Novel laying device for heat-conducting silicon wafer

Abstract

The utility model relates to the technical field of heat conduction silicon wafer laying, and discloses a novel heat conduction silicon wafer laying device which comprises a supporting bottom plate, a material suction mechanism is arranged on the supporting bottom plate, the material suction mechanism comprises a supporting frame, a lead screw is rotatably connected to the interior of the supporting frame through a bearing, and a lead screw sliding block is arranged on the outer wall of the lead screw in a threaded and sleeved mode. According to the utility model, a workpiece on which a heat-conducting silicon wafer needs to be laid is placed on the material placing table, and the air box is pushed to descend through the inner rod of the hydraulic rod, so that the sucking disc enters the material storage box and is in contact with the heat-conducting silicon wafer, and air in the air box can be extracted through the air extracting pump, so that the air in the air box is in negative pressure; and then, the hydraulic rod drives the inner rod to reset, so that the purpose of convenient feeding is achieved.

Description

Technical Field

[0001] The utility model relates to the technical field of thermal conductive silicon wafer laying, in particular to a novel thermal conductive silicon wafer laying device. Background Art

[0002] Thermally conductive silicon wafer laying refers to the process of installing or laying thermally conductive silicon wafers on the surface or inside of an object that needs to dissipate heat to improve the heat dissipation capacity of the object. In the fields of electronics, electricity, lighting, etc., thermally conductive silicon wafers are often needed to improve the heat dissipation performance of devices to ensure their stable operation and extend their service life.

[0003] According to the Chinese patent announcement number CN218826949U, the utility model discloses a high thermal conductivity silicon wafer loading disk for an ion implanter, which relates to the technical field of silicon wafer loading disks, and comprises: a loading disk body, a receiving groove is arranged on the loading disk body, a silicon wafer body is arranged inside the receiving groove, a slide groove is symmetrically arranged at the front of the receiving groove, a moving channel is arranged in the slide groove, a clamping elastic block is slidably connected to the inside of the slide groove, a limiting plate is fixedly connected to the lower part of the clamping elastic block through the moving channel, a matching block is fixedly connected to the lower part of the limiting plate, a connecting elastic band is arranged on the matching block, and a mounting frame is fixedly connected to the lower surface of the loading disk body. By cooperating with the clamping elastic block, the matching stop block and the clamping spring, the silicon wafer body can be completely clamped, and the clamping force relies on the elastic force of the connecting elastic band. The clamping operation is simple, reliable and easy to use. However, in electronic equipment and various heat dissipation demand scenarios, the laying of thermally conductive silicon wafers is very important. When laying the transmitted thermally conductive silicon wafer, it is not convenient to load the material and it is not convenient to adjust according to the actual laying requirements, thereby reducing the efficiency of subsequent laying. Utility Model Content

[0004] 1. Technical issues to be resolved

[0005] In view of the deficiencies of the prior art, the utility model provides a novel device for laying out a heat-conducting silicon wafer.

[0006] (II) Technical solution

[0007] To achieve the above-mentioned purpose, the utility model provides the following technical solutions: a new type of thermal conductive silicon wafer laying device includes a supporting base plate, a suction mechanism is arranged on the supporting base plate, the suction mechanism includes a supporting frame, a screw rod is rotatably connected to the inside of the supporting frame through a bearing, a screw rod slider is provided on the threaded sleeve on the outer wall of the screw rod, a hydraulic rod is fixedly installed on the top of the screw rod slider, an air box is fixedly installed on the inner rod of the hydraulic rod, an air pump is fixedly installed on the air box, and a suction cup is fixedly installed on the bottom of the air box.

[0008] Preferably, the support base is also provided with an adjustment mechanism, the adjustment mechanism includes a support block, the support block is fixedly mounted on the top of the support base through a support column, and the support block is provided with a slide groove. According to this preference, the screw hole block threadedly sleeved on the outer wall of the screw slides on the inner wall of the slide groove.

[0009] Preferably, the adjustment mechanism further comprises a screw rod, which is rotatably connected to the inside of the slide slot via a bearing, and a screw hole block is threadedly sleeved on the outer wall of the screw rod, and the screw hole block is slidably connected to the inner wall of the slide slot and fixedly connected to the support frame. According to this preference, the screw rod rotates, thereby driving the pulley set fixedly sleeved on the outer wall of the screw rod to rotate.

[0010] Preferably, a first motor is fixedly mounted on one side of the support block, the first motor is fixedly connected to one end of the screw, and a pulley set is fixedly sleeved on the outer wall of one end of the screw. According to this preference, by starting the first motor, the output end of the first motor drives the fixedly connected screw to rotate.

[0011] Preferably, a second motor and a limiting rod are fixedly installed inside the support frame, the output end of the second motor is fixedly connected to one end of the screw rod, and the screw rod slider is slidably sleeved on the outer wall of the limiting rod. Through this preference, the limiting rod can limit the screw rod slider.

[0012] Preferably, a material discharging platform is fixedly installed on the top of the support base plate, and a material storage box is also fixedly installed on the top of the support base plate. Through this optimization, the workpiece that needs to lay the heat-conducting silicon wafer can be placed on the material discharging platform.

[0013] (III) Beneficial effects

[0014] Compared with the prior art, the utility model provides a new type of thermal conductive silicon wafer laying device, which has the following beneficial effects:

[0015] 1. This novel device for laying thermally conductive silicon wafers, through the coordinated action of a suction mechanism, a second motor, a limit rod, a discharge table, and a storage box, places the workpiece on which the thermally conductive silicon wafer is to be laid on the discharge table, and the inner rod of the hydraulic rod pushes the air box down, so that the suction cup enters the storage box and contacts the thermally conductive silicon wafer. The air inside the air box can be extracted by an air pump to make the air inside the air box negative pressure, and the suction cup can adsorb the thermally conductive silicon wafer. Then the hydraulic rod drives the inner rod to reset, so as to achieve the purpose of facilitating material loading. The output end of the second motor drives the screw rod to rotate, thereby driving the screw rod slider to move. The limit rod can limit the screw rod slider, and the screw rod slider can drive all components on itself to move, so that the front and rear positions can be adjusted according to laying requirements, thereby improving the efficiency of subsequent laying.

[0016] 2. This new type of thermally conductive silicon wafer laying device, through the cooperation of the adjustment mechanism, the first motor, and the pulley kit, drives the fixedly connected screw to rotate through the output end of the first motor, thereby driving the pulley kit to rotate, and through the transmission connection of the belt, the two screws rotate synchronously, so that the screw hole block slides on the inner wall of the slide groove, thereby driving all the components on the support frame to move, and then the left and right position can be adjusted according to the laying requirements. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] The accompanying drawings are used to provide a further understanding of the present invention and constitute a part of the specification. Together with the embodiments of the present invention, they are used to explain the present invention and do not constitute a limitation of the present invention. In the accompanying drawings:

[0018] Figure 1 It is a three-dimensional diagram of the structure of the utility model;

[0019] Figure 2 This is a schematic diagram of the top view structure of the utility model;

[0020] Figure 3 It is a schematic diagram of the side cross-sectional structure of the utility model.

[0021] In the figure: 1. supporting bottom plate; 21. material suction mechanism; 211. supporting frame; 212. screw rod; 213. screw rod slider; 214. hydraulic rod; 215. air box; 216. vacuum pump; 217. suction cup; 31. adjusting mechanism; 311. supporting block; 312. slide groove; 313. screw rod; 314. screw hole block; 4. first motor; 5. pulley kit; 6. second motor; 7. limit rod; 8. material discharge table; 9. material storage box. DETAILED DESCRIPTION

[0022] The technical solutions in the embodiments of the present invention will be described clearly and completely below in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, rather than all of the embodiments.

[0023] Example 1

[0024] like Figure 1-3As shown, the utility model provides a novel device for laying heat-conducting silicon wafers, including a supporting base plate 1, on which a suction mechanism 21 is arranged, the suction mechanism 21 includes a supporting frame 211, a screw rod 212 is rotatably connected to the inside of the supporting frame 211 through a bearing, a screw rod slide block 213 is provided with a threaded sleeve on the outer wall of the screw rod 212, a hydraulic rod 214 is fixedly installed on the top of the screw rod slide block 213, an air box 215 is fixedly installed on the inner rod of the hydraulic rod 214, and an air pump 216 is fixedly installed on the air box 215, A suction cup 217 is fixedly installed at the bottom of the air box 215. The air inside the air box 215 is at negative pressure. The suction cup 217 can adsorb the heat-conducting silicon wafer. A second motor 6 and a limit rod 7 are fixedly installed inside the support frame 211. The output end of the second motor 6 is fixedly connected to one end of the screw rod 212. The screw slider 213 is slidably sleeved on the outer wall of the limit rod 7. The limit rod 7 can limit the screw slider 213. A material discharge table 8 is fixedly installed on the top of the support base plate 1, and a material storage box 9 is also fixedly installed on the top of the support base plate 1.

[0025] In this embodiment, the workpiece on which the heat-conducting silicon wafer needs to be laid is placed on the discharge table 8, and the hydraulic rod 214 is started so that the inner rod of the hydraulic rod 214 pushes the air box 215 to descend, so that the suction cup 217 enters the storage box 9 and contacts the heat-conducting silicon wafer. The vacuum pump 216 is started so that the vacuum pump 216 can extract the gas inside the air box 215 to make the air inside the air box 215 negative pressure, and the suction cup 217 can adsorb the heat-conducting silicon wafer. Then the hydraulic rod 214 drives the inner rod to reset, so as to achieve the purpose of facilitating material loading. The second motor 6 is started so that the output end of the second motor 6 drives the fixedly connected screw rod 212 to rotate, thereby driving the screw slider 213 threadedly sleeved on the outer wall of the screw rod 212 to move. The limit rod 7 can limit the screw slider 213, and the screw slider 213 can drive all components on itself to move, so that the front and rear positions can be adjusted according to the laying requirements.

[0026] Example 2

[0027] like Figure 1-3As shown, on the basis of Example 1, the utility model provides a technical solution: preferably, an adjustment mechanism 31 is also provided on the support base plate 1, the adjustment mechanism 31 includes a support block 311, the support block 311 is fixedly installed on the top of the support base plate 1 through a support column, the support block 311 is provided with a slide groove 312, the adjustment mechanism 31 also includes a screw 313, the screw 313 is rotatably connected to the inside of the slide groove 312 through a bearing, the outer wall of the screw 313 is threadedly sleeved with a screw hole block 314, the screw hole block 314 is slidably connected to the inner wall of the slide groove 312 and fixedly connected to the support frame 211, a first motor 4 is fixedly installed on one side of the support block 311, the first motor 4 is fixedly connected to one end of the screw 313, and the outer wall of one end of the screw 313 is fixedly sleeved with a pulley kit 5, the pulley kit 5 rotates, and the two screws 313 rotate synchronously under the transmission connection of the belt.

[0028] In this embodiment, by starting the first motor 4, the output end of the first motor 4 drives the fixedly connected screw 313 to rotate, thereby driving the pulley kit 5 fixedly mounted on the outer wall of the screw 313 to rotate, and through the transmission connection of the belt, the two screws 313 rotate synchronously, so that the screw hole block 314 threadedly mounted on the outer wall of the screw 313 slides on the inner wall of the slide groove 312, thereby driving all components on the support frame 211 to move, and then the left and right positions can be adjusted according to the laying requirements.

[0029] The working principle of the new type of thermal conductive silicon wafer laying device is described in detail below.

[0030] like Figure 1-3As shown, when in use, the workpiece that needs to be laid with the thermally conductive silicon wafer can be placed on the discharge table 8, and by starting the hydraulic rod 214, the inner rod of the hydraulic rod 214 pushes the air box 215 to descend, so that the suction cup 217 enters the storage box 9 and contacts the thermally conductive silicon wafer. By starting the vacuum pump 216, the vacuum pump 216 can extract the gas inside the air box 215, so that the air inside the air box 215 is negative pressure, and the suction cup 217 can adsorb the thermally conductive silicon wafer. Then the hydraulic rod 214 drives the inner rod to reset, so as to achieve the purpose of facilitating material loading. By starting the second motor 6, the output end of the second motor 6 drives the fixedly connected screw rod 212 to rotate, thereby driving the threaded sleeve on the outer wall of the screw rod 212 The screw slider 213 is designed to move, and the limit rod 7 can limit the screw slider 213. The screw slider 213 can drive all the components on it to move, so that the front and rear position can be adjusted according to the laying requirements. By starting the first motor 4, the output end of the first motor 4 drives the fixedly connected screw 313 to rotate, thereby driving the pulley kit 5 fixedly sleeved on the outer wall of the screw 313 to rotate. Under the transmission connection of the belt, the two screws 313 rotate synchronously, so that the screw hole block 314 threadedly sleeved on the outer wall of the screw 313 slides on the inner wall of the slide groove 312, thereby driving all the components on the support frame 211 to move, and then the left and right position can be adjusted according to the laying requirements.

Claims

1. A novel device for laying a thermally conductive silicon wafer, comprising a supporting base plate (1), characterized in that: A material suction mechanism (21) is arranged on the support bottom plate (1), and the material suction mechanism (21) comprises a support frame (211), a screw rod (212) is rotatably connected to the support frame (211) via a bearing, a screw rod slider (213) is threadedly sleeved on the outer wall of the screw rod (212), a hydraulic rod (214) is fixedly mounted on the top of the screw rod slider (213), an air box (215) is fixedly mounted on the inner rod of the hydraulic rod (214), an air pump (216) is fixedly mounted on the air box (215), and a suction cup (217) is fixedly mounted on the bottom of the air box (215).

2. A novel thermal conductive silicon wafer laying device according to claim 1, characterized in that: The support base plate (1) is also provided with an adjustment mechanism (31), the adjustment mechanism (31) comprising a support block (311), the support block (311) being fixedly mounted on the top of the support base plate (1) via a support column, and the support block (311) being provided with a slide groove (312).

3. A novel thermal conductive silicon wafer laying device according to claim 2, characterized in that: The adjusting mechanism (31) further comprises a screw rod (313), wherein the screw rod (313) is rotatably connected to the inside of the slide groove (312) via a bearing, and a screw hole block (314) is threadedly sleeved on the outer wall of the screw rod (313), and the screw hole block (314) is slidably connected to the inner wall of the slide groove (312) and fixedly connected to the support frame (211).

4. A novel thermal conductive silicon wafer laying device according to claim 2, characterized in that: A first motor (4) is fixedly mounted on one side of the support block (311), the first motor (4) is fixedly connected to one end of a screw rod (313), and a pulley set (5) is fixedly sleeved on the outer wall of one end of the screw rod (313).

5. The novel thermal conductive silicon wafer laying device according to claim 1 is characterized in that: A second motor (6) and a limiting rod (7) are fixedly installed inside the support frame (211); the output end of the second motor (6) is fixedly connected to one end of the screw rod (212); and the screw rod slider (213) is slidably sleeved on the outer wall of the limiting rod (7).

6. A novel thermal conductive silicon wafer laying device according to claim 1, characterized in that: A material discharging platform (8) is fixedly mounted on the top of the supporting base plate (1), and a material storage box (9) is also fixedly mounted on the top of the supporting base plate (1).

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