Clamp for thin-wall semiconductor part

Abstract

The utility model discloses a clamp for a thin-walled semiconductor component, and relates to the technical field of semiconductor components. The device comprises a base, an L-shaped plate is fixedly arranged on the rear side of the top of the base, a rectangular groove is formed in the middle of the L-shaped plate, suction pipes are evenly embedded in the positions, located on the two sides of the rectangular groove, of the surface of the L-shaped plate, and semiconductor parts are placed on the tops of the suction pipes; the limiting block is fixedly arranged on the rear side of the top of the L-shaped plate and used for limiting the front-back position of the semiconductor part; and the centering mechanism is arranged in the rectangular groove. According to the thin-wall type semiconductor part clamping device, the thin-wall type semiconductor part is positioned and fixed through the base, the L-shaped plate, the limiting block, the centering mechanism, the adsorption mechanism and the like, compared with traditional rigid part clamping, the device generates negative pressure adsorption force through the exhaust fan, the semiconductor part is firmly adsorbed to the suction pipe, and the clamping efficiency is improved. The thin-wall type semiconductor part can be effectively fixed, and the thin-wall type semiconductor part cannot be damaged.

Description

Technical Field

[0001] The utility model relates to the technical field of semiconductor component equipment, in particular to a clamp for thin-walled semiconductor components. Background Art

[0002] When processing certain thin-walled semiconductor components, higher precision requirements are placed on the flatness of the processing surface, especially for components made of easily deformed materials such as aluminum (AL6061) and stainless steel (SUS304). Their planar structures are prone to distortion and deformation during processing, making it difficult to meet standard requirements and making clamping more difficult.

[0003] The clamping parts of the thin-walled semiconductor components used in the prior art are mostly made of rigid materials. Although the components can be effectively fixed, they are easily squeezed and damaged during fixation, and cannot be adaptively adjusted according to the specifications of the semiconductor components. The practicality is low. Therefore, we propose a clamp for thin-walled semiconductor components to solve the above problems. Utility Model Content

[0004] In order to achieve the above-mentioned purpose, the utility model specifically adopts the following technical solutions:

[0005] A fixture for thin-walled semiconductor components, comprising:

[0006] A base, wherein an L-shaped plate is fixedly arranged on the top rear side of the base, a rectangular groove is constructed in the middle of the L-shaped plate, straws are evenly embedded on the surface of the L-shaped plate at both sides of the rectangular groove, and the semiconductor components are placed on the top of the straws;

[0007] A limit block, fixedly mounted on the top rear side of the L-shaped plate, for limiting the front and rear positions of semiconductor components;

[0008] A centering mechanism, disposed inside the rectangular groove, for centering the semiconductor component;

[0009] The adsorption mechanism includes a hood embedded in the side plate of the L-shaped plate, an exhaust fan is installed on the back of the L-shaped plate, the air inlet end of the exhaust fan is connected to the hood, rubber hoses are connected at intervals on both sides of the front end of the hood, and the end of the rubber hose away from the hood can be connected to the suction pipe.

[0010] Furthermore, a limiting notch is structured at the bottom of the front end of the limiting block, and the limiting notch is triangular in shape.

[0011] Furthermore, a buffer ring is provided at the upper end of the straw, and the buffer ring is a butyl rubber ring.

[0012] Furthermore, reinforcing rods are fixedly provided between the two sides of the front end of the L-shaped plate and the base.

[0013] Furthermore, the centering mechanism includes a sliding rod fixed between the inner walls of the rectangular groove, and clamps are slidably sleeved on both sides of the surface of the sliding rod. A spring is connected between the clamp and the inner wall of the rectangular groove, and the spring is sleeved on the surface of the sliding rod.

[0014] Furthermore, a connector is provided at one end of the rubber hose away from the wind hood, and the connector is threadedly connected to the suction tube.

[0015] The beneficial effects of the utility model are as follows:

[0016] The utility model realizes the positioning and fixation of thin-walled semiconductor parts through components such as a base, an L-shaped plate, a limit block, a centering mechanism and an adsorption mechanism. Compared with traditional rigid part clamping, the device generates a negative pressure adsorption force through an exhaust fan, and firmly adsorbs the semiconductor parts on the straw, which can not only effectively fix the thin-walled semiconductor parts, but also will not cause damage to them. When in use, the parts are placed on the top of the L-shaped plate, and the thin-walled semiconductor parts can be ensured to be in the center position through the centering mechanism. The rubber hose is connected to the straws at the four corners of the parts, so that semiconductor parts of a certain specification can be effectively fixed. The device is flexible to use, can effectively fix semiconductor parts of different specifications, and improves processing efficiency and processing quality. The device has the advantages of simple manufacture and easy use, can meet the processing needs of thin-walled semiconductor parts, has high practicality, and is worthy of widespread application and promotion. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] Figure 1 It is a three-dimensional structural schematic diagram of the utility model;

[0018] Figure 2 It is another three-dimensional structural schematic diagram of the utility model;

[0019] Figure 3 It is a side schematic diagram of the utility model.

[0020] Figure numerals: 1. base; 2. L-shaped plate; 201. rectangular groove; 3. suction tube; 301. buffer ring; 4. limit block; 401. limit notch; 5. centering mechanism; 501. slide rod; 502. splint; 503. spring; 6. adsorption mechanism; 601. wind hood; 602. exhaust fan; 603. rubber hose; 6031. connector; 7. reinforcing rod. DETAILED DESCRIPTION

[0021] In order to make the purpose, technical solution and advantages of the embodiments of the present utility model clearer, the technical solution in the embodiments of the present utility model will be clearly and completely described below in conjunction with the drawings in the embodiments of the present utility model.

[0022] The present application provides a fixture for thin-walled semiconductor components. The fixture for thin-walled semiconductor components in the prior art mainly uses a rigid material for the clamping part. Although the components can be effectively fixed, the components are easily squeezed and damaged during fixation, and the components cannot be adaptively adjusted according to the specifications of the semiconductor components. The following technical solutions are provided. Figure 1-Figure 3 Make a detailed description:

[0023] A fixture for thin-walled semiconductor components, comprising:

[0024] A base 1, wherein an L-shaped plate 2 is fixedly arranged on the top rear side of the base 1, a rectangular groove 201 is constructed in the middle of the L-shaped plate 2, and straws 3 are evenly embedded on both sides of the rectangular groove 201 on the surface of the L-shaped plate 2, and semiconductor components are placed on the top of the straws 3;

[0025] A limit block 4 is fixedly mounted on the top rear side of the L-shaped plate 2 and is used to limit the front and rear positions of semiconductor components;

[0026] A centering mechanism 5, disposed inside the rectangular groove 201, for centering semiconductor components;

[0027] The adsorption mechanism 6 includes a hood 601 embedded in the side plate of the L-shaped plate 2, an exhaust fan 602 is installed on the back of the L-shaped plate 2, the air inlet end of the exhaust fan 602 is connected to the hood 601, and rubber hoses 603 are connected to both sides of the front end of the hood 601 at intervals, and the end of the rubber hose 603 away from the hood 601 can be connected to the suction tube 3.

[0028] It should be noted that after the thin-walled semiconductor component is fixed, the device mainly performs laser printing operation on its surface.

[0029] Specific steps and principle of use of the fixture for thin-walled semiconductor components:

[0030] In the first step, a thin-walled semiconductor component is placed on the top of the L-shaped plate 2, and one end of the thin-walled semiconductor component is in conflict with the stop block 4. The centering mechanism 5 can ensure that the thin-walled semiconductor component is centered.

[0031] In the second step, the rubber hose 603 is connected to the suction tubes 3 at the four corners of the component, and the exhaust fan 602 is started. The negative pressure adsorption force is generated by the exhaust fan 602 to firmly adsorb the semiconductor component on the suction tube 3, so that the thin-walled semiconductor component can be effectively fixed. Compared with the traditional rigid part clamping, this method will not cause damage to the thin-walled semiconductor component. The device is flexible to use and can effectively fix semiconductor components of different specifications, thereby improving the processing efficiency and processing quality. The device has the advantages of simple manufacture and easy use, and can meet the processing needs of thin-walled semiconductor components.

[0032] like Figure 1 As shown, in some embodiments, the bottom front end of the limit block 4 is constructed with a limit notch 401, and the limit notch 401 is triangular. More specifically, by setting the limit notch 401, it can better adapt to thin-walled semiconductor components of different shapes and sizes, and realize the restriction of their front and rear positions. The triangular design of the limit notch 401 can improve the stability and reliability of the fixture, and ensure that the components will not be offset or moved during the processing.

[0033] like Figure 2 As shown, in some embodiments, a buffer ring 301 is provided at the upper end of the suction tube 3, and the buffer ring 301 is a butyl rubber ring. More specifically, by providing the buffer ring 301, the extrusion damage to thin-walled semiconductor components during the adsorption process can be reduced. The butyl rubber ring has good elasticity and sealing properties, can effectively protect the surface of the components, and ensure the uniform distribution of the adsorption force. At the same time, the butyl rubber ring is easy to replace and maintain, and the buffer rings 301 of different sizes and materials can be selected as needed to adapt to semiconductor components of different specifications.

[0034] like Figure 2 As shown, in some embodiments, reinforcing rods 7 are fixedly provided between the front ends of the L-shaped plate 2 and the base 1. More specifically, by providing the reinforcing rods 7, the overall stability and rigidity of the clamp can be improved, so that it can better withstand vibrations and loads during the processing.

[0035] like Figure 2 As shown, in some embodiments, the centering mechanism 5 includes a sliding rod 501 fixed between the inner walls of the rectangular groove 201, and clamps 502 are slidably sleeved on both sides of the surface of the sliding rod 501. A spring 503 is connected between the clamp 502 and the inner wall of the rectangular groove 201, and the spring 503 is sleeved on the surface of the sliding rod 501. More specifically, by setting up the centering mechanism 5, precise centering and positioning of thin-walled semiconductor components can be achieved. The cooperation of the clamp 502 and the spring 503 can adapt to semiconductor components of different shapes and sizes and achieve fine-tuning of their positions.

[0036] like Figure 3 As shown, in some embodiments, a connector 6031 is provided at one end of the rubber hose 603 away from the wind hood 601, and the connector 6031 is threadedly connected to the suction tube 3. More specifically, this design can conveniently connect and disassemble the rubber hose 603 and the suction tube 3 to achieve adsorption and fixation of semiconductor components of different specifications.

[0037] The above description of the disclosed embodiments enables those skilled in the art to implement or use the present invention. Various modifications to these embodiments will be apparent to those skilled in the art, and the general principles defined herein may be implemented in other embodiments without departing from the spirit or scope of the present invention. Therefore, the present invention will not be limited to the embodiments shown herein, but will conform to the widest scope consistent with the principles and novel features disclosed herein.

Claims

1. A fixture for thin-walled semiconductor components, characterized in that: include: A base (1), wherein an L-shaped plate (2) is fixedly provided on the rear side of the top of the base (1), a rectangular groove (201) is formed in the middle of the L-shaped plate (2), straws (3) are evenly embedded on both sides of the rectangular groove (201) on the surface of the L-shaped plate (2), and semiconductor components are placed on top of the straws (3); A limit block (4) is fixedly mounted on the top rear side of the L-shaped plate (2) and is used to limit the front and rear positions of semiconductor components; A centering mechanism (5), arranged inside the rectangular groove (201) and used for centering semiconductor components; The adsorption mechanism (6) comprises a hood (601) embedded in a side plate of the L-shaped plate (2); an exhaust fan (602) is installed on the back of the L-shaped plate (2); an air inlet end of the exhaust fan (602) is connected to the hood (601); rubber hoses (603) are connected to both sides of the front end of the hood (601) at intervals; and one end of the rubber hose (603) away from the hood (601) can be connected to the suction pipe (3).

2. A fixture for thin-walled semiconductor components according to claim 1, characterized in that: The front bottom of the limiting block (4) is structured with a limiting notch (401), and the limiting notch (401) is in a triangular shape.

3. A fixture for thin-walled semiconductor components according to claim 1, characterized in that: The upper end of the suction tube (3) is provided with a buffer ring (301), and the buffer ring (301) is a butyl rubber ring.

4. A fixture for thin-walled semiconductor components according to claim 1, characterized in that: Reinforcement rods (7) are fixedly provided between the two sides of the front end of the L-shaped plate (2) and the base (1).

5. The fixture for thin-walled semiconductor components according to claim 1, characterized in that: The centering mechanism (5) comprises a sliding rod (501) fixed between the inner side walls of the rectangular groove (201), clamping plates (502) are slidably sleeved on both sides of the surface of the sliding rod (501), a spring (503) is connected between the clamping plates (502) and the inner side walls of the rectangular groove (201), and the spring (503) is sleeved on the surface of the sliding rod (501).

6. A fixture for thin-walled semiconductor components according to claim 1, characterized in that: A connector (6031) is provided at one end of the rubber hose (603) away from the wind shield (601), and the connector (6031) is threadedly connected to the suction pipe (3).

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