Light emitting diode
By adding a white adhesive layer around the LED chip, the adhesion and reflectivity between the bulb and the bracket are enhanced, solving the problem of low light output efficiency and improving brightness.
Patent Information
- Application Number
- CN202420831893.3
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-04-19
- Publication Date
- 2025-01-10
- Estimated Expiration
- 2034-04-19
AI Technical Summary
The light extraction efficiency of existing light-emitting diodes is not high.
A white adhesive layer is placed around the LED chip to cover the surface of the bracket, which improves the adhesion and airtightness between the ball head and the bracket, and enhances the reflectivity of the bracket to red light.
The light extraction efficiency and anti-sulfurization ability of the light-emitting diodes were improved, and the brightness was increased by 2.0%.
Smart Images
Figure CN222339926U_ABST
Abstract
Description
Technical Field
[0001] The present disclosure relates to the field of light-emitting devices, and in particular to a light-emitting diode. Background Art
[0002] As an efficient and energy-saving lighting source, light emitting diodes (LEDs) have been widely used and developed in recent years, and they play an important role in home lighting, commercial lighting, automotive lighting and other fields. With the continuous expansion of LED applications, the requirements for LED brightness and light efficiency are also increasing. In order to meet the market demand for higher brightness and better light efficiency, LED packaging technology is constantly innovating and improving.
[0003] The related art provides a light emitting diode, including: a bracket, a light emitting diode chip arranged on the bracket, a wire connecting the bracket and the light emitting diode chip, and a ball head covering the bracket and the chip.
[0004] However, the light extraction efficiency of the light emitting diode using the above packaging structure is not high. Utility Model Content
[0005] The embodiment of the present disclosure provides a light emitting diode, which is conducive to enhancing the light extraction efficiency of the light emitting diode. The technical solution is as follows:
[0006] In one aspect, a light emitting diode is provided, the light emitting diode comprising:
[0007] Bracket, white glue layer, LED chip, wire and ball head.
[0008] The light-emitting diode chip is located on the surface of the bracket and in the middle of the bracket. The wire is electrically connected to the light-emitting diode chip and the bracket respectively. The white glue layer covers the surface of the bracket around the light-emitting diode chip. The ball head is connected to the bracket, and the ball head covers the light-emitting diode chip and the white glue layer.
[0009] Optionally, the bracket includes a substrate and a first bracket coating layer located on the substrate.
[0010] Optionally, the light emitting diode chip is a red light chip.
[0011] Optionally, the white glue layer is a white glue film coated on the bracket around the light-emitting diode chip.
[0012] Optionally, the white glue layer is a white glue sheet bonded to the bracket around the light-emitting diode chip.
[0013] Optionally, the thickness of the white glue layer is greater than the thickness of the light emitting diode chip.
[0014] Optionally, the thickness of the white glue layer is equal to the thickness of the light emitting diode chip.
[0015] Optionally, the thickness of the white glue layer is smaller than the thickness of the light emitting diode chip.
[0016] Optionally, the thickness of the white glue layer is less than 80 microns.
[0017] Optionally, the thickness of the white glue layer is 60 to 80 microns.
[0018] The technical solution provided by the embodiments of the present disclosure has the following beneficial effects:
[0019] In the disclosed embodiment, by providing a surface of the bracket covering the periphery of the LED chip, on the one hand, the adhesion of the connection between the ball head and the bracket can be improved, the air tightness of the product can be improved, and the anti-sulfurization ability of the product can be improved. On the other hand, the covering of the white glue layer can also increase the reflectivity of the bracket to the red light generated by the LED chip, thereby enhancing the light extraction efficiency of the product. BRIEF DESCRIPTION OF THE DRAWINGS
[0020] In order to more clearly illustrate the technical solutions in the embodiments of the present disclosure, the drawings required for use in the description of the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present disclosure. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying any creative work.
[0021] Figure 1 is a structural schematic diagram of a light emitting diode provided by an embodiment of the present disclosure;
[0022] Figure 2 is a top view of a light emitting diode provided by an embodiment of the present disclosure;
[0023] Figure 3 is a top view of another light emitting diode provided by an embodiment of the present disclosure;
[0024] Figure 4 It is a flow chart of a light emitting diode packaging method provided in an embodiment of the present disclosure.
[0025] The reference numerals are as follows:
[0026] 101: substrate; 102: first bracket coating; 103: second bracket coating; 104: white glue layer; 105: light emitting diode chip; 106: wire; 107: ball head; 1: negative electrode area; 2: positive electrode area; 3: insulating tape; 1000: bracket. DETAILED DESCRIPTION
[0027] In order to make the objectives, technical solutions and advantages of the present disclosure more clear, the embodiments of the present disclosure will be further described in detail below with reference to the accompanying drawings.
[0028] Figure 1 is a schematic diagram of the structure of a light emitting diode provided by an embodiment of the present disclosure. Figure 1 The light emitting diode includes: a bracket 1000, a white glue layer 104, a light emitting diode chip 105, a wire 106 and a ball head 107.
[0029] Among them, the LED chip 105 is located on the surface of the bracket 1000 and in the middle of the bracket 1000, the wire 106 is electrically connected to the LED chip 105 and the bracket 1000 respectively, the white glue layer 104 covers the surface of the bracket 1000 around the LED chip 105, the ball head 107 is connected to the bracket 1000, and the ball head 107 covers the LED chip 105 and the white glue layer 104.
[0030] In the embodiment of the present disclosure, by providing a surface of the bracket 1000 covering the surroundings of the LED chip 105, on the one hand, the adhesion of the connection between the ball head 105 and the bracket 1000 can be improved, the air tightness of the product can be improved, and the anti-sulfurization ability of the product can be improved. On the other hand, the covering of the white glue layer 104 can also increase the reflectivity of the bracket 1000 to the red light generated by the LED chip 105, thereby enhancing the light extraction efficiency of the product.
[0031] In the embodiment of the present disclosure, the light emitting diode chip 105 is a red light chip used for plant lighting.
[0032] like Figure 1 As shown, in a possible implementation of the present disclosure, the bracket 1000 includes a substrate 101, a first bracket coating 102, and a second bracket coating 103 stacked in sequence.
[0033] In another possible implementation of the present disclosure, the bracket 1000 may only include a substrate 101 and a first bracket coating layer 102 located on the substrate 101. In this implementation, since the embodiment of the present disclosure improves the reflectivity by providing a white glue layer 104, it is not necessary to achieve the reflection effect through the second bracket coating layer 103. In this case, only the above two structures are used to save the cost of the packaging structure.
[0034] Exemplarily, the substrate 101 may be a ceramic substrate, that is, an alumina substrate, which has high strength and hardness.
[0035] Exemplarily, the first bracket plating layer 102 may be a copper plating layer. The high electrical conductivity of the copper plating layer enables the copper plating layer to provide excellent electrical conductivity. The copper plating layer also has good thermal conductivity, which helps to dissipate heat and improve stability and lifespan.
[0036] Exemplarily, the second bracket coating 103 may be a silver coating. The silver coating has excellent thermal conductivity, which helps to dissipate heat. The silver coating also has good reflectivity, which improves the luminous efficiency.
[0037] Of course, the structures of the aforementioned substrate 101, the first bracket coating 102 and the second bracket coating 103 are merely examples and are not intended to be limiting of the present application.
[0038] In the embodiment of the present disclosure, the wire 106 may be a gold wire, which has excellent electrical conductivity and chemical stability, provides efficient electrical transmission and long-term durability in the light-emitting diode package, and is easy to process and weld.
[0039] Figure 2 A top view of a light emitting diode provided in an embodiment of the present disclosure. Figure 2 The figure shows a top view of the LED packaging structure before the white glue is applied, that is, a schematic diagram of the connection between the LED chip 105 and the bracket 1000. Figure 2 The first bracket coating 102 and the second bracket coating 103 of the bracket 1000 both include a cathode region 1 and an anode region 2, and the portion separating the cathode region 1 and the anode region 2 is an insulating strip 3. The light emitting diode chip 105 is disposed in the cathode region 1 and is electrically connected to the cathode region 1.
[0040] Exemplarily, the N-pole of the LED chip 105 is electrically connected to the cathode region 1 , and the P-pole of the LED chip 105 is electrically connected to the anode region 2 via the wire 103 .
[0041] In the disclosed embodiment, the ball head 107 may be a silicone ball head. The silicone ball head has good flexibility and temperature resistance, can effectively reduce shock and moisture; it also has biocompatibility and is suitable for various environments, especially for diode packaging connections with high reliability and stability requirements. The transparency of the silicone ball head allows light to pass through without affecting the luminous efficiency, ensuring the brightness and light quality of the light-emitting diode.
[0042] Figure 3 A top view of another light emitting diode provided in an embodiment of the present disclosure. Figure 3 The figure shows a top view of the packaging structure of the light emitting diode after being coated with white glue. Figure 3 The white glue layer 104 covers the cathode region 1, the anode region 2 and the insulating tape 3 around the light emitting diode chip 105 on the bracket 1000 .
[0043] In a possible implementation, the white glue layer 104 is a white glue film coated on the bracket 1000 around the LED chip 105. The white glue layer 104 is formed by spraying white glue, and the white glue layer 104 is tightly connected to the bracket 1000.
[0044] Exemplarily, a piezoelectric valve glue sprayer is used to evenly spray highly reflective white wall glue on the surface of the bracket 1000 to form a white glue layer 104 .
[0045] In a possible implementation, the white glue layer 104 is a white film bonded to the bracket 1000 around the LED chip 105. The white film is used to bond highly reflective white wall glue to the surface of the bracket 1000 to form the white glue layer 104, and the manufacturing process is simple.
[0046] In the disclosed embodiment, the thickness of the white glue layer 104 may be greater than the thickness of the LED chip 105 , may be equal to the thickness of the LED chip 105 , or may be less than the thickness of the LED chip 105 .
[0047] In one example, the light emitting diode is used for high-power red light illumination of plants, and at this time, the thickness of the white glue layer 104 is smaller than the thickness of the light emitting diode chip 105. This thickness design ensures that the light emitting angle of the light emitting diode is large enough on the basis of ensuring the reflection efficiency of the white glue layer 104, and is suitable for the needs of high-power red light illumination of plants.
[0048] Exemplarily, the thickness of the white glue layer 104 is less than 80 micrometers. Such thickness design can ensure that the thickness of the white glue layer 104 is smaller than the thickness of the light emitting diode chip 105, thereby meeting the requirements of the reflection effect and the light output angle.
[0049] For example, the thickness of the white glue layer 104 is 60-80 micrometers. This thickness design can obtain a better reflection effect and light output angle.
[0050] Figure 4 A flow chart of a light emitting diode packaging method provided by an embodiment of the present disclosure. Figure 4 The method steps include:
[0051] S11. Provide a bracket.
[0052] like Figure 1 As shown, in a possible implementation of the present disclosure, the bracket 1000 includes a substrate 101, a first bracket coating 102, and a second bracket coating 103 stacked in sequence.
[0053] In another possible implementation of the present disclosure, the bracket 1000 may only include a substrate 101 and a first bracket coating layer 102 located on the substrate 101. In this implementation, since the embodiment of the present disclosure improves the reflectivity by providing a white glue layer 104, it is not necessary to achieve the reflection effect through the second bracket coating layer 103. In this case, only the above two structures are used to save the cost of the packaging structure.
[0054] Exemplarily, the substrate 101 may be a ceramic substrate, that is, an alumina substrate, which has high strength and hardness.
[0055] Exemplarily, the first bracket plating layer 102 may be a copper plating layer. The high electrical conductivity of the copper plating layer enables the copper plating layer to provide excellent electrical conductivity. The copper plating layer also has good thermal conductivity, which helps to dissipate heat and improve stability and lifespan.
[0056] Exemplarily, the second bracket coating 103 may be a silver coating. The silver coating has excellent thermal conductivity, which helps to dissipate heat. The silver coating also has good reflectivity, which improves the luminous efficiency.
[0057] Of course, the structures of the aforementioned substrate 101, the first bracket coating 102 and the second bracket coating 103 are merely examples and are not intended to be limiting of the present application.
[0058] S12, placing the light emitting diode chip on the bracket.
[0059] Exemplarily, the light-emitting diode chip is die-bonded on the bracket using conductive silver glue, and then the silver glue is baked to solidify.
[0060] See also Figure 2 The first bracket coating 102 and the second bracket coating 103 of the bracket 1000 both include a cathode region 1 and an anode region 2, and the portion separating the cathode region 1 and the anode region 2 is an insulating strip 3. The light emitting diode chip is die-bonded to the cathode region 1 using conductive silver glue, and is electrically connected to the cathode region 1.
[0061] S13, connecting the light emitting diode chip and the bracket through a wire.
[0062] Exemplarily, the P pole of the light-emitting diode chip is electrically connected to the positive electrode region through a wire.
[0063] For example, a wire bonding machine is used to bond two ends of the gold wire to the P-pole and anode regions of the light-emitting diode chip, respectively.
[0064] S14. Form a white glue layer on the surface of the bracket around the light emitting diode chip.
[0065] In a possible implementation, a white glue spraying process is used to form a white glue layer, and the white glue layer is tightly connected to the bracket.
[0066] Exemplarily, a piezoelectric valve glue sprayer is used to evenly spray highly reflective white wall glue on the surface of the bracket to form a white glue layer that completely covers the silver glue around the chip and the bottom of the bracket.
[0067] In a possible implementation, the white glue layer is a white glue sheet bonded to the bracket around the light-emitting diode chip. The white glue sheet is used to bond the highly reflective white wall glue to the bracket surface to form the white glue layer, and the manufacturing process is simple.
[0068] In the disclosed embodiment, the thickness of the white glue layer may be greater than the thickness of the light-emitting diode chip, may be equal to the thickness of the light-emitting diode chip, or may be less than the thickness of the light-emitting diode chip.
[0069] In one example, the LED is used for high-power red light illumination of plants. In this case, the thickness of the white glue layer is smaller than the thickness of the LED chip. This thickness design ensures that the light output angle of the LED is large enough on the basis of ensuring the reflection efficiency of the white glue layer, which is suitable for high-power red light illumination of plants.
[0070] Exemplarily, the thickness of the white glue layer is less than 80 micrometers. This thickness design can ensure that the thickness of the white glue layer is smaller than the thickness of the light-emitting diode chip, thereby meeting the requirements of the reflection effect and the light output angle.
[0071] For example, the thickness of the white glue layer is 60 to 80 microns. This thickness design can obtain a better reflection effect and light output angle.
[0072] S15, making a ball head covering the light emitting diode chip and the white glue layer.
[0073] Exemplarily, a mold top machine is used to inject silicone into the mold, and the mold top is baked and cured to form the ball head.
[0074] After completing the above packaging, the light emitting diode package products are cut into individual pieces according to the bracket cutting lines.
[0075] It is worth noting that, according to the packaging process of the light-emitting diode disclosed in the present invention, experiments have verified that the brightness of the process using white glue spraying is 2.0% higher than that of the process not using white glue, and the brightness is significantly improved.
[0076] Table 1 below is a comparison of the brightness of a light emitting diode packaged in the related art and a light emitting diode packaged in an embodiment of the present disclosure.
[0077] Among them, I is the current, the unit is A; U is the voltage, the unit is V;
[0078] P is power, unit is W; Eff is light efficiency, unit is lm / W; Φv is light intensity, unit is; Φe is radiation power, unit is W;
[0079] PPE is photosynthetic photon flux efficiency, in umol / s / W; PPF is photosynthetic photon flux, in umol / s;
[0080] The peak wavelength is in nm; AVG is the mean value.
[0081] Table 1
[0082]
[0083] The above description is only an optional embodiment of the present disclosure and is not intended to limit the present disclosure. Any modifications, equivalent substitutions, improvements, etc. made within the spirit and principles of the present disclosure shall be included in the protection scope of the present disclosure.
Claims
1. A light emitting diode, characterized in that: The light emitting diode comprises: A support (1000), a white glue layer (104), a light emitting diode chip (105), a wire (106) and a ball head (107); The light-emitting diode chip (105) is located on the surface of the bracket (1000) and in the middle of the bracket (1000); the wire (106) is electrically connected to the light-emitting diode chip (105) and the bracket (1000) respectively; the white glue layer (104) covers the surface of the bracket (1000) around the light-emitting diode chip (105); the ball head (107) is connected to the bracket (1000); and the ball head (107) covers the light-emitting diode chip (105) and the white glue layer (104).
2. The light emitting diode according to claim 1, characterized in that: The support (1000) comprises a substrate (101) and a first support coating layer (102) located on the substrate (101).
3. The light emitting diode according to claim 1, characterized in that: The light emitting diode chip (105) is a red light chip.
4. The light emitting diode according to any one of claims 1 to 3, characterized in that: The white glue layer (104) is a white glue film coated on the bracket (1000) around the light-emitting diode chip (105).
5. The light emitting diode according to any one of claims 1 to 3, characterized in that: The white glue layer (104) is a white glue sheet bonded to the bracket (1000) around the light emitting diode chip (105).
6. The light emitting diode according to any one of claims 1 to 3, characterized in that: The thickness of the white glue layer (104) is greater than the thickness of the light emitting diode chip (105).
7. The light emitting diode according to any one of claims 1 to 3, characterized in that: The thickness of the white glue layer (104) is equal to the thickness of the light emitting diode chip (105).
8. The light emitting diode according to any one of claims 1 to 3, characterized in that: The thickness of the white glue layer (104) is smaller than the thickness of the light emitting diode chip (105).
9. The light emitting diode according to claim 8, characterized in that: The thickness of the white glue layer (104) is less than 80 micrometers.
10. The light emitting diode according to claim 9, characterized in that: The thickness of the white glue layer (104) is 60 to 80 microns.