Silicon carbide wafer transfer device
By designing a silicon carbide wafer transfer device that includes a lifting guide component and a locking component, the existing technology solves the problems of low silicon carbide wafer transfer efficiency, high risk of falling, and pollution, and achieves efficient, safe, and pollution-free wafer transfer. transfer.
Patent Information
- Application Number
- CN202420271234.9
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-02-04
- Publication Date
- 2025-01-14
- Estimated Expiration
- 2034-02-04
AI Technical Summary
In the prior art, the transfer method of silicon carbide wafers between jams is low, the risk of falling is high, and it is easy to contaminate the wafer surface.
A silicon carbide wafer transfer device including a first platform, a second platform, a lifting guide assembly and a locking assembly is designed. The lifting guide assembly allows the jams on the second platform to be aligned between any slots, and the lock is used to Tightly secures component positions for efficient wafer transfer.
It improves the efficiency of transferring silicon carbide wafers between jams, reduces the risk of wafer falling, and avoids contamination of the wafer surface.
Smart Images
Figure CN222355098U_ABST
Abstract
Description
Technical Field
[0001] The present application relates to the technical field of silicon carbide wafer transfer, and in particular to a silicon carbide wafer transfer device. Background Art
[0002] During the processing of silicon carbide wafers, it is often necessary to replace the plugs of the silicon carbide wafers, which requires transferring the silicon carbide wafers between different plugs.
[0003] At present, the main method for transferring silicon carbide wafers between card slots is to use a film reversing device, that is, to use a film reversing device to transfer silicon carbide wafers one by one according to the card slot positions in the card slots. This method cannot transfer silicon carbide wafers between any card slots. In order to transfer silicon carbide wafers between any card slots, the prior art relies on manual use of a suction pen to transfer silicon carbide wafers. This operation method has the problems of low work efficiency, high risk of wafers falling, and easy contamination of the wafer surface. Utility Model Content
[0004] The purpose of the present application is to provide a silicon carbide wafer transfer device to improve work efficiency, prevent the wafer from falling during the transfer process, and not easily contaminate the wafer surface.
[0005] In order to solve the above technical problems, the present application provides a silicon carbide wafer transfer device, comprising: a first platform, a second platform, a lifting guide assembly, and a locking assembly;
[0006] The lifting guide assembly is arranged on one side of the first platform, the second platform is slidably arranged on the lifting guide assembly, the locking assembly is connected to the second platform, and the locking assembly is used to lock the second platform on the lifting guide assembly;
[0007] The first platform is used to set a first plug at the top, and the second platform is used to set a second plug at the top, the first plug has a first slot for placing a silicon carbide wafer, and the second plug has a second slot for placing a silicon carbide wafer, and the second platform can be lifted and lowered along the lifting guide assembly to align any of the first slots with any of the second slots in the horizontal direction.
[0008] Optionally, the lifting guide assembly includes at least one vertical guide shaft;
[0009] A vertical guide hole is formed on the second platform, and the second platform is sleeved on the guide shaft through the guide hole. The locking assembly is used to lock the second platform on at least one of the guide shafts.
[0010] Optionally, there are three guide shafts;
[0011] The three guide shafts form an isosceles triangle supporting structure.
[0012] Optionally, the locking assembly includes a locking bolt;
[0013] A horizontal locking threaded hole is formed on the side wall of the second platform, and the locking threaded hole is connected to the guide hole. The rod of the locking bolt is threadedly connected in the locking threaded hole, and the tail end face of the locking bolt abuts against the corresponding side wall of the guide shaft to achieve locking.
[0014] Optionally, it also includes: a push piece assembly;
[0015] The pusher assembly is used to push the silicon carbide wafer from the first slot into the second slot aligned with the first slot, or to push the silicon carbide wafer from the second slot into the first slot aligned with the second slot.
[0016] Optionally, the push-piece assembly includes a handle, a push rod, and two clamping plates;
[0017] The two ends of the push rod are defined as a first end and a second end, and the two ends of the splint are defined as a third end and a fourth end. The handle is fixedly connected to the first end of the push rod, and the third ends of the two splints are fixedly connected to the second end of the push rod. The two splints are symmetrically arranged along the cross-section of the push rod passing through the center line.
[0018] Optionally, the third ends of the two clamps are fixed to the end surface of the second end of the push rod, the fourth ends of the two clamps are arranged away from the push rod, and the third ends of the two clamps are spaced apart.
[0019] Optionally, it also includes: a base;
[0020] The first platform and the lifting guide assembly are both arranged on the base 1 .
[0021] Optionally, it also includes: a laser;
[0022] The laser is slidably arranged on the lifting guide assembly, the laser is arranged horizontally, the laser can be lifted and lowered along the lifting guide assembly, and the laser is used to confirm whether any of the first card slots is aligned with any of the second card slots.
[0023] The silicon carbide wafer transfer device provided in the present application slides a second platform on a lifting guide assembly on one side of the first platform and locks it with a locking assembly. The second platform can be lifted and lowered along the lifting guide assembly so that any card slot of the plug on the second platform is aligned with any card slot of the plug on the first platform, thereby realizing the transfer of the silicon carbide wafer between any two card slots of the original plug and the target plug, thereby improving work efficiency, preventing the wafer from falling during the transfer process, and not easily contaminating the wafer surface. BRIEF DESCRIPTION OF THE DRAWINGS
[0024] Figure 1 A schematic diagram of the three-dimensional structure of the silicon carbide wafer transfer device according to the embodiment of the present application after a plug is provided;
[0025] Figure 2 This is a schematic diagram of the structure of the push-piece assembly of the embodiment provided in this application;
[0026] Figure 3 This is a schematic diagram of the structure of the wafer pushing assembly of the embodiment provided in the present application when pushing a silicon carbide wafer.
[0027] The reference numerals in the above drawings are described as follows:
[0028] 1-base; 2-first platform; 3-second platform; 4-locking assembly, 41-locking bolt; 5-lifting guide assembly, 51-first guide shaft, 52-second guide shaft, 53-third guide shaft; 6-push sheet assembly, 61-handle, 62-push rod, 63-clamp; 7-first plug, 71-first slot; 8-second plug, 81-second slot; 9-silicon carbide wafer; 10-laser. DETAILED DESCRIPTION
[0029] In order to enable those skilled in the art to better understand the present application, the present application is further described in detail below in conjunction with the accompanying drawings and specific implementation methods.
[0030] The silicon carbide wafer transfer device provided in the present application is mainly used to solve the technical problems of low work efficiency, high risk of wafer falling, and easy contamination of the wafer surface in the existing manual operation suction pen method of transferring silicon carbide wafers between any card slots.
[0031] Please refer to Figures 1 to 3 , Figure 1 This is a schematic diagram of the three-dimensional structure of the silicon carbide wafer transfer device according to the embodiment of the present application after a plug is provided. Figure 2 This is a schematic diagram of the structure of the push-piece assembly of the embodiment provided in this application. Figure 3 This is a schematic diagram of the structure of the wafer pushing assembly of the embodiment provided in the present application when pushing a silicon carbide wafer.
[0032] In the embodiment of the present application, the silicon carbide wafer transfer device includes a first platform 2, a second platform 3, a lifting guide assembly 5, and a locking assembly 4; the lifting guide assembly 5 is arranged on one side of the first platform 2, the second platform 3 is slidably arranged on the lifting guide assembly 5, the locking assembly 4 is connected to the second platform 3, and the locking assembly 4 is used to lock the second platform 3 on the lifting guide assembly 5; the first platform 2 is used to set a first plug 7 on the top, and the second platform 3 is used to set a second plug 8 on the top, the first plug 7 has a first card slot 71 for placing the silicon carbide wafer, and the second plug 8 has a second card slot 81 for placing the silicon carbide wafer, and the number of the first card slot 71 and the second card slot 81 can be one or more. The second platform 3 can be lifted and lowered along the lifting guide assembly 5 to align any first card slot 71 with any second card slot 81 in the horizontal direction.
[0033] The existing method of transferring silicon carbide wafers using a film flipper requires transferring silicon carbide wafers one by one according to the position of the slots in the plug, and it is impossible to transfer silicon carbide wafers between any slots. Although the manually operated suction pen method can transfer silicon carbide wafers between any slots, the work efficiency is low, the risk of silicon carbide wafers falling is high, and the surface of the silicon carbide wafers is easily contaminated. The silicon carbide wafer transfer device provided in the present application slides a second platform 3 on a lifting guide assembly 5 on one side of the first platform 2 and is locked with a locking assembly 4. The second platform 3 can be lifted and lowered along the lifting guide assembly 5 so that the height of any slot of the second plug 8 on the second platform 3 can be adjusted, and then it can be aligned with any slot of the first plug 7 on the first platform 2. In this way, the silicon carbide wafer can be transferred between any two slots of the first plug 7 and the second plug 8, which not only improves the work efficiency, but also prevents the silicon carbide wafer from falling during the transfer process, and is not easy to contaminate the surface of the silicon carbide wafer.
[0034] In the present application, the lifting guide assembly 5 is used to guide the lifting of the second platform 3 in the vertical direction, which is equivalent to the guide rail for the lifting of the second platform 3, and the locking assembly 4 is used to lock the second platform 3 on the lifting guide assembly 5. When the second platform 3 needs to be lifted, the locking assembly 4 is released, and after the second platform 3 is slid up and down to the required position, the locking assembly 4 is locked to lock the second platform 3 at the required position relative to the lifting guide assembly 5.
[0035] In actual configuration, the lifting guide assembly 5 can be of various structures as long as it can guide the lifting of the second platform 3, and the present application does not impose any limitation on this.
[0036] As an optional solution, the lifting guide assembly 5 includes at least one vertical guide shaft; a vertical guide hole is opened on the second platform 3, and the second platform 3 is mounted on the guide shaft through the guide hole. The locking assembly 4 is used to lock the second platform 3 on at least one guide shaft.
[0037] The number of guide shafts is set according to the requirements, for example, it can be one or more. Figure 1 The three guide shafts in the embodiment shown are the first guide shaft 51, the second guide shaft 52, and the third guide shaft 53. Specifically, the first guide shaft 51 is arranged in the middle of the side of the second platform 3 away from the first platform 2; the second guide shaft 52 and the third guide shaft 53 are arranged on the side of the second platform 3 close to the first platform 2, and are symmetrically arranged about the longitudinal section through the axis of the first guide shaft 51. In this way, the three guide shafts form an isosceles triangle support structure, which can stably support the second platform 3 and the plug thereon.
[0038] As another optional solution, the lifting guide assembly 5 may include at least two vertical slide rails and at least one slider slidably arranged in each slide rail, and the side wall of the second platform 3 is fixedly connected to the slider. In this way, the second platform 3 can slide up and down along the slide rail as the slider slides on the slide rail.
[0039] There are other optional solutions for the structure of the lifting guide assembly 5, which will not be described in detail here.
[0040] It is understandable that the locking assembly 4 may also be of various structures, as long as it can achieve locking of the second platform 3 when needed, and the present application does not impose any limitation on this.
[0041] In the embodiment provided in the present application, the locking assembly 4 includes a locking bolt 41; correspondingly, a horizontally extending locking threaded hole is provided on the side wall of the second platform 3, and the locking threaded hole is connected to the guide hole provided on the second platform 3. The rod of the locking bolt 41 is threadedly connected in the locking threaded hole, and the tail end face of the locking bolt 41 abuts against the side wall of the corresponding guide shaft to achieve locking.
[0042] The number of locking bolts 41 can be set according to demand, and can be set only at the position corresponding to the first guide shaft 51 as shown in this embodiment, or can be set at the position corresponding to each guide shaft.
[0043] When it is necessary to lift the second platform 3, loosen the locking bolt 41 so that the second platform 3 is in a sliding state; when the second platform 3 slides to the required position, tighten the locking bolt 41, and the tail end face of the locking bolt 41 presses against the corresponding guide shaft, thereby locking the second platform 3 on the guide shaft.
[0044] In order to install and support the first platform 2 and the lifting guide assembly 5, the silicon carbide wafer transfer device provided in the embodiment of the present application is further provided with a base 1; the first platform 2 and the lifting guide assembly 5 are both provided on the base 1. Specifically, the first platform 2 is fixed on the base 1, and the first guide shaft 51, the second guide shaft 52, and the third guide shaft 53 are fixed on one side of the first platform 2 on the base 1.
[0045] When the silicon carbide wafer transfer device provided in the present application is in use, the first platform 2 is used to set the first plug 7, and the second platform 3 is used to set the second plug 8. The plug where the silicon carbide wafer 9 to be transferred is defined as the original plug, the slot is the original slot, the plug to be transferred to is the target plug, and the slot is the target slot. The transfer of silicon carbide wafers in the present application is to transfer the silicon carbide wafer 9 in the original slot in the original plug into the target slot in the target plug. When specifically set, any of the first plug 7 and the second plug 8 can be the original plug. When one of the plugs is the original plug, the other plug corresponds to the target plug. The present application does not limit which platform is specifically set to set the original plug and which platform is set to set the target plug. It can be understood that the first slot 71 and the second slot 81 should both be horizontal through slots. When the first plug 7 and the second plug 8 are set, the slot notches should be opposite so that the slots of the two plugs can be aligned during the lifting process of the second platform 3.
[0046] In addition, it should be noted that the first plug 7 and the second plug 8 can be unfixed on the corresponding platform or can be detachably fixed, as long as they can remain stable when the chip is transferred and can be easily removed and replaced with other plugs when the transfer is completed; the distance between the first plug 7 and the second plug 8 should be able to ensure that the silicon carbide chip will not fall during the transfer process.
[0047] In order to efficiently and contaminant-free transfer of silicon carbide wafers between the first plug 7 and the second plug 8, the silicon carbide wafer transfer device provided in the embodiment of the present application is further provided with a pusher assembly 6. The pusher assembly 6 is used to transfer the silicon carbide wafer between the slots of the two plugs, specifically, to push the silicon carbide wafer 9 from the first slot 71 into the second slot 81 aligned with the first slot 71 or to push the silicon carbide wafer 9 from the second slot 81 into the first slot 71 aligned with the second slot 81.
[0048] In actual configuration, the specific structure of the push-piece assembly 6 can be various, as long as it can achieve the above-mentioned push-transfer function, and this application does not impose any limitation on this.
[0049] Please continue to refer to Figure 2 , Figure 3 As an optional solution, the push piece assembly 6 includes a handle 61, a push rod 62, and two clamps 63; the two ends of the push rod 62 are defined as a first end and a second end, the handle 61 is fixedly connected to the first end of the push rod 62, the two ends of the clamps 63 are defined as a third end and a fourth end, the third ends of the two clamps 63 are fixedly connected to the second end of the push rod 62, and the two clamps 63 are symmetrically arranged along the cross-section of the push rod 62 passing through the center line.
[0050] The third ends of the two clamping plates 63 are fixed to the end surface of the second end of the push rod 62, and the fourth ends of the two clamping plates 63 are set away from the push rod 62. The third ends of the two clamping plates 63 have a spacing, so that the two clamping plates 63 and the end surface of the second end of the push rod 62 form a flat bottom V-shaped groove. In this way, when it is necessary to push the silicon carbide wafer 9, the handle 61 is manually held to clamp the silicon carbide wafer 9 to be transferred in the flat bottom V-shaped groove, and the silicon carbide wafer 9 can be pushed against the end surface of the second end of the push rod 62, and then pushed forward, which is easy to operate and pollution-free.
[0051] The shapes of the handle 61 and the push rod 62 can be set according to needs. For example, the handle 61 and the push rod 62 can both be cylindrical, and the two are coaxially arranged for easy processing and manipulation.
[0052] The pusher assembly 6 of the above structure provided in this embodiment has a simple structure, can stably push the silicon carbide wafer 9, and is not likely to damage the silicon carbide wafer 9.
[0053] The push-piece assembly 6 can be arranged on the base 1, or on one side of the first platform 2, and the present application does not limit this. For example, the push-piece assembly 6 can be hung on a hook on one side of the first platform 2, so that it is convenient to take when in use.
[0054] It is understandable that the pusher assembly 6 may also include a driving member, such as a cylinder, and the cylinder is connected to the handle 61, so that the cylinder pushes the push rod 62 to move linearly to push the silicon carbide wafer 9, thereby realizing the automation of wafer pushing. At this time, the position of the pusher assembly 6 can be set as needed. For example, when the original plug is set on the first platform 2 and the target plug is set on the second platform 3, that is, the first plug 7 is the original plug and the second plug 8 is the target plug, in order to transfer the silicon carbide wafer 9 to be transferred in the first plug 7 into the second plug 8, a lifting assembly can be set on the side of the first platform 2 away from the second platform 3, and the pusher assembly 6 is set on the lifting assembly, so that the pusher assembly 6 can be lifted to the height of the silicon carbide wafer 9 to be transferred, and the push rod 62 is aligned with the silicon carbide wafer 9, and the silicon carbide wafer 9 can be automatically pushed by starting the cylinder.
[0055] With respect to the above-mentioned embodiment, in the process of lifting and lowering the second platform 3, in order to confirm whether any second card slot 81 in the second card plug 8 on the second platform 3 is aligned with any first card slot 71 in the first card plug 7 on the first platform 2, the silicon carbide wafer transfer device of the present application is also provided with a laser 10 for confirming whether the two card slots are aligned. Specifically, the laser 10 is slidably arranged on the lifting guide assembly 5, and the laser 10 is horizontally arranged. The laser 10 can be lifted and lowered along the lifting guide assembly 5, and the laser 10 can confirm whether any first card slot 71 is aligned with any second card slot 81. Here, the alignment of the two card slots is to smoothly push the silicon carbide wafer 9 in the original card slot into the target card slot, and the judgment standard for whether the alignment is in place can be whether the bottom surfaces of the two card slots are in the same horizontal plane, or other criteria, for example, whether the top surfaces are in the same horizontal plane.
[0056] The position of the laser 10 can be set as needed. For example, in this embodiment, the laser 10 is slidably set on the first guide shaft 51. The laser 10 is horizontally set and faces the side of the first platform 2. The laser 10 is locked and fixed on the first guide shaft 51 when not in use. It slides up and down when in use, and is locked again when sliding to the position of the original card slot or the target card slot to confirm whether the bottom surface or the top surface of the original card slot and the target card slot are in the same horizontal plane.
[0057] In the embodiment provided in the present application, the first plug 7 is the original plug, the second plug 8 is the target plug, the second plug 8 is arranged between the second guide shaft 52 and the third guide shaft 53 at the top of the second platform 3, the second guide shaft 52 and the third guide shaft 53 can also play a certain positioning role for the second plug 8, the first plug 7 is arranged on the side of the top of the first platform 2 close to the second platform 3, and the card slots of the two plugs are Figure 1 In the left and right directions, the laser 10 emits light toward the two card slots, and it can be determined based on the light whether the bottom surface or top surface of the original card slot and the target card slot are located in the same horizontal plane.
[0058] The specific operation process of transferring the silicon carbide wafer 9 from the original card slot in the first card plug 7 to the target card slot in the second card plug 8 by the silicon carbide wafer transfer device provided in the embodiment of the present application is described in detail below:
[0059] First, the first plug 7 is arranged on the first platform 2, and the second plug 8 is arranged between the second guide shaft 52 and the third guide shaft 53 on the second platform 3. The first card slot 71 in the first plug 7 and the second card slot 81 in the second plug 8 are both Figure 1 Horizontal through slots in the left and right directions;
[0060] Then, loosen the laser 10, and make the laser 10 rise and fall along the first guide shaft 51 until the horizontal light emitted by the laser 10 is on the same horizontal plane as the bottom surface of an original card slot in the first card plug 7, and tighten and fix the laser 10;
[0061] Next, loosen the locking bolt 41 and manually adjust the second platform 3 so that the second platform 3 is lifted and lowered along the three guide shafts, thereby driving the second plug 8 to lift and lower. During the lifting and lowering process of the second platform 3, determine whether the bottom surface of the target card slot in the second plug 8 is located at the same horizontal plane as the bottom surface of the original card slot in the first plug 7 according to the light of the laser 10. If not, continue to adjust the height of the second platform 3 until the target card slot is aligned with the original card slot. At this time, tighten the locking bolt 41 to fix the second platform 3 on the first guide shaft 51.
[0062] Finally, the handle 61 of the push piece assembly 6 is manually held, and the two clamping plates 63 are pushed from the side of the original card slot away from the target card slot. Figure 1 The first plug 7 and the second plug 8 are connected to the slot on the right side of the first plug 7, and the upper and lower sides of one end of the silicon carbide wafer 9 to be transferred are clamped. The handle 61 is pushed, and the push rod 62 is used to push the silicon carbide wafer 9 from the original slot to the left into the target slot, completing the transfer of a silicon carbide wafer between the first plug 7 and the second plug 8. If the silicon carbide wafers in other slots of the first plug 7 need to be transferred to other slots of the second plug 8, the positions of the laser 10 and the second platform 3 are repeatedly adjusted to perform the next round of transfer, so that the transfer of silicon carbide wafers between any two slots of the first plug 7 and the second plug 8 can be realized. In the whole process, the work efficiency of silicon carbide wafer transfer is high, and the silicon carbide wafer is not easy to fall off or be contaminated.
[0063] In addition, if it is necessary to transfer the silicon carbide wafer between the other two plugs, the first plug 7 and the second plug 8 are removed and the other plugs are installed.
[0064] It can be seen that the silicon carbide wafer transfer device provided in the embodiment of the present application can not only realize the transfer of silicon carbide wafers between any two card slots of the original plug and the target plug, but also improve work efficiency, avoid the wafer from falling during the transfer process, and is not easy to contaminate the wafer surface.
[0065] The principles and implementation methods of the present application are described in this article using specific examples. The description of the above embodiments is only used to help understand the device and its core idea of the present application. It should be pointed out that for ordinary technicians in this technical field, without departing from the principles of the present application, several improvements and modifications can be made to the present application, and these improvements and modifications also fall within the scope of protection of the claims of the present application.
Claims
1. A silicon carbide wafer transfer device, characterized in that: include: A first platform (2), a second platform (3), a lifting guide assembly (5), and a locking assembly (4); The lifting guide component (5) is arranged on one side of the first platform (2), the second platform (3) is slidably arranged on the lifting guide component (5), the locking component (4) is connected to the second platform (3), and the locking component (4) is used to lock the second platform (3) on the lifting guide component (5); The first platform (2) is used to set a first plug (7) on the top, and the second platform (3) is used to set a second plug (8) on the top, the first plug (7) has a first slot (71) for placing a silicon carbide wafer, and the second plug (8) has a second slot (81) for placing a silicon carbide wafer, and the second platform (3) can be lifted and lowered along the lifting guide assembly (5) to align any of the first slots (71) with any of the second slots (81) in the horizontal direction.
2. The silicon carbide wafer transfer device according to claim 1, characterized in that: The lifting guide assembly (5) comprises at least one vertical guide shaft; A vertical guide hole is provided on the second platform (3), and the second platform (3) is sleeved on the guide shaft through the guide hole. The locking assembly (4) is used to lock the second platform (3) on at least one of the guide shafts.
3. The silicon carbide wafer transfer device according to claim 2, characterized in that: There are three guide shafts; The three guide shafts form an isosceles triangle supporting structure.
4. The silicon carbide wafer transfer device according to claim 2 or 3, characterized in that: The locking assembly (4) comprises a locking bolt (41); A horizontal locking threaded hole is formed on the side wall of the second platform (3), the locking threaded hole is connected to the guide hole, the rod of the locking bolt (41) is threadedly connected in the locking threaded hole, and the tail end face of the locking bolt (41) abuts against the corresponding side wall of the guide shaft to achieve locking.
5. The silicon carbide wafer transfer device according to any one of claims 1 to 3, characterized in that: Also includes: Push piece assembly (6); The pusher assembly (6) is used to push the silicon carbide wafer (9) from the first slot (71) into the second slot (81) aligned with the first slot (71), or to push the silicon carbide wafer (9) from the second slot (81) into the first slot (71) aligned with the second slot (81).
6. The silicon carbide wafer transfer device according to claim 5, characterized in that: The push piece assembly (6) comprises a handle (61), a push rod (62), and two clamping plates (63); The two ends of the push rod (62) are defined as a first end and a second end, and the two ends of the clamping plate (63) are defined as a third end and a fourth end. The handle (61) is fixedly connected to the first end of the push rod (62), and the third ends of the two clamping plates (63) are fixedly connected to the second end of the push rod (62). The two clamping plates (63) are symmetrically arranged along the cross-section of the center line of the push rod (62).
7. The silicon carbide wafer transfer device according to claim 6, characterized in that: The third ends of the two clamping plates (63) are fixed to the end surface of the second end of the push rod (62), the fourth ends of the two clamping plates (63) are arranged away from the push rod (62), and the third ends of the two clamping plates (63) are spaced apart.
8. The silicon carbide wafer transfer device according to any one of claims 1 to 3, characterized in that: Also includes: Base (1); The first platform (2) and the lifting guide assembly (5) are both arranged on the base (1).
9. The silicon carbide wafer transfer device according to any one of claims 1 to 3, characterized in that: Also included: a laser (10); The laser (10) is slidably arranged on the lifting guide assembly (5); the laser (10) is arranged horizontally; the laser (10) can be lifted and lowered along the lifting guide assembly (5); and the laser (10) is used to confirm whether any of the first card slots (71) and any of the second card slots (81) are aligned.