Automatic adhesive cutting and film pasting equipment for semiconductor

Abstract

The utility model discloses a semiconductor automatic glue cutting and film pasting device, a material supply group comprises a material loading unit and a material unloading unit, and a group of material transfer units used for realizing processing and material transfer are arranged between the material loading unit and the material unloading unit; the processing group comprises a glue supply unit and a film pasting unit; and the film cutting unit is arranged in the middle section position of the material transferring unit, comprises a positioning table, a film cutter and a cutting air cylinder used for driving the film cutter to carry out cutting work, and is used for completing secondary cutting work of the film on the semiconductor product after film pasting. In the film pasting processing work of the chip semiconductor, through cooperation of the feeding set and the processing set, automatic feeding and film pasting processing actions of the semiconductor chip semiconductor are achieved, accurate film pasting processing can be achieved, and the high-quality film pasting processing effect is achieved; in addition, the processing efficiency of rubberizing work can be effectively improved, the labor cost is reduced, and the processing purpose of efficient and automatic production is achieved.

Description

Technical Field

[0001] The utility model belongs to the technical field of semiconductor processing and relates to automatic semiconductor glue cutting and film pasting equipment. Background Art

[0002] The integrated circuit (IC) industry is a high-growth point in the current global economic development. Among them, the advancement of semiconductor manufacturing technology and the rapid growth of market demand for tiny chips have made the chip I / O density higher and higher, and the chip lead spacing and pad diameter continue to decrease. At the same time, in order to improve production efficiency, the packaging speed has increased year by year, which has put forward extremely high requirements on the positioning accuracy and operating speed of post-packaging equipment. The film bonding equipment determines the accuracy, efficiency and stability of the chip film bonding process and is a key equipment in the chip packaging process.

[0003] At present, common film pasting processing technology is mainly realized by the combination of manual and semi-automatic film pasting equipment, but the overall automation degree of this processing method is low. The production efficiency is closely related to the operation level of the workers, especially when the product to be processed is a tiny device that is difficult to locate. The position of the film pasting processing and the consistency of the position of the film pasting are difficult to guarantee, so the reliability is poor. Therefore, for this field, how to automate the film pasting processing of semiconductor products is one of the technical problems that the technicians in this field urgently need to solve. Utility Model Content

[0004] In order to solve the implementation technical problems, the utility model adopts the following technical solutions:

[0005] A semiconductor automatic glue cutting and film laminating device comprises: a processing machine platform and a feeding group arranged on the processing machine platform for realizing semiconductor loading and unloading and a processing group for realizing semiconductor film laminating;

[0006] The feeding group includes: a feeding unit for feeding and a unloading unit for unloading, and a group of transfer units for processing and transferring materials are arranged between the feeding unit and the unloading unit;

[0007] The processing group includes: a glue supply unit for realizing film feeding work and a film pasting unit for realizing film pasting processing;

[0008] It is arranged in the middle section of the material transfer unit, and includes: a positioning table, a film cutter, and a cutting cylinder for driving the film cutter to perform cutting work, and is used to complete the secondary cutting work of the film on the semiconductor product after film pasting.

[0009] As a further solution of the utility model: the loading unit and the unloading unit both include: a material moving device, a material transfer device and a pick-up and place device;

[0010] The material transfer device includes: a rotating table and a driving motor for driving the rotating table to rotate. The rotating table is provided with a plurality of material discharging seats arranged around the rotating table.

[0011] A plurality of semiconductors stacked in gaps are placed in the material discharging seat; the position where the rotating truncated table is connected to the material transfer group is the material transfer position, and a material transfer lifting module is arranged at the material transfer position;

[0012] The material transfer device comprises: a set of material transfer lifting modules and a material transfer moving module installed on the material transfer lifting module, and a material transfer frame is installed on the material transfer moving module, and a set of electrostatic suction cups extending toward the rotating table are arranged on the material transfer frame;

[0013] The material transfer device also includes: a material transfer table, a through material discharge position is formed on the material transfer table, and sunken material support grooves are formed at both ends of the material transfer table and the material discharge position;

[0014] The pick-and-place device is arranged between the material moving device and the material transfer unit, and includes: a pick-and-place moving module, a pick-and-place lifting module installed on the pick-and-place moving module, and a pick-and-place clamping module installed on the pick-and-place lifting module for realizing semiconductor material picking;

[0015] The pick-and-place moving module extends from the material moving device to the material transfer unit.

[0016] As a further solution of the utility model: the glue supply unit comprises: a feeding frame, which comprises: a material unwinding roller shaft, a film stripping cutting table and a material receiving roller shaft in sequence according to the feeding direction of the material roll;

[0017] The upper end of the stripping film cutting table is provided with a glue supply device, which includes: a group of glue supply moving modules extending toward the film sticking unit, on which are mounted glue supply and suction heads for suctioning glue, glue supply lifting cylinders for driving the glue supply and suction heads to lift and lower, and glue supply and overturning modules for driving the glue supply and suction heads to overturn;

[0018] The stripping film cutting table is provided with a film cutting knife for cutting the film sheets;

[0019] A discharging camera module is provided at the upper end of the glue supply device;

[0020] The film pasting unit comprises: a group of film pasting moving modules extending from the glue supply unit to the material loading unit, a group of film pasting lifting modules are installed on the film pasting moving modules, and a film pasting material taking suction head for realizing the film pasting work is installed on the film pasting lifting module.

[0021] As a further solution of the utility model: a group of film sticking camera modules are also arranged between the glue supply unit and the feeding unit.

[0022] As a further solution of the utility model: the material transfer unit includes: a group of material transfer moving modules extending from the loading unit to the unloading unit, and a material discharge table for realizing material discharge is arranged on the material transfer moving module.

[0023] The beneficial effects of the utility model are as follows: in the film pasting processing of chip semiconductors, by setting the cooperation of the feeding group and the processing group, the automatic feeding and film pasting processing action of the semiconductor chip semiconductor is realized, which can realize accurate film pasting processing and achieve the effect of high-quality film pasting processing; and it can effectively improve the processing efficiency of the glue pasting work, reduce the labor cost, and achieve the processing purpose of efficient and automated production. BRIEF DESCRIPTION OF THE DRAWINGS

[0024] Figure 1 It is a schematic diagram of the structure of the utility model.

[0025] Figure 2 It is a structural schematic diagram of the feeding group in the utility model.

[0026] Figure 3 It is a structural schematic diagram of the processing group in the utility model.

[0027] Figure 4 It is another structural schematic diagram of the processing group in the utility model. DETAILED DESCRIPTION

[0028] The following will be combined with the drawings in the embodiments of the present application to clearly and completely describe the technical solutions in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, not all of the embodiments. It should be understood that the present application is not limited to the example embodiments disclosed herein. Based on the embodiments in the present application, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of this application.

[0029] In the description of the present invention, it should be understood that the terms "length", "width", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", etc., indicating the orientation or position relationship, are based on the orientation or position relationship shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the present invention.

[0030] In addition, the terms "first" and "second" are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Therefore, the features defined as "first" and "second" may explicitly or implicitly include one or more of the features. In the description of the present utility model, the meaning of "plurality" is two or more, unless otherwise clearly and specifically defined.

[0031] In the embodiments of the present invention, unless otherwise clearly specified and limited, the terms "installed", "connected", "connected", "fixed" and the like should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium, it can be the internal connection of two elements or the interaction relationship between two elements. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0032] The utility model provides Figures 1 to 4 In an embodiment of the utility model, a semiconductor automatic glue cutting and film laminating device comprises: a processing machine 1 and a feeding group for realizing semiconductor loading and unloading and a processing group for realizing semiconductor film laminating arranged on the processing machine 1;

[0033] The feeding group includes: a feeding unit 3 for feeding and a unloading unit 2 for unloading, and a group of transfer units 4 for processing and transferring are arranged between the feeding unit 3 and the unloading unit 2;

[0034] During the processing, the semiconductor to be processed is placed in the loading position of the transfer unit 4 through the loading unit 3, and the semiconductor to be processed is fed to the lower feeding unit 2 through the transfer unit 4;

[0035] The processing group includes: a glue supply unit 6 for realizing film feeding and a film pasting unit 5 for realizing film pasting. During the processing, the glue supply unit 6 will peel the film from the raw material roll to realize feeding, and the film pasting unit 5 will position and attach the film to the semiconductor to be processed in the material transfer unit 4 to complete the film pasting process of the semiconductor;

[0036] The processing group also includes: a group of film cutting devices 7 arranged between the loading unit 3 and the unloading unit 2, which are arranged in the middle position of the transfer unit 4, including: a positioning table 74, a film cutter 71 and a cutting cylinder 73 for driving the film cutter 71 to perform cutting work, which is used to complete the secondary cutting work of the film on the semiconductor product after film pasting.

[0037] Furthermore, the loading unit 3 and the unloading unit 2 both include: a material moving device, a material transfer device, and a pick-and-place device;

[0038] The material transfer device includes: a rotating table 32 and a driving motor 31 for driving the rotating table 32 to rotate. The rotating table 32 is provided with a plurality of material discharging seats 33 arranged around the rotating table 32.

[0039] A plurality of semiconductors stacked in gaps are placed in the material discharging seat 33; the position where the rotating truncated table 32 is connected to the material transfer group is the material transfer position, and a material transfer lifting module (not shown) is arranged at the material transfer position; and the position where the material discharging seat 33 is installed in the rotating truncated table 32 is provided with an avoidance groove (not shown), and the material discharging seat 33 can be driven to move up and down by the material transfer lifting module to achieve the effect of clip-type material discharging or feeding;

[0040] The material transfer device includes: a material transfer lifting module (not shown) and a material transfer moving module 37 installed on the material transfer lifting module, and a material transfer frame is installed on the material transfer moving module 37, and a group of electrostatic suction cups 36 extending toward the rotating round table 32 are arranged on the material transfer frame;

[0041] The material transfer device further comprises: a rotating table 35, on which a through material discharge position 34 is formed, and at both ends of the rotating table 35 and the material discharge position 34, sunken material support grooves are formed; during the loading operation, the material transfer lifting module and the material transfer moving module 37 in the material transfer group drive the electrostatic suction cup 36 to suck the bottom of the semiconductor from the material discharge seat 33, take it out and place it in the material discharge position 34, and support it through the material support grooves on both sides; and during the unloading operation, the electrostatic suction cup 36 is driven to take out the processed semiconductor wafer from the material discharge position 34 and place it in the material discharge seat 33;

[0042] The pick-and-place device is arranged between the material moving device and the material transfer unit 4, and includes: a pick-and-place moving module 39, a pick-and-place lifting module 310 installed on the pick-and-place moving module 39, and a pick-and-place clamping module 38 installed on the pick-and-place lifting module 310 for realizing semiconductor material picking. The pick-and-place clamping module 38 can work by vacuum adsorption, clamping and other material picking methods;

[0043] The pick-and-place moving module 39 extends from the material moving device to the material transfer unit 4 . The pick-and-place moving module 39 and the pick-and-place lifting module 310 cooperate to drive the pick-and-place clamping module 38 to realize the semiconductor material transfer work between the material moving device and the material transfer unit 4 .

[0044] Furthermore, the glue supply unit 6 includes: a feeding frame 64, and the feeding frame 64 includes: a material unwinding roller shaft 61, a material stripping film cutting table 66 and a material receiving roller shaft 63 in sequence according to the feeding direction of the material roll;

[0045] The upper end of the stripping film cutting table 66 is provided with a glue supply device 8, which includes: a group of glue supply moving modules 84 extending toward the film sticking unit 5, on which the glue supply moving modules 84 are mounted glue supply and suction heads 81 for suctioning glue, a glue supply lifting cylinder 82 for driving the glue supply and suction heads 81 to lift and lower, and a glue supply flipping module 83 for driving the glue supply and suction heads 81 to flip;

[0046] During the processing, the film sheet roll is fed out from the unwinding roller 61, and the release film is separated from the film sheet for laminating by the film stripping cutting station 66, and the release film is rolled up by the receiving roller 63. A plurality of tensioning rollers 62 are arranged between the unwinding roller 61, the film stripping cutting station 66 and the receiving roller 63, and the tensioning force of the film sheet is increased by the tensioning roller 62.

[0047] The film stripping and cutting table 66 is provided with a film cutting knife 65 for cutting the film. The film is taken out from the film stripping and cutting table 66 by the glue supply and suction head 81 in the glue supply device 8, and is driven to move toward the film laminating unit 5 by the glue supply moving module 84.

[0048] The upper end of the glue supply device 8 is provided with a discharging camera module 9. When the glue supply moving module 84 drives the discharging, the glue supply flip module 83 drives the glue supply and suction head 81 to flip, and the film passes through the lower end of the discharging camera module 9, so as to realize the first positioning flying shot and determine the glue suction position of the glue supply and suction head 81.

[0049] The film pasting unit 5 comprises: a film pasting moving module 51 extending from the glue supply unit 6 to the material loading unit 3, a film pasting lifting module 52 is installed on the film pasting moving module 51, and a film pasting material taking suction head for realizing the film pasting work is installed on the film pasting lifting module 52;

[0050] The glue supply moving module 84 will drive the flipped glue supply and suction head 81 to move to the lower end of the film sticking material taking suction head, and through the cooperation of the film sticking moving module 51 and the film sticking lifting module 52, the film sticking material taking suction head will take the glue film from the glue supply and suction head 81 and align it with the semiconductor of the material transfer unit 4.

[0051] In order to reduce the overall structural cost, the film laminating unit 5 can be used to replace the pick-and-place device of the loading unit 3 to implement the loading of semiconductors.

[0052] Furthermore, a group of film sticking camera modules 10 are also arranged between the glue supply unit 6 and the loading unit 3. When the film sticking moving module 51 drives the film sticking material taking suction head to the material transfer unit 4 for transferring and sticking the film, the film sticking material taking suction head will pass through the upper end of the film sticking camera module 10 to perform the effect of secondary positioning and flying shooting, thereby improving the processing accuracy of the film sticking.

[0053] Furthermore, the material transfer unit 4 includes: a group of material transfer moving modules 41 extending from the loading unit 3 to the unloading unit 2, and a material discharge table 42 for realizing material discharge is arranged on the material transfer moving module 41. During the operation, the semiconductor product is placed on the material discharge table 42, and the material transfer effect is realized by the material transfer moving module 41.

[0054] It should also be noted that, in this article, relational terms such as first and second, etc. are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Moreover, the terms "include", "comprise" or any other variants thereof are intended to cover non-exclusive inclusion, so that a process, method, article or device including a series of elements includes not only those elements, but also other elements not explicitly listed, or also includes elements inherent to such process, method, article or device. In the absence of further restrictions, the elements defined by the statement "including a ..." do not exclude the presence of other identical elements in the process, method, article or device including the elements.

[0055] The above description of the disclosed embodiments enables those skilled in the art to implement or use the present application. Various modifications to these embodiments will be apparent to those skilled in the art, and the general principles defined herein may be implemented in other embodiments without departing from the spirit or scope of the present application. Therefore, the present application will not be limited to the embodiments shown herein, but will conform to the widest scope consistent with the principles and novel features disclosed herein.

Claims

1. A semiconductor automatic glue cutting and film laminating equipment, characterized in that: include: A processing machine and a feeding group arranged on the processing machine for realizing semiconductor loading and unloading and a processing group for realizing semiconductor film bonding; The feeding group includes: a feeding unit for feeding and a unloading unit for unloading, and a group of transfer units for processing and transferring materials are arranged between the feeding unit and the unloading unit; The processing group includes: a glue supply unit for realizing film feeding work and a film pasting unit for realizing film pasting processing; It is arranged in the middle section of the material transfer unit, and includes: a positioning table, a film cutter, and a cutting cylinder for driving the film cutter to perform cutting work, and is used to complete the secondary cutting work of the film on the semiconductor product after film pasting.

2. The semiconductor automatic glue cutting and film laminating equipment according to claim 1, characterized in that: Both the loading unit and the unloading unit include: a material moving device, a material transfer device and a pick-and-place device; The material transfer device includes: a rotating table and a driving motor for driving the rotating table to rotate. The rotating table is provided with a plurality of material discharging seats arranged around the rotating table. A plurality of semiconductors stacked in gaps are placed in the material discharging seat; the position where the rotating truncated table is connected to the material transfer group is the material transfer position, and a material transfer lifting module is arranged at the material transfer position; The material transfer device comprises: a set of material transfer lifting modules and a material transfer moving module installed on the material transfer lifting module, and a material transfer frame is installed on the material transfer moving module, and a set of electrostatic suction cups extending toward the rotating table are arranged on the material transfer frame; The material transfer device also includes: a material transfer table, a through material discharge position is formed on the material transfer table, and sunken material support grooves are formed at both ends of the material transfer table and the material discharge position; The pick-and-place device is arranged between the material moving device and the material transfer unit, and includes: a pick-and-place moving module, a pick-and-place lifting module installed on the pick-and-place moving module, and a pick-and-place clamping module installed on the pick-and-place lifting module for realizing semiconductor material picking; The pick-and-place moving module extends from the material moving device to the material transfer unit.

3. The semiconductor automatic glue cutting and film laminating equipment according to claim 1 is characterized in that: The glue supply unit comprises: a feeding frame, which comprises: a material unwinding roller shaft, a film stripping cutting table and a material receiving roller shaft in sequence according to the feeding direction of the material roll; The upper end of the stripping film cutting table is provided with a glue supply device, which includes: a group of glue supply moving modules extending toward the film sticking unit, on which are mounted glue supply and suction heads for suctioning glue, glue supply lifting cylinders for driving the glue supply and suction heads to lift and lower, and glue supply and overturning modules for driving the glue supply and suction heads to overturn; The stripping film cutting table is provided with a film cutting knife for cutting the film sheets; A discharging camera module is provided at the upper end of the glue supply device; The film pasting unit comprises: a group of film pasting moving modules extending from the glue supply unit to the material loading unit, a group of film pasting lifting modules are installed on the film pasting moving modules, and a film pasting material taking suction head for realizing the film pasting work is installed on the film pasting lifting module.

4. The semiconductor automatic glue cutting and film laminating equipment according to claim 1, characterized in that: A set of film sticking camera modules is also arranged between the glue supply unit and the feeding unit.

5. The semiconductor automatic glue cutting and film laminating equipment according to claim 1, characterized in that: The material transfer unit comprises: a group of material transfer moving modules extending from the material loading unit to the material unloading unit, and a material discharge platform for discharging the material is arranged on the material transfer moving module.

Images