Integrated circuit chip burning positioning device

Abstract

The utility model discloses an integrated circuit chip burning positioning device, which comprises a working table connected with a protective frame; the positioning plate is arranged in the protection frame, and the positioning plate is connected with a vacuum negative pressure pump through an exhaust pipe; and the negative pressure cavity is formed in the positioning plate, and the negative pressure cavity is connected with an exhaust pipe. According to the integrated circuit chip burning positioning device, the vacuum negative pressure pump is controlled to work, a negative pressure cavity in the positioning plate can be subjected to air exhaust through an air exhaust pipe, so that a chip above can be subjected to negative pressure adsorption and fixation through a negative pressure hole formed in a positioning convex plate, clamping and fixing of the positioning plate are not needed, and the working efficiency is improved. The chip clamping device has the advantages that the chip clamping device is simple in structure, chip damage caused by too large clamping force and unstable clamping caused by too small clamping force are avoided, after machining is completed, the vacuum negative pressure pump stops working, the electric telescopic rod is controlled to work, the jacking plate can be driven to ascend, the chip above the jacking plate is jacked, the chip is jacked out of the protection frame, and the chip can be taken out conveniently.

Description

Technical Field

[0001] The utility model relates to the technical field of integrated circuit processing equipment, in particular to an integrated circuit chip burning and positioning device. Background Art

[0002] A chip is a silicon wafer containing an integrated circuit, which is used to complete calculations and process tasks. Chips are used in our daily lives in mobile phones, computers, televisions, home appliances and other fields, and are the core cornerstone of high-end manufacturing. After the chip is manufactured, it needs to be flashed with software. This process is called burning, also called firmware. When burning the chip, special burning equipment is required. The chip burning process has high requirements for the accuracy of the chip placement, so the chip needs to be positioned during burning.

[0003] CN219609622U discloses a chip burning positioning structure, comprising a support plate, the bottom of the support plate is fixedly connected to a support leg, the top of the support plate is fixedly connected to a burning rack, a first electric telescopic rod is installed on the top of the burning rack, a burning assembly is installed on the bottom of the output shaft of the first electric telescopic rod, a positioning platform is arranged below the burning assembly, a positioning groove is arranged inside the positioning platform, a through hole is arranged on the side wall around the positioning platform, a pull rod is inserted into the through hole, one end of the pull rod is fixedly connected to a pull ring, and the other end of the pull rod is fixedly connected to the positioning plate, a spring is fixedly connected between the positioning plate and the groove wall of the positioning groove, a material taking port is arranged at the bottom of the positioning groove, a material taking mechanism is arranged below the material taking port, and a dust cover is installed on the top connection part of the positioning platform. The positioning structure can realize simultaneous positioning of the chip from multiple angles through the positioning plate during burning, but due to the existence of the positioning plate, when the chip is clamped by the positioning plate, it is difficult to determine whether the clamping force of the positioning plate is sufficient, if the clamping force is too large, the chip is easily damaged, and if the clamping force is too small, the clamping is easily unstable. Utility Model Content

[0004] The utility model aims to solve the shortcomings existing in the prior art, and proposes an integrated circuit chip burning and positioning device, comprising: a workbench, the workbench is connected with a protective frame; a positioning plate, the positioning plate is arranged inside the protective frame, and the positioning plate is connected to a vacuum negative pressure pump through an exhaust pipe; a negative pressure chamber, the negative pressure chamber is opened inside the positioning plate, and the negative pressure chamber is connected to the exhaust pipe; a positioning convex plate, a plurality of the positioning convex plates are arranged on the positioning plate, and a negative pressure hole is opened on the positioning convex plate; a lifting assembly, the lifting assembly is connected to the workbench; a pressure relief groove is formed between adjacent positioning convex plates, and a through hole is opened in the middle of the positioning plate; the lifting assembly comprises a mounting frame, the mounting frame is connected to the bottom of the workbench, an electric telescopic rod is arranged inside the mounting frame, a lifting plate is connected above the electric telescopic rod, and the electric telescopic rod is located in the through hole.

[0005] As a further description of the above technical solution: the upper part of the protection frame is rotatably connected to the sealing cover through a hinge, and an observation window is arranged on the protection frame.

[0006] As a further description of the above technical solution: a first connecting plate is provided on one side of the protective frame, and the first connecting plate is detachably connected to the workbench through a first bolt.

[0007] As a further description of the above technical solution: second connecting plates are provided on both sides of the positioning plate, and the second connecting plates are detachably connected to the protective frame through second bolts.

[0008] As a further description of the above technical solution: the connection between the installation frame and the workbench is a detachable connection.

[0009] As a further description of the above technical solution: two exhaust pipes are provided and are located in the middle of both sides of the positioning plate.

[0010] As a further description of the above technical solution: a plurality of positioning protrusions are arranged at equal intervals, and each of the positioning protrusions is provided with at least one negative pressure hole.

[0011] The above technical solution has the following advantages or beneficial effects:

[0012] The utility model controls the operation of the vacuum negative pressure pump to evacuate the negative pressure cavity inside the positioning plate through the exhaust pipe, so that the chip above can be fixed by negative pressure adsorption through the negative pressure hole provided on the positioning convex plate, and there is no need for the positioning plate to clamp and fix it, thereby avoiding damage to the chip caused by excessive clamping force and unstable clamping caused by insufficient clamping force. After the processing is completed, the vacuum negative pressure pump stops working and controls the operation of the electric telescopic rod to drive the lifting plate to rise, lift the chip above it, and lift the chip out of the protective frame, so that the chip can be easily taken out. BRIEF DESCRIPTION OF THE DRAWINGS

[0013] Figure 1 This is a schematic diagram of the structure of a chip burning and positioning device in one embodiment of the utility model;

[0014] Figure 2 A cross-sectional view of a chip burning and positioning device in one embodiment of the utility model;

[0015] Figure 3 for Figure 1 Schematic diagram of the internal structure of the protective frame in the chip burning and positioning device;

[0016] Figure 4 for Figure 1 Schematic diagram of the structure of the positioning board in the chip burning positioning device.

[0017] Legend:

[0018] 1. Workbench; 2. Protection frame; 3. Positioning plate; 4. Exhaust pipe; 5. Vacuum negative pressure pump; 6. Negative pressure chamber; 7. Positioning convex plate; 8. Negative pressure hole; 9. Lifting assembly; 10. Pressure relief groove; 11. Through hole; 12. Sealing cover; 13. Observation window; 14. First connecting plate; 15. First bolt; 16. Second connecting plate; 17. Second bolt; 91. Mounting frame; 92. Electric telescopic rod; 93. Lifting plate. DETAILED DESCRIPTION

[0019] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

[0020] In the description of the present invention, it should be noted that the terms "vertical", "up", "down", "horizontal", etc. indicate orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the present invention.

[0021] In the description of the present invention, it is also necessary to explain that, unless otherwise clearly specified and limited, the terms "set", "set", "connected", and "connected" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection, or it can be indirectly connected through an intermediate medium, or it can be the internal communication of two components. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0022] See also Figure 1-4The utility model provides a technical solution: an integrated circuit chip burning positioning device of the utility model comprises: a workbench 1, a protective frame 2 is connected to the workbench 1; a positioning plate 3, the positioning plate 3 is arranged inside the protective frame 2, and the positioning plate 3 is connected to a vacuum negative pressure pump 5 through an exhaust pipe 4; a negative pressure chamber 6, the negative pressure chamber 6 is arranged inside the positioning plate 3, and the negative pressure chamber 6 is connected to the exhaust pipe 4; a positioning convex plate 7, a plurality of positioning convex plates 7 are arranged on the positioning plate 3, and a negative pressure hole 8 is opened on the positioning convex plate 7; a lifting assembly 9, the lifting assembly 9 is connected to the workbench 1; a pressure relief groove 10 is formed between adjacent positioning convex plates 7, and a through hole 11 is opened in the middle of the positioning plate 3; the lifting assembly 9 comprises a mounting frame 91, the mounting frame 91 is connected to the bottom of the workbench 1, an electric telescopic rod 92 is arranged inside the mounting frame 91, a lifting plate 93 is connected above the electric telescopic rod 92, and the electric telescopic rod 92 is located in the through hole 11.

[0023] In this embodiment, by controlling the operation of the vacuum negative pressure pump 5, the negative pressure chamber 6 inside the positioning plate 3 can be evacuated through the exhaust pipe 4, so that the chip above can be negatively adsorbed and fixed through the negative pressure hole 8 provided on the positioning convex plate 7, without the need for positioning plate clamping and fixing, thereby avoiding damage to the chip due to excessive clamping force and unstable clamping due to insufficient clamping force. After the processing is completed, the vacuum negative pressure pump 5 stops working and controls the electric telescopic rod 92 to work, which can drive the lifting plate 93 to rise, lift the chip above it, and lift the chip out of the protective frame 2, making it convenient to take out the chip.

[0024] Among them, under normal circumstances, due to the poor flatness of the back of the chip, air leakage will occur between the negative pressure hole 8. At this time, the negative pressure generated by the air leakage will enter the interior of the chip. Since the membrane structure on the chip is not resistant to high pressure, the negative pressure generated by the air leakage will affect the membrane structure on the chip, and even damage the membrane structure. For this reason, a pressure relief groove 10 is formed between adjacent positioning convex plates 7. In actual use, once air leakage occurs between the back of the chip and the negative pressure hole 8, the negative pressure generated by the air leakage will be dispersed to the outside through the negative pressure hole 8 in the first time, thereby avoiding interference with the membrane structure on the chip.

[0025] In addition, it should be noted that, in actual use, although air leakage may occur between the back of the chip and the negative pressure hole 8, the negative pressure that the negative pressure hole 8 can provide can be adjusted by an external vacuum negative pressure pump 5. Therefore, even if there is a small amount of air leakage, the required adsorption force can still be generated on the back of the chip through the negative pressure hole 8, thereby ensuring that the chip is stably fixed.

[0026] like Figure 1 and Figure 2As shown, specifically, the top of the protection frame 2 is rotatably connected to the sealing cover 12 by a hinge, and an observation window 13 is provided on the protection frame 2; the positioning plate 3 can be protected by the protection frame 2, and the positioning plate 3 can be sealed by the sealing cover 12 to prevent dust from falling in when not in use.

[0027] like Figure 1 and Figure 2 As shown, specifically, a first connecting plate 14 is provided on one side of the protective frame 2, and the first connecting plate 14 is detachably connected to the workbench 1 through a first bolt 15; the first bolt 15 facilitates the installation and disassembly of the protective frame 2 on the workbench 1, and facilitates the maintenance and replacement of the protective frame 2.

[0028] like Figure 2 and Figure 3 As shown, specifically, second connecting plates 16 are provided on both sides of the positioning plate 3, and the second connecting plates 16 are detachably connected to the protective frame 2 through second bolts 17; the second bolts 17 facilitate installation and disassembly of the positioning plate 3 in the protective frame 2, and facilitate maintenance and replacement of the positioning plate 3.

[0029] like Figure 1 and Figure 2 As shown, specifically, the connection between the mounting frame 91 and the workbench 1 is a detachable connection; through the detachable connection between the mounting frame 91 and the workbench 1, it is convenient to install and disassemble the electric telescopic rod 92 and the lifting plate 93, and it is convenient to repair and replace the electric telescopic rod 92 and the lifting plate 93.

[0030] like Figure 2 and Figure 3 As shown, specifically, two exhaust pipes 4 are provided and are located in the middle of both sides of the positioning plate 3; by adopting two exhaust pipes 4, the exhaust efficiency can be accelerated, and by arranging the exhaust ports of the exhaust pipes 4 in the middle of both sides of the positioning plate 3, all-round exhaust can be quickly achieved in the positioning plate 3.

[0031] like Figure 3 and Figure 4 As shown, specifically, a plurality of positioning protrusions 7 are arranged at equal intervals, and each positioning protrusion 7 is provided with at least one negative pressure hole 8; to ensure stable adsorption of the chip by the negative pressure hole 8, the air suction hole 6 usually needs to correspond to the upper and lower positions of the center position of the chip unit on the chip. Due to the existence of the pressure relief groove 10, the negative pressure generated by the deflation will inevitably contact the pressure relief groove 10 before entering the membrane structure inside the chip, thereby neutralizing the negative pressure in time to avoid damaging the chip.

[0032] Working principle: the staff controls the vacuum negative pressure pump 5 to evacuate the negative pressure chamber 6 inside the positioning plate 3 through the exhaust pipe 4, so that the chip above can be fixed by negative pressure adsorption through the negative pressure hole 8 provided on the positioning convex plate 7, without the need for positioning plate clamping and fixing, to avoid chip damage caused by excessive clamping force and unstable clamping caused by insufficient clamping force. After the processing is completed, the vacuum negative pressure pump 5 stops working and controls the electric telescopic rod 92 to work, which can drive the lifting plate 93 to rise, lift the chip above it, and lift the chip out of the protective frame 2, so as to facilitate the removal of the chip.

[0033] It should be noted that, in this article, relational terms such as first and second, etc. are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Moreover, the terms "include", "comprise" or any other variants thereof are intended to cover non-exclusive inclusion, so that a process, method, article or device including a series of elements includes not only those elements, but also other elements not explicitly listed, or also includes elements inherent to such process, method, article or device.

[0034] The preferred embodiments of the utility model disclosed above are only used to help explain the utility model. The preferred embodiments do not describe all the details in detail, nor do they limit the utility model to the specific implementation methods described. Obviously, many modifications and changes can be made according to the content of this specification. This specification selects and specifically describes these embodiments in order to better explain the principles and practical applications of the utility model, so that technicians in the relevant technical field can well understand and use the utility model. The utility model is limited only by the claims and their full scope and equivalents.

Claims

1. An integrated circuit chip programming and positioning device, characterized in that: include: A workbench (1), wherein a protective frame (2) is connected to the workbench (1); A positioning plate (3), wherein the positioning plate (3) is arranged inside the protective frame (2), and the positioning plate (3) is connected to a vacuum negative pressure pump (5) via an exhaust pipe (4); A negative pressure chamber (6), wherein the negative pressure chamber (6) is disposed inside the positioning plate (3), and the negative pressure chamber (6) is connected to the air extraction pipe (4); Positioning convex plates (7), a plurality of said positioning convex plates (7) are arranged on said positioning plate (3), and said positioning convex plates (7) are provided with negative pressure holes (8); A lifting assembly (9), wherein the lifting assembly (9) is connected to the workbench (1); A pressure relief groove (10) is formed between adjacent positioning convex plates (7), and a through hole (11) is opened in the middle of the positioning plate (3); The lifting assembly (9) comprises a mounting frame (91), the mounting frame (91) being connected to the bottom of the workbench (1), an electric telescopic rod (92) being arranged inside the mounting frame (91), a lifting plate (93) being connected above the electric telescopic rod (92), and the electric telescopic rod (92) being located in the through hole (11).

2. The integrated circuit chip programming and positioning device according to claim 1, characterized in that: The top of the protection frame (2) is rotatably connected to the sealing cover (12) via a hinge, and an observation window (13) is provided on the protection frame (2).

3. The integrated circuit chip programming and positioning device according to claim 1, characterized in that: A first connecting plate (14) is provided on one side of the protection frame (2), and the first connecting plate (14) is detachably connected to the workbench (1) via a first bolt (15).

4. The integrated circuit chip programming and positioning device according to claim 1, characterized in that: Second connecting plates (16) are provided on both sides of the positioning plate (3), and the second connecting plates (16) are detachably connected to the protection frame (2) via second bolts (17).

5. The integrated circuit chip programming and positioning device according to claim 1, characterized in that: The installation frame (91) and the workbench (1) are connected in a detachable manner.

6. The integrated circuit chip programming and positioning device according to claim 1, characterized in that: Two air extraction pipes (4) are provided and are located in the middle of both sides of the positioning plate (3).

7. The integrated circuit chip programming and positioning device according to claim 1, characterized in that: A plurality of positioning convex plates (7) are arranged at equal intervals, and each positioning convex plate (7) is provided with at least one negative pressure hole (8).

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