two liquid accumulation rollers 20 on the second side 13, the liquid accumulation rollers 20 on the notches on both sides of the electroplating tank 10 can make the plating liquid fully contact with the surface of the film 50, and the plating liquid can overflow from both sides of the film 50 along its own width direction into the side of the film 50 away from the bottom of the electroplating tank 10, so that the two opposite sides of the film 50 along its own thickness direction can contact with the plating liquid. Therefore, the first area on the liquid outlet is equivalent to the area covered by the projection of the film 50 along the first direction, and the liquid outlet 32 ​​is arranged on the liquid outlet avoiding the first area, so as to ensure that in the process of the plating liquid entering the electroplating tank 10, the plating liquid will not directly flow into the direction of the film 50 to generate a large impact force on the film 50.

[0039] The electroplating assembly includes an anode mechanism 21 and a conductive roller. The anode mechanism 21 includes two. The two anode mechanisms 21 are arranged between the liquid accumulation rollers 20 on the first side 12 and the second side 13 of the electroplating tank 10 and form a gap for the film 50 to pass through. The gap also constitutes a part of the film-penetrating channel 11. Generally, the electroplating tank 10 in this embodiment may include multiple electroplating tanks 10, and the film 50 needs to pass through multiple electroplating tanks 10 to achieve the plating of a predetermined film layer of a specified thickness. The conductive roller includes a first conductive roller 22 and a second conductive roller 23. The first conductive roller 22 and the second conductive roller 23 are arranged on one side of the electroplating tank 10 close to another electroplating tank 10. One of the first conductive roller 22 and the second conductive roller 23 is used to contact one side of the film 50 along its own thickness direction, and the other of the first conductive roller 22 and the second conductive roller 23 is used to contact the other side of the film 50 along its own thickness direction. Therefore, the first conductive roller 22 and the second conductive roller 23 respectively conduct electricity to the two side surfaces of the film 50 along its own thickness direction, so that the metal in the electroplating solution can be deposited on the surface of the film 50 as the cathode. Secondly, the electroplating equipment in this embodiment further includes a tension roller 24 and a speed regulating roller 25. The tension roller 24 can be arranged between the conductive roller and the liquid accumulation roller 20 to increase the tension of the film 50. The speed regulating roller 25 can be arranged at the first side 12 of the electroplating tank 10 (i.e., the entrance of the film 50 into the electroplating tank 10). The speed regulating roller 25 is used to adjust the speed of the film 50 so that the film 50 in the electroplating process passes through each electroplating tank 10 at a predetermined speed to achieve electroplating.

[0040] The transmembrane channel 11 in this embodiment has a width along the width direction of the film 50 and a length along the moving direction of the film 50. The area where the liquid outlet is provided with the liquid outlet 32 ​​is the second area, and the second area is located on at least one side of the liquid outlet along the first direction. And / or, the second area is located on at least one side of the liquid outlet along the width direction of the transmembrane channel 11 (the width direction of the transmembrane channel 11 is the width direction of the film 50, and the width direction of the transmembrane channel 11 is perpendicular to the first direction and the direction indicated by the arrow Y). And / or, the second area is located on the liquid outlet along the length direction of the transmembrane channel 11 (the length direction of the transmembrane channel 11 is the moving direction of the film 50 or the length direction, that is, Figure 2 The shape of the liquid outlet member in this embodiment may be a rectangular structure, a trapezoidal structure, or other regular or irregular structures. However, no matter what the structure of the liquid outlet member is, in this embodiment, the liquid outlet 32 ​​is arranged in the second area of ​​the liquid outlet member under the above-mentioned orientation to reduce the impact force of the electroplating liquid from the liquid outlet 32 ​​on the film 50 passing through the transmembrane channel 11, reduce the disturbance of the electroplating liquid in the electroplating tank 10, and avoid wrinkles on the film 50.

[0041] In the existing method of feeding liquid through a liquid inlet pipe set at the bottom of the electroplating tank 10, the electroplating liquid rushing into the direction of the film 50 will produce an impact force on the film 50, and the pump group that transmits the electroplating liquid during the rushing process is prone to inhaling air. After the air enters the electroplating tank 10 along with the electroplating liquid, the bubbles formed by the air in the electroplating liquid will rise to the bottom of the film surface of the film 50 to form bulges. These bulges will cause dead wrinkles on the film surface when the film 50 passes through the roller system. In order to prevent the film 50 from causing dead wrinkles on the film surface due to bubbles, specifically, the membrane-penetrating channel 11 in this embodiment has a width along the width direction of the film 50. As shown in FIG. Figures 3 to 5As shown, the liquid outlet part includes a hollow box body 30, and the liquid inlet cavity 31 is a cavity in the hollow box body 30. The length of the hollow box body 30 along the width direction of the membrane-penetrating channel 11 is greater than the width of the membrane-penetrating channel 11, and less than the width of the bottom of the electroplating tank 10 along the width direction of the membrane-penetrating channel 11. The liquid outlet 32 ​​is arranged at least at one end of the hollow box body 30 along the width direction of the membrane-penetrating channel 11. One or both ends of the hollow box body 30 along the width direction of the membrane-penetrating channel 11 are staggered with the first area of ​​the hollow box body 30 covered by the projection of the membrane-penetrating channel 11 along the first direction. Therefore, in this embodiment, the liquid outlet 32 ​​is arranged at one or both ends of the hollow box body 30 along the width direction of the membrane-penetrating channel 11 to reduce the impact force generated by the plating solution on the film 50 when entering the electroplating tank 10. At the same time, since the projections of one or both ends of the hollow box body 30 along the first direction along the width direction of the membrane passage 11 will not overlap on the film 50 passing through the membrane passage 11, after the bubbles entrained in the plating solution enter the electroplating tank 10, the bubbles will not rise to the surface of the film 50 close to the bottom of the electroplating tank 10 to form bulges, thereby preventing the film 50 from being wrinkled due to bubbles, thereby further improving the film surface quality of the film 50.

[0042] like Figure 5 As shown, the hollow box body 30 has a first end face 33 and a second end face 34 along the width direction of the membrane-penetrating channel 11. The liquid outlet 32 ​​includes a plurality of liquid outlets 32, which are arranged on at least one of the first end face 33 and the second end face 34. In this embodiment, after the plating liquid is input into the liquid inlet cavity 31 of the hollow box body 30, the plating liquid will flow into the electroplating tank 10 along the plurality of liquid outlets 32 on the first end face 33 and / or the second end face 34 of the hollow box body 30. The plating liquid flowing out of the plurality of liquid outlets 32 on the first end face 33 and / or the second end face 34 will not cause a large impact force on the film 50, thereby avoiding the film surface of the film 50 from fluctuating. Moreover, the bubbles carried in the plating liquid will not rise and deposit on the surface of the film 50 to form bulges.

[0043] The hollow box body 30 in the present embodiment includes a rectangular hollow box body, which is arranged at the bottom of the electroplating tank 10, and the length direction of the rectangular hollow box body is parallel to the width direction of the membrane-penetrating channel 11. The hollow box body 30 in the present embodiment can also be a square hollow box body and / or a trapezoidal hollow box body. However, no matter which form the hollow box body 30 is in, the length of the hollow box body 30 along the width direction of the membrane-penetrating channel 11 is greater than the width of the membrane-penetrating channel 11, and less than the width of the bottom of the electroplating tank 10 along the width direction of the membrane-penetrating channel 11. The liquid outlet 32 ​​is arranged at least one end of the hollow box body 30 along the width direction of the membrane-penetrating channel 11 to ensure that the electroplating solution flowing out of the liquid outlet 32 ​​will not cause a large impact force on the film 50 on the membrane-penetrating channel 11 or bring bubbles to the surface of the film 50, thereby improving the flatness of the film surface of the film 50 after electroplating. The rectangular hollow box body in this embodiment can also be set on the side wall of the electroplating tank 10 close to the bottom of the tank. Being set at the bottom of the electroplating tank 10 can make the distance between the rectangular hollow box body and the membrane-penetrating channel 11 farther, further reducing the influence of the disturbance on the film 50 caused by the process of the plating liquid flowing into the electroplating tank 10 from the liquid outlet 32 ​​on at least one of the first end face 33 and the second end face 34 of the rectangular hollow box body, thereby avoiding the formation of dead wrinkles on the membrane surface of the film 50.

[0044] The electroplating tank 10 includes a first side 12 and a second side 13 which are arranged opposite to each other along the length direction of the transmembrane channel 11, and the hollow box body 30 (such as a rectangular hollow box body) includes at least two. At least two hollow box bodies 30 are respectively arranged on the first side 12 and the second side 13. Then, a drain port can be arranged at the bottom of the electroplating tank 10 between the first side 12 and the second side 13, so that a new electroplating solution that meets the concentration requirements can flow into the electroplating tank 10 through the hollow box body 30 on the first side 12 and the second side 13 of the electroplating tank 10, and the previous electroplating solution can flow out of the electroplating tank 10 through the drain port in the middle, so as to maintain the balance of the electroplating solution in the electroplating tank 10. Specifically, the two hollow box bodies 30 are respectively fixedly arranged at the bottom of the first side 12 and the second side 13 of the electroplating tank 10. The side of the hollow box body 30 close to the bottom of the electroplating tank 10 and the side close to the side wall of the electroplating tank 10 are both fixedly connected to the electroplating tank.

[0045] The liquid outlet member in this embodiment is also provided with a liquid inlet channel 35. The liquid inlet channel 35 is connected to the liquid inlet cavity 31, and the cross-sectional area of ​​the liquid inlet channel 35 is greater than the cross-sectional area of ​​the liquid outlet 32. Thus, after the electroplating liquid is transported from the liquid inlet channel 35 to the liquid inlet cavity 31, the electroplating liquid in the liquid inlet cavity 31 flows into the electroplating tank 10 from the liquid outlet 32. The electroplating equipment provided in this embodiment also includes a liquid inlet valve, which is provided on the liquid inlet channel 35, and the liquid inlet valve is used to control the flow rate of the electroplating liquid entering the liquid inlet cavity 31. The liquid inlet valve may include one of a regulating valve, an angle valve, a needle valve, a butterfly valve, a diaphragm valve, and the like.

[0046] The electroplating equipment provided in this embodiment also includes a plating liquid conveying device, which is used to convey the plating liquid along the liquid inlet channel 35 to the liquid inlet cavity 31. The plating liquid conveying device includes a liquid storage tank, a transmission pipeline and an infusion pump. The liquid storage tank stores the plating liquid. One end of the transmission pipeline is arranged in the liquid storage tank and the other end is connected to the liquid inlet channel 35. The infusion pump is arranged on the transmission pipeline. When it is necessary to introduce the plating liquid that meets the concentration requirements into the plating tank 10, the infusion pump is started, and the plating liquid in the liquid storage tank is input into the liquid inlet cavity 31 of the liquid outlet part along the transmission pipeline and the liquid inlet channel 35 under the action of the infusion pump. The plating liquid enters the plating tank 10 from the liquid outlet 32 ​​of the liquid outlet part, which can not only reduce the impact force on the film 50 when the plating liquid enters the plating tank 10, but also reduce the disturbance of the plating liquid. After the bubbles entrained in the electroplating solution enter the electroplating tank 10, they rise to both sides of the membrane-penetrating channel 11 along the width direction of the film 50, and will not form bulges under the film surface of the film 50, thereby avoiding the formation of dead wrinkles on the film surface.

[0047] The second embodiment of the utility model is based on the above embodiment and combined with the attached Figures 1 to 5 , provides an application embodiment of an electroplating device. In this application embodiment, the liquid outlet of the electroplating device is a hollow box body 30, and the hollow box body 30 is a rectangular hollow box body. A liquid inlet channel 35 is provided at the bottom of the rectangular hollow box body, and a plurality of liquid outlets 32 are provided on the first end face 33 and the second end face 34 of the rectangular hollow box body with smaller areas along its length direction. The liquid outlets 32 can be a circular hole structure or a rectangular hole structure. The liquid inlet channel 35 is connected to the plating liquid conveying device, and the plating liquid enters the liquid inlet cavity 31 of the rectangular hollow box body from the liquid inlet channel 35, and then enters the electroplating tank 10 from the liquid outlets 32 on the end faces of both sides of the rectangular hollow box body. The rectangular hollow box body is installed at the bottom of the electroplating tank 10. The length direction of the rectangular hollow box body is parallel to the width direction of the film 50. The electroplating equipment can reduce the impact force on the film 50 when the electroplating solution enters the electroplating tank 10 and reduce the disturbance of the plating solution through the rectangular hollow box body set in this embodiment. At the same time, after the bubbles entrained in the electroplating solution enter the electroplating tank 10, they rise to both sides of the film 50 along its own width direction, and will not form bulges under the film surface of the film 50 to cause dead wrinkles on the film 50.

[0048] The length of the liquid outlet (such as a rectangular hollow box body) along the width direction of the membrane passage 11 is greater than the width of the film 50, and less than the width of the bottom of the electroplating tank 10 along the width direction of the membrane passage 11. When the cross-sections of the liquid inlet channel 35 and the liquid outlet 32 ​​are both circular, the diameter of the liquid inlet channel 35 is greater than the diameter of the liquid outlet 32. A liquid inlet valve is provided on the liquid inlet channel 35, and the liquid inlet valve is used to control the flow rate of the electroplating liquid entering the liquid inlet cavity 31 of the liquid outlet. The plating liquid conveying device is a liquid inlet pipeline connected to the liquid storage tank, and an infusion pump is provided on the liquid inlet pipeline.

[0049] The electroplating equipment in this embodiment also includes a plurality of electroplating tanks 10 and liquid outlets arranged in the plurality of electroplating tanks 10. The liquid outlet is arranged at the bottom of the electroplating tank 10, and the first side 12 and the second side 13 of any electroplating tank 10 are provided with liquid outlets. That is, one liquid outlet is arranged at the inlet side of the film 50 of the electroplating tank 10, and the other liquid outlet is arranged at the outlet side of the film 50 of the electroplating tank 10. The bottom of the electroplating tank 10 and the tank wall close to the liquid outlet are respectively fixedly connected to the bottom and side wall of the liquid outlet provided with a liquid inlet channel 35. At this time, a liquid inlet pipeline connected to the liquid inlet channel 35 of the liquid outlet will be provided at the bottom of the electroplating tank 10, and the liquid inlet channel 35 is connected to the transmission pipeline of the plating liquid conveying device through the liquid inlet pipeline, so as to realize that the plating liquid in the liquid storage tank is pressed into the liquid inlet cavity 31 of the liquid outlet under the action of the infusion pump.

[0050] The electroplating equipment in this embodiment also includes a roller, a tension roller 24, a first conductive roller 22, and a second conductive roller 23 arranged in sequence, and the film 50 passes through the above roller system in sequence. Anode mechanisms 21 are arranged on the upper and lower sides of the film 50. The anode mechanism 21 is titanium blue or a titanium plate, and a copper ball is installed in the titanium blue. The first conductive roller 22 contacts the first surface of the film 50 along its own thickness direction, and the second conductive roller 23 contacts the second surface of the film 50 along its own thickness direction, and conducts electricity to the surfaces on both sides of the film 50 respectively, so that the metal (such as copper) in the electroplating solution can be deposited on the surface of the film 50 to form the required metal film layer.

[0051] Two pairs of liquid accumulation rollers 20 are arranged in each electroplating tank 10 of the electroplating equipment. The two pairs of liquid accumulation rollers 20 are respectively arranged at the inlet and outlet of the film 50 of the electroplating tank 10. Each pair of liquid accumulation rollers 20 are arranged adjacently and spaced up and down along the first direction to form a film-penetrating channel 11 for the film 50 to pass through the electroplating tank 10, and the film 50 passes through the film-penetrating channel 11 between the two liquid accumulation rollers 20. A liquid storage tank 40 is also arranged below the multiple electroplating tanks 10, and the liquid storage tank 40 is used to receive the electroplating liquid overflowing from the electroplating tank 10.

[0052] The liquid outlet in this embodiment can reduce the impact force on the film 50 at the notch of the electroplating tank 10 when the plating solution enters the electroplating tank 10, and reduce the disturbance of the plating solution. After the bubbles entrained in the plating solution enter the electroplating tank 10, they will only rise to the two sides of the film 50 along its own width direction, and will not form bulges below the film surface of the film 50, thereby avoiding the formation of dead wrinkles on the film surface of the film 50. That is, in this embodiment, the liquid outlet is changed from the existing liquid inlet pipe set at the bottom of the electroplating tank 10 to discharge liquid from the horizontal front to discharge liquid from both ends, thereby avoiding bubbles from forming bulges on the surface of the film 50.

[0053] For ease of description, spatially relative terms such as "above", "above", "on the upper surface of", "above", etc. may be used here to describe the spatial positional relationship between a device or feature and other devices or features as shown in the figure. It should be understood that spatially relative terms are intended to include different orientations of the device in use or operation in addition to the orientation described in the figure. For example, if the device in the accompanying drawings is inverted, the device described as "above other devices or structures" or "above other devices or structures" will be positioned as "below other devices or structures" or "below other devices or structures". Thus, the exemplary term "above" can include both "above" and "below". The device can also be positioned in other different ways (rotated 90 degrees or in other orientations), and the spatially relative descriptions used here are interpreted accordingly.

[0054] In addition, it should be noted that the use of terms such as "first" and "second" to limit components is only for the convenience of distinguishing the corresponding components. Unless otherwise stated, the above terms have no special meaning and therefore cannot be understood as limiting the scope of protection of this application.

[0055] The above are only preferred embodiments of the present application and are not intended to limit the present application. For those skilled in the art, the present application may have various modifications and variations. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present application shall be included in the protection scope of the present application.

Claims

1. An electroplating device, characterized in that: include: An electroplating mechanism, the electroplating mechanism comprising an electroplating tank (10) and an electroplating component, the electroplating tank (10) being used to contain a plating solution, the electroplating tank (10) being provided with a transmembrane channel (11), the electroplating component being provided in the electroplating tank (10) to at least plate a predetermined film layer on a thin film (50) passing through the transmembrane channel (11); a liquid outlet member, the liquid outlet member being arranged in the electroplating tank (10) and located at a position of the electroplating tank (10) deviating from the transmembrane channel (11), the liquid outlet member being provided with a liquid inlet cavity (31), and the liquid outlet member being provided with a liquid outlet (32) for connecting the liquid inlet cavity (31) and the electroplating tank (10); The liquid outlet has a first area covered by the projection of the transmembrane channel (11) along a first direction, the liquid outlet (32) is arranged offset from the first area, and the first direction is the direction of the transmembrane channel (11) approaching the liquid outlet.

2. The electroplating equipment according to claim 1, characterized in that: The transmembrane channel (11) has a width along the width direction of the film (50) and a length along the moving direction of the film (50); the area of ​​the liquid outlet member where the liquid outlet (32) is provided is the second area, and the second area is located on at least one side of the liquid outlet member along the first direction; and / or, the second area is located on at least one side of the liquid outlet member along the width direction of the transmembrane channel (11); and / or, the second area is located on at least one side of the liquid outlet member along the length direction of the transmembrane channel (11).

3. The electroplating equipment according to claim 1, characterized in that: The transmembrane channel (11) has a width along the width direction of the film (50), and the liquid outlet comprises: A hollow box body (30), the liquid inlet cavity (31) is a cavity inside the hollow box body (30), the length of the hollow box body (30) along the width direction of the transmembrane channel (11) is greater than the width of the transmembrane channel (11) and less than the width of the bottom of the electroplating tank (10) along the width direction of the transmembrane channel (11), and the liquid outlet (32) is arranged at at least one end of the hollow box body (30) along the width direction of the transmembrane channel (11).

4. The electroplating equipment according to claim 3, characterized in that: The hollow box body (30) has a first end face (33) and a second end face (34) along the width direction of the transmembrane channel (11), and the liquid outlet (32) includes a plurality of liquid outlets (32), which are arranged on at least one of the first end face (33) and the second end face (34).

5. The electroplating equipment according to claim 3, characterized in that: The hollow box body (30) comprises a rectangular hollow box body, the rectangular hollow box body is arranged at the bottom of the electroplating tank (10), and the length direction of the rectangular hollow box body is parallel to the width direction of the membrane-penetrating channel (11).

6. The electroplating equipment according to any one of claims 4 to 5, characterized in that: The electroplating tank (10) comprises a first side (12) and a second side (13) which are arranged opposite to each other along the length direction of the transmembrane channel (11), and the hollow box body (30) comprises at least two, and at least two of the hollow box bodies (30) are respectively arranged on the first side (12) and the second side (13).

7. The electroplating equipment according to any one of claims 1 to 5, characterized in that: The liquid outlet member is also provided with a liquid inlet channel (35), the liquid inlet channel (35) being in communication with the liquid inlet cavity (31); and / or the cross-sectional area of ​​the liquid inlet channel (35) is greater than the cross-sectional area of ​​the liquid outlet (32).

8. The electroplating equipment according to claim 7, characterized in that: Also includes: A liquid inlet valve is arranged on the liquid inlet channel (35), and is used to control the flow rate of the electroplating solution entering the liquid inlet chamber (31).

9. The electroplating equipment according to claim 8, characterized in that: The electroplating equipment also includes: A plating liquid conveying device is used to convey the electroplating liquid along the liquid inlet channel (35) into the liquid inlet cavity (31).

10. The electroplating equipment according to claim 9, characterized in that: The plating solution conveying device comprises: A liquid storage tank, wherein the liquid storage tank stores electroplating liquid; a transmission pipeline, one end of which is disposed in the liquid storage tank and the other end of which is connected to the liquid inlet channel (35); An infusion pump is arranged on the transmission pipeline.

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