High-precision chip etching device

Abstract

The utility model relates to the technical field of chip etching, in particular to a high-precision chip etching device which comprises a bottom plate, the top of the bottom plate is fixedly connected with a supporting plate, the surface of the supporting plate is fixedly connected with a water collecting box, the side face of the water collecting box abuts against a first valve, a rack is connected into the bottom plate in a sliding mode, and a driving motor is installed at the top of the bottom plate. The output end of the driving motor is fixedly connected with a gear which is meshed with the rack; through cooperative use of a driving motor, a gear, a rack, an electric telescopic rod, a side plate, a brush, a water tank, a water pump and a spray head, after the surface of a chip is etched, water in the water tank can be sprayed to the surface of the chip through the spray head, and through the meshing effect of the gear and the rack, the side plate and the brush are driven to move circularly, so that the surface of the chip is etched. And meanwhile, the electric telescopic rod drives the side plate to move up and down circularly, so that the etching liquid can be thoroughly removed from the surface of the semiconductor plate, the cleanliness of the surface of the semiconductor plate is improved, and the chip etching precision can be improved.

Description

Technical Field

[0001] The utility model relates to the technical field of chip etching, in particular to a high-precision chip etching device. Background Art

[0002] The semiconductor manufacturing process is complex and tedious, and a large amount of equipment is required in the semiconductor manufacturing process. Among them, etching equipment is extremely important equipment in the semiconductor manufacturing process. Etching is mainly divided into wet etching and dry etching according to the process. Wet etching is favored by chip manufacturers because of its strong adaptability, little damage to silicon wafers, and wide application. Wet etching is usually used in some applications with larger process sizes.

[0003] A chip etching device with the Chinese authorization announcement number CN219917127U supports and places the wafer by setting a circular groove-shaped rotating groove, and the rotating groove can be driven to rotate and drive the wafer to rotate together. During the etching process, it can ensure that a certain flushing force is generated between the etching liquid and the wafer, and the etched material can be flushed away in time, ensuring that the etching liquid can fully corrode the part of the wafer surface that needs to be removed, ensuring sufficient etching effect on the chip wafer.

[0004] There are still certain shortcomings in use. After etching the chip, the etching solution still remains on the surface of the chip. If the etching solution cannot be removed from the chip surface in time, the chip will be damaged. In addition, impurities contained in the etching solution will also adhere to the surface of the chip, thereby affecting the quality of the chip during manufacturing. Utility Model Content

[0005] The purpose of the utility model is to provide a high-precision chip etching device to solve the problem raised in the above-mentioned background technology that after the chip is etched, the etching liquid still remains on the surface of the chip and the etching liquid cannot be removed from the chip surface in time, which will cause damage to the chip, and the impurities contained in the etching liquid will also adhere to the surface of the chip, thereby affecting the quality of the chip during manufacturing.

[0006] In order to achieve the above purpose, the utility model provides the following technical solutions:

[0007] A high-precision chip etching device comprises a base plate, the top of the base plate is fixedly connected to a support plate, the surface of the support plate is fixedly connected to a water collecting box, the side of the water collecting box abuts against a first valve, a rack is slidably connected inside the base plate, a driving motor is installed on the top of the base plate, the output end of the driving motor is fixedly connected to a gear, the gear and the rack are meshed, an electric telescopic rod is fixedly connected to the side of the rack, the top of the electric telescopic rod is fixedly connected to a side plate, the inner wall of the side plate is fixedly connected to a brush, the side of the support plate is fixedly connected to a water tank, the surface of the water tank abuts against a connecting cover, and a water pump is installed on the top of the water tank.

[0008] As a preferred solution of the utility model, a nozzle is fixedly connected to the side of the water pump, one end of the nozzle extends into the water tank, and the other end of the nozzle is arranged on the side of the water collecting box.

[0009] As a preferred solution of the utility model, a cylinder is installed on the top of the support plate, a telescopic tube is fixedly connected to the side of the cylinder, and a connecting plate is fixedly connected to the bottom of the telescopic tube.

[0010] As a preferred solution of the utility model, a groove is provided at the bottom of the connecting plate, a friction plate is fixedly connected in the groove, a semiconductor plate is arranged in the groove, and the friction plate abuts against the semiconductor plate.

[0011] As a preferred solution of the utility model, an etching box is fixedly connected to the top of the support plate, and a second valve is abutted against the outer surface of the etching box.

[0012] As a preferred solution of the utility model, a universal wheel is arranged at the bottom of the base plate, and the universal wheel is movably connected to the base plate.

[0013] As a preferred solution of the utility model, a plurality of the brushes are provided, and the plurality of the brushes are evenly distributed on the inner wall of the side plate, and the plurality of the brushes have the same size.

[0014] As a preferred solution of the utility model, the nozzle and the side plate are respectively arranged on both sides of the water collecting box, and the shape of the nozzle is L-shaped.

[0015] Compared with the prior art, the beneficial effects of the utility model are:

[0016] 1. In the utility model, by setting a driving motor, a gear, a rack, an electric telescopic rod, a side plate, a brush, a water tank, a water pump and a nozzle for coordinated use, when the chip surface is etched, the water in the water tank can be sprayed onto the surface of the chip through the nozzle, and the side plate and the brush are driven to move in a circular motion through the meshing action of the gear and the rack, and the side plate is driven to move up and down in a circular motion through the electric telescopic rod, so that the etching liquid can be completely removed from the surface of the semiconductor board, thereby improving the cleanliness of the surface of the semiconductor board.

[0017] 2. In the utility model, by setting up the cylinder, telescopic tube, connecting plate, semiconductor plate, friction plate and groove for coordinated use, the semiconductor plate can be fixed to the bottom of the connecting plate, and the semiconductor plate can be placed in the etching box through the telescopic tube to etch the surface of the semiconductor plate. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] Figure 1 It is a schematic diagram of the overall structure of the utility model;

[0019] Figure 2 It is a side view structural schematic diagram of the utility model;

[0020] Figure 3 It is a structural schematic diagram of the connection board and the semiconductor board of the utility model;

[0021] Figure 4 It is a structural schematic diagram of the side plate and the brush of the utility model.

[0022] In the figure: 1. bottom plate; 2. universal wheel; 3. rack; 4. driving motor; 5. gear; 6. electric telescopic rod; 7. side plate; 8. brush; 9. etching box; 10. water collecting box; 11. water tank; 12. connecting cover; 13. water pump; 14. nozzle; 15. cylinder; 16. telescopic tube; 17. connecting plate; 18. first valve; 19. second valve; 20. semiconductor plate; 21. support plate; 22. friction plate; 23. groove. DETAILED DESCRIPTION

[0023] The technical solutions in the embodiments of the utility model will be clearly and completely described below in conjunction with the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, rather than all of the embodiments. Based on the embodiments of the utility model, all other embodiments obtained by ordinary technicians in this field without making creative work are within the scope of protection of the utility model.

[0024] For examples, see Figure 1-4 , the utility model provides a technical solution:

[0025] A high-precision chip etching device comprises a base plate 1, a support plate 21 is fixedly connected to the top of the base plate 1, a water collecting box 10 is fixedly connected to the surface of the support plate 21, a first valve 18 is abutted against the side of the water collecting box 10, a rack 3 is slidably connected inside the base plate 1, a drive motor 4 is installed on the top of the base plate 1, a gear 5 is fixedly connected to the output end of the drive motor 4, the gear 5 and the rack 3 are meshed, an electric telescopic rod 6 is fixedly connected to the side of the rack 3, a side plate 7 is fixedly connected to the top of the electric telescopic rod 6, a brush 8 is fixedly connected to the inner wall of the side plate 7, a water tank 11 is fixedly connected to the side of the support plate 21, a connecting cover 12 is abutted against the surface of the water tank 11, and a water pump 13 is installed on the top of the water tank 11.

[0026] In this embodiment, Figure 1 and Figure 4As shown, a nozzle 14 is fixedly connected to the side of the water pump 13, one end of the nozzle 14 extends into the water tank 11, and the other end of the nozzle 14 is arranged on the side of the water collecting box 10. A cylinder 15 is installed on the top of the support plate 21, and a telescopic tube 16 is fixedly connected to the side of the cylinder 15. A connecting plate 17 is fixedly connected to the bottom of the telescopic tube 16. A groove 23 is provided at the bottom of the connecting plate 17, and a friction plate 22 is fixedly connected in the groove 23. A semiconductor plate 20 is arranged in the groove 23, and the friction plate 22 is against the semiconductor plate 20.

[0027] Among them, when the chip surface is etched, the water in the water tank 11 can be sprayed onto the surface of the chip through the nozzle 14, and the side plate 7 and the brush 8 are driven to circulate through the meshing action of the gear 5 and the rack 3. At the same time, the side plate 7 is driven to circulate up and down through the electric telescopic rod 6, so that the etching liquid can be completely removed from the surface of the semiconductor board 20, thereby improving the cleanliness of the surface of the semiconductor board 20.

[0028] In this embodiment, Figure 2 and Figure 3 As shown, the top of the support plate 21 is fixedly connected to the etching box 9, the outer surface of the etching box 9 is abutted against the second valve 19, a universal wheel 2 is provided at the bottom of the base plate 1, and the universal wheel 2 is movably connected to the base plate 1, a plurality of brushes 8 are provided, and the plurality of brushes 8 are evenly distributed on the inner wall of the side plate 7, and the sizes of the plurality of brushes 8 are the same, the nozzle 14 and the side plate 7 are respectively arranged on both sides of the water collecting box 10, and the shape of the nozzle 14 is L-shaped.

[0029] The semiconductor board 20 may be fixed to the bottom of the connecting plate 17 , and the semiconductor board 20 may be placed in the etching box 9 through the telescopic tube 16 , and the surface of the semiconductor board 20 may be etched.

[0030] The working process of the utility model is as follows: when the high-precision chip etching device designed by the present invention is used, the semiconductor plate 20 is placed in the groove 23, and the semiconductor plate 20 is squeezed and fixed by the friction plate 22, and the switch of the cylinder 15 and the telescopic tube 16 is turned on, and the connecting plate 17 and the semiconductor plate 20 are moved to the etching box 9 by the cylinder 15 and the telescopic tube 16, and the semiconductor plate 20 is etched by the etching liquid. When the etching of the semiconductor plate 20 is completed, the semiconductor plate 20 is moved to the water collection box 9 by the cylinder 15 and the telescopic tube 16. The top of the box 10 is then turned on, and the switch of the water pump 13 is turned on. The clean water in the water tank 11 is sprayed onto the surface of the semiconductor board 20 through the nozzle 14 by the water pump 13, and the gear 5 is driven to rotate by the driving motor 4. Through the meshing action between the gear 5 and the rack 3, the rack 3, the electric telescopic rod 6, the side plate 7 and the brush 8 can be driven to move, and the side plate 7 is driven to move up and down by the electric telescopic rod 6, and then the etching liquid on the surface of the semiconductor board 20 can be cleaned by the brush 8, thereby improving the quality of the semiconductor board 20 during manufacturing.

[0031] Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that various changes, modifications, substitutions and variations may be made to the embodiments without departing from the principles and spirit of the present invention, and that the scope of the present invention is defined by the appended claims and their equivalents.

Claims

1. A high-precision chip etching device, comprising a base plate (1), characterized in that: The top of the bottom plate (1) is fixedly connected to a support plate (21), the surface of the support plate (21) is fixedly connected to a water collecting box (10), the side of the water collecting box (10) is abutted against a first valve (18), a rack (3) is slidably connected inside the bottom plate (1), a driving motor (4) is installed on the top of the bottom plate (1), the output end of the driving motor (4) is fixedly connected to a gear (5), the gear (5) and the rack (3) are meshed, an electric telescopic rod (6) is fixedly connected to the side of the rack (3), the top of the electric telescopic rod (6) is fixedly connected to a side plate (7), the inner wall of the side plate (7) is fixedly connected to a brush (8), the side of the support plate (21) is fixedly connected to a water tank (11), the surface of the water tank (11) is abutted against a connection cover (12), and a water pump (13) is installed on the top of the water tank (11).

2. A high-precision chip etching device according to claim 1, characterized in that: A nozzle (14) is fixedly connected to the side of the water pump (13), one end of the nozzle (14) extends into the water tank (11), and the other end of the nozzle (14) is arranged on the side of the water collection box (10).

3. A high-precision chip etching device according to claim 1, characterized in that: A cylinder (15) is installed on the top of the support plate (21), a telescopic tube (16) is fixedly connected to the side of the cylinder (15), and a connecting plate (17) is fixedly connected to the bottom of the telescopic tube (16).

4. A high-precision chip etching device according to claim 3, characterized in that: A groove (23) is provided at the bottom of the connecting plate (17), a friction plate (22) is fixedly connected in the groove (23), a semiconductor plate (20) is arranged in the groove (23), and the friction plate (22) abuts against the semiconductor plate (20).

5. The high-precision chip etching device according to claim 1, characterized in that: The top of the support plate (21) is fixedly connected to an etching box (9), and the outer surface of the etching box (9) is abutted against a second valve (19).

6. A high-precision chip etching device according to claim 1, characterized in that: A universal wheel (2) is provided at the bottom of the base plate (1), and the universal wheel (2) is movably connected to the base plate (1).

7. The high-precision chip etching device according to claim 1, characterized in that: A plurality of the brushes (8) are provided, and the plurality of the brushes (8) are evenly distributed on the inner wall of the side plate (7), and the plurality of the brushes (8) have the same size.

8. A high-precision chip etching device according to claim 2, characterized in that: The spray head (14) and the side plate (7) are respectively arranged on two sides of the water collecting box (10), and the spray head (14) is in an L-shape.

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