Chip water-cooling heat dissipation structure

Abstract

The utility model discloses a chip water-cooling heat radiation structure, comprising an upper cold plate and a lower cold plate which are formed by punching a thin plate, and the upper cold plate and the lower cold plate form a cold plate structure; the lower cooling plate is arranged below the upper cooling plate in a sealed mode and forms a cooling cavity in a surrounding mode, the upper cooling plate is provided with a refrigerant inlet and a refrigerant outlet which are communicated with the cooling cavity, and the lower cooling plate is attached to the surface of the chip. A double-thin-plate type cold plate structure is adopted, the cold plate structure composed of an upper cold plate and a lower cold plate is attached to the upper end face of a chip, and heat of the chip is conducted to the cold plate structure. Cooling liquid is injected into the cooling cavity through the refrigerant inlet to cool the whole cold plate structure and then is discharged out of the refrigerant outlet, the cooling liquid continuously flows in and out to cool the cold plate structure, then chip heat dissipation is achieved, and therefore efficient and stable heat dissipation and precise refrigeration are achieved.

Description

Technical Field

[0001] The utility model belongs to the technical field of liquid cooling servers and relates to a chip water cooling heat dissipation structure. Background Art

[0002] With the vigorous development of my country's digital economy, the demand for AI and intelligent computing is growing rapidly, new digital applications are changing with each passing day, and diverse computing infrastructure such as high-density and high-computing power is continuing to develop. At the same time, under the macro situation of "dual carbon", government departments are increasingly strict in supervising the PUE (power utilization efficiency) of data centers.

[0003] Traditional radiators use air cooling to dissipate heat. High-power chips require large radiators to barely dissipate heat. They cannot meet the cooling requirements of chips above 450W. The cooling efficiency is unstable, and the chip is prone to over-temperature alarms, affecting the chip function. The use of large radiators leads to heavy weight, which cannot meet the development trend of high volume power density of servers. When used in servers, the weight of a single server module increases, and it is time-consuming and labor-intensive to carry, install, and plug and unplug, affecting the competitiveness of the product. When the chip uses a radiator, a fan must be installed to force the heat to be conducted out. Therefore, it is necessary to reserve space for the fan installation, and the fan generates a lot of noise, affecting the use environment.

[0004] Therefore, the traditional air-cooling heat dissipation method can no longer meet the requirements of high-density cabinets, chip-level precision cooling, higher energy saving, lower land saving and lower noise. Utility Model Content

[0005] The utility model aims to provide a chip water-cooling heat dissipation structure, which adopts a double-sheet thin-plate cold plate structure to solve the problems existing in traditional air-cooling radiators.

[0006] The purpose of the utility model is achieved through the following technical solutions:

[0007] A chip water-cooling heat dissipation structure adopts a double-sheet thin-plate cold plate structure, including an upper cold plate and a lower cold plate formed by stamping thin plates, the upper cold plate and the lower cold plate constitute a cold plate structure; the lower cold plate is sealed and arranged below the upper cold plate to enclose a cooling cavity, a refrigerant inlet and a refrigerant outlet connected to the cooling cavity are arranged on the upper cold plate, and the lower cold plate is arranged in contact with the chip surface.

[0008] As a further improvement of an embodiment of the utility model, a liquid flow channel connecting a refrigerant inlet and a refrigerant outlet is provided in the cooling cavity, and a heat dissipation component is provided in the liquid flow channel.

[0009] As a further improvement of an embodiment of the utility model, the heat dissipation component includes a plurality of PIN columns, and the gaps between two adjacent PIN columns are distributed throughout the cooling cavity.

[0010] As a further improvement of an embodiment of the utility model, the PIN column is integrally formed with the lower cold plate by forging. The function of the PIN column is to increase the heat dissipation area and increase the contact with the cold medium (cooling liquid), and quickly take away the heat from the chip heat source through the flow of the liquid.

[0011] As a further improvement of an embodiment of the utility model, the PIN column is a cylindrical structure, and each of the PIN columns is the same.

[0012] As a further improvement of an embodiment of the utility model, the cooling cavity is formed by stamping in the middle of the upper cold plate, the lower cold plate is arranged on the upper cold plate to cover the cooling cavity, and the lower cold plate is sealed on the upper cold plate by welding.

[0013] As a further improvement of an embodiment of the utility model, a first through hole is provided at the corner of the upper cold plate, and a second through hole corresponding to the first through hole is provided on the lower cold plate, and the first through hole and the second through hole cooperate to be used for installation and positioning of the cold plate structure.

[0014] As a further improvement of an embodiment of the utility model, the lower cold plate is welded by brazing.

[0015] The above technical solution has the following beneficial effects:

[0016] 1. The double-sheet thin-plate cold plate structure is adopted. The chip is close to the lower cold plate. The cold plate structure is designed with a liquid flow channel inside. The flow channel is densely covered with PIN columns for heat dissipation. When the liquid flows through, the heat of the high-power chip can be quickly transferred out over a large area, thereby achieving efficient and stable heat dissipation and precise cooling;

[0017] 2. The cold plate structure is composed of only two thin plates, which greatly reduces the space volume, so that the height design of the server chassis is not limited by the chip heat dissipation structure, thereby realizing the development trend of high volume power density of chips in server applications and arranging more servers in the cabinet level of the same space volume, greatly improving the space utilization of the data center;

[0018] 3. The cold plate structure only has the weight of its own materials, which greatly reduces the weight of a single chip when used in the server, saving time and effort during transportation, installation, and plugging, and realizing the lightweight design requirements of the server chassis module;

[0019] 4. The chip water cooling does not require fan support, which can achieve zero fan noise and improve product competitiveness. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] In order to more clearly illustrate the implementation of the utility model or the technical solution in the prior art, the following is a brief introduction to the drawings required for the implementation or the prior art description. Obviously, the drawings in the following description are only exemplary, and for ordinary technicians in this field, other implementation drawings can be derived from the provided drawings without creative work.

[0021] The structures, proportions, sizes, etc. illustrated in this specification are only used to match the contents disclosed in the specification so as to facilitate understanding and reading by persons familiar with the technology. They are not used to limit the conditions under which the present invention can be implemented, and therefore have no substantial technical significance. Any structural modification, change in proportion or adjustment of size shall still fall within the scope of the technical contents disclosed in the present invention without affecting the effects and purposes that can be achieved by the present invention.

[0022] Figure 1 The present invention is a three-dimensional structural schematic diagram.

[0023] Figure 2 The utility model provides a schematic diagram of the explosion structure.

[0024] Figure 3 This is a schematic diagram of the main structure provided by the utility model.

[0025] Figure 4 This is a schematic diagram of the three-dimensional structure of the upper cold plate provided by the utility model.

[0026] In the figure: 1-upper cold plate; 2-lower cold plate; 3-cooling chamber; 4-refrigerant inlet; 5-refrigerant outlet; 6-chip; 7-PCB board; 8-PIN column; 9-first through hole; 10-second through hole. DETAILED DESCRIPTION

[0027] It should be noted that, in the absence of conflict, the embodiments and features in the embodiments of the present application can be combined with each other. The present utility model will be described in detail below with reference to the accompanying drawings and in combination with the embodiments.

[0028] It should be noted that, unless otherwise specified, all technical and scientific terms used in this application have the same meanings as commonly understood by ordinary technicians in the technical field to which this application belongs.

[0029] In the present invention, unless otherwise specified, the directional words used, such as "up, down, top, bottom", usually refer to the directions shown in the drawings, or to the components themselves in the vertical, perpendicular or gravity directions; similarly, for ease of understanding and description, "inside and outside" refer to the inside and outside relative to the outline of each component itself, but the above-mentioned directional words are not used to limit the present invention. Example

[0030] See also Figure 1-Figure 4 As shown, a chip water-cooling heat dissipation structure adopts a double-sheet thin plate cold plate structure, including an upper cold plate 1 and a lower cold plate 2 formed by stamping of thin plates, and the upper cold plate 1 and the lower cold plate 2 form a cold plate structure. The lower cold plate 2 is sealed and arranged below the upper cold plate 1 to enclose a cooling cavity 3, and the upper cold plate 1 is provided with a refrigerant inlet 4 and a refrigerant outlet 5 connected to the cooling cavity 3. When in use, the lower end surface of the lower cold plate 2 is attached to the upper surface of the chip 6. In actual application, the chip 6 is mounted on the PCB board 7 and is a major heat source on the PCB board 7. By attaching the cold plate structure composed of the upper cold plate 1 and the lower cold plate 2 to the upper end surface of the chip 6, the heat of the chip 6 is conducted to the cold plate structure. Coolant is injected into the cooling cavity 3 through the refrigerant inlet 4 to cool the entire cold plate structure and then discharged from the refrigerant outlet 5. The coolant continues to flow in and out to cool the cold plate structure, thereby achieving heat dissipation of the chip 6.

[0031] In order to improve the heat dissipation capacity of the cold plate structure in this embodiment, a liquid flow channel connecting the refrigerant inlet 4 and the refrigerant outlet 5 is provided in the cooling chamber 3, and a heat dissipation component is provided in the liquid flow channel. Since the cooling chamber 3 is not partitioned in this embodiment, the entire cooling chamber can be used as a liquid flow channel.

[0032] Specifically, in this embodiment, the heat dissipation components are a plurality of PIN columns 8. The PIN columns 8 are centrally arranged on the lower cold plate 2, and the upper cold plate 1 is stamped to form a cooling cavity 3. When the lower cold plate 2 is sealed on the upper cold plate 1 by welding, the PIN columns 8 all fall into the cooling cavity 3.

[0033] Furthermore, the PIN column 8 and the lower cold plate 2 are forged into one piece, and the gap between two adjacent PIN columns 8 is distributed throughout the cooling cavity 3, thereby maximizing the heat transfer from the chip 6 to the coolant in the cooling cavity 3 and quickly cooling the chip.

[0034] Preferably, the PIN column 8 in this embodiment is a cylindrical structure, and each of the PIN columns 8 is identical and equidistant between adjacent ones.

[0035] Of course, in addition to being arranged on the lower cold plate 2, the PIN column 8 can also be welded and arranged in the cooling cavity 3 of the upper cold plate 1. Although its heat conduction effect is worse than that of being fixed on the lower cold plate 2, and it cannot quickly conduct the heat on the chip, it can also conduct the heat on the cold plate structure to the coolant in the cooling cavity 3 to achieve chip cooling.

[0036] In this embodiment, the cooling cavity 3 is formed by stamping in the middle of the upper cold plate 1, and the refrigerant inlet 4 and the refrigerant outlet 5 are distributed on both sides of the cooling cavity 3. When the lower cold plate 2 is arranged on the upper cold plate 1, the cooling cavity 3 is covered, and the lower cold plate 2 is sealed on the upper cold plate 1 by welding.

[0037] Furthermore, the lower cold plate 2 may be welded to the upper cold plate 1 by brazing to achieve a sealed welding of the two, thereby ensuring that the coolant in the cooling cavity 3 does not escape from the gap between the lower cold plate 2 and the upper cold plate 1 .

[0038] In order to facilitate the positioning of the cold plate structure and enable it to be better installed on the chip 6, a first through hole 9 is provided at the corner of the upper cold plate 1, and a second through hole 10 corresponding to the first through hole 9 is provided on the lower cold plate 2. The above-mentioned first through hole 9 and the second through hole 10 are used for installation and positioning of the cold plate structure.

[0039] In summary, the embodiments of the present invention achieve the following technical effects:

[0040] By adopting a double-thin plate cold plate structure, the chip is close to the lower cold plate. The cold plate structure is designed with a liquid flow channel inside, and the flow channel is densely covered with heat-dissipating PIN columns. When the liquid flows through, the heat of the high-power chip can be quickly conducted away over a large area, thereby achieving efficient and stable heat dissipation and precise cooling.

[0041] At the same time, the cold plate structure is composed of only two thin plates, which greatly reduces the space volume and makes the server chassis height design not restricted by the chip heat dissipation structure, thereby realizing the development trend of high volume power density of chips in server applications and the layout of more servers in the cabinet level of the same space volume, greatly improving the space utilization of the data center.

[0042] Since the cold plate structure only has its own material weight, when it replaces the original air cooling structure, the weight of a single chip in the server is greatly reduced, saving time and effort during transportation, installation, and plugging, and achieving the design requirements of lightweight server chassis modules. At the same time, the chip water cooling does not require fans, which can achieve zero fan noise and improve product competitiveness.

[0043] Obviously, the embodiments described above are only some embodiments of the utility model, not all embodiments. Based on the embodiments in the utility model, all other embodiments obtained by ordinary technicians in this field without creative work should fall within the scope of protection of the utility model.

[0044] It should be noted that the terms used herein are only for describing specific embodiments and are not intended to limit the exemplary embodiments according to the present application. As used herein, unless the context clearly indicates otherwise, the singular form is also intended to include the plural form. In addition, it should be understood that when the terms "comprise" and / or "include" are used in this specification, it indicates the presence of features, steps, operations, devices, components and / or combinations thereof.

[0045] It should be noted that the terms "first", "second", etc. in the specification and claims of the present application and the above-mentioned drawings are used to distinguish similar objects, and are not necessarily used to describe a specific order or sequence. It should be understood that the numbers used in this way can be interchanged where appropriate, so that the embodiments of the present application described herein can be implemented in an order other than those illustrated or described herein.

[0046] The above description is only the preferred embodiment of the utility model, and is not intended to limit the utility model. For those skilled in the art, the utility model can have various modifications and changes. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the utility model shall be included in the protection scope of the utility model.

Claims

1. A chip water cooling heat dissipation structure, characterized in that: It includes an upper cold plate and a lower cold plate which are formed by stamping of thin plates, and the upper cold plate and the lower cold plate form a cold plate structure; the lower cold plate is sealed and arranged below the upper cold plate to enclose a cooling cavity, and a refrigerant inlet and a refrigerant outlet which are connected to the cooling cavity are arranged on the upper cold plate, and the lower cold plate is arranged in contact with the chip surface; a liquid flow channel which is connected to the refrigerant inlet and the refrigerant outlet is arranged in the cooling cavity, and a heat dissipation component is arranged in the liquid flow channel.

2. The chip water cooling and heat dissipation structure according to claim 1 is characterized in that: The heat dissipation component includes a plurality of PIN columns, and the gaps between two adjacent PIN columns are distributed throughout the cooling cavity.

3. The chip water cooling and heat dissipation structure according to claim 2 is characterized in that: The PIN column and the lower cold plate are forged into one piece.

4. The chip water cooling and heat dissipation structure according to claim 3 is characterized in that: The PIN column is a cylindrical structure, and each of the PIN columns is the same.

5. The chip water cooling and heat dissipation structure according to claim 1 is characterized in that: The cooling cavity is formed by stamping in the middle of the upper cold plate, the lower cold plate is arranged on the upper cold plate to cover the cooling cavity, and the lower cold plate is sealed on the upper cold plate by welding.

6. The chip water cooling and heat dissipation structure according to claim 5, characterized in that: A first through hole is provided at a corner of the upper cold plate, and a second through hole corresponding to the first through hole is provided on the lower cold plate. The first through hole and the second through hole cooperate to be used for installation and positioning of the cold plate structure.

7. The chip water cooling and heat dissipation structure according to claim 5 or 6, characterized in that: The lower cold plate is welded by brazing.

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