Novel patch type three-pin inductor

Abstract

The utility model provides a novel patch type three-pin inductor, which relates to the field of patch type three-pin inductors, and comprises a block body, a lead and a fixing mechanism, and the fixing mechanism is annularly arranged on the outer side of the block body; the fixing mechanism comprises a plurality of mounting plates, a plurality of mounting grooves distributed at equal intervals are formed in the surfaces of the mounting plates, wires are wound in the mounting grooves distributed at equal intervals, and the tops of the mounting plates are connected with the inner side wall of the block. And therefore, the influence on subsequent use caused by the change of the inductance value of the inductor due to dislocation between the copper wires when the equipment is subjected to mechanical vibration can be prevented.

Description

Technical Field

[0001] The utility model relates to the field of chip type three-pin inductors, in particular to a novel chip type three-pin inductor. Background Art

[0002] SMD three-pin inductor, commonly known as SMD (Surface Mount Device) three-pin inductor, is an inductor component designed for surface mount technology. Compared with traditional through-hole inductors, it has the advantages of small size, suitable for automated production, and high installation density. It is widely used in modern electronic devices, especially in compact and high-density circuit board designs.

[0003] The existing SMD triangular inductor uses copper wires directly wound around the outside of the block. There are gaps between the copper wires. When the inductor is installed in a device and the device undergoes mechanical vibration, it will cause misalignment between the copper wires. At this time, the inductance of the inductor will change, affecting subsequent use.

[0004] Therefore, it is necessary to provide a new type of SMD three-pin inductor to solve the above technical problems. Utility Model Content

[0005] In order to solve the above technical problems, the utility model provides a novel SMD three-pin inductor.

[0006] The novel SMD three-pin inductor provided by the utility model comprises: a block, a conductor and a fixing mechanism, wherein the fixing mechanism is arranged on the outside of the block;

[0007] The fixing mechanism comprises a plurality of mounting plates, the surfaces of the plurality of mounting plates are provided with a plurality of mounting grooves distributed at equal intervals, the plurality of mounting grooves distributed at equal intervals are wound with wires, and the tops of the plurality of mounting plates are connected to the inner side walls of the block.

[0008] Preferably, the block includes a core block, a reinforcement layer and a heat-conducting layer which are sequentially arranged from the inside to the outside, and the heat-conducting layer is connected to one side of the mounting plate.

[0009] Preferably, two opposite connecting grooves and a clamping groove are provided on the top of the block, and the two clamping grooves are respectively provided at opposite positions of the bottom walls of the two connecting grooves.

[0010] Preferably, a straight groove is further provided on the top of the block, and the straight groove is located between the two clamping grooves.

[0011] Preferably, the core block is made of pure copper.

[0012] Preferably, the reinforcement layer is made of iron alloy.

[0013] Preferably, the heat conducting layer is made of graphite.

[0014] Compared with the related art, the novel SMD three-pin inductor provided by the utility model has the following beneficial effects:

[0015] A fixing mechanism is arranged on the outer ring of the block, and a mounting plate in the fixing mechanism fixes the wire. When in use, the wire is inserted into a mounting groove provided on the surface of the mounting plate and wrapped around the outer side of the block. When the inductor is installed in the equipment, the equipment vibrates mechanically. Since the wire is restricted by the mounting groove, misalignment between the wires is avoided, resulting in a change in the inductance of the inductor, thereby extending the service life of the inductor. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] Figure 1 This is a schematic diagram of the overall structure of the novel SMD three-pin inductor provided by the utility model;

[0017] Figure 2 A schematic diagram of the overall cross-sectional structure of the novel SMD three-pin inductor provided by the utility model;

[0018] Figure 3 is a schematic diagram of the cross-sectional structure of the mounting plate;

[0019] Figure 4 This is the enlarged view of point A;

[0020] Figure 5 This is an enlarged view of point B.

[0021] Numbers in the figure: 1, block; 11, core block; 12, reinforcement layer; 13, heat conducting layer; 2, connecting groove; 3, card groove; 4, mounting plate; 41, mounting groove; 42, wire; 5, straight groove. DETAILED DESCRIPTION

[0022] The utility model is further described below in conjunction with the accompanying drawings and implementation modes.

[0023] Please refer to Figures 1 to 5 ,in, Figure 1 This is a schematic diagram of the overall structure of the novel SMD three-pin inductor provided by the utility model; Figure 2 A schematic diagram of the overall cross-sectional structure of the novel SMD three-pin inductor provided by the utility model; Figure 3 is a schematic diagram of the cross-sectional structure of the mounting plate; Figure 4 This is the enlarged view of point A; Figure 5 This is an enlarged view of point B.

[0024] In the specific implementation process, Figures 1 to 5 As shown, it includes a block 1, a wire 42 and a fixing mechanism, and the fixing mechanism is arranged on the outside of the block 1;

[0025] The fixing mechanism includes a plurality of mounting plates 4, the surfaces of the plurality of mounting plates 4 are provided with a plurality of mounting grooves 41 distributed at equal intervals, the plurality of mounting grooves 41 distributed at equal intervals are wound with wires 42, and the tops of the plurality of mounting plates 4 are connected to the inner side walls of the block 1;

[0026] Specifically, the wire 42 is wound in a mounting groove 41 opened on the surface of the mounting plate 4, and a plurality of mounting plates 4 are arranged around the outer side of the block 1 to fix the wire 42, thereby avoiding misalignment between the wires 42 in the inductor due to mechanical vibration, resulting in a change in the inductance of the inductor, thereby extending the service life of the inductor.

[0027] refer to Figure 1 , Figure 2 As shown, a straight groove 5 is further provided on the top of the block 1, and the straight groove 5 is located between the two slots 3. The core block 11 is made of pure copper, the reinforcing layer 12 is made of iron alloy, and the heat conducting layer 13 is made of graphite.

[0028] Specifically, the core block 11 is made of pure copper, which has good thermal conductivity. The reinforcing layer 12 is made of iron alloy, which is an iron-based alloy. The iron-based alloy has high material strength and can enhance the stability of the overall device. In addition, the heat-conducting layer 13 is made of graphite, which has good thermal and electrical conductivity and can discharge the heat generated by the wire 42 in a timely manner.

[0029] The top of the block 1 is provided with two opposite connecting grooves 2 and a clamping groove 3, and the two clamping grooves 3 are respectively provided at opposite positions of the bottom walls of the two connecting grooves 2;

[0030] Furthermore, the connection slot 2 is mainly used to connect other components, and the card slot 3 is mainly used to fix the end of the wire 42. Preferably, one end of the wire 42 is clamped in the card slot 3, and the wire 42 is fixed by a clamping method, wherein the wire 42 is preferably a copper wire.

[0031] refer to Figures 3 to 5 As shown, the block 1 includes a core block 11, a reinforcement layer 12 and a heat-conducting layer 13 which are sequentially arranged from the inside to the outside, and the heat-conducting layer 13 is connected to one side of the mounting plate 4;

[0032] Specifically, by setting up a reinforcing layer 12 and a heat-conducting layer 13, the reinforcing layer 12 is used to strengthen the overall structure, and the heat-conducting layer 13 mainly dissipates heat for the mounting plate 4, thereby dissipating heat for the wire 42 wound on the surface of the mounting plate 4, and the mounting plate 4 is preferably made of aluminum alloy with good conductivity.

[0033] The working principle of the utility model is as follows: when in use, one end of the wire 42 only needs to be engaged in the card slot 3, and the other end is wound along the installation slot 41 opened on the surface of the installation plate 4, so that the wire 42 can be fixed.

[0034] The circuits and controls involved in the present invention are all prior art and will not be described in detail here.

[0035] The above description is only an embodiment of the present invention, and does not limit the patent scope of the present invention. Any equivalent structure or equivalent process transformation made by using the contents of the specification and drawings of the present invention, or directly or indirectly applied in other related technical fields, are also included in the patent protection scope of the present invention.

Claims

1. A new type of SMD three-pin inductor, characterized in that: It comprises a block (1), a conductor (42) and a fixing mechanism, wherein the fixing mechanism is arranged on the outside of the block (1); The fixing mechanism comprises a plurality of mounting plates (4), the surfaces of the plurality of mounting plates (4) being provided with a plurality of mounting grooves (41) distributed at equal intervals, wires (42) being wound in the plurality of mounting grooves (41) distributed at equal intervals, and the tops of the plurality of mounting plates (4) being connected to the inner side walls of the block (1).

2. The novel SMD three-pin inductor according to claim 1 is characterized in that: The block (1) comprises a core block (11), a reinforcement layer (12) and a heat-conducting layer (13) which are arranged in sequence from the inside to the outside, and the heat-conducting layer (13) is connected to one side of the mounting plate (4).

3. The novel SMD three-pin inductor according to claim 2 is characterized in that: Two opposite connecting grooves (2) and a clamping groove (3) are provided on the top of the block (1), and the two clamping grooves (3) are respectively provided at opposite positions of the bottom walls of the two connecting grooves (2).

4. The novel SMD three-pin inductor according to claim 3 is characterized in that: A straight groove (5) is also provided on the top of the block (1), and the straight groove (5) is located between the two clamping grooves (3).

5. The novel SMD three-pin inductor according to claim 4 is characterized in that: The core block (11) is made of pure copper.

6. The novel SMD three-pin inductor according to claim 5 is characterized in that: The material of the reinforcement layer (12) is iron alloy.

7. The novel SMD three-pin inductor according to claim 6 is characterized in that: The material of the heat conducting layer (13) is graphite.

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