Metal super-thick heat dissipation circuit board
By designing metal ultra-thick heat dissipation circuit boards, combined with the installation base, heat dissipation components and protective structure, the problem of insufficient support and heat dissipation capabilities of thick copper printed circuit boards is solved, and effective protection and efficient heat dissipation of large electronic components are achieved.
Patent Information
- Application Number
- CN202420975194.6
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-05-07
- Publication Date
- 2025-01-10
- Estimated Expiration
- 2034-05-07
AI Technical Summary
Existing thick copper printed circuit boards cannot effectively support large electronic components, which are prone to damage and have poor heat dissipation capabilities, resulting in burnout of electronic components.
Design a metal ultra-thick heat dissipation circuit board, which adopts the matching design of the mounting base and the top shell, is embedded in the circuit board body, and installs heat dissipation components on it, including a heat dissipation fan, a heat dissipation fin, a heat dissipation copper tube and a micro water pump. The circulating waterway and external exhaust method improves the heat dissipation effect, and uses springs and silicone washer to protect the circuit board.
Effectively protect the circuit board, avoid board damage, improve support for large electronic components, and significantly improve heat dissipation effect, prevent heat accumulation, and extend the service life of the circuit board.
Smart Images
Figure CN222339797U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to the technical field of circuit boards, in particular to an ultra-thick metal heat dissipation circuit board. Background Art
[0002] In the control terminals of some large machines, thicker copper printed circuit boards are required to ensure thermal conductivity and durability. Traditional ultra-thin circuit boards cannot meet the requirements and are easily damaged during the welding process of large components.
[0003] With the continuous development of science and technology, thick copper printed circuit boards have gradually replaced ultra-thin circuit boards. However, the existing thick copper printed circuit boards cannot guarantee the support capacity for large electronic components and have no protective structure, which makes it easy for traditional circuit boards to cause board surface damage during use, thus affecting their use. In addition, due to the thickness of the printed circuit board, the heat dissipation capacity is poor, and heat is easily accumulated on the circuit board, and the electronic components on the circuit board are easily burned out.
[0004] Therefore, it is particularly important to design a metal ultra-thick heat dissipation circuit board to solve the above defects. Utility Model Content
[0005] In view of the shortcomings of the prior art, the utility model designs a metal super-thick heat dissipation circuit board, which aims to solve the technical problems that the thick copper printed circuit board in the prior art cannot guarantee the support capacity for large electronic components, has no protective structure, is easily damaged during use, and has poor heat dissipation capacity, and the electronic components on the circuit board are easily burned out.
[0006] In order to achieve the above purpose, the utility model provides the following technical solutions:
[0007] A metal ultra-thick heat dissipation circuit board comprises a mounting base and a circuit board body mounted inside the mounting base, a top shell is mounted on the top of the mounting base, a heat dissipation component is mounted inside the top shell and above the circuit board body, and a protective cover is mounted on the top of the top shell;
[0008] Mounting shells are provided on the left and right sides inside the mounting base, mounting grooves are opened on the inner walls of the two groups of mounting shells, the circuit board body is embedded in the inner side of the mounting grooves, and receiving blocks are fixedly connected to the front and rear ends of the inner sides of the two groups of mounting shells and located at the bottom of the circuit board body, and the four corners of the circuit board body are connected to the receiving blocks by mounting screws.
[0009] As a preferred solution of the utility model, an air inlet cover is installed at the front end of the inner side of the two groups of mounting shells, and multiple groups of air inlets are opened on the inner side of the air inlet cover. The inner side of the two groups of mounting shells and located below the circuit board body form a heat dissipation duct.
[0010] As a preferred solution of the utility model, a spring is sleeved on the outer side of the mounting screw, and a protective gasket is installed on the outer side of the mounting screw and at the bottom of the spring, and the protective gasket is a silicone gasket.
[0011] As a preferred solution of the utility model, fixing holes are provided at the four corners of the mounting base, and multiple groups of connectors are installed on the left and right sides of the mounting base, and the multiple groups of connectors are adapted for use with the circuit board body.
[0012] As a preferred solution of the utility model, the heat dissipation assembly includes a cooling fan, cooling fins, cooling copper tubes, a water tank and a micro water pump. The cooling fan is installed on the top of the top shell and is located on the inner side of the protective cover, the cooling fins are installed on the bottom of the cooling fan, the cooling copper tubes are installed inside the cooling fins, the water tank is installed on the right end of the front side of the top shell, and the micro water pump is installed on the left end of the front side of the top shell.
[0013] As a preferred solution of the utility model, one end of the heat dissipation copper tube is connected to the interior of the water tank, a water inlet is provided on the top of the water tank, a cover is installed on the outside of the water inlet, the other end of the heat dissipation copper tube is connected to the output end of a micro water pump, and the input end of the micro water pump is connected to the interior of the water tank through a pumping pipe.
[0014] As a preferred solution of the utility model, the four corners of the top shell are connected to the mounting base by screws, multiple groups of mounting blocks are fixedly connected to the outer side of the protective cover, and the multiple groups of mounting blocks are connected to the top shell by screws, and an air outlet is opened on the top of the protective cover.
[0015] Compared with the prior art, the beneficial effects of the utility model are:
[0016] 1. In the utility model, the circuit board body is embedded in the mounting grooves on the inner sides of the two sets of mounting shells through the matching design of the mounting base and the top shell. The mounting base and the top shell are used to provide external protection for the circuit board body, and the mounting shell can further protect the circuit board body. At the same time, the circuit board body is located on the inner side of the mounting groove, and is connected and installed with the receiving block through the mounting screws. The circuit board body is fixedly installed on the inner side of the mounting groove, which can ensure the support force for large electronic components and avoid the damage of the board surface due to various factors during use. When the circuit board body is installed and fixed by the mounting screws, the spring on the outer side of the mounting screw can avoid damage to the board surface caused by over-tightening when tightening. At the same time, the silicone protective gasket is used to prevent the bottom of the spring from causing damage to the board surface, further improving the protection effect of the circuit board body.
[0017] 2. In the utility model, through the coordinated design of the mounting base and the heat dissipation component, when the circuit board body is in use, the heat dissipation fan is started, and the external air is sucked into the heat dissipation duct from the multiple groups of air inlets inside the air inlet cover by means of external exhaust, and finally the heat inside the mounting base is discharged through the heat dissipation fan, and at the same time, the micro water pump is started to input the water in the water tank into the heat dissipation copper tube through the water suction pipe, and the water entering the heat dissipation copper tube flows back into the water tank, thereby forming a circulating water circuit, and continuously dissipating the heat for the heat dissipation fins, so that when the heat dissipation fan discharges the heat inside the mounting base, the hot air is dissipated, thereby avoiding the increase of the temperature outside the mounting base on the outside of the mounting base after the hot air is discharged, and at the same time avoiding the discharged hot air to flow back into the inside of the mounting base, further improving the heat dissipation effect of the circuit board body. BRIEF DESCRIPTION OF THE DRAWINGS
[0018] Figure 1 It is a schematic diagram of the structure of the utility model;
[0019] Figure 2 It is a schematic diagram of the structure of the utility model;
[0020] Figure 3 It is a schematic diagram of the structure of the utility model;
[0021] Figure 4 It is a schematic diagram of the structure of the utility model;
[0022] Figure 5 It is a schematic diagram of the structure of the utility model.
[0023] In the figure: 1. mounting base; 101. mounting shell; 102. mounting slot; 103. receiving block; 104. mounting screw; 105. air inlet cover; 106. air inlet; 107. heat dissipation duct; 108. spring; 109. protective gasket; 110. fixing hole; 111. joint; 2. circuit board body; 3. top shell; 4. heat dissipation assembly; 401. cooling fan; 402. cooling fins; 403. cooling copper tube; 404. water tank; 405. micro water pump; 406. cover; 407. water pump; 5. protective cover; 501. mounting block; 502. air outlet. DETAILED DESCRIPTION
[0024] The technical solutions in the embodiments of the utility model will be clearly and completely described below in conjunction with the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, rather than all of the embodiments. Based on the embodiments of the utility model, all other embodiments obtained by ordinary technicians in this field without making creative work are within the scope of protection of the utility model.
[0025] Example:
[0026] See also Figure 1-Figure 5 , the utility model provides a technical solution:
[0027] A metal ultra-thick heat dissipation circuit board comprises a mounting base 1 and a circuit board body 2 mounted inside the mounting base 1, a top shell 3 is mounted on the top of the mounting base 1, a heat dissipation component 4 is mounted inside the top shell 3 and above the circuit board body 2, and a protective cover 5 is mounted on the top of the top shell 3.
[0028] First, mounting shells 101 are provided on the left and right sides of the mounting base 1, and mounting grooves 102 are opened on the inner side walls of the two groups of mounting shells 101. The circuit board body 2 is embedded in the inner side of the mounting groove 102, and the front and rear ends of the inner sides of the two groups of mounting shells 101 and the bottom of the circuit board body 2 are fixedly connected with receiving blocks 103. The four corners of the circuit board body 2 are connected to the receiving blocks 103 by mounting screws 104. The circuit board body 2 is embedded in the mounting grooves 102 inside the two groups of mounting shells 101. The mounting base 1 and the top shell 3 are used to provide external protection for the circuit board body 2, and the mounting shell 101 can further protect the circuit board body 2. At the same time, the circuit board body 2 is located on the inner side of the mounting groove 102, and is connected and installed with the receiving block 103 by mounting screws 104. The circuit board body 2 is fixedly installed on the inner side of the mounting groove 102, which can ensure the support force for large electronic components and avoid the damage of the board surface due to various factors during use.
[0029] Furthermore, an air inlet cover 105 is installed at the front end of the inner side of the two groups of mounting shells 101, and multiple groups of air inlet ports 106 are opened on the inner side of the air inlet cover 105. A heat dissipation duct 107 is formed on the inner side of the two groups of mounting shells 101 and below the circuit board body 2. When the circuit board body 2 is in use, the air inlet cover 105 is used in conjunction with the heat dissipation assembly 4 to constitute a heat dissipation system for the circuit board body 2.
[0030] Then, a spring 108 is sleeved on the outer side of the mounting screw 104, and a protective gasket 109 is installed on the outer side of the mounting screw 104 and at the bottom of the spring 108. The protective gasket 109 is a silicone gasket. When the mounting screw 104 is used to install and fix the circuit board body 2, the spring 108 on the outer side of the mounting screw 104 can avoid damage to the board surface caused by over-tightening when tightening, and at the same time cooperate with the silicone protective gasket 109 to prevent the bottom of the spring 108 from causing damage to the board surface, thereby further improving the protection effect of the circuit board body 2.
[0031] Furthermore, fixing holes 110 are opened at the four corners of the mounting base 1, and multiple sets of connectors 111 are installed on the left and right sides of the mounting base 1. The multiple sets of connectors 111 are adapted to be used with the circuit board body 2. After the circuit board body 2 is installed inside the mounting base 1, the mounting base 1 can be fixedly installed through the fixing holes 110, and at the same time, it is electrically connected to the circuit board body 2 through the multiple sets of connectors 111, which facilitates connection with external devices.
[0032] In this embodiment, the specific structure of the heat dissipation component 4 is as follows:
[0033] The heat dissipation assembly 4 includes a cooling fan 401, cooling fins 402, cooling copper tubes 403, a water tank 404 and a micro water pump 405. The cooling fan 401 is installed on the top of the top shell 3 and is located on the inner side of the protective cover 5. The cooling fins 402 are installed on the bottom of the cooling fan 401. The cooling copper tubes 403 are installed inside the cooling fins 402. The water tank 404 is installed on the right end of the front of the top shell 3. The micro water pump 405 is installed on the left end of the front of the top shell 3.
[0034] Secondly, one end of the heat dissipation copper tube 403 is connected to the inside of the water tank 404, a water inlet is provided on the top of the water tank 404, a cover 406 is installed on the outside of the water inlet, the other end of the heat dissipation copper tube 403 is connected to the output end of the micro water pump 405, the input end of the micro water pump 405 is connected to the inside of the water tank 404 through the pumping pipe 407, when the circuit board body 2 is in use, the heat dissipation fan 401 is started, and the external air is sucked into the heat dissipation duct 107 from the multiple groups of air inlets 106 inside the air inlet cover 105 by means of external exhaust, and finally the inside of the mounting base 1 is exhausted by the heat dissipation fan 401. The heat is discharged, and at the same time, the micro water pump 405 is started to input the water in the water tank 404 into the heat dissipation copper tube 403 through the pumping pipe 407. The water entering the heat dissipation copper tube 403 flows back into the water tank 404, thereby forming a circulating water circuit to continuously dissipate heat for the heat dissipation fins 402. When the heat dissipation fan 401 discharges the heat inside the mounting base 1, the hot air is cooled, thereby preventing the hot air from being located outside the mounting base 1 after being discharged and increasing the temperature outside the mounting base 1, and at the same time preventing the discharged hot air from flowing back into the mounting base 1, further improving the heat dissipation effect of the circuit board body 2.
[0035] Finally, the four corners of the top shell 3 are connected to the mounting base 1 by screws, and multiple groups of mounting blocks 501 are fixedly connected to the outside of the protective cover 5. The multiple groups of mounting blocks 501 are connected to the top shell 3 by screws. An air outlet 502 is provided on the top of the protective cover 5. The top shell 3 is installed on the top of the mounting base 1 to provide external protection for the top of the circuit board body 2. The protective cover 5 is installed on the top of the top shell 3 through the mounting blocks 501 to provide external protection for the cooling fan 401. When the cooling fan 401 discharges hot air, the hot air is discharged through the air outlet 502.
[0036] In this embodiment, the implementation scenario is specifically as follows: the circuit board body 2 is embedded in the mounting groove 102 on the inner side of the two sets of mounting shells 101, and the mounting base 1 and the top shell 3 are used to provide external protection for the circuit board body 2, and the mounting shell 101 can further protect the circuit board body 2. At the same time, the circuit board body 2 is located on the inner side of the mounting groove 102, and is connected and installed with the receiving block 103 by installing screws 104. The circuit board body 2 is fixedly installed on the inner side of the mounting groove 102, which can ensure the support force for large electronic components and avoid damage caused by various factors during use. In case of damage to the board surface, when the mounting screws 104 are used to install and fix the circuit board body 2, the spring 108 on the outside of the mounting screws 104 can prevent damage to the board surface caused by over-tightening when tightening, and at the same time cooperate with the silicone protective gasket 109 to prevent the bottom of the spring 108 from causing damage to the board surface, further improving the protection effect of the circuit board body 2. When the circuit board body 2 is in use, the cooling fan 401 is started, and the external air is sucked into the cooling air duct 107 from the multiple air inlets 106 inside the air inlet cover 105 by means of external exhaust, and finally the cooling air is exhausted. The fan 401 discharges the heat inside the mounting base 1, and at the same time, the micro water pump 405 is started to input the water in the water tank 404 into the heat dissipation copper tube 403 through the water pumping pipe 407, and the water entering the heat dissipation copper tube 403 flows back into the water tank 404, thereby forming a circulating water circuit to continuously dissipate heat for the heat dissipation fins 402. When the heat dissipation fan 401 discharges the heat inside the mounting base 1, the hot air is dissipated, thereby preventing the hot air from being located outside the mounting base 1 after being discharged and increasing the temperature outside the mounting base 1, and preventing the discharged hot air from flowing back. The inside of the mounting base 1 is entered, and the heat dissipation effect of the circuit board body 2 is further improved. The protective cover 5 is installed on the top of the top shell 3 through the mounting block 501 to provide external protection for the cooling fan 401. When the cooling fan 401 discharges hot air, the hot air is discharged through the air outlet 502. The whole operation process is simple and convenient. Compared with the existing metal ultra-thick heat dissipation circuit board, the utility model can enhance the overall protection effect of the metal ultra-thick heat dissipation circuit board through design, can ensure the support force for large electronic components, and at the same time improve the heat dissipation effect of the metal ultra-thick heat dissipation circuit board.
[0037] Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that various changes, modifications, substitutions and variations may be made to the embodiments without departing from the principles and spirit of the present invention, and that the scope of the present invention is defined by the appended claims and their equivalents.
Claims
1. A metal ultra-thick heat dissipation circuit board, comprising a mounting base (1) and a circuit board body (2) mounted inside the mounting base (1), characterized in that: A top shell (3) is installed on the top of the mounting base (1), a heat dissipation component (4) is installed inside the top shell (3) and above the circuit board body (2), and a protective cover (5) is installed on the top of the top shell (3); The left and right sides of the interior of the mounting base (1) are both provided with mounting shells (101); the inner side walls of the two sets of mounting shells (101) are both provided with mounting grooves (102); the circuit board body (2) is embedded in the inner side of the mounting grooves (102); the front and rear ends of the inner sides of the two sets of mounting shells (101) and the bottom of the circuit board body (2) are both fixedly connected with receiving blocks (103); the four corners of the circuit board body (2) are connected to the receiving blocks (103) by means of mounting screws (104).
2. The metal ultra-thick heat dissipation circuit board according to claim 1, characterized in that: An air inlet cover (105) is installed at the front end of the inner side of the two groups of mounting shells (101), and a plurality of air inlet ports (106) are provided on the inner side of the air inlet cover (105). A heat dissipation duct (107) is formed on the inner side of the two groups of mounting shells (101) and below the circuit board body (2).
3. The metal ultra-thick heat dissipation circuit board according to claim 1, characterized in that: A spring (108) is sleeved on the outer side of the mounting screw (104), and a protective gasket (109) is installed on the outer side of the mounting screw (104) and at the bottom of the spring (108), and the protective gasket (109) is a silicone gasket.
4. The metal ultra-thick heat dissipation circuit board according to claim 1, characterized in that: The four corners of the mounting base (1) are each provided with fixing holes (110), and the left and right sides of the mounting base (1) are each provided with a plurality of sets of connectors (111), and the plurality of sets of connectors (111) are each adapted for use with the circuit board body (2).
5. The metal ultra-thick heat dissipation circuit board according to claim 1, characterized in that: The heat dissipation component (4) comprises a heat dissipation fan (401), heat dissipation fins (402), a heat dissipation copper tube (403), a water tank (404) and a micro water pump (405); the heat dissipation fan (401) is installed on the top of the top shell (3) and is located on the inner side of the protective cover (5); the heat dissipation fins (402) are installed on the bottom of the heat dissipation fan (401); the heat dissipation copper tube (403) is installed inside the heat dissipation fins (402); the water tank (404) is installed on the right end of the front of the top shell (3); and the micro water pump (405) is installed on the left end of the front of the top shell (3).
6. The metal super-thick heat dissipation circuit board according to claim 5, characterized in that: One end of the heat dissipation copper tube (403) is connected to the interior of the water tank (404); a water inlet is provided on the top of the water tank (404); a cover (406) is installed on the outside of the water inlet; the other end of the heat dissipation copper tube (403) is connected to the output end of a micro water pump (405); and the input end of the micro water pump (405) is connected to the interior of the water tank (404) via a water pump (407).
7. The metal super-thick heat dissipation circuit board according to claim 1, characterized in that: The four corners of the top shell (3) are connected to the mounting base (1) by means of screws, a plurality of groups of mounting blocks (501) are fixedly connected to the outer side of the protective cover (5), and the plurality of groups of mounting blocks (501) are connected to the top shell (3) by means of screws, and an air outlet (502) is provided on the top of the protective cover (5).