Temperature control type gas heating system and semiconductor manufacturing equipment

Abstract

The utility model discloses a temperature control type gas heating system and semiconductor manufacturing equipment, and the system comprises a cavity which is used for a reaction gas to pass through; the gas pipeline is communicated with the cavity and is used for introducing inert gas into the cavity; and the heating assembly is used for heating inert gas in the gas pipeline. In the using process, inert gas heated by the heating assembly is introduced into the cavity through the gas pipeline, so that the high-temperature inert gas purges the cavity, fine moisture in the cavity is removed, air in the cavity is diluted through the inert gas, and the air in the cavity is purified. And the chemical reaction between the reaction gas and moisture or oxygen in air is reduced, so that the generation of solid acidified matters is inhibited.

Description

Technical Field

[0001] The utility model relates to the technical field of semiconductor processing, in particular to a temperature-controlled gas heating system and a semiconductor manufacturing device. Background Art

[0002] In the semiconductor manufacturing process, the semiconductor manufacturing equipment has a vacuum chamber, which is connected to a pipeline. Various gases are transported into the vacuum chamber through the pipeline to participate in the reaction. The gas reacts chemically with water or oxygen in the air to form solid acid compounds (Powder). Therefore, it is necessary to suppress the generation of solid acid compounds inside the pipeline. Utility Model Content

[0003] The utility model aims to provide a temperature-controlled gas heating system and semiconductor manufacturing equipment, which can suppress the generation of solid acidified substances inside a pipeline.

[0004] In order to achieve the above object, the utility model is implemented through the following technical solutions:

[0005] A temperature-controlled gas heating system comprises: a cavity for passing a reaction gas; a gas pipeline connected to the cavity and used to pass an inert gas into the cavity; and a heating component for heating the inert gas in the gas pipeline.

[0006] Preferably, the temperature-controlled gas heating system further comprises: a control component, which is in communication with the gas pipeline and is used to control the gas supply pressure of the inert gas.

[0007] Furthermore, the control component includes a pressure monitoring device for monitoring whether the gas supply pressure meets a set value.

[0008] Preferably, the gas supply source is connected to the gas pipeline via an air pipe joint, and the air pipe joint is provided with a one-way valve to prevent the gas in the pipeline from flowing back.

[0009] Furthermore, the control component is also connected to the heating component to control the heating temperature of the heating component.

[0010] Furthermore, the heating component includes a heating rod, an outer wall of the heating rod is provided with a temperature switch, and the temperature switch is connected to the control component.

[0011] Furthermore, the cavity includes an air inlet end and an air outlet end, and the air outlet end is provided with a temperature sensor for detecting the temperature of the gas, and the temperature sensor is connected to the control component.

[0012] Furthermore, the control circuit of the heating component is connected to the control component via an aviation plug.

[0013] Furthermore, the temperature sensor includes a detection end and a fixed end, the detection end is placed inside the cavity, and the fixed end is locked on the outer wall of the cavity through a ferrule joint.

[0014] A semiconductor manufacturing equipment comprises the temperature-controlled gas heating system described in any one of the above items.

[0015] The utility model has the following beneficial effects:

[0016] During use of the utility model, an inert gas heated by a heating component is introduced into the cavity through a gas pipeline, so that the high-temperature inert gas is used to purge the cavity, thereby removing fine moisture in the cavity and using the inert gas to dilute the air inside the cavity, reducing the chemical reaction between the reaction gas and moisture or oxygen in the air, thereby inhibiting the generation of solid acidified products. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] In order to more clearly illustrate the technical solution of the utility model, the following is a brief introduction to the drawings required for the description. Obviously, the drawings described below are an embodiment of the utility model. For ordinary technicians in this field, other drawings can be obtained based on these drawings without creative work:

[0018] Figure 1 It is a schematic diagram of the overall structure of the gas heating device body in one embodiment of the utility model;

[0019] Figure 2 It is a schematic diagram of the exploded structure of the gas heating device body in one embodiment of the utility model;

[0020] Figure 3 This is a schematic diagram of the structure of a temperature sensor in one embodiment of the utility model;

[0021] Figure 4 It is a schematic diagram of the structure of an external control cabinet in one embodiment of the utility model.

[0022] Description of reference numerals:

[0023] 1: Cavity;

[0024] 2: Gas pipeline;

[0025] 3: External control cabinet;

[0026] 4: Shell;

[0027] 5: Trachea connector;

[0028] 6: Aviation plug;

[0029] 7: Heating rod;

[0030] 8: Aviation socket;

[0031] 9: Quick-connect connector;

[0032] 10: Temperature control meter;

[0033] 11: Glass flow meter;

[0034] 12: Temperature switch;

[0035] 13: Temperature sensor;

[0036] 14: Flange. DETAILED DESCRIPTION

[0037] The utility model is further described in detail below in conjunction with the accompanying drawings and specific implementation methods. According to the following description, the advantages and features of the utility model will be clearer. It should be noted that the accompanying drawings adopt a very simplified form and use non-precise proportions, which are only used to conveniently and clearly assist in explaining the purpose of the implementation method of the utility model. In order to make the purpose, features and advantages of the utility model more obvious and easy to understand, please refer to the accompanying drawings. It should be noted that the structure, proportion, size, etc. illustrated by the accompanying drawings of this specification are only used to match the content disclosed in the specification, so that people familiar with this technology can understand and read, and are not used to limit the limiting conditions for the implementation of the utility model, so they have no technical substantive significance. Any modification of the structure, change of the proportional relationship or adjustment of the size, without affecting the effect that the utility model can produce and the purpose that can be achieved, should still fall within the scope of the technical content disclosed by the utility model. The "first" and "second" in the utility model are only to distinguish the relative position relationship, not a specific restriction on the quantity.

[0038] like Figure 1-4 As shown, this embodiment provides a temperature-controlled gas heating system, including: a cavity 1 for passing reaction gas; a gas pipeline 2, connected to the cavity 1, for passing inert gas into the cavity 1; and a heating component for heating the inert gas in the gas pipeline 2.

[0039] During use of this embodiment, an inert gas heated by a heating component is introduced into the cavity 1 through the gas pipe 2, so that the high-temperature inert gas is used to purge the cavity 1, thereby removing fine moisture in the cavity 1 and using the inert gas to dilute the air inside the cavity 1, reducing the chemical reaction between the reaction gas and moisture or oxygen in the air, thereby inhibiting the formation of solid acidified products.

[0040] The temperature-controlled gas heating system in this embodiment is also used to prevent the temperature of the gas at the end of the vacuum pump of the semiconductor manufacturing equipment from being too low, thereby causing the reaction gas to condense and form dust, causing blockage in the on-site pipeline. The gas pipeline 2 is heated by the heating rod 7, and the inert gas will be heated after passing through the gas pipeline 2. The cavity 1 is installed in the gas heating device body and connected to the on-site pipeline. The inert gas is input to continuously purge the on-site pipeline, which first plays a cleaning role and second takes away the heat of the gas heating device body to prevent the gas heating device body from being burned due to excessive temperature.

[0041] As a preferred implementation, the temperature-controlled gas heating system in this embodiment further includes: a control component, which is connected to the gas pipeline 2 and is used to control the gas supply pressure of the inert gas.

[0042] like Figure 1 and 2 As shown, specifically, the temperature-controlled gas heating system in this embodiment includes a gas heating device body and an external control cabinet 3 connected to the gas heating device body. The gas heating device body specifically includes a shell 4, a gas pipe joint 5 provided on the shell 4, an aviation plug 6, and a heating rod 7 provided inside the shell; one end of the gas pipeline 2 is connected to the gas supply source on the external control cabinet 3 through the gas pipe joint 5, and the other end is connected to the cavity 1, and the heating rod 7 heats the middle section of the gas pipeline 2; the power supply and control circuit in the heating device body is connected to the external control cabinet 3 through the aviation plug 6; both ends of the cavity 1 pass through the shell 4 and are connected to the on-site pipeline, so as to pass the reaction gas.

[0043] Specifically, the control component in this embodiment includes a pressure monitoring device for monitoring whether the gas supply pressure meets the set value.

[0044] Specifically, the electronic pressure gauge (digital pressure gauge) in this embodiment monitors in real time whether the gas supply pressure meets the set value. If the gas supply pressure is insufficient, the electronic pressure gauge will transmit a signal to the intermediate relay inside the external control cabinet 3, and the normally closed point of the relay will be disconnected, cutting off the power supply of the gas heating device body. At the same time, the normally open point will be closed, and an audible and visual alarm will be issued.

[0045] like Figure 4 As shown, the external control cabinet 3 in this embodiment has the functions of gas flow control, gas pressure monitoring, temperature control, and leakage protection. The pressure gauge and leakage circuit breaker are arranged inside the external control cabinet 3, and the external control cabinet 3 is provided with an aviation socket 8 for circuit connection, a quick-connect connector 9 for gas supply, a temperature control meter 10 for displaying the heating temperature, and a glass flow meter 11 for displaying the gas supply flow rate.

[0046] As a preferred embodiment, the gas supply source in this embodiment is connected to the gas pipeline 2 through the trachea connector 5, and the trachea connector 5 is built with a one-way valve to prevent the gas in the pipeline from flowing back. Specifically, in this embodiment, the gas supply source is connected to the N2 gas source through a dedicated trachea connector 5. The trachea connector 5 in this embodiment has three specifications of 1 / 4', 3 / 8' and 6mm. Among them, the connection methods of the 1 / 4' and 3 / 8' specifications have both ferrule connection and quick plug connection, and the connection method of the 6mm specification has only quick plug connection.

[0047] The one-way valve built into the air pipe joint 5 of the present embodiment can only conduct in one direction. The function of this valve is to prevent the reaction gas from flowing back into the gas heating device body. The on-site gas heating device body is not always in an open state. When there is no ventilation or power supply, in order to prevent the residual reaction gas in the cavity 1 from entering the gas heating device body and causing abnormal damage, a one-way valve is installed at the lower end of the air pipe joint 5, so that the gas can only go out but not in.

[0048] Specifically, the control component in this embodiment is also connected to the heating component to control the heating temperature of the heating component.

[0049] The gas heating device body in this embodiment is connected to the external control cabinet 3, including power connection and gas pipe connection. The power supply and gas source at the plant end are integrated into the external control cabinet 3, and then distributed to each gas heating device body. The gas source options include 1 / 4', 3 / 8' and 6mm. The flow rate of a single gas heating device body is controlled at 40-80LPM, and the heating power is about 900W. The external control cabinet 3 is equipped with a built-in pressure monitoring device to monitor the gas supply pressure value in real time. At the same time, the main switch adopts a leakage circuit breaker to increase the leakage protection function. The aviation plug 6 has an anti-misplacement port to prevent incorrect insertion and is locked to prevent loosening.

[0050] The external control cabinet 3 in the prior art does not contain leakage protection configuration. The switch of the external control cabinet 3 in this embodiment is replaced with a leakage protection circuit breaker. If leakage occurs in the gas heating device body and the leakage current reaches 30mA or more, it will immediately trip and disconnect, and the blue reset button on the leakage circuit breaker will pop out. Specifically, a fuse is provided in the external control circuit in this embodiment to prevent short circuit and overload, and to protect the control circuit.

[0051] More specifically, the heating assembly in this embodiment includes a heating rod 7 , an outer wall of the heating rod 7 is provided with a temperature switch 12 , and the temperature switch 12 is connected to the control assembly.

[0052] Specifically, the gas heating device body in this embodiment uses special insulation materials inside, which has good insulation effect; and a heating component is installed inside to minimize heat loss; the gas heating device body in this embodiment maintains a good working temperature of the gas heating device body through an external control cabinet 3.

[0053] The temperature switch 12 in this embodiment is usually of KSD301 (normally closed, 10A, 230°C). This configuration is used to prevent the temperature from being too high, and the placement is optimized - placed on the outer wall of the heating rod 7, so as to better control the heating temperature.

[0054] The temperature switch 12 in this embodiment is a component attached to the plane of the heating rod 7, which can monitor the actual temperature of the heating rod 7 in real time. When the temperature exceeds the set value of the component, the temperature switch 12 will disconnect the power supply.

[0055] If the glass flow meter 11 in this embodiment is damaged, the inert gas cannot be output, and the power supply of the heating rod 7 has not been disconnected, the temperature inside the gas heating device body continues to rise. When the temperature reaches the operating temperature of the temperature switch 12, the normally closed point built into the temperature switch 12 immediately disconnects the power supply of the heating rod 7 to achieve the purpose of protection.

[0056] More specifically, the cavity 1 in this embodiment includes an air inlet end and an air outlet end. The air outlet end is provided with a temperature sensor 13 for detecting the gas temperature. The temperature sensor 13 is connected to the control component.

[0057] The temperature sensor 13 in this embodiment is placed at the air outlet end, and the length and installation method of the temperature sensor 13 are optimized. If it is too short, it will have a greater impact on the measurement results, and if it is too long, it will be inconvenient to install. Figure 3 As shown, more specifically, the temperature sensor 13 in this embodiment includes a detection end and a fixed end. The detection end is placed inside the cavity 1 to detect the gas temperature, and the fixed end is locked on the outer wall of the cavity 1 through a ferrule joint to ensure sealing and prevent the reaction gas from entering the system cavity and corroding and damaging the internal electrical components.

[0058] More specifically, the control circuit of the heating component in this embodiment is connected to the control component through the aviation plug 6, and no tools are required.

[0059] Specifically, in this embodiment, the air inlet end and the air outlet end are both provided with flanges 14, which are connected to the on-site pipelines through the flanges 14. The flanges 14 can be easily installed and removed with the on-site pipelines using clamps, and the installation and removal are simple;

[0060] The temperature-controlled gas heating system in this embodiment is easy to maintain, and the PM cycle can be extended from 1 to 2 months to 12 months; when a fault occurs inside the gas heating device body, installation and disassembly are very simple.

[0061] This embodiment also provides a semiconductor manufacturing equipment, including the above-mentioned temperature-controlled gas heating system, and the specific structure is not repeated here.

[0062] Although the content of the utility model has been described in detail through the above preferred embodiments, it should be appreciated that the above description should not be considered as a limitation of the utility model. After reading the above content, various modifications and substitutions of the utility model will be obvious to those skilled in the art. Therefore, the protection scope of the utility model should be limited by the attached claims.

Claims

1. A temperature-controlled gas heating system, comprising: a cavity for passing a reaction gas; a gas pipeline, connected to the cavity, and used for introducing an inert gas into the cavity; The heating component is used for heating the inert gas in the gas pipeline.

2. The temperature-controlled gas heating system according to claim 1, characterized in that: Also includes: A control component is connected to the gas pipeline and is used to control the gas supply pressure of the inert gas.

3. The temperature-controlled gas heating system according to claim 2, characterized in that: The control assembly includes a pressure monitoring device for monitoring whether the gas supply pressure meets a set value.

4. The temperature-controlled gas heating system according to claim 1, characterized in that: Also includes: A gas supply source is connected to the gas pipeline through a gas pipe joint, and the gas pipe joint is equipped with a one-way valve to prevent the gas in the pipeline from flowing back.

5. The temperature-controlled gas heating system according to claim 2, characterized in that: The control component is also connected to the heating component and is used to control the heating temperature of the heating component.

6. The temperature-controlled gas heating system according to claim 5, characterized in that: The heating component comprises a heating rod, an outer wall of the heating rod is provided with a temperature switch, and the temperature switch is connected to the control component.

7. The temperature-controlled gas heating system according to claim 6, characterized in that: The cavity comprises an air inlet end and an air outlet end. The air outlet end is provided with a temperature sensor for detecting the temperature of the gas. The temperature sensor is connected to the control component.

8. The temperature-controlled gas heating system according to claim 7, characterized in that: The control circuit of the heating component is connected to the control component via an aviation plug.

9. The temperature-controlled gas heating system according to claim 7, characterized in that: The temperature sensor comprises a detection end and a fixed end. The detection end is placed inside the cavity, and the fixed end is locked on the outer wall of the cavity through a ferrule joint.

10. A semiconductor manufacturing equipment, characterized in that: It comprises a temperature-controlled gas heating system as described in any one of claims 1 to 9.

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