Monocrystalline silicon grinding all-in-one machine power head
By introducing piezoelectric adjustment components and heat dissipation components into the power head of the single crystal silicon grinding integrated machine, the problem of poor stability of the power head is solved, more efficient silicon rod processing and self-heating are achieved, and the quality of finished products and resource utilization efficiency are improved. .
Patent Information
- Application Number
- CN202322017189.2
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2023-07-28
- Publication Date
- 2025-01-14
- Estimated Expiration
- 2033-07-28
AI Technical Summary
The stability of the existing single-crystal silicon grinding integrated motor is poor, which affects the processing efficiency and quality of silicon rods.
The power head design includes a piezoelectric adjustment component and a heat dissipation component. The piezoelectric adjustment component generates a damping force to eliminate vibration by analyzing the system's excitation signal, and the heat dissipation component realizes self-heating through sublimation and condensation of the coolant.
It improves the stability and finished product quality of the power head of the single crystal silicon grinding integrated machine, reduces resource consumption, and avoids the need for additional cooling equipment.
Smart Images
Figure CN222345203U_ABST
Abstract
Description
Technical Field
[0001] The present application relates to the technical field of single crystal silicon processing equipment, and in particular to a power head of a single crystal silicon grinding integrated machine. Background Art
[0002] Monocrystalline silicon is an important material used in solar photovoltaic power generation. The existing technology has very high requirements for the precision and roughness of monocrystalline silicon. After the crystalline silicon is generated from the single crystal furnace, it must be cut into squares, corners ground and surface ground on the power head of the monocrystalline silicon grinding machine before it can meet the use requirements.
[0003] As the core part of the grinding machine, the performance of the power head has a great impact on the efficiency and quality of silicon rod processing. In the precision system, micro-vibration and heating will affect the movement accuracy, structural life, working stability, etc. of the mechanism. The existing power head uses spring shock absorbers for shock absorption, but the spring shock absorbers can only passively eliminate the vibration generated by the power head during the processing, resulting in poor shock absorption effect, making the stability of the existing single crystal silicon grinding machine power head poor.
[0004] Therefore, the technical problem of the prior art is that the stability of the power head of the single crystal silicon grinding machine is poor. Utility Model Content
[0005] The present application provides a power head for a single crystal silicon grinding machine, which solves the technical problem of poor stability of the power head for a single crystal silicon grinding machine in the prior art, thereby achieving the technical effect of improving the stability of the power head for a single crystal silicon grinding machine and ensuring the quality of single crystal silicon finished products.
[0006] A power head of a single crystal silicon grinding machine is used for grinding single crystal silicon, comprising: a shell, a power mechanism and a piezoelectric adjustment component; the power mechanism is arranged in the shell, and comprises a stator component and a rotor component, the stator component is sleeved on the outside of the rotor component, and the stator component can drive the rotor component to rotate; the piezoelectric adjustment component is arranged between the rotor component and the shell, and is used to eliminate the vibration of the rotor component.
[0007] Preferably, the rotor assembly comprises: an outer shaft, the stator assembly is sleeved on the outer shaft, and the outer shaft can rotate automatically under the drive of the stator assembly; and an inner shaft, the inner shaft is connected to the outer shaft, and the inner shaft can rotate synchronously under the drive of the outer shaft.
[0008] Preferably, the piezoelectric adjustment component includes at least one piezoresistive damper, one end of the piezoresistive damper abuts against the outer shaft, and the other end of the piezoresistive damper abuts against the housing.
[0009] Preferably, the piezoresistive damper comprises: a shell and a linear bearing, a piezoelectric sheet, and a semicircular ceramic ball located inside the shell; wherein the linear bearing, the piezoelectric sheet, and the semicircular ceramic ball are arranged in sequence inside the shell along the length direction of the shell.
[0010] Preferably, three or more piezoresistive dampers are arranged in an array along the circumference of the outer shaft.
[0011] Preferably, the piezoelectric adjustment component further includes at least one control unit, and the control unit is connected to the piezoresistive damper.
[0012] Preferably, the rotor assembly further comprises a fine grinding head and a rough grinding head, and the fine grinding head and the rough grinding head are connected to the inner shaft and the outer shaft respectively.
[0013] Preferably, the power mechanism further comprises a driving assembly, wherein the driving assembly is respectively connected to the inner shaft and the outer shaft, and can drive the inner shaft and the outer shaft to extend and retract alternately.
[0014] Preferably, the power head of the monocrystalline silicon grinding machine further comprises at least one heat dissipation component, and the heat dissipation component comprises: a heat dissipation pipe, at least one of the heat dissipation pipes is arranged on the outside of the stator assembly, and at least part of the heat dissipation pipe is connected to the outer wall of the stator assembly.
[0015] Preferably, the heat dissipation assembly further comprises at least one heat fin; wherein the heat dissipation pipe comprises a heat absorbing end and a heat dissipation end, the heat absorbing end is connected to the stator assembly, and the heat dissipation fins are arranged at intervals at the heat dissipation end.
[0016] In summary, the beneficial technical effects of this application are:
[0017] 1. Provide a power head of a monocrystalline silicon grinding machine, including a piezoelectric adjustment component, which is arranged between a rotor component and a shell. The piezoelectric adjustment component realizes vibration isolation by analyzing the system excitation signal and generating a damping force opposite thereto. By setting the piezoelectric adjustment component, the piezoelectric adjustment component can eliminate the vibration generated by the rotor component during rotation by automatic adjustment, thereby improving the stability of the power head of the monocrystalline silicon grinding machine and ensuring the technical effect of the quality of the monocrystalline silicon finished product.
[0018] 2. Provide a power head of a single crystal silicon grinding machine, including a heat dissipation component, the heat dissipation component includes at least one heat dissipation pipe, the heat dissipation pipe is connected to the stator component, and a coolant is arranged in the heat dissipation pipe. The self-heating of the heat dissipation component can be achieved through the sublimation and condensation of the coolant, and no additional cooling equipment is required, thereby saving resources and improving the stability of the power head. BRIEF DESCRIPTION OF THE DRAWINGS
[0019] Figure 1This is a front view of a power head of a single crystal silicon grinding integrated machine of the utility model;
[0020] Figure 2 This is a left view of a power head of a single crystal silicon grinding machine of the utility model;
[0021] Figure 3 for Figure 2 Schematic diagram of the cross-sectional structure in the AA direction;
[0022] Figure 4 It is a top view of a medium-voltage damper in a power head of a single-crystal silicon grinding machine of the utility model;
[0023] Figure 5 for Figure 4 Schematic diagram of the cross-sectional structure in the BB direction.
[0024] Explanation of the reference numerals: 100, housing; 200, power mechanism; 210, stator assembly; 220, rotor assembly; 221, outer shaft; 222, inner shaft; 223, fine grinding head; 224, rough grinding head; 230, drive assembly; 300, piezoelectric adjustment assembly; 310, piezoelectroelectric damper; 311, housing; 312, linear bearing; 313, piezoelectric sheet; 314, semicircular ceramic ball; 320, control unit; 400, heat dissipation assembly; 410, heat pipe; 420, heat fan. DETAILED DESCRIPTION
[0025] The serial numbers for the components herein, such as "first", "second", etc., are only used to distinguish the objects described and do not have any order or technical meaning. The "connection" and "coupling" mentioned in this application, unless otherwise specified, include direct and indirect connections (couplings). In the description of this application, it should be understood that the orientation or positional relationship indicated by the terms "upper", "lower", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise", etc. are based on the orientation or positional relationship shown in the accompanying drawings, which is only for the convenience of describing this application and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation to this application.
[0026] In the present application, unless otherwise clearly specified and limited, a first feature being “above” or “below” a second feature may mean that the first and second features are in direct contact, or the first and second features are in indirect contact through an intermediate medium. Moreover, a first feature being “above”, “above”, and “above” a second feature may mean that the first feature is directly above or obliquely above the second feature, or simply means that the first feature is higher in level than the second feature. A first feature being “below”, “below”, and “below” a second feature may mean that the first feature is directly below or obliquely below the second feature, or simply means that the first feature is lower in level than the second feature.
[0027] The present application provides a power head for a single crystal silicon grinding machine, which solves the technical problem of poor stability of the power head for a single crystal silicon grinding machine in the prior art, thereby achieving the technical effect of improving the stability of the power head for a single crystal silicon grinding machine and ensuring the quality of the single crystal silicon finished product.
[0028] The power head is the core part of the grinding machine, which is used to grind the monocrystalline silicon. The power head in this application can perform both fine grinding and rough grinding, and its performance has a great impact on the efficiency and quality of silicon rod processing. In the precision system, micro-vibration and heating phenomena will affect the movement accuracy, structural life, working stability, etc. of the mechanism. The existing power head uses a spring shock absorber for shock absorption, but the spring shock absorber can only passively eliminate the vibration generated by the power head during the processing, resulting in poor shock absorption effect, which makes the stability of the existing monocrystalline silicon grinding machine power head poor.
[0029] In order to better understand the above technical solution, the above technical solution will be described in detail below in conjunction with the accompanying drawings and specific implementation methods. It should be understood that the specific embodiments described here are only used to explain the present application and are not used to limit the present application.
[0030] A power head of a single crystal silicon grinding machine is used for grinding single crystal silicon, comprising: a shell 100, a power mechanism 200 and a piezoelectric adjustment component 300; the power mechanism 200 is arranged in the shell 100, and comprises a stator component 210 and a rotor component 220, the stator component 210 is sleeved on the outside of the rotor component 220, and the stator component 210 can drive the rotor component 220 to rotate; the piezoelectric adjustment component 300 is arranged between the rotor component 220 and the shell 100, and is used to eliminate the vibration of the rotor component 220.
[0031] Specifically, the power head is as follows Figure 1-3 As shown, it includes a shell 100, which is made of metal material and is used to support and protect the components located in the shell 100. In this embodiment, a power mechanism 200 and a piezoelectric adjustment component 300 are arranged inside the shell 100.
[0032] The power mechanism 200 includes a stator assembly 210 and a rotor assembly 220. The stator assembly 210 is fixedly mounted on the housing 100. The stator assembly 210 includes an electromagnetic induction component. The rotor assembly 220 is disposed in the stator assembly 210. The rotor assembly 220 can rotate under the action of the stator assembly 210 to provide power for the power head.
[0033] The piezoelectric regulating component 300 is arranged between the rotor component 220 and the shell 100. The piezoelectric regulating component 300 realizes vibration isolation by analyzing the system excitation signal and generating a damping force opposite thereto. By setting the piezoelectric regulating component 300, the piezoelectric regulating component 300 can eliminate the vibration generated by the rotor component 220 during the rotation process by automatic adjustment, thereby improving the stability of the power head of the single crystal silicon grinding machine and ensuring the technical effect of the quality of the single crystal silicon finished product.
[0034] For further information, please refer to Figure 3 The rotor assembly 220 includes: an outer shaft 221 and an inner shaft 222. The outer shaft 221 is arranged corresponding to the stator assembly 210, and the outer shaft 221 can rotate by itself under the drive of the stator assembly 210; the inner shaft 222 is connected to the outer shaft 221, and the inner shaft 222 can rotate synchronously under the drive of the outer shaft 221. The rotor assembly 220 includes an outer shaft 221 and an inner shaft 222. The outer shaft 221 is sleeved on the outside of the inner shaft 222. As mentioned above, the outer shaft 221 can rotate by itself under the action of the stator assembly 210 to provide power for the power head; it can be imagined that since the outer shaft 221 needs to rotate relative to the housing 100, a plurality of bearing assemblies are provided in the present application for supporting and lubricating the outer shaft 221. The preferred installation method of the bearing assembly is to install it at the head and tail end of the outer shaft 221; the inner shaft 222 is arranged in the outer shaft 221, and a mounting portion is provided on the inner shaft 222, and a mounting portion corresponding to the inner shaft 221 is provided on the outer shaft 221. The inner shaft 222 and the outer shaft 221 are connected through the mounting portion, and when the outer shaft 221 rotates, the inner shaft 222 can be driven to rotate synchronously.
[0035] Please refer to Figure 3 The piezoelectric adjustment component 300 includes at least one piezoresistive damper 310, one end of which abuts against the outer shaft 221, and the other end abuts against the housing 100. The piezoelectric adjustment component 300 includes a piezoresistive damper 310, which is located on the outer shaft 221 and connected to the housing 100. The piezoresistive damper 310 can offset the vibration of the outer shaft 221 by abutting against the outer shaft 221.
[0036] Please continue to refer to Figure 5The piezoresistive damper 310 includes: a housing 311 and a linear bearing 312, a piezoelectric sheet 313, and a semicircular ceramic ball 314 located in the housing 311; wherein the linear bearing 312, the piezoelectric sheet 313, and the semicircular ceramic ball 314 are arranged in sequence in the housing 311 along the length direction of the housing 311. The housing 311 includes a top plate located at both ends, the top plate abuts against the outer shaft 221 and the housing 100 respectively, and a positioning portion adapted to the top plate is provided on the outer shaft 221 and the housing 100; the housing 311 is provided with a linear bearing 312 and a semicircular ball in sequence to ensure that the direction of the force will not be offset, and the housing 311 is provided with a plurality of piezoelectric sheets 313 stacked in sequence, and the piezoelectric sheets 313 generate vibrations through the reverse electric effect to affect the vibration of the outer shaft 221.
[0037] Furthermore, three or more piezoelastomer dampers 310 are arranged in a circular array along the outer shaft 221. A single piezoelastomer damper 310 can only generate vibration in one direction. By setting three or more piezoelastomer dampers 310 and arranging the piezoelastomer dampers 310 in a uniform circular pattern, the vibration of the outer shaft 221 can be balanced from multiple directions.
[0038] Specifically, the piezoelectric adjustment component 300 further includes at least one control unit 320, and the control unit 320 is connected to the piezoresistive damper 310. Then, the damper is given an output electrical signal through the controller, and then, due to the inverse piezoelectric effect of the piezoelectric ceramic component, the ceramic component will output a corresponding displacement, and the system will restore the equilibrium state under the different feedback forces of more than three groups of piezoresistive dampers 310.
[0039] Please refer to Figure 3 The rotor assembly 220 further includes a fine grinding head 223 and a rough grinding head 224, and the fine grinding head 223 and the rough grinding head 224 are respectively connected to the inner shaft 222 and the outer shaft 221. The power head in the present application is used for grinding single crystal silicon. By setting the fine grinding head 223 and the rough grinding head 224, one power head can perform two processes of fine grinding and rough grinding, without the need for additional switching power heads, thereby improving the versatility of the power head, reducing costs, and improving efficiency.
[0040] Furthermore, the power mechanism 200 further includes a driving assembly 230, which is connected to the inner shaft 222 and the outer shaft 221 respectively, and can drive the inner shaft 222 and the outer shaft 221 to alternately extend and retract. By providing the driving assembly 230, and the driving assembly 230 can drive the inner shaft 222 and the outer shaft 221 to alternately extend and retract, as before, the outer shaft 221 and the inner shaft 222 are respectively connected to the fine grinding head 223 and the rough grinding head 224, and the fine grinding and the rough grinding can be alternately performed by controlling the inner shaft 222 and the outer shaft 221 to alternately extend and retract.
[0041] Please refer to Figure 3The power head of the monocrystalline silicon grinding machine also includes at least one heat dissipation component 400, which includes: a heat dissipation pipe 410, at least one heat dissipation pipe 410 is arranged outside the stator component 210, and at least part of the heat dissipation pipe 410 is connected to the outer wall of the stator component 210. The stator component 210 is driven to rotate by electromagnetic induction. During this process, the stator component 210 generates a large amount of heat, which causes the temperature of the stator component 210 to rise. The increase in the temperature of the stator component 210 will affect the stability of the power head; in this application, the heat dissipation component 400 is provided to dissipate heat for the stator component 210, so that the temperature of the stator component 210 is always maintained at a fixed value, and the stability of the power head will not be affected by excessive temperature. Specifically, the heat dissipation assembly 400 in this embodiment includes at least one heat dissipation pipe 410, in which a cooling fluid is provided, wherein at least a portion of the heat dissipation pipe 410 abuts against the outer wall of the stator assembly 210, and the heat of the stator assembly 210 is transferred out through the abutting portion, thereby reducing the temperature of the stator assembly 210.
[0042] Furthermore, the heat dissipation component 400 also includes at least one heat fin 420; wherein the heat dissipation pipe 410 includes a heat absorbing end and a heat dissipation end, the heat absorbing end is connected to the stator component 210, and heat dissipation fins are arranged at intervals at the heat dissipation end. The heat dissipation pipe 410 includes a heat absorbing end and a heat dissipation end, the heat absorbing end is connected to the stator component 210, and the fluid in the heat absorbing end will vaporize and absorb heat under the influence of high temperature, and the vaporized fluid will condense at the heat dissipation end, so that the heat can be dissipated through the heat dissipation end; the heat dissipation end is provided with heat dissipation fins, which are evenly arranged on the outside of the heat dissipation pipe 410, and the heat dissipation is achieved by expanding the contact area between the heat dissipation pipe 410 and the air by arranging the heat dissipation fins. In this embodiment, by arranging a heat dissipation component 400 that can automatically cool, the conventional cooling means through external output and input are replaced, thereby achieving the purpose of saving resources and improving the reliability of the power head.
[0043] Technical effect:
[0044] 1. Provide a power head of a monocrystalline silicon grinding machine, including a piezoelectric adjustment component 300. The piezoelectric adjustment component 300 is arranged between the rotor component 220 and the shell 100. The piezoelectric adjustment component 300 realizes vibration isolation by analyzing the system excitation signal and generating a damping force opposite thereto. By setting the piezoelectric adjustment component 300, the piezoelectric adjustment component 300 can eliminate the vibration generated by the rotor component 220 during the rotation process by automatic adjustment, thereby improving the stability of the power head of the monocrystalline silicon grinding machine and ensuring the technical effect of the quality of the monocrystalline silicon finished product.
[0045] 2. Provide a power head of a single crystal silicon grinding machine, including a heat dissipation component 400, the heat dissipation component 400 includes at least one heat dissipation pipe 410, the heat dissipation pipe 410 is connected to the stator component 210, and a coolant is arranged in the heat dissipation pipe 410. The heat dissipation component 400 can achieve self-heating through sublimation and condensation of the coolant, and no additional cooling equipment is required, thereby saving resources and improving the stability of the power head.
[0046] Although the preferred embodiments of the present application have been described, those skilled in the art may make additional changes and modifications to these embodiments once they are aware of the basic creative concepts. Therefore, the appended claims are intended to be interpreted as including the preferred embodiments and all changes and modifications that fall within the scope of the present application. Obviously, those skilled in the art may make various changes and modifications to the present application without departing from the spirit and scope of the present application. Thus, if these modifications and variations of the present application fall within the scope of the claims of the present application and their equivalents, the present application is also intended to include these modifications and variations.
Claims
1. A power head of a single crystal silicon grinding machine, used for grinding single crystal silicon, characterized in that: include: Housing (100); A power mechanism (200), the power mechanism (200) being disposed in the housing (100), the power mechanism (200) comprising a stator assembly (210) and a rotor assembly (220), the stator assembly (210) being sleeved on the outside of the rotor assembly (220), and the stator assembly (210) being capable of driving the rotor assembly (220) to rotate; as well as A piezoelectric adjustment component (300) is arranged between the rotor component (220) and the housing (100) and is used to eliminate vibration of the rotor component (220).
2. The power head of the single crystal silicon grinding machine according to claim 1, characterized in that: The rotor assembly (220) comprises: An outer shaft (221), the stator assembly (210) being sleeved on the outer shaft (221), and the outer shaft (221) being rotatable under the drive of the stator assembly (210); An inner shaft (222), wherein the inner shaft (222) is connected to the outer shaft (221), and the inner shaft (222) can rotate synchronously with the outer shaft (221).
3. The power head of the single crystal silicon grinding machine according to claim 2, characterized in that: The piezoelectric adjustment component (300) comprises at least one piezoresistive damper (310), one end of the piezoresistive damper (310) abuts against the outer shaft (221), and the other end of the piezoresistive damper (310) abuts against the housing (100).
4. The power head of the single crystal silicon grinding machine according to claim 3, characterized in that: The piezoresistive damper (310) comprises: a housing (311), and a linear bearing (312), a piezoelectric sheet (313), and a semicircular ceramic ball (314) located inside the housing (311); The linear bearing (312), the piezoelectric sheet (313), and the semicircular ceramic ball (314) are sequentially arranged inside the housing (311) along the length direction of the housing (311).
5. The power head of the single crystal silicon grinding machine according to claim 3, characterized in that: Three or more piezoelectromechanical dampers (310) are arranged in an array along the circumference of the outer shaft (221).
6. The power head of the single crystal silicon grinding machine according to claim 5, characterized in that: The piezoelectric adjustment component (300) further comprises at least one control unit (320), wherein the control unit (320) is connected to the piezoresistive damper (310).
7. The power head of the single crystal silicon grinding machine according to claim 2, characterized in that: The rotor assembly (220) further comprises a fine grinding head (223) and a rough grinding head (224), wherein the fine grinding head (223) and the rough grinding head (224) are respectively connected to the inner shaft (222) and the outer shaft (221).
8. The power head of the single crystal silicon grinding machine according to claim 7, characterized in that: The power mechanism (200) further comprises a driving assembly (230), wherein the driving assembly (230) is respectively connected to the inner shaft (222) and the outer shaft (221), and can drive the inner shaft (222) and the outer shaft (221) to extend and retract alternately.
9. The power head of the single crystal silicon grinding machine according to claim 1, characterized in that: The power head of the integrated single crystal silicon grinding machine further comprises at least one heat dissipation component (400), wherein the heat dissipation component (400) comprises: A heat dissipation pipe (410), wherein at least one of the heat dissipation pipes (410) is disposed outside the stator assembly (210); Wherein, at least part of the heat dissipation pipe (410) is connected to the outer wall of the stator assembly (210).
10. The power head of the single crystal silicon grinding machine according to claim 9, characterized in that: The heat dissipation assembly (400) further includes at least one heat sink (420); The heat dissipation pipe (410) comprises a heat absorbing end and a heat dissipation end, the heat absorbing end is connected to the stator assembly (210), and the heat sink is arranged at intervals on the heat dissipation end.