Liquid cooling heat dissipation device
By adjusting the area ratio of the water inlet and outlet and the fluid flow path in the liquid-cooled heat dissipation device, the problem of uneven heat exchange efficiency in the prior art is solved, and a higher flow rate and heat exchange efficiency are achieved, achieving uniform heat dissipation Purpose.
Patent Information
- Application Number
- CN202420685673.4
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-04-03
- Publication Date
- 2025-01-10
- Estimated Expiration
- 2034-04-03
AI Technical Summary
The existing liquid-cooled heat dissipation devices have the problem of uneven heat exchange performance during the heat exchange process, especially the heat exchange performance at the water inlet and the efficiency at the water outlet is reduced, resulting in poor overall heat dissipation effect.
By designing that the ratio of the water inlet and outlet area is different, the flow rate at the water inlet is increased, and the complex reflow path of the working fluid is extended to improve heat exchange efficiency through the complex reflow path of the working fluid along the Z-axis, X-axis and Y-axis directions.
The flow rate and heat exchange volume are improved, and a more uniform heat dissipation effect is achieved. The heat dissipation of the hottest heat-generating electronic components under the bottom plate is preferred, and the heat exchange efficiency in other areas is improved.
Smart Images

Figure CN222339830U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to a liquid cooling heat dissipation device, in particular to a liquid cooling heat dissipation device with a fast flow rate and capable of increasing the flow length path to improve the heat exchange efficiency. Background Art
[0002] With the advancement and development of science and technology, the working efficiency of electronic devices has gradually improved, which has increased the power of electronic components inside electronic devices. Since electronic components will generate more heat during operation, the heat dissipation of electronic components has become increasingly important. In order to dissipate the heat of electronic components, various heat dissipation devices are arranged around the vicinity of heat-generating electronic components to prevent the temperature of the electronic components from being too high, thereby affecting the performance and stability of the electronic devices during operation. Among them, attaching a liquid cooling heat dissipation device to the heat-generating electronic components can directly exchange heat with the heat source through the circulation of the working fluid. Compared with other heat dissipation devices, it can directly and effectively dissipate heat, so liquid cooling heat dissipation devices are widely used in electronic devices.
[0003] Generally known liquid cooling device 1 such as Figure 1A and Figure 1B As shown, the liquid-cooled heat dissipation device 1 has a base plate 10 and a cover body 11, and a plurality of heat dissipation fins 12 are provided on the base plate 10. In the known technology, the base plate 10 is usually attached to a heat-generating electronic component (not shown). As shown in the figure, the water inlet 13 and the water outlet 14 are respectively connected on both sides of the cover body 11. Therefore, when the working fluid flows into the liquid-cooled heat dissipation device 1 from the water inlet 13 on the cover body 11, as shown by the arrow A, it flows from the first end 12a of the plurality of heat dissipation fins 12 to the second end 12b, and then flows out from the water outlet 14, thereby performing heat exchange with the heat-generating electronic component attached to the bottom plate 10, so as to achieve the purpose of promoting heat dissipation. However, in this known technology, it is obvious that the heat-generating electronic component (i.e. Figure 1B The region I) shown can first perform heat exchange, so its cooling performance is better. However, as part of the heat energy is exchanged and brought into the working fluid, the working fluid temperature near the water outlet 14 is higher, so the heat exchange performance of region II is reduced, and its cooling performance will be significantly reduced, resulting in poor heat dissipation effect in this region II. In this way, it can be seen that the liquid cooling heat dissipation device 1 in this prior art cannot achieve an overall uniform and effective heat dissipation effect.
[0004] In addition, another conventional liquid cooling device 2 is described in US Pat. No. US8746330, which is briefly described as follows: Figure 2A and Figure 2BIn the figure, the liquid cooling device 2 comprises a bottom plate 20 and a cover 21, and a plurality of heat dissipation fins 22 are arranged on the bottom plate 20. A partition 210 is arranged between the cover 21 and the heat dissipation fins 22, and the space inside the cover 21 is divided into an upper cavity 21a and a lower cavity 21b by the partition 210, and an elongated water inlet opening 210a is arranged in the center of the partition 210, and elongated water outlet openings 210b are arranged on two opposite sides of the partition 210. Figure 2A As shown, the cover body 21 is also provided with a water inlet 23 and a water outlet 24. In this liquid-cooled heat sink 2, the flow of the working fluid is as shown by the arrow B1. It first flows into the upper cavity 21a in the cover body 21 from the water inlet 23 on the cover body 21, and then flows downward from the water inlet opening 210a in the center of the partition 210 into the lower cavity 21b. As shown by the arrow B1, it flows from the central portion 22c of the heat sink fin 22 to the first end 22a and the second end 22b on both sides, thereby exchanging heat with the heat sink fin 22, and then flows out from the water outlet openings 210b on both sides of the partition 210, and flows out of the liquid-cooled heat sink 2 from the water outlet 24. This known liquid-cooled heat sink 2 can effectively dissipate heat for heat-generating electronic components arranged below the center of the bottom plate 20 (i.e., corresponding to the area below the water inlet opening 210a). Figure 2B The area III shown. However, in this prior art, when the working fluid flows into the lower cavity 21b from the water inlet opening 210a, it flows to both sides of the heat sink fins 22. In other words, it generates a split flow, so the flow rate and flow velocity of the area IV on both sides are halved, so that the heat exchange efficiency of the area IV on both sides is reduced, and the heat dissipation effect of these two areas IV is poor. It can be seen that even if the liquid cooling heat dissipation device 2 in this prior art is adopted, the heat-generating electronic components under the two sides of the bottom plate 20 cannot effectively dissipate heat, so it is difficult to achieve an overall uniform and effective heat dissipation effect.
[0005] Therefore, how to develop a liquid cooling device that overcomes the above-mentioned shortcomings is an urgent need at present. Utility Model Content
[0006] One purpose of the utility model is to provide a liquid cooling device, which increases the flow rate of the water inlet flushing the cooling fins by different ratios of the water inlet and the water outlet area, thereby improving the flow rate and promoting the heat exchange efficiency.
[0007] Another object of the present invention is to provide a liquid cooling device, which uses a working fluid to flush the cooling fins downward from the water inlet, and sequentially flows along the Y-axis direction, the X-axis direction, the Y-axis direction, and then refluxes along the X-axis direction and the Y-axis direction, thereby extending the reflux path of the working fluid, increasing the heat exchange efficiency, and promoting uniform heat dissipation.
[0008] According to the concept of the utility model, the utility model provides a liquid cooling heat dissipation device, comprising: a bottom plate, a heat dissipation fin group and a base body; the heat dissipation fin group is arranged on the bottom plate, and comprises: a plurality of first heat dissipation fins, a plurality of second heat dissipation fins and at least one third heat dissipation fin. Each of the first heat dissipation fins has a first head end, a first tail end and a first top, and the first top is connected to the first head end and the first tail end. Each of the second heat dissipation fins has a second head end, a second tail end and a second top, and the second top is connected to the second head end and the second tail end. At least one third heat dissipation fin is arranged between the plurality of first heat dissipation fins and the plurality of second heat dissipation fins, and the third heat dissipation fin has a third head end, a third tail end, a third top, a first side surface and a second side surface, wherein the first side surface and the second side surface are respectively located on both sides of the third top surface, and are connected to the third head end and the third tail end at the same time, and the first side surface faces the plurality of first heat dissipation fins, and the second side surface faces the plurality of second heat dissipation fins. The seat body is covered on the heat dissipation fin group and the bottom plate, and has a water inlet and at least one water outlet. The water inlet faces the first top, and the at least one water outlet faces the second top.
[0009] According to the concept of the utility model, the seat body has a liquid injection groove and a liquid outlet groove, the water inlet is arranged in the liquid injection groove, and at least one water outlet is arranged in the liquid outlet groove.
[0010] According to the conception of the utility model, a guide angle is provided in the liquid injection groove, which is connected to the water inlet.
[0011] According to the conception of the utility model, the chamfer is a portion of the bottom surface of the liquid injection groove.
[0012] According to the concept of the present invention, the liquid cooling device further includes a flow limiting structure, which is arranged around the periphery of the water inlet to block the water inlet from at least one water outlet.
[0013] According to the conception of the present utility model, the plurality of first heat dissipation fins have a first arrangement density, the plurality of second heat dissipation fins have a second arrangement density, and the first arrangement density is greater than the second arrangement density.
[0014] According to the conception of the present utility model, the plurality of first heat dissipation fins have a first arrangement density, the plurality of second heat dissipation fins have a second arrangement density, and the first arrangement density is equal to the second arrangement density.
[0015] According to the conception of the utility model, each first heat dissipation fin, each second heat dissipation fin and at least one third heat dissipation fin of the heat dissipation fin group are sheet metal structures of the same size.
[0016] According to the conception of the utility model, the thickness of the third heat dissipation fin is greater than the thickness of each first heat dissipation fin and each second heat dissipation fin.
[0017] According to the conception of the present utility model, the height of the third heat dissipation fin is greater than the height of each first heat dissipation fin and each second heat dissipation fin.
[0018] According to the conception of the present utility model, the length of the third heat dissipation fin is greater than the length of each first heat dissipation fin and each second heat dissipation fin.
[0019] According to the concept of the utility model, the utility model provides a liquid cooling device, comprising: a bottom plate, a heat sink fin group and a seat body; the heat sink fin group is arranged on the bottom plate, and comprises: a plurality of first heat sink fins, a plurality of second heat sink fins and at least one third heat sink fin, and the at least one third heat sink fin is arranged between the plurality of first heat sink fins and the plurality of second heat sink fins. The seat body covers the heat sink fin group and the bottom plate, and has a water inlet and at least one water outlet, the water inlet faces the first top of the plurality of first heat sink fins, and the at least one water outlet faces the second top of the plurality of second heat sink fins. When the working fluid is injected from the water inlet, it flows to the first top of the plurality of first heat sink fins along the Z-axis direction, and flows to the two sides of the plurality of first heat sink fins along the X-axis direction, and then flows along the Y-axis direction, flows to the two sides of the plurality of second heat sink fins, and then flows to the water outlet along the X-axis direction and the Y-axis direction along the plurality of second heat sink fins, so as to form a reflux path in three axes of the Z-axis, the X-axis and the Y-axis.
[0020] The beneficial effect of the utility model is that the utility model provides a liquid cooling heat dissipation device, which increases the flow rate of the water inlet to flush the heat dissipation fins by different ratios of the water inlet and the water outlet area, thereby increasing the flow rate and the heat exchange amount, that is, promoting the heat exchange efficiency. In addition, the liquid cooling heat dissipation device of the utility model can also flush the heat dissipation fins downward from the water inlet through the working fluid, and reflux in the Y-axis direction, the X-axis direction, the Y-axis direction, and then in the X-axis direction and the Y-axis direction, thereby extending the reflux path of the working fluid, increasing the heat exchange efficiency, and achieving the purpose of promoting uniform heat dissipation. BRIEF DESCRIPTION OF THE DRAWINGS
[0021] Figure 1A It is a schematic cross-sectional structure diagram of a liquid cooling device of the known technology.
[0022] Figure 1B for Figure 1A A schematic top view of the flow of working fluid in the liquid cooling device is shown.
[0023] Figure 2A FIG. 1 is a schematic cross-sectional view of a liquid cooling device according to another known technology.
[0024] Figure 2B for Figure 2A A schematic top view of the flow of working fluid in the liquid cooling device is shown.
[0025] Figure 3AIt is a schematic diagram of the exploded structure of the liquid cooling device of the first preferred embodiment of the utility model.
[0026] Figure 3B for Figure 3A A bottom view of the base of the liquid cooling heat sink is shown.
[0027] Figure 3C for Figure 3A The schematic diagram of the structure of the heat dissipation fin group and the base plate of the liquid cooling device is shown.
[0028] Figure 3D for Figure 3A A three-dimensional diagram of the flow of working fluid in a liquid-cooled heat sink is shown.
[0029] Figure 3E for Figure 3A A schematic top view of the flow of working fluid in the liquid cooling device is shown.
[0030] Figure 4 It is a schematic top view of the flow of working fluid in the liquid cooling device of the second preferred embodiment of the utility model.
[0031] Figure 5 It is a schematic top view of the flow of working fluid in the liquid cooling device of the third preferred embodiment of the utility model.
[0032] The reference numerals are as follows:
[0033] 1, 2, 3, 4, 5: Liquid cooling device
[0034] 10, 20, 30, 40, 50: bottom plate
[0035] 11, 21: Cover
[0036] 21a: Upper cavity
[0037] 21b: Lower cavity
[0038] 210: Bulkhead
[0039] 210a: Water entry opening
[0040] 210b: Water outlet opening
[0041] 12, 22: cooling fins
[0042] 12a, 22a: First end
[0043] 12b, 22b: Second end
[0044] 22c: Central
[0045] 13, 23, 310, 410, 510: water inlet
[0046] 14, 24, 311, 411, 511: Water outlet
[0047] 31, 41, 51: base body
[0048] 31a: Liquid filling tank
[0049] 31b: Liquid outlet tank
[0050] 31c: Cavity
[0051] 313: First Surface
[0052] 314: Second Surface
[0053] 315: Frame
[0054] 316: Square groove
[0055] 317, 318: Bottom surface
[0056] 319: Current limiting structure
[0057] 32, 42, 52: cooling fins
[0058] 320, 420, 520: First heat sink fin
[0059] 320a, 420a, 520a: First headend
[0060] 320b, 420b, 520b: First end
[0061] 320c, 420c, 520c: First top
[0062] 321, 421, 521: Second heat sink fins
[0063] 321a, 421a, 521a: Second headend
[0064] 321b, 421b, 521b: Second end
[0065] 321c, 421c, 521c: Second top
[0066] 322, 422, 522: The third heat sink
[0067] 322a, 422a, 522a: Third headend
[0068] 322b, 422b, 522b: The third end
[0069] 322c, 422c, 522c: third top
[0070] 322d, 422d, 522d: First side
[0071] 322e, 422e, 522e: Second side
[0072] 33: Upper cover
[0073] 330: Through opening
[0074] 34: Water inlet pipe
[0075] 35: Water outlet pipe
[0076] A, B1, C1, C2: Arrows showing the direction of flow of the working fluid
[0077] I, II, II, IV: Area
[0078] X, Y, X: three axes DETAILED DESCRIPTION
[0079] Some typical embodiments that embody the features and advantages of the utility model will be described in detail in the following description. It should be understood that the utility model can have various changes in different ways, all of which do not depart from the scope of the utility model, and the descriptions and illustrations therein are essentially used for illustrative purposes, rather than limiting the utility model. For example, if the following content of the present disclosure describes that a first feature is set on or above a second feature, it means that it includes an embodiment in which the first feature and the second feature are directly in contact, and also includes an embodiment in which the additional feature can be set between the first feature and the second feature, so that the first feature and the second feature may not be in direct contact. In addition, in order to facilitate the description of the relationship between a component or feature component and another (plural) component or (plural) feature component in the accompanying drawings, space-related terms, such as "below", "above" and similar terms, can be used. In addition to the orientation shown in the accompanying drawings, space-related terms are used to cover different orientations of the device in use or operation. The device can also be positioned in another way (for example, rotated 90 degrees or located in other orientations), and the description of the space-related terms used can be interpreted accordingly. In addition, it is understood that although the terms "first", "second", "third", etc. may be used in the claims to describe different components, these components should not be limited by these terms, and these components described in the embodiments are represented by different component symbols. These terms are used to distinguish different components. For example, a first component may be referred to as a second component, and similarly, a second component may be referred to as a first component without departing from the scope of the embodiments.
[0080] Please also see Figure 3A , Figure 3B and Figure 3C . Figure 3A It is a schematic diagram of the exploded structure of the liquid cooling device of the first preferred embodiment of the utility model. Figure 3B for Figure 3A A bottom view of the base of the liquid cooling heat sink is shown. Figure 3C for Figure 3A The schematic diagram of the structure of the heat sink fin group and the bottom plate of the liquid cooling device is shown in FIG. Figure 3A and Figure 3C As shown, the liquid cooling device 3 of the present invention comprises: a bottom plate 30, a base body 31 and a heat dissipation fin group 32. The heat dissipation fin group 32 is arranged on the bottom plate 30, and comprises a plurality of first heat dissipation fins 320, a plurality of second heat dissipation fins 321 and at least one third heat dissipation fin 322. Each of the first heat dissipation fins 320 has a first head end 320a, a first tail end 320b and a first top 320c, and the first top 320c is connected to the first head end 320a and the first tail end 320b. Similarly, each of the second heat dissipation fins 321 has a second head end 321a, a second tail end 321b and a second top 321c, and the second top 321c is connected to the second head end 321a and the second tail end 321b. The at least one third heat dissipation fin 322 is disposed between the plurality of first heat dissipation fins 320 and the plurality of second heat dissipation fins 321. The third heat dissipation fin 322 has a third head end 322a, a third tail end 322b, a third top 322c, a first side 322d and a second side 322e, wherein the first side 322d and the second side 322e are respectively located on both sides of the third top 322c and are connected to the third head end 322a and the third tail end 322b, and the first side 322d faces the plurality of first heat dissipation fins 320, and the second side 322e faces the plurality of second heat dissipation fins 321. The base 31 covers the heat dissipation fin group 32 and the bottom plate 30, and has a water inlet 310 and at least one water outlet 311, wherein the water inlet 310 faces the aforementioned first top 320c, and the water outlet 311 faces the aforementioned second top 321c.
[0081] like Figure 3A and Figure 3B As shown, the base 31 of the liquid cooling device 3 of this embodiment is a plate-like structure with a thickness, and has a first surface 313 and a second surface 314 (such as Figure 3BAs shown in the figure, the first surface 313 is partially recessed to form a square groove 316, but the invention is not limited thereto. In the present embodiment, the water inlet 310 is a long strip-shaped opening, and is disposed in the center of the square groove 316, and penetrates the seat body 31, but the shape and setting position of the water inlet 310 can be arbitrarily changed according to the actual application situation, and the invention is not limited thereto. Also, in the present embodiment, the bottom surface of the square groove 316 is further recessed downward to form a liquid injection groove 31a and a liquid outlet groove 31b, wherein the bottom surface 317 of the liquid injection groove 31a is connected to the water inlet 310. In some embodiments, a portion of the bottom surface 317 may be, but is not limited to, an inclined slope, which is used as a guide angle to assist in directing the working liquid to the water inlet 310 and reduce the pressure drop. In this embodiment, the base 31 of the liquid cooling device 3 has two water outlets 311, both of which are square openings that penetrate the base 31 and are respectively arranged on both sides of the water inlet 310. The two water outlets 311 are arranged in the liquid outlet groove 31b of the square groove 316 and are both connected to the bottom surface 318 of the liquid outlet groove 31b. However, the number and location of the water outlets 311 can also be changed according to the actual application situation. In addition, the square groove 316 of the base 31 also includes a flow limiting structure 319, such as Figure 3A As shown, the flow limiting structure 319 can be, but is not limited to, a U-shaped frame structure, and is disposed around the periphery of the water inlet 310 to block the water inlet 310 from the two water outlets 311 and the liquid outlet trough 31b, thereby limiting the working fluid to only flow from the water inlet 310 into the cavity 31c below, and cannot escape to the water outlet 311 next to it. Also, please refer to Figure 3B As shown in the figure, a frame 315 is protruded on the second surface 314, and the appearance of the frame 315 corresponds to the base plate 30. Therefore, when the base 31 is correspondingly covered on the base plate 30 and the heat dissipation fin group 32, a cavity 31c can be defined between the frame 315 and the base plate 30, and the heat dissipation fin group 32 is correspondingly accommodated in the cavity 31c.
[0082] Please also see Figure 3A and Figure 3D . Figure 3D for Figure 3AA three-dimensional diagram of the flow of the working fluid of the liquid-cooled heat dissipation device is shown. In this embodiment, the liquid-cooled heat dissipation device 3 also includes an upper cover 33, and the upper cover 33 corresponds to covering the square groove 316 of the base body 31. The upper cover 33 has two through openings 330, and they are respectively connected to the water inlet pipe 34 and the water outlet pipe 35. Therefore, when the upper cover 33 covers the base body 31, the working fluid can be transported downward through the through opening 330 of the upper cover 33 through the water inlet pipe 34 to the injection groove 31a of the square groove 316 of the base body 31, that is, it flows in the direction shown by the arrow C1, and then guided to the water inlet 310 along the bottom surface 317 of the injection groove 31a, and as shown in the figure, transported downward to the cavity 31c. As a result, the working fluid flows in the cavity 31c and exchanges heat with the heat dissipation fin group 32. As shown Figure 3D As shown, when the working fluid is injected downward into the cavity 31c, it is vertically injected downward along the Z-axis direction into the heat sink fin group 32, and then flows to the two sides of the heat sink fin group 32 along the X-axis direction, that is, as shown by arrow C2, when the working fluid flows to both sides, it will flow up and down along the Y-axis direction, and then flow back to the center along the X-axis direction from both sides of the heat sink fin group 32, and then flow upward along the Z-axis direction to the two water outlets 311 as shown by arrow C3, so as to flow into the liquid outlet tank 31b, and then be transported to the water outlet pipe 35 through the through opening 330 of the upper cover 33, thereby forming a heat dissipation reflux of the working fluid. In addition, in this embodiment, the water inlet 310 is correspondingly arranged between the two water outlets 311, and the ratio of the total area of the water inlet 310 to the two water outlets 311 is 1:2, but it is not limited thereto. The small, narrow water inlet 310 increases the downward flushing pressure of the working fluid, thereby increasing the flow rate at the water inlet 310, and allowing the working fluid to maintain a higher flow rate when refluxing and cooling the liquid cooling device 3. Please refer to the following Table 1, which is a flow rate comparison table of this embodiment and two prior arts.
[0083] Table 1
[0084]
[0085] As can be seen from Table 1 above, the liquid cooling heat dissipation device 3 of this embodiment is designed with a relatively narrow water inlet 310 area, so that when the working fluid is injected into the cavity 31c, it is limited to flush the local heat dissipation fin group 32, thereby increasing the flow rate from the water inlet to the heat dissipation fins to 1.5 times that of the known technology 1 and 3 times that of the known technology 2. In this way, the flow rate of the liquid cooling heat dissipation device 3 is increased, the heat exchange amount is increased, and the heat dissipation of the hottest heat-generating electronic components under the bottom plate 30 can be preferentially performed. As for the heat-generating electronic components on both sides and other areas, due to the factor of the flow limit at the water inlet 310 mentioned above, their flow rate is still increased compared to the known technology, so that a better heat exchange performance can be maintained, so that the heat-generating electronic components in other areas can also obtain good heat dissipation efficiency, and thus can dissipate heat evenly.
[0086] See also Figure 3E . Figure 3E for Figure 3AA schematic top view of the working fluid flow of the liquid cooling device shown. As shown in the figure, the heat sink fin group 32 includes a plurality of first heat sink fins 320, a plurality of second heat sink fins 321 and at least one third heat sink fin 322. In the present embodiment, the heat sink fin group 32 has a first heat sink fin group, two second heat sink fin groups and two third heat sink fins 322. As mentioned above, the first heat sink fin group includes a plurality of first heat sink fins 320, and each second heat sink fin group also includes a plurality of second heat sink fins 321. In the present embodiment, the plurality of first heat sink fins 320, the plurality of second heat sink fins 321 and the third heat sink fins 322 may be, but are not limited to, made of a metal material with a high thermal conductivity coefficient, but are not limited thereto. In some embodiments, the plurality of first heat sink fins 320, the plurality of second heat sink fins 321 and the third heat sink fins 322 may be, but are not limited to, the same heat sink fin structure; however, in other embodiments, the third heat sink fin 322 may be a metal sheet structure that is slightly longer than the first heat sink fin 320 and the second heat sink fin 321, or slightly thicker than the first heat sink fin 320 and the second heat sink fin 321, or slightly taller than the first heat sink fin 320 and the second heat sink fin 321, but its length, width and height are not limited thereto and may be varied according to actual implementation conditions. As shown in the figure, the first heat sink fins 320 of the first heat sink fin group of the present embodiment are correspondingly arranged below the water inlet 310, the second heat sink fins 321 of the two second heat sink fin groups are respectively correspondingly arranged below the two water outlets 311, and the two third heat sink fins 322 are respectively correspondingly arranged between the first heat sink fins 320 of the first heat sink fin group and the second heat sink fins 321 of the two second heat sink fin groups. In other words, the first heat sink fins 320 of the first heat sink fin group are sandwiched between the second heat sink fins 321 of the two second heat sink fin groups through the two third heat sink fins 322. As mentioned above, each first heat sink fin 320 has a first head end 320a, a first tail end 320b and a first top 320c, and the first top 320c is connected to the first head end 320a and the first tail end 320b. Similarly, each second heat dissipation fin 321 has a second head end 321a, a second tail end 321b and a second top 321c, and the second top 321c is connected to the second head end 321a and the second tail end 321b. Each third heat dissipation fin 322 also has a third head end 322a, a third tail end 322b, a third top 322c, a first side 322d and a second side 322e, wherein the first side 322d and the second side 322e are respectively located on both sides of the third top 322c and are connected to the third head end 322a and the third tail end 322b, and the first side 322d faces the plurality of first heat dissipation fins 320, and the second side 322e faces the plurality of second heat dissipation fins 321.Since the water inlet 310 is disposed above the first heat sink fins 320, the water inlet 310 faces the first tops 320c of the first heat sink fins 320, while the two water outlets 311 face the second tops 321c of the second heat sink fins 321. As shown in the figure, when the working fluid flows downward from the water inlet 310 along the Z-axis direction into the cavity 31c, it first contacts the first tops 320c of the first heat sink fins 320, and then flows to both sides along the X-axis direction, as shown by arrow C2, flowing to the first head end 320a and the first tail end 320b respectively, and then flows upward or downward along the Y-axis direction from the two sides of the bottom plate 30 and the cavity 31c, flows through the third head end 322a and the third tail end 322b of the third heat sink fin 322, and then flows to the two second heat sinks 31c. The second head ends 321a and the second tail ends 321b of the plurality of second heat dissipating fins 321 of the heat fin group then flow toward the two water outlets 311 along the X-axis direction according to the pressure drawn outward by the working fluid, and then flow out of the water outlet 311 upward along the X-axis direction. In this way, since the working fluid of this embodiment has a path for flowing toward the two sides of the cavity 31c along the Y-axis direction, its return flow path is significantly longer than that of the known technology, so the heat dissipation capacity is also better, and the purpose of uniform heat dissipation can be achieved.
[0087] See also Figure 4 . Figure 4The schematic top view of the working fluid flow of the liquid cooling heat dissipation device of the second preferred embodiment of the utility model. As shown in the figure, the liquid cooling heat dissipation device 4 of this embodiment also includes: a base plate 40, a seat body 41 and a heat dissipation fin group 42. The heat dissipation fin group 42 is arranged on the base plate 40, and includes a plurality of first heat dissipation fins 420, a plurality of second heat dissipation fins 421 and a third heat dissipation fin 422. Similarly, each first heat dissipation fin 420 has a first head end 420a, a first tail end 420b and a first top 420c, and the first top 420c is connected to the first head end 420a and the first tail end 420b. Each second heat dissipation fin 421 has a second head end 421a, a second tail end 421b and a second top 421c, and the second top 421c is connected to the second head end 421a and the second tail end 421b. As shown in the figure, the third heat dissipation fin 422 is disposed between the plurality of first heat dissipation fins 420 and the plurality of second heat dissipation fins 421 to separate the plurality of first heat dissipation fins 420 and the plurality of second heat dissipation fins 421, and the third heat dissipation fin 422 has a third head end 422a, a third tail end 422b, a third top 422c, a first side 422d and a second side 422e, wherein the first side 422d and the second side 422e are respectively located on both sides of the third top 422c and are connected to the third head end 422a and the third tail end 422b, and the first side 422d faces the plurality of first heat dissipation fins 420, and the second side 422e faces the plurality of second heat dissipation fins 421. The base 41 covers the heat dissipation fin group 42 and the bottom plate 40, and has a water inlet 410 and a water outlet 411, wherein the water inlet 410 faces the aforementioned first top 420c, and the water outlet 411 faces the aforementioned second top 421c. The difference between this embodiment and the aforementioned embodiment is that this embodiment has only a single set of water outlets 411 , and therefore also has only a single set of a plurality of second heat dissipation fins 421 disposed corresponding to the water outlets 411 .In this embodiment, the water inlet 410 is still designed to correspond to the top of the heat-generating electronic component with the highest wattage of the heat source, and as shown in the figure, when the working fluid flows downward from the water inlet 410 of the liquid-cooled heat dissipation device 4, since the working fluid flows vertically downward, that is, flows in the Z-axis direction, it first contacts the first top 420c of the plurality of first heat dissipation fins 420, and then flows to the sides of the first heat dissipation fins 420, that is, flows in the X-axis direction toward the first head end 320a and the first tail end 320b, so it can first dissipate heat for the heat-generating electronic component below the first heat dissipation fin 420; then it flows upward along the two sides of the bottom plate 40 in the Y-axis direction. The working fluid flows in the X-axis direction and the Z-axis direction respectively through the third head end 422 and the third tail end 422b of the third heat dissipating fin 422, and then flows to the second head end 421a and the second tail end 421b of the plurality of second heat dissipating fins 421, and according to the pressure drawn outward by the working fluid, flows toward the water outlet 411 arranged at the center of the second heat dissipating fin 421. In this way, since the working fluid of this embodiment has the three axial return flow paths in the Z-axis direction, the X-axis direction and the Y-axis direction, the return flow length path is significantly longer than that of the known technology, so the heat dissipation capacity is also better, and the purpose of uniform heat dissipation can be achieved.
[0088] See also Figure 5 . Figure 51 is a top view schematic diagram of the working fluid flow of the liquid cooling heat dissipation device of the third preferred embodiment of the utility model. As shown in the figure, the liquid cooling heat dissipation device 5 of this embodiment also includes: a bottom plate 50, a base body 51 and a heat dissipation fin group 52. The heat dissipation fin group 52 is arranged on the bottom plate 50, and includes a plurality of first heat dissipation fins 520, a plurality of second heat dissipation fins 521 and a third heat dissipation fin 522. Similar to the aforementioned embodiment, the first heat dissipation fin 520 of this embodiment has a first head end 520a, a first tail end 520b and a first top 520c, the second heat dissipation fin 521 has a second head end 521a, a second tail end 521b and a second top 521c, the third heat dissipation fin 522 is disposed between the plurality of first heat dissipation fins 520 and the plurality of second heat dissipation fins 521, and has a third head end 522a, a third tail end 522b, a third top 522c, a first side surface 522d and a second side surface 522e, and the first side surface 522d faces the plurality of first heat dissipation fins 520, and the second side surface 522e also faces the plurality of second heat dissipation fins 521. In this embodiment, the base 51 also has only a single water inlet 510 and a single water outlet 511, and the water inlet 510 faces the first top 520c of the aforementioned plurality of first heat sink fins 520, and the water outlet 511 faces the second top 521c of the aforementioned plurality of second heat sink fins 521. However, in this embodiment, the plurality of first heat sink fins 520 have a first arrangement density, and the plurality of second heat sink fins 521 have a second arrangement density, and the first arrangement density is greater than the second arrangement density. In other words, the number of first heat sink fins 520 is greater than that of second heat sink fins 521, which means that the first arrangement density of the plurality of first heat sink fins 520 is denser, and the second arrangement density of the plurality of second heat sink fins 521 is sparser, and the distance between each second heat sink fin 521 is larger. By configuring the arrangement density with different densities, the pressure drop of the overall liquid cooling device 5 is improved. Of course, in other embodiments, the first arrangement density of the plurality of first heat sink fins 520 may be equal to or less than the second arrangement density of the plurality of second heat sink fins 521, and the present invention is not limited thereto. It can be seen that the number, arrangement density and arrangement method of the first heat sink fins 520 and the second heat sink fins 521 can be changed according to the configuration of the heat-generating electronic components of different heat sources or according to the actual operation conditions, and the present invention is not limited thereto.
[0089] like Figure 5As shown, when the working fluid flows vertically downward along the Z-axis direction from the water inlet 510 of the liquid cooling heat dissipation device 5, it first contacts the first top 520c of the plurality of first heat dissipation fins 520, and then flows along the X-axis direction toward the first head end 320a and the first tail end 320b of the first heat dissipation fin 520. Afterwards, it flows upward along the two sides of the bottom plate 50 in the Y-axis direction, flows through the third head end 522 and the third tail end 522b of the third heat dissipation fin 522, and then flows to the second head end 521a and the second tail end 521b of the plurality of second heat dissipation fins 521 arranged with a relatively sparse density, and flows toward the water outlet 511 disposed at the center of the second heat dissipation fin 521 in the X-axis direction and the Z-axis direction according to the pressure drawn outward by the working fluid, thereby extending the flow path of the liquid cooling heat dissipation device 5, and cooperating with the first heat dissipation fin 520 and the second heat dissipation fin 521 to improve the heat dissipation efficiency and evenly dissipate heat.
[0090] In summary, the utility model provides a liquid cooling device, which increases the flow rate of the water inlet to flush the heat sink fins by different ratios of the water inlet and the water outlet area, thereby increasing the flow rate and the heat exchange amount, that is, promoting the heat exchange efficiency. In addition, the liquid cooling device of the utility model can also flush the heat sink fins downward from the water inlet through the working fluid, and reflux in the Y-axis direction, the X-axis direction, the Y-axis direction, and then in the X-axis direction and the Y-axis direction, thereby extending the reflux path of the working fluid, increasing the heat exchange efficiency, and achieving the purpose of promoting uniform heat dissipation.
[0091] The present invention can be modified in various ways by those skilled in the art, but all of them are within the protection scope of the appended claims.
Claims
1. A liquid cooling device, characterized in that: Include: a bottom plate; A heat dissipation fin group is disposed on the bottom plate, comprising: A plurality of first heat dissipation fins, each of which has a first head end, a first tail end and a first top end, and the first top end is connected to the first head end and the first tail end at the same time; A plurality of second heat dissipation fins, each of the second heat dissipation fins having a second head end, a second tail end and a second top portion, the second top portion being connected to the second head end and the second tail end at the same time; and At least one third heat dissipation fin is disposed between the plurality of first heat dissipation fins and the plurality of second heat dissipation fins, the third heat dissipation fin having a third head end, a third tail end, a third top, a first side face and a second side face, wherein the first side face and the second side face are respectively located on both sides of the third top face and are both connected to the third head end and the third tail end, and the first side face faces the plurality of first heat dissipation fins, and the second side face faces the plurality of second heat dissipation fins; as well as A base body is covered on the heat dissipation fin group and the bottom plate, and has a water inlet and at least one water outlet. The water inlet faces the first top, and the water outlet faces the second top.
2. The liquid cooling device according to claim 1, characterized in that: The seat body has a liquid injection groove and a liquid outlet groove, the water inlet is arranged in the liquid injection groove, and the water outlet is arranged in the liquid outlet groove.
3. The liquid cooling device according to claim 2, characterized in that: The liquid injection groove has a guide angle therein and is connected to the water inlet.
4. The liquid cooling device according to claim 3, characterized in that: The chamfer is a portion of a bottom surface of the liquid injection groove.
5. The liquid cooling device according to claim 1, characterized in that: The liquid cooling device also includes a flow limiting structure, which is arranged around the periphery of the water inlet to block the water inlet from the water outlet.
6. The liquid cooling device according to claim 1, characterized in that: The plurality of first heat dissipation fins have a first arrangement density, the plurality of second heat dissipation fins have a second arrangement density, and the first arrangement density is greater than the second arrangement density.
7. The liquid cooling device according to claim 1, characterized in that: The plurality of first heat dissipation fins have a first arrangement density, the plurality of second heat dissipation fins have a second arrangement density, and the first arrangement density is equal to the second arrangement density.
8. The liquid cooling device according to claim 1, characterized in that: Each of the first heat dissipation fins, each of the second heat dissipation fins and the third heat dissipation fin of the heat dissipation fin group are sheet metal structures with the same size.
9. The liquid cooling device according to claim 1, characterized in that: The thickness of the third heat dissipation fin is greater than the thickness of each of the first heat dissipation fins and each of the second heat dissipation fins.
10. The liquid cooling device according to claim 1, characterized in that: The height of the third heat dissipation fin is greater than the height of each of the first heat dissipation fins and each of the second heat dissipation fins.
11. The liquid cooling device according to claim 1, characterized in that: The length of the third heat dissipation fin is greater than the length of each of the first heat dissipation fins and each of the second heat dissipation fins.
12. A liquid cooling device, characterized in that: Include: a bottom plate; A heat dissipation fin group is disposed on the bottom plate, comprising: A plurality of first heat dissipation fins; a plurality of second heat dissipation fins; and At least one third heat dissipation fin is disposed between the plurality of first heat dissipation fins and the plurality of second heat dissipation fins; as well as A base body, covering the heat dissipation fin group and the bottom plate, having a water inlet and at least one water outlet, the water inlet facing a first top of the plurality of first heat dissipation fins, and the water outlet facing a second top of the plurality of second heat dissipation fins; Among them, when a working fluid is injected from the water inlet, it flows along the Z-axis direction to a first top of the aforementioned multiple first heat dissipation fins, and flows along the X-axis direction to both sides of the aforementioned multiple first heat dissipation fins, and then flows along the Y-axis direction to both sides of the aforementioned multiple second heat dissipation fins, and then flows along the X-axis direction and the Y-axis direction along the aforementioned multiple second heat dissipation fins to the water outlet, so as to form a reflux path in three axes of Z, X and Y.
13. The liquid cooling device according to claim 12, characterized in that: The liquid cooling device also includes a flow limiting structure, which is arranged around the periphery of the water inlet to block the water inlet from the water outlet.
14. The liquid cooling device according to claim 12, characterized in that: The plurality of first heat dissipation fins have a first arrangement density, the plurality of second heat dissipation fins have a second arrangement density, and the first arrangement density is greater than the second arrangement density.
15. The liquid cooling device according to claim 12, characterized in that: Each of the first heat dissipation fins, each of the second heat dissipation fins and the third heat dissipation fin of the heat dissipation fin group are sheet metal structures with the same size.
Citation Information
Patent Citations
Fluid heat exchanger configured to provide a split flow
US8746330B2
Cited By
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