External mainboard module and numerical control system

Abstract

The utility model provides an external mainboard module and a numerical control system, and the external mainboard module comprises a heat dissipation housing which is provided with a groove; the heat conduction pad is arranged at the bottom of the groove; the circuit board is arranged in the groove, and the circuit board is connected with the heat conduction pad; the at least one plug is arranged on one side, far away from the heat conduction pad, of the circuit board, and the plug extends out of a notch of the groove. According to the external mainboard module and the numerical control system, when the mainboard module is applied to the numerical control system, overall external arrangement can be achieved, dismounting and mounting are convenient, flexible configuration of different kinds of mainboard modules can be achieved, meanwhile, the circuit board can achieve efficient heat dissipation through the heat conduction pad and the heat dissipation shell, and the heat dissipation efficiency is improved. Therefore, high-performance operation of the numerical control system is ensured.

Description

Technical Field

[0001] The present disclosure relates to the technical field of motherboard modules, and in particular to an external motherboard module and a numerical control system. Background Art

[0002] With the rapid development of CNC technology, there are more and more types of motherboard modules used in CNC systems. However, most of the current motherboard modules are integrated into the CNC system, which is not only inconvenient to disassemble and assemble, but also unable to realize the flexible configuration of different types of motherboard modules. In addition, the heat dissipation effect is poor, making it difficult to achieve high-performance operation of the CNC system. Summary of the invention

[0003] The present disclosure aims to solve one of the technical problems in the related art at least to some extent.

[0004] To this end, the purpose of the present disclosure is to provide an external motherboard module and a numerical control system.

[0005] To achieve the above-mentioned purpose, the first aspect of the present disclosure provides an external motherboard module, comprising: a heat dissipation shell, the heat dissipation shell is provided with a groove; a thermal pad, the thermal pad is arranged at the bottom of the groove; a circuit board, the circuit board is arranged in the groove, and the circuit board and the thermal pad are connected; at least one plug, the plug is arranged on a side of the circuit board away from the thermal pad, and the plug extends out of the notch of the groove.

[0006] Optionally, a plurality of heat dissipation bars are arranged on a side of the heat dissipation housing away from the groove, and the plurality of heat dissipation bars are distributed at intervals.

[0007] Optionally, the mainboard module further includes: a sealing gasket, which is arranged around the notch of the groove.

[0008] Optionally, at least one dial plate is arranged around the heat dissipation housing.

[0009] Optionally, the mainboard module also includes: a plurality of fixing columns, which are arranged at the bottom of the groove; a plurality of first fixing plates, which are arranged around the circuit board and have first through holes; and a plurality of screws, the threaded ends of the screws passing through the first through holes and being threadedly arranged on the fixing columns.

[0010] Optionally, a second fixing plate is arranged around the heat dissipation housing, and the second fixing plate is provided with a second through hole.

[0011] Optionally, avoidance grooves are arranged around the heat dissipation housing, and the second fixing plate is located in the avoidance grooves.

[0012] Optionally, the at least one plug includes: a first connector, which is arranged on a side of the circuit board away from the thermal pad, and the first connector extends out of the notch of the groove; a second connector, which is arranged on a side of the circuit board away from the thermal pad, and the second connector extends out of the notch of the groove; wherein the first connector and the second connector are respectively located at two ends of the circuit board.

[0013] The second aspect of the present disclosure provides a numerical control system, comprising: a numerical control body, which is provided with at least one socket; an external motherboard module as provided in the first aspect of the present disclosure, wherein the heat dissipation shell of the motherboard module is arranged on the numerical control body, and the plug of the motherboard module is inserted into the socket.

[0014] Optionally, the CNC body includes: a touch display surface and a mounting surface that are opposite to each other, the socket is arranged on the mounting surface, and the heat dissipation housing is arranged on the mounting surface.

[0015] The technical solution provided by the present disclosure may have the following beneficial effects:

[0016] Since the circuit board is arranged in the groove of the heat dissipation housing, and the plug on the circuit board extends out of the notch of the groove, the mainboard module can be placed externally as a whole when used in the numerical control system, and it is convenient to disassemble and assemble, thereby facilitating the flexible configuration of different types of mainboard modules. At the same time, since the thermal pad is arranged between the circuit board and the heat dissipation housing, the circuit board can utilize the thermal pad and the heat dissipation housing to achieve high-efficiency heat dissipation, thereby ensuring the high-performance operation of the numerical control system.

[0017] Additional aspects and advantages of the present disclosure will be given in part in the following description and in part will be obvious from the following description or learned through practice of the present disclosure. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] The above and / or additional aspects and advantages of the present disclosure will become apparent and easily understood from the following description of the embodiments in conjunction with the accompanying drawings, in which:

[0019] Figure 1 is a structural schematic diagram of an external motherboard module proposed in an embodiment of the present disclosure;

[0020] Figure 2 is a structural schematic diagram of a numerical control system proposed in an embodiment of the present disclosure;

[0021] As shown in the figure: 1. CNC body, 11. socket, 12. mounting surface;

[0022] 2. Mainboard module;

[0023] 21. heat dissipation housing, 211. groove, 212. heat dissipation strip, 213. dial plate, 214. second fixing plate, 215. second through hole, 216. avoidance groove;

[0024] 22. Thermal pad;

[0025] 23. Circuit board, 231. First fixing plate, 232. First through hole;

[0026] 24. Plug, 241. First connector, 242. Second connector;

[0027] 25. Sealing gasket, 26. Fixing column. DETAILED DESCRIPTION

[0028] Embodiments of the present disclosure are described in detail below, examples of which are shown in the accompanying drawings, wherein the same or similar reference numerals throughout represent the same or similar elements or elements having the same or similar functions. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain the present disclosure, and are not to be construed as limitations of the present disclosure. On the contrary, the embodiments of the present disclosure include all changes, modifications, and equivalents that fall within the spirit and connotation of the appended claims.

[0029] like Figure 1 As shown, the embodiment of the present disclosure proposes an external motherboard module 2, including: a heat dissipation shell 21, a thermal pad 22, a circuit board 23 and at least one plug 24, the heat dissipation shell 21 is provided with a groove 211, the thermal pad 22 is arranged at the bottom of the groove 211, the circuit board 23 is arranged in the groove 211, and the circuit board 23 and the thermal pad 22 are connected, the plug 24 is arranged on a side of the circuit board 23 away from the thermal pad 22, and the plug 24 extends out of the notch of the groove 211.

[0030] It can be understood that since the circuit board 23 is arranged in the groove 211 of the heat dissipation shell 21, and the plug 24 on the circuit board 23 extends out of the notch of the groove 211, the mainboard module 2 can be externalized as a whole when applied to the numerical control system, and it is convenient to disassemble and assemble, thereby facilitating the flexible configuration of different types of mainboard modules 2. At the same time, since the thermal pad 22 is arranged between the circuit board 23 and the heat dissipation shell 21, the circuit board 23 can utilize the thermal pad 22 and the heat dissipation shell 21 to achieve efficient heat dissipation, thereby ensuring the high performance operation of the numerical control system.

[0031] It should be noted that the heat dissipation housing 21 is used to accommodate the circuit board 23 and dissipate heat from the circuit board 23. The specific type of the heat dissipation housing 21 can be set according to actual needs and is not limited to this. For example, the heat dissipation housing 21 can be made of aluminum material of ADC12 and formed by die casting.

[0032] The thermal pad 22 is used for heat conduction between the circuit board 23 and the heat dissipation housing 21. The specific type of the thermal pad 22 can be set according to actual needs and is not limited to this. For example, the thermal pad 22 can be made of a high thermal conductivity silicone sheet and processed by a die-cutting process.

[0033] The circuit board 23 is used for receiving, sending, calculating, processing, etc. of data. The specific type of the circuit board 23 can be set according to actual needs and is not limited to this. For example, the circuit board 23 can be a printed circuit board (PCB) on which chips for communication, calculation, processing, etc. are arranged, which can be used as a main board in a numerical control system.

[0034] The plug 24 is used for communication with the circuit board 23, that is, input or output. The specific type of the plug 24 can be set according to actual needs and is not limited to this. For example, the plug 24 can be a connector, which is made of engineering plastic and is injection molded by a mold.

[0035] like Figure 1 As shown, in some embodiments, a plurality of heat dissipation bars 212 are disposed on a side of the heat dissipation housing 21 away from the groove 211 , and the plurality of heat dissipation bars 212 are distributed at intervals.

[0036] It can be understood that since the multiple heat dissipation bars 212 are spaced apart on the side of the heat dissipation housing 21 away from the groove 211, when the heat on the circuit board 23 is transferred from the thermal pad 22 to the heat dissipation housing 21, the multiple heat dissipation bars 212 can ensure that there is a larger heat exchange area between the heat dissipation housing 21 and the external air, thereby effectively improving the heat dissipation efficiency of the heat dissipation housing 21, and further ensuring the high performance operation of the circuit board 23.

[0037] It should be noted that the heat sink 212 is used for heat conduction. The specific type of the heat sink 212 can be set according to actual needs and is not limited to this. For example, the heat sink 212 can be die-casted as a whole with the mold and the heat sink shell 21. The heat sink 212 can be two, three, four, five, six, etc.

[0038] like Figure 1 As shown, in some embodiments, the mainboard module 2 further includes: a sealing gasket 25 , which is arranged around the notch of the groove 211 .

[0039] It can be understood that since the sealing gasket 25 is arranged around the notch of the groove 211, when the heat dissipation housing 21 is arranged on the CNC body 1 of the CNC system, it can cooperate with the CNC body 1 to make the groove 211 form a sealed chamber, thereby reducing external interference to the circuit board 23, thereby ensuring the high performance operation of the circuit board 23.

[0040] It should be noted that the sealing gasket 25 is used for sealing between the heat dissipation housing 21 and the CNC body 1. The specific type of the sealing gasket 25 can be set according to actual needs and is not limited to this. For example, the sealing gasket 25 can be made of nitrile rubber material and formed by mold processing.

[0041] like Figure 1 As shown, in some embodiments, at least one dial plate 213 is disposed around the heat dissipation housing 21 .

[0042] It is understandable that, since the lever plates 213 are arranged around the heat dissipation shell 21, the operator can use the lever plates 213 protruding from the heat dissipation shell 21 to apply force, thereby making the disassembly and assembly of the mainboard module 2 more convenient, and further facilitating the flexible configuration of different types of mainboard modules 2.

[0043] It should be noted that the paddle plate 213 is used for disassembly and assembly of the heat dissipation housing 21. The specific type of the paddle plate 213 can be set according to actual needs and is not limited to this. For example, the paddle plate 213 can be integrally die-casted with the heat dissipation housing 21 through a mold, and the paddle plate 213 can be one, two, three, four, five, six, etc.

[0044] like Figure 1 As shown, in some embodiments, the mainboard module 2 also includes: a plurality of fixing columns 26, a plurality of first fixing plates 231 and a plurality of screws (not shown in the figure), the fixing columns 26 are arranged at the bottom of the groove 211, the first fixing plates 231 are arranged around the circuit board 23, and the first fixing plates 231 are provided with first through holes 232, and the threaded ends of the screws pass through the first through holes 232 and are threadedly arranged on the fixing columns 26.

[0045] It can be understood that since the fixing column 26 is arranged at the bottom of the groove 211, and the first fixing plate 231 is arranged around the circuit board 23, when the threaded end of the screw passes through the first through hole 232 and is threaded on the fixing column 26, the circuit board 23 can be firmly set in the groove 211, ensuring the stable operation of the mainboard module 2, and at the same time facilitating the disassembly of the circuit board 23, making the use of the mainboard module 2 more convenient.

[0046] It should be noted that the fixing column 26 is used for installing screws. The specific type of the fixing column 26 can be set according to actual needs and is not limited to this. For example, the fixing column 26 can be a columnar structure integrally formed with the heat dissipation housing 21, and the fixing column 26 is provided with a threaded hole that cooperates with the screw.

[0047] The first fixing plate 231 is used to set the first through hole 232 . The specific type of the first fixing plate 231 can be set according to actual needs and is not limited to this. For example, the first fixing plate 231 can be a plate-like structure integrally formed with the circuit board 23 .

[0048] The screws are used to fasten the first fixing plate 231 to the fixing column 26 , and the specific type of the screws can be set according to actual needs and is not limited thereto.

[0049] The numbers of the fixing posts 26 , the first through holes 232 and the screws correspond to each other. For example, the number of the fixing posts 26 , the first through holes 232 and the screws can be three, four, five or the like.

[0050] like Figure 1 As shown, in some embodiments, a second fixing plate 214 is disposed around the heat dissipation housing 21 , and the second fixing plate 214 is provided with a second through hole 215 .

[0051] It can be understood that since the second fixing plate 214 is arranged around the heat dissipation shell 21 and the second fixing plate 214 is provided with a second through hole 215, when the mainboard module 2 is applied to the CNC system, the second through hole 215 on the second fixing plate 214 can be used to fix the mainboard module 2 on the CNC body 1, and at the same time, the disassembly of the mainboard module 2 is facilitated, making the use of the CNC system more convenient.

[0052] It should be noted that the second fixing plate 214 is used to fix the mainboard module 2 on the CNC body 1. The specific type of the second fixing plate 214 can be set according to actual needs and is not limited to this. For example, the second fixing plate 214 can be die-cast integrally with the heat dissipation shell 21.

[0053] The second through hole 215 on the second fixing plate 214 can be used with a screw to achieve fixation on the CNC body 1 . For example, the threaded end of the screw passes through the second through hole 215 and is threadedly connected to the CNC body 1 .

[0054] like Figure 1 As shown, in some embodiments, avoidance grooves 216 are provided around the heat dissipation housing 21 , and the second fixing plate 214 is located in the avoidance grooves 216 .

[0055] It is understandable that by arranging the second fixing plate 214 in the avoidance groove 216, the second fixing plate 214 is prevented from forming a protruding structure on the heat dissipation housing 21, thereby ensuring that the mainboard module 2 is easy to disassemble and assemble while making the mainboard module 2 occupy a smaller space and have a stronger integrity.

[0056] It should be noted that the avoidance groove 216 is used to be set on the second fixed plate 214. The specific type of the avoidance groove 216 can be set according to actual needs and is not limited to this. For example, the avoidance groove 216 can be set at the corner of the heat dissipation shell 21. The avoidance groove 216 is formed during the die-casting process of the heat dissipation shell 21.

[0057] like Figure 1 As shown, in some embodiments, at least one plug 24 includes: a first connector 241 and a second connector 242, the first connector 241 is arranged on a side of the circuit board 23 away from the thermal pad 22, and the first connector 241 extends out of the notch of the groove 211, the second connector 242 is arranged on a side of the circuit board 23 away from the thermal pad 22, and the second connector 242 extends out of the notch of the groove 211, wherein the first connector 241 and the second connector 242 are respectively located at two ends of the circuit board 23.

[0058] It can be understood that since the first connector 241 is arranged on the side of the circuit board 23 away from the thermal pad 22, and the first connector 241 extends out of the notch of the groove 211, the mainboard module 2 can easily communicate using the first connector 241. Since the second connector 242 is arranged on the side of the circuit board 23 away from the thermal pad 22, and the second connector 242 extends out of the notch of the groove 211, the mainboard module 2 can easily communicate using the second connector 242. Therefore, through the arrangement of the first connector 241 and the second connector 242, the operation of the mainboard module 2 is more stable and efficient.

[0059] It should be noted that the first connector 241 and the second connector 242 both belong to the plug 24. The first connector 241 and the second connector 242 can be used as the input and output of the circuit board 23 respectively. For example, the first connector 241 is used as the input of the circuit board 23, and the second connector 242 is used as the output of the circuit board 23, or the first connector 241 is used as the output of the circuit board 23, and the second connector 242 is used as the input of the circuit board 23.

[0060] like Figure 2 As shown, the embodiment of the present disclosure also proposes a CNC system, including: a CNC body 1 and an external motherboard module 2 as in the embodiment of the present disclosure, the CNC body 1 is provided with at least one socket 11, the heat dissipation shell 21 of the motherboard module 2 is arranged on the CNC body 1, and the plug 24 of the motherboard module 2 is inserted into the socket 11.

[0061] It can be understood that since the circuit board 23 is arranged in the groove 211 of the heat dissipation shell 21, and the plug 24 on the circuit board 23 extends out of the notch of the groove 211 and is inserted into the socket 11 of the CNC body 1, the mainboard module 2 can be externalized as a whole in the CNC system, and it is convenient to disassemble and assemble, thereby facilitating the flexible configuration of different types of mainboard modules 2. At the same time, since the thermal pad 22 is arranged between the circuit board 23 and the heat dissipation shell 21, the circuit board 23 can utilize the thermal pad 22 and the heat dissipation shell 21 to achieve efficient heat dissipation, thereby ensuring the high performance operation of the CNC system.

[0062] It should be noted that the socket 11 is used for inserting the plug 24. The specific type of the socket 11 can be set according to actual needs and is not limited to this. For example, the socket 11 can be a connector that is compatible with the plug 24, which is made of engineering plastic and is injection molded by a mold.

[0063] like Figure 2 As shown, in some embodiments, the CNC body 1 includes: a touch display surface (not shown in the figure) and a mounting surface 12 in opposite positions, the socket 11 is arranged on the mounting surface 12, and the heat dissipation shell 21 is arranged on the mounting surface 12.

[0064] It is understandable that, since the heat dissipation housing 21 is disposed on the mounting surface 12 , the mainboard module 2 can be kept away from the touch display surface of the CNC body 1 , thereby reducing external interference to the mainboard module 2 and making the operation of the mainboard module 2 more stable.

[0065] It should be noted that the touch display surface of the CNC body 1 is used for touch and display, and the installation surface 12 of the CNC body 1 is the side opposite to the touch display surface. In addition to the mainboard module 2, components such as a switching power supply and a communication interface can also be set thereon.

[0066] In the description of the present disclosure, the terms "first", "second", etc. are used for descriptive purposes only and cannot be understood as indicating or implying relative importance. In addition, in the description of the present disclosure, unless otherwise specified, the meaning of "plurality" is two or more.

[0067] Any process or method description in a flowchart or otherwise described herein may be understood to represent a module, segment or portion of code that includes one or more executable instructions for implementing the steps of a specific logical function or process, and the scope of the preferred embodiments of the present disclosure includes alternative implementations in which functions may not be performed in the order shown or discussed, including performing functions in a substantially simultaneous manner or in the reverse order depending on the functions involved, which should be understood by those skilled in the art to which the embodiments of the present disclosure belong.

[0068] In the description of this specification, the description with reference to the terms "one embodiment", "some embodiments", "example", "specific example", or "some examples" means that the specific features, structures, materials or characteristics described in conjunction with the embodiment or example are included in at least one embodiment or example of the present disclosure. In this specification, the schematic representation of the above terms does not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials or characteristics described may be combined in any one or more embodiments or examples in a suitable manner.

[0069] Although the embodiments of the present disclosure have been shown and described above, it is to be understood that the above embodiments are exemplary and are not to be construed as limitations of the present disclosure. A person skilled in the art may change, modify, replace and vary the above embodiments within the scope of the present disclosure.

Claims

1. An external motherboard module, characterized in that: include: A heat dissipation shell, wherein the heat dissipation shell is provided with a groove; A thermally conductive pad, the thermally conductive pad being arranged at the bottom of the groove; A circuit board, wherein the circuit board is disposed in the groove and connected to the thermal pad; At least one plug is disposed on a side of the circuit board away from the thermal pad, and the plug extends out of a notch of the groove.

2. The external motherboard module according to claim 1, characterized in that: A plurality of heat dissipation bars are arranged on one side of the heat dissipation housing away from the groove, and the plurality of heat dissipation bars are distributed at intervals.

3. The external motherboard module according to claim 1, characterized in that: The mainboard module also includes: A sealing gasket is arranged around the notch of the groove.

4. The external motherboard module according to claim 1, characterized in that: At least one paddle is arranged around the heat dissipation housing.

5. The external motherboard module according to claim 1, characterized in that: The mainboard module also includes: A plurality of fixing columns, wherein the fixing columns are arranged at the bottom of the groove; A plurality of first fixing plates, wherein the first fixing plates are arranged around the circuit board and the first fixing plates are provided with first through holes; A plurality of screws, wherein the threaded ends of the screws pass through the first through holes and are threadedly disposed on the fixing posts.

6. The external motherboard module according to claim 1, characterized in that: A second fixing plate is arranged around the heat dissipation housing, and the second fixing plate is provided with a second through hole.

7. The external motherboard module according to claim 6, characterized in that: The heat dissipation housing is provided with avoidance grooves around its periphery, and the second fixing plate is located in the avoidance grooves.

8. The external motherboard module according to claim 1, characterized in that: The at least one plug comprises: A first connector, the first connector is arranged on a side of the circuit board away from the thermal pad, and the first connector extends out of a notch of the groove; A second connector, the second connector is arranged on a side of the circuit board away from the thermal pad, and the second connector extends out of a notch of the groove; Wherein, the first connector and the second connector are respectively located at two ends of the circuit board.

9. A numerical control system, characterized in that: include: A numerical control body, wherein the numerical control body is provided with at least one socket; According to any one of claims 1 to 8, the heat dissipation housing of the motherboard module is arranged on the CNC body, and the plug of the motherboard module is inserted into the socket.

10. The numerical control system according to claim 9, characterized in that: The numerical control main body comprises: The touch display surface and the mounting surface are opposite to each other, the socket is arranged on the mounting surface, and the heat dissipation shell is arranged on the mounting surface.

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