Chemical cleaning device for surfaces of semiconductor parts

Abstract

The utility model discloses a semiconductor part surface chemical cleaning device, and relates to the technical field of semiconductor equipment. The semiconductor part surface chemical cleaning device comprises a cleaning tank, an L-shaped plate is fixedly arranged on the rear side of the edge of the cleaning tank, the bottom of one side of the cleaning tank is communicated with a drainage pipe, and a valve is installed on a pipe body of the drainage pipe; and the cleaning mechanism comprises a motor installed at the top of the L-shaped plate, an output shaft of the motor penetrates through the L-shaped plate to be connected with an installation pipe, an installation rod is arranged at the bottom end of the installation pipe, a circular truncated cone is fixedly arranged at the bottom end of the installation rod, and rectangular grooves are formed in the side wall of the circular truncated cone in an annular array mode. The utility model discloses. According to the semiconductor part cleaning device, comprehensive cleaning of semiconductor parts can be achieved, the cleaning effect and operation safety are ensured through the design of the clamping mechanism, the locking piece and the like, meanwhile, the drying efficiency can be improved through the arrangement of the fan heater, the working efficiency of the device is improved, practicability is high, and the semiconductor part cleaning device is worthy of being widely applied and popularized.

Description

Technical Field

[0001] The utility model relates to the technical field of semiconductor equipment, in particular to a semiconductor component surface chemical cleaning device. Background Art

[0002] Semiconductor components refer to components that meet the requirements of semiconductor equipment and technology in terms of materials, structure, process, quality and precision, reliability and stability. Semiconductor components have high process requirements during assembly. These components will be cleaned to remove dust adhered to the surface, usually using special chemical cleaning fluids.

[0003] Most existing cleaning devices place semiconductor components in the device and then clean the surface by spraying. However, the side of the semiconductor component that contacts the device cannot come into contact with the chemical cleaning liquid, so that the surface cannot be cleaned well. In addition, it is difficult to quickly remove the moisture attached to the semiconductor component during drying, and the drying efficiency is low. Therefore, we propose a semiconductor component surface chemical cleaning device to solve the above problems. Utility Model Content

[0004] In order to achieve the above-mentioned purpose, the utility model specifically adopts the following technical solutions:

[0005] A semiconductor component surface chemical cleaning device, comprising:

[0006] A cleaning tank, wherein an L-shaped plate is fixedly arranged at the rear side of the edge of the cleaning tank, a drain pipe is connected to the bottom of one side of the cleaning tank, and a valve is installed on the body of the drain pipe;

[0007] The cleaning mechanism comprises a motor mounted on the top of the L-shaped plate, the output shaft of the motor passes through the L-shaped plate and is connected to a mounting tube, a mounting rod is provided at the bottom end of the mounting tube, a truncated table is fixed at the bottom end of the mounting rod, a rectangular groove is configured in an annular array on the side wall of the truncated table, and a positioning groove for placing semiconductor components is provided at the bottom of the rectangular groove;

[0008] The clamping mechanism is arranged on the upper side of the rectangular groove and is used for clamping and fixing the semiconductor components.

[0009] Furthermore, the clamping mechanism includes a sliding rod slidably inserted into the top of the rectangular groove, a pressure plate is fixed to one end of the sliding rod located inside the rectangular groove, a spring is connected between the pressure plate and the inner top wall of the rectangular groove, the spring is sleeved on the surface of the sliding rod, and a locking member is provided on the top of the table for preventing the sliding rod from moving downward.

[0010] Furthermore, the locking member includes a mounting plate fixed on the top of the sliding rod, a sleeve is embedded in the middle of the mounting plate, the sleeve is slidably sleeved on the surface of the mounting rod, hook plates are symmetrically hinged on both sides of the sleeve, and hook sleeves matching the hook plates are symmetrically fixed on the side walls of the mounting rod.

[0011] Furthermore, a heater is embedded on the upper side of the rear wall of the cleaning tank.

[0012] Furthermore, the upper end of the mounting rod is threaded and is threadedly connected to the mounting pipe.

[0013] Furthermore, water leakage holes penetrating the truncated cone body are evenly distributed at the bottom of the positioning groove.

[0014] The beneficial effects of the utility model are as follows:

[0015] The utility model can realize efficient cleaning of semiconductor components through the combined design of the cleaning tank, the cleaning mechanism and the clamping mechanism. The cleaning tank is used to contain chemical cleaning liquid. The cleaning mechanism drives the mounting tube and the round table to rotate through a motor. The semiconductor components are immersed in the chemical cleaning liquid to realize comprehensive cleaning. The clamping mechanism is used to fix the semiconductor components to ensure that they will not move or fall off during the cleaning process. When the semiconductor components are dried, the chemical cleaning liquid in the cleaning tank is discharged through the drain pipe. The motor drives the mounting tube and the round table to rotate. Under the action of centrifugal force, the moisture on the surface of the semiconductor components can be quickly separated, thereby improving the production efficiency of the semiconductor components. The utility model has high practicality and is worthy of widespread application and promotion. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] Figure 1 It is a three-dimensional structural schematic diagram of the utility model;

[0017] Figure 2 It is another three-dimensional structural schematic diagram of the utility model;

[0018] Figure 3 It is a schematic diagram of the truncated table structure of the utility model.

[0019] Figure numerals: 1. cleaning tank; 101. drain pipe; 2. L-shaped plate; 3. cleaning mechanism; 301. motor; 302. mounting pipe; 303. mounting rod; 304. frustum; 3041. rectangular groove; 3042. positioning groove; 4. clamping mechanism; 401. sliding rod; 402. pressure plate; 403. spring; 5. locking piece; 501. mounting plate; 502. sleeve; 503. hook plate; 504. hook sleeve; 6. heater. DETAILED DESCRIPTION

[0020] In order to make the purpose, technical solution and advantages of the embodiments of the present utility model clearer, the technical solution in the embodiments of the present utility model will be clearly and completely described below in conjunction with the drawings in the embodiments of the present utility model.

[0021] The present application provides a semiconductor component surface chemical cleaning device, which is mainly used to solve the problem that in the prior art, most cleaning devices place semiconductor components in the device and then clean the surface by spraying, but the side of the semiconductor component in contact with the device cannot be in contact with the chemical cleaning liquid, so that the surface cannot be well cleaned, and the moisture attached to the semiconductor component is difficult to be quickly removed during drying, resulting in low drying efficiency, and the following technical solutions are provided. Figure 1-Figure 3 Make a detailed description:

[0022] A semiconductor component surface chemical cleaning device, comprising:

[0023] A cleaning tank 1, an L-shaped plate 2 is fixedly provided at the rear side of the edge of the cleaning tank 1, a drain pipe 101 is connected to the bottom of one side of the cleaning tank 1, and a valve is installed on the body of the drain pipe 101;

[0024] The cleaning mechanism 3 includes a motor 301 installed on the top of the L-shaped plate 2, the output shaft of the motor 301 passes through the L-shaped plate 2 and is connected to a mounting tube 302, a mounting rod 303 is provided at the bottom end of the mounting tube 302, a round platform 304 is fixed at the bottom end of the mounting rod 303, a side wall of the round platform 304 is configured with a rectangular groove 3041 in an annular array, and a positioning groove 3042 for placing semiconductor components is provided at the bottom of the rectangular groove 3041;

[0025] The clamping mechanism 4 is arranged on the upper side of the rectangular groove 3041 and is used to clamp and fix the semiconductor components.

[0026] The semiconductor component surface chemical cleaning device can achieve efficient cleaning of semiconductor components through the combined design of the cleaning tank 1, the cleaning mechanism 3 and the clamping mechanism 4. The cleaning tank 1 is used to contain chemical cleaning liquid. The cleaning mechanism 3 drives the mounting tube 302 and the round table 304 to rotate through the motor 301. The semiconductor components are immersed in the chemical cleaning liquid to achieve comprehensive cleaning. The clamping mechanism 4 is used to fix the semiconductor components to ensure that they will not move or fall off during the cleaning process. When the semiconductor components are dried, the chemical cleaning liquid in the cleaning tank 1 is discharged through the drain pipe 101. The motor 301 drives the mounting tube 302 and the round table 304 to rotate. Under the action of centrifugal force, the moisture on the surface of the semiconductor components can be quickly separated, thereby improving the production efficiency of the semiconductor components.

[0027] like Figure 3As shown, in some embodiments, the clamping mechanism 4 includes a sliding rod 401 that is slidably inserted into the top of the rectangular groove 3041, and a pressure plate 402 is fixedly provided at one end of the sliding rod 401 located inside the rectangular groove 3041, and a spring 403 is connected between the pressure plate 402 and the inner top wall of the rectangular groove 3041, and the spring 403 is sleeved on the surface of the sliding rod 401. A locking piece 5 for preventing the sliding rod 401 from moving downward is provided on the top of the table 304. More specifically, the semiconductor components to be cleaned are placed in the positioning groove 3042 of the table 304. Under the action of the spring 403, the pressure plate 402 moves downward, and the pressure plate 402 contacts and clamps the semiconductor components. The clamping mechanism 4 can effectively fix the semiconductor components to ensure that they will not move or fall off during the cleaning process. At the same time, the locking piece 5 of the clamping mechanism 4 is designed to make it safer and more reliable when removing the semiconductor components.

[0028] like Figure 3 As shown, in some embodiments, the locking member 5 includes a mounting plate 501 fixed on the top of the slide bar 401, a sleeve 502 is embedded in the middle of the mounting plate 501, the sleeve 502 is slidably sleeved on the surface of the mounting rod 303, hook plates 503 are symmetrically hinged on both sides of the sleeve 502, and hook sleeves 504 matched with the hook plates 503 are symmetrically fixed on the side walls of the mounting rod 303. More specifically, when the slide bar 401 rises, the hook plate 503 on the sleeve 502 will be stuck with the hook sleeve 504, thereby preventing the slide bar 401 from continuing to move downward.

[0029] like Figure 1 As shown, in some embodiments, a heater 6 is embedded on the upper side of the rear wall of the cleaning tank 1. More specifically, the heater 6 is a combined unit composed of a ventilator, a motor and a radiator. Its working principle is to provide heat to the surrounding environment through electric heating elements or burning fuel, so as to achieve the purpose of increasing the indoor temperature. After the semiconductor components are cleaned in the cleaning tank 1, there may be some moisture on the surface. At this time, the heater 6 can be turned on to accelerate the surface drying of the semiconductor components to improve the processing efficiency of subsequent processes. In addition, the heater 6 also has functions such as ventilation, air conditioning assistance, dehumidification and moisture-proofing, which also plays a positive role in maintaining the comfort of the cleaning environment and improving the air quality. The heater 6 is a prior art and its power supply circuit is not described in detail.

[0030] like Figure 3 As shown, in some embodiments, the upper end of the mounting rod 303 is threaded, and is threadedly connected to the mounting tube 302. More specifically, the height of the table 304 can be adjusted by threading the mounting rod 303 and the mounting tube 302 so that the table 304 can be immersed in the chemical cleaning solution or raised to the heater 6, thereby improving the drying efficiency.

[0031] like Figure 3As shown, in some embodiments, leakage holes are evenly distributed on the bottom of the positioning groove 3042 and penetrate the body of the frustum 304. More specifically, leakage holes are evenly distributed on the bottom of the positioning groove 3042 and penetrate the body of the frustum 304. The main function of the leakage holes is to remove the accumulated water during the cleaning process. When the semiconductor components are immersed and cleaned by the cleaning liquid in the cleaning tank 1, some cleaning liquid and water may enter the positioning groove 3042. The provision of leakage holes can effectively discharge these liquids to prevent them from accumulating in the positioning groove 3042 and causing secondary pollution to the semiconductor components. In addition, this design is also conducive to improving the cleaning efficiency, because when the liquid in the cleaning tank 1 can be discharged in time, the concentration of the cleaning liquid can be kept constant, thereby improving the cleaning effect.

[0032] The above description of the disclosed embodiments enables those skilled in the art to implement or use the present invention. Various modifications to these embodiments will be apparent to those skilled in the art, and the general principles defined herein may be implemented in other embodiments without departing from the spirit or scope of the present invention. Therefore, the present invention will not be limited to the embodiments shown herein, but will conform to the widest scope consistent with the principles and novel features disclosed herein.

Claims

1. A semiconductor component surface chemical cleaning device, characterized in that: include: A cleaning tank (1), wherein an L-shaped plate (2) is fixedly provided at the rear side of the edge of the cleaning tank (1), a drainage pipe (101) is connected to the bottom of one side of the cleaning tank (1), and a valve is installed on the pipe body of the drainage pipe (101); A cleaning mechanism (3) comprises a motor (301) mounted on the top of an L-shaped plate (2), an output shaft of the motor (301) passing through the L-shaped plate (2) and connected to a mounting tube (302), a mounting rod (303) being provided at the bottom end of the mounting tube (302), a truncated platform (304) being fixedly provided at the bottom end of the mounting rod (303), a side wall of the truncated platform (304) being configured with a rectangular groove (3041) in an annular array, and a positioning groove (3042) for placing semiconductor components being provided at the bottom of the rectangular groove (3041); The clamping mechanism (4) is arranged on the upper side of the interior of the rectangular groove (3041) and is used to clamp and fix the semiconductor component.

2. A semiconductor component surface chemical cleaning device according to claim 1, characterized in that: The clamping mechanism (4) comprises a slide bar (401) slidably inserted into the top of the rectangular groove (3041); a pressure plate (402) is fixedly provided at one end of the slide bar (401) located inside the rectangular groove (3041); a spring (403) is connected between the pressure plate (402) and the inner top wall of the rectangular groove (3041); the spring (403) is sleeved on the surface of the slide bar (401); and a locking member (5) is provided on the top of the truncated table (304) for preventing the slide bar (401) from moving downward.

3. A semiconductor component surface chemical cleaning device according to claim 2, characterized in that: The locking member (5) comprises a mounting plate (501) fixedly mounted on the top of the sliding rod (401), a sleeve (502) being embedded in the middle of the mounting plate (501), the sleeve (502) being slidably mounted on the surface of the mounting rod (303), hook plates (503) being symmetrically hinged on both sides of the sleeve (502), and hook sleeves (504) matching the hook plates (503) being symmetrically fixedly mounted on the side walls of the mounting rod (303).

4. A semiconductor component surface chemical cleaning device according to claim 1, characterized in that: A heater (6) is embedded on the upper side of the rear wall of the cleaning tank (1).

5. The semiconductor component surface chemical cleaning device according to claim 1, characterized in that: The upper end of the mounting rod (303) is threaded and is threadedly connected to the mounting tube (302).

6. A semiconductor component surface chemical cleaning device according to claim 1, characterized in that: The bottom of the positioning groove (3042) is evenly distributed with water leakage holes penetrating the body of the truncated table (304).

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