High-heat-dissipation LED switching power supply

Abstract

The utility model discloses an LED switching power supply with high heat dissipation, which relates to the technical field of LED heat dissipation, and comprises a power supply box, an electric energy component arranged on one side in the power supply box, and a heat dissipation opening formed in the top of the power supply box, and one side of the surface of the electric energy component is fixedly connected with a heat dissipation base capable of absorbing and dissipating heat through direct contact. Clamping blocks are arranged on the two sides of the inner wall of the power source box. The heat dissipation base makes contact with the electric energy source assembly so that heat energy can be gathered in the heat dissipation fins, the semiconductor heat dissipation fins arranged on the two sides of the interior of the disassembly block are utilized so that the heat energy can be fully volatilized, and the residual heat energy can be driven by the transverse fan to transversely move; and then the hot air flows out through the heat dissipation openings through the working of the longitudinal fans, the situation that most heat dissipation structures do not have the high heat dissipation effect is avoided, redundant heat energy is transmitted out through cooling of semiconductors, the high heat dissipation efficiency of the structure is improved, heat dissipation is changed into useful work, and meanwhile the working efficiency of a power source in the device is also improved.

Description

Technical Field

[0001] The utility model relates to the technical field of LED heat dissipation, in particular to an LED switching power supply with high heat dissipation. Background Art

[0002] The high frequency of ED switching power supply is its development direction. High frequency makes the switching power supply smaller and allows the switching power supply to enter a wider range of applications, especially in the field of high-tech, which promotes the miniaturization and lightness of high-tech products.

[0003] After searching, the applicant discovered that a Chinese patent disclosed "an LED switching power supply with efficient heat dissipation", and its publication number is "CN211352025U", which includes a shell, an insulating base, a circuit main board, a transformer, a plurality of switch terminals, a plurality of heat dissipation aluminum plates and an automatic heat dissipation device; the top of the heat dissipation aluminum plate is provided with a receiving groove for installing the switch terminal, and the side of the heat dissipation aluminum plate is provided with a plurality of heat dissipation fins arranged parallel to each other, the shell includes a bottom plate, a top cover and four side plates, and the automatic heat dissipation device includes a temperature detector, a first heat dissipation fan and a plurality of second heat dissipation fans. The utility model arranges the switch terminals on the heat dissipation aluminum plate, increases the heat dissipation area by heat dissipation fins, and realizes cooling and heat dissipation; the automatic heat dissipation device can monitor the internal temperature of the switching power supply in real time through the temperature detector, and when the temperature reaches a high value, the first heat dissipation fan and the second heat dissipation fan are automatically turned on to achieve rapid heat dissipation, temperature control adjustment, and efficient heat dissipation; a plurality of heat dissipation holes are respectively provided in the shell, which can increase the heat flow rate in the switching power supply;

[0004] However, when most switching power supplies are in use, the heat dissipation effect of their heat dissipation structure will only work through a fan to guide the hot air direction, which will directly affect the heat dissipation effect of the internal structure, making the heat dissipation work inefficient. The internal structure cannot be cooled in time, which will also make the power load become huge, thereby increasing safety hazards. Utility Model Content

[0005] The purpose of the utility model is to provide a high heat dissipation LED switching power supply, so as to solve the problem that most switching power supplies mentioned in the above background technology, when in use, the heat dissipation effect of the heat dissipation structure of which can only work through a fan to guide the hot air direction, which will directly affect the heat dissipation effect of the internal structure, making the heat dissipation work inefficient, and the internal structure cannot be cooled in time, which will also make the power load of the power supply become huge, thereby increasing the safety hazard.

[0006] To achieve the above-mentioned purpose, the utility model provides the following technical solutions: a high heat dissipation LED switching power supply, comprising a power box and an electric energy component provided on one side of the power box and a heat dissipation port opened on the top, one side of the surface of the electric energy component is fixedly connected to a heat dissipation base capable of absorbing heat by direct contact, blocks are provided on both sides of the inner wall of the power box, and the opposite sides of the two blocks are slidably connected to a disassembly block having a cooling effect and which can be replaced and repaired at will, and a vertical heat dissipation box is provided on the inner wall of the power box on one side of the heat dissipation base.

[0007] Preferably, the heat dissipation base is fixedly connected to one side of the surface of the electric energy component, and a plurality of heat sinks are provided on the side of the heat dissipation base away from the electric energy component. A heat pipe is commonly provided inside the plurality of heat sinks, and one end of the plurality of heat pipes is commonly fixedly connected to an energy gathering block.

[0008] Preferably, a heat dissipation fan block is fixedly connected to one side of the surface of the energy gathering block, through openings are provided on both sides of the heat dissipation fan block located on the energy gathering block, and a mesh surface is provided on one side of the surface of the heat dissipation fan block.

[0009] Preferably, a converging cavity is provided inside the heat dissipation fan block, a transverse motor is fixedly connected to one side of the inner wall of the converging cavity, and a transverse fan is fixedly connected to the output end of the transverse motor.

[0010] Preferably, the material used for the heat sink is aluminum, and the material used for the plurality of heat pipes is copper.

[0011] Preferably, the two card blocks are fixedly connected to the inner wall of the power box at two sides of the heat dissipation base, and opposite sides of the two card blocks are commonly fixedly connected with a fixing block.

[0012] Preferably, the disassembly block is slidably connected to the opposite side of the two fixed blocks, the upper and lower sides of the disassembly block are provided with sliding grooves, and the inner wall of the sliding groove is slidably connected to the surface of the fixed block, and the opposite side of the disassembly block is provided with semiconductor heat sinks.

[0013] Preferably, the vertical heat dissipation box is fixedly connected to the inside of the power box on one side of the disassembly block, the inner wall of the vertical heat dissipation box is fixedly connected with a longitudinal motor, the output end of the longitudinal motor is fixedly connected with a longitudinal fan, and through slots are opened on both sides of the vertical heat dissipation box.

[0014] The technical effects and advantages of the utility model are as follows: the utility model utilizes the heat dissipation base to directly contact the electric energy component to gather heat inside a plurality of heat sinks, and then utilizes the semiconductor heat sinks provided on both sides of the disassembly block to fully volatilize the heat energy, and the remaining excess heat energy will be moved laterally by the drive of the transverse fan, and then the hot air flow will flow out through the heat dissipation port through the work of the longitudinal fan, thus avoiding the fact that most heat dissipation structures do not have a high heat dissipation effect, utilizes the cooling of the semiconductor, and then transfers the excess heat energy, thereby improving the high efficiency of the heat dissipation of the structure, making the heat dissipation become useful work, and also improving the working efficiency of the power supply inside the device. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] Figure 1 It is a three-dimensional structural schematic diagram of the utility model.

[0016] Figure 2 It is a front cross-sectional structural schematic diagram of the utility model.

[0017] Figure 3 It is a schematic diagram of the three-dimensional structure of the heat dissipation base of the utility model.

[0018] Figure 4 For the utility model Figure 2 Schematic diagram of the enlarged structure of part A in the middle.

[0019] Figure 5 This is a schematic diagram of the disassembly block structure of the utility model.

[0020] In the figure: 1. power box; 2. electric energy component; 3. heat dissipation base; 301. radiator fin; 302. heat pipe; 303. energy gathering block; 304. heat dissipation fan block; 305. convergence cavity; 306. through port; 307. horizontal motor; 308. horizontal fan; 309. mesh surface; 4. clamp block; 401. fixing block; 5. disassembly block; 501. sliding slot; 502. semiconductor heat sink; 6. vertical heat dissipation box; 601. longitudinal motor; 602. longitudinal fan; 603. through slot; 7. heat dissipation port. DETAILED DESCRIPTION

[0021] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

[0022] The utility model provides Figure 1-5A high heat dissipation LED switching power supply shown in the figure comprises a power supply box 1 and an electric energy component 2 provided on one side of the power supply box 1 and a heat dissipation port 7 opened on the top. A heat dissipation base 3 capable of absorbing heat by direct contact is fixedly connected to one side of the surface of the electric energy component 2. Blocks 4 are provided on both sides of the inner wall of the power supply box 1. The two opposite sides of the two blocks 4 are slidably connected to a disassembly block 5 having a cooling effect and which can be replaced and repaired at will. A vertical heat dissipation box 6 is provided on one side of the inner wall of the power supply box 1 located at the heat dissipation base 3. The utility model utilizes the heat dissipation base 3 to directly contact the electric energy component 2 so that heat is gathered inside a plurality of heat sink fins 301. Then, the semiconductor heat sink fins 502 provided on both sides of the disassembly block 5 are utilized to fully volatilize the heat energy. The remaining excess heat energy will move horizontally driven by the horizontal fan 308, and then the hot air flow will flow out through the heat dissipation port 7 through the operation of the longitudinal fan 602, thereby avoiding the fact that most heat dissipation structures do not have a high heat dissipation effect. The cooling of the semiconductor is utilized to transfer the excess heat energy, thereby improving the efficiency of the heat dissipation of the structure, making the heat dissipation become useful work, and also improving the working efficiency of the power supply inside the device.

[0023] like Figure 2-3 As shown, the heat dissipation base 3 is fixedly connected to one side of the surface of the electric energy component 2, and a plurality of heat sinks 301 are arranged on the side of the heat dissipation base 3 away from the electric energy component 2. A heat pipe 302 is commonly arranged inside the plurality of heat sinks 301, and one end of the plurality of heat pipes 302 is commonly fixedly connected to an energy gathering block 303. The energy gathering block 303 is in contact with the plurality of heat pipes 302, and can transfer the heat energy that cannot be volatilized by the semiconductor heat sink 502 to the inside, and finally transfer it out of the inside of the power supply box 1 through the guide. A heat dissipation fan block 304 is fixedly connected to one side of the surface of the energy gathering block 303, and the heat dissipation fan block 304 is located on both sides of the energy gathering block 303 and is provided with a through The opening 306 can allow the heat energy attached to the energy gathering block 303 to enter the interior of the heat dissipation fan block 304 through the setting of the opening 306. A mesh surface 309 is provided on one side of the surface of the heat dissipation fan block 304. A focusing cavity 305 is provided inside the heat dissipation fan block 304. A transverse motor 307 is fixedly connected to one side of the inner wall of the focusing cavity 305. A transverse fan 308 is fixedly connected to the output end of the transverse motor 307. The material used for the heat sink 301 is aluminum material, and the material used for the multiple heat pipes 302 is copper material. The use of copper material enables the heat pipes 302 to quickly and evenly distribute heat energy for the multiple heat sinks 301.

[0024] like Figure 4As shown, the two card blocks 4 are fixedly connected to the inner wall of the power box 1 on both sides of the heat dissipation base 3, and the opposite sides of the two card blocks 4 are commonly fixedly connected with a fixed block 401. The setting of the fixed block 401 enables the disassembly block 5 to be disassembled at will, so that the disassembly block 5 can be quickly disassembled and the working condition of the semiconductor heat sink 502 inside it can be checked. The disassembly block 5 is slidably connected to the opposite sides of the two fixed blocks 401. The upper and lower sides of the disassembly block 5 are provided with sliding grooves 501, and the inner wall of the sliding groove 501 is slidably connected to the surface of the fixed block 401. The opposite sides of the disassembly block 5 are provided with semiconductor heat sinks 502, which are located on both sides of the multiple heat sinks 301, and can first process the heat energy and volatilize the heat energy in time.

[0025] like Figure 5 As shown, the vertical heat dissipation box 6 is fixedly connected to the inside of the power supply box 1 on one side of the disassembly block 5, the inner wall of the vertical heat dissipation box 6 is fixedly connected with a longitudinal motor 601, the output end of the longitudinal motor 601 is fixedly connected with a longitudinal fan 602, and both sides of the vertical heat dissipation box 6 are provided with through grooves 603, through the grooves 603, the excess heat energy that cannot be processed inside can be discharged.

[0026] Working principle of the utility model: When the utility model is used, the heat energy generated by the electric energy component 2 is firstly absorbed by the heat dissipation base 3 by using the direct contact between the heat dissipation base 3 and the electric energy component 2. While absorbing the heat energy, the heat energy is distributed inside the multiple heat sinks 301. Since the heat pipes 302 are distributed inside the multiple heat sinks 301, the heat energy storage inside the multiple heat sinks 301 becomes uniform due to the involvement of the heat pipes 302. While absorbing the heat energy, the semiconductor heat sinks 502 provided on both sides of the disassembly block 5 located on both sides of the heat sink 301 will first volatilize part of the heat energy provided by the heat sink 301;

[0027] When the heat energy attached to the semiconductor heat sink 502 is too much and exceeds the working range of the semiconductor heat sink 502, the excess heat energy will be transferred through the horizontal fan 308 and enter the interior of the vertical heat sink 6 through the slot 603 opened on the left side of the vertical heat sink 6. Finally, the longitudinal fan 602 is driven by the longitudinal motor 601 to operate, and the excess heat energy will be discharged from the interior of the power box 1 through the slot 603 on the top of the vertical heat sink 6 and the heat dissipation port 7.

[0028] Finally, it should be noted that the above is only a preferred embodiment of the present invention and is not intended to limit the present invention. Although the present invention has been described in detail with reference to the aforementioned embodiments, those skilled in the art can still modify the technical solutions described in the aforementioned embodiments or make equivalent substitutions for some of the technical features therein. Any modifications, equivalent substitutions, improvements, etc. made within the spirit and principles of the present invention should be included in the protection scope of the present invention.

Claims

1. A high heat dissipation LED switching power supply, comprising a power supply box (1), an electric energy source component (2) provided on one side of the power supply box (1), and a heat dissipation port (7) opened on the top, characterized in that: A heat dissipation base (3) capable of absorbing heat through direct contact is fixedly connected to one side of the surface of the electric energy component (2); blocks (4) are provided on both sides of the inner wall of the power supply box (1); opposite sides of the two blocks (4) are slidably connected to a disassembly block (5) having a cooling effect and capable of being replaced and repaired at will; and a vertical heat dissipation box (6) is provided on the inner wall of the power supply box (1) on one side of the heat dissipation base (3).

2. The high heat dissipation LED switching power supply according to claim 1, characterized in that: The heat dissipation base (3) is fixedly connected to one side of the surface of the electric energy component (2); a plurality of heat sinks (301) are provided on the side of the heat dissipation base (3) away from the electric energy component (2); a heat conduction pipe (302) is commonly provided inside the plurality of heat conduction pipes (301); and one end of the plurality of heat conduction pipes (302) is commonly fixedly connected to an energy gathering block (303).

3. The high heat dissipation LED switching power supply according to claim 2, characterized in that: A heat dissipation fan block (304) is fixedly connected to one side of the surface of the energy gathering block (303); passage openings (306) are provided on both sides of the heat dissipation fan block (304) located on the energy gathering block (303); and a mesh surface (309) is provided on one side of the surface of the heat dissipation fan block (304).

4. The high heat dissipation LED switching power supply according to claim 3, characterized in that: A converging cavity (305) is provided inside the heat dissipation fan block (304), a transverse motor (307) is fixedly connected to one side of the inner wall of the converging cavity (305), and a transverse fan (308) is fixedly connected to the output end of the transverse motor (307).

5. The high heat dissipation LED switching power supply according to claim 2, characterized in that: The material used for the heat sink (301) is aluminum, and the material used for the plurality of heat pipes (302) is copper.

6. The high heat dissipation LED switching power supply according to claim 1, characterized in that: The two card blocks (4) are both fixedly connected to the inner wall of the power box (1) and located on both sides of the heat dissipation base (3), and opposite sides of the two card blocks (4) are commonly fixedly connected to a fixing block (401).

7. The high heat dissipation LED switching power supply according to claim 1, characterized in that: The disassembly block (5) is slidably connected to the opposite sides of the two fixed blocks (401); the upper and lower sides of the disassembly block (5) are provided with sliding grooves (501); the inner wall of the sliding groove (501) is slidably connected to the surface of the fixed block (401); and the opposite sides of the disassembly block (5) are provided with semiconductor heat sinks (502).

8. The high heat dissipation LED switching power supply according to claim 1, characterized in that: The vertical heat dissipation box (6) is fixedly connected to the inside of the power supply box (1) on one side of the disassembly block (5); a longitudinal motor (601) is fixedly connected to the inner wall of the vertical heat dissipation box (6); an output end of the longitudinal motor (601) is fixedly connected to a longitudinal fan (602); and through slots (603) are provided on both sides of the vertical heat dissipation box (6).

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