Circuit board convenient for wire arrangement

Abstract

The utility model relates to a circuit board convenient for wire arrangement in the circuit board field, which comprises a main board and a wire arrangement board arranged below the main board, the surface of the main board is provided with a conductive wire passing notch, one side of the wire arrangement board close to the wire passing notch is bent to form an arc-shaped bent end, the main board is provided with a connecting notch connected with the bent end, and the connecting notch is connected with the connecting notch. A conductive threading notch is formed in the arc-shaped side face of the bent end, protrusions are arranged on the surface of the wiring board, a wire groove is formed between every two adjacent protrusions, one end of each wire groove extends towards the bent end and is communicated with the corresponding threading notch, and the top of each protrusion is connected with a heat conduction silica gel pad. Connecting wires on the mainboard can penetrate through the wire penetrating notches from the wire passing notches of the mainboard to enter the wire guiding grooves, a channel is provided for distribution of the connecting wires, efficient connecting wire management is achieved, heat on the surface of the mainboard can be rapidly absorbed by arranging the heat conduction silica gel pad, the heat is conducted to the protrusions and dissipated, and the heat dissipation performance and the use stability of the mainboard are improved.

Description

Technical Field

[0001] The utility model relates to the field of circuit boards, in particular to a circuit board which is convenient for wiring. Background Art

[0002] Circuit board, as an important component of electronic equipment, is the basis for realizing circuit connection and function realization. It is widely used in many fields such as computers, communication equipment, home appliances, industrial automation, etc. The basic structure of the circuit board is composed of insulating substrate, conductive circuit and electronic components, among which the conductive circuit is responsible for transmitting current or signal between different components on the board.

[0003] During the manufacturing and use process, wiring of the circuit board is a crucial step. Wiring is not only related to the realization of the circuit board function, but also directly affects the performance and stability of the entire device. Traditional circuit board wiring usually adopts a fixed wiring mode, such as straight line, curve or mesh structure, to connect electronic components with conductive lines by welding or plugging.

[0004] However, the existing circuit boards cannot fix the connecting wires when arranging the wires. The complex distribution of the connecting wires can easily lead to electromagnetic interference and signal attenuation, affecting the performance and stability of the equipment. The connecting wires are easily loosened at the connection with the circuit board, affecting the use of the equipment. In addition, the existing circuit boards are installed in the corresponding areas. The circuit boards will generate heat during use, and the heat generated by its operation is concentrated on the surface of the circuit board and is not easy to dissipate, thereby causing damage to the components on the circuit board, affecting the normal connectivity of the circuit, and being unfavorable for the stable use of the circuit board. Utility Model Content

[0005] The purpose of the utility model is to solve the above defects and provide a circuit board that is easy to arrange wires, so as to solve the technical problems in the above background technology that the circuit board is not easy to distribute and connect the connecting wires, and the heat generated by the circuit board during operation is not easy to transfer and dissipate, thereby affecting the stable use of the circuit board.

[0006] The purpose of the utility model is achieved by the following methods:

[0007] A circuit board for arranging wires conveniently comprises a main board and a wiring board arranged below the main board, wherein a conductive wire-passing slot is provided on the surface of the main board, a side of the wiring board close to the wire-passing slot is bent to form an arc-shaped bent end, a connecting slot connected to the bent end is provided on the main board, a plurality of conductive wire-threading slots are provided on the arc-shaped side of the bent end, a plurality of protrusions are provided on the surface of the wiring board, a wire groove is formed between two adjacent protrusions, one end of the wire groove extends toward the bent end and is connected to the wire-threading slot, and a thermally conductive silicone pad is connected to the top of the protrusion.

[0008] Further in the above description, the protrusion extends toward the top, and one end of the protrusion contacts the surface of the bent end, and the top of the protrusion contacts the thermally conductive silicone pad to form a plurality of heat dissipation fins. Through the abutment between the thermally conductive silicone pad and the protrusion, the thermally conductive silicone pad absorbs the heat generated by the operation of the motherboard and transfers it to the protrusion. Heat dissipation fins are formed by a plurality of protrusions distributed at intervals, thereby increasing the contact area with the air and improving the heat dissipation efficiency of the motherboard.

[0009] Further in the above description, a connection platform is formed on the surface of the bent end, and a plurality of connection holes matching with the connection slots are opened on the connection platform. The connection holes are arranged to facilitate installation and connection with the connection slots, so that the cable plate can be connected to the bottom of the motherboard, thereby improving the structure and appearance of the cable distribution and reducing the entanglement of the connection wires of the motherboard.

[0010] Further in the above description, the threading slots are distributed in an array with equal spacing along the surface of the bending end, and the protrusions are distributed in an array with equal spacing along the surface of the wiring board. The provision of the threading slots can space the connecting wires of the mainboard and have a certain fixing effect, thereby preventing the connecting wires from piling up and entanglement.

[0011] Further in the above description, the thermally conductive silicone pad is arranged between the mainboard and the cable plate, and the upper surface of the thermally conductive silicone pad is in contact with the lower surface of the mainboard. The arranged thermally conductive silicone pad can enhance the thermal conductivity and heat dissipation effect of the mainboard and prevent heat accumulation on the mainboard.

[0012] Further in the above description, the four corners of the motherboard are connected with mounting columns, the surfaces of the mounting columns are provided with conductive mounting holes, and the height of the mounting columns is greater than the height of the wiring board. The mounting columns are used to form a gap between the lower surface of the motherboard and the connection, thereby improving the contact with the air and enhancing the heat dissipation effect on the motherboard.

[0013] The beneficial effects of the utility model are as follows: the wire-passing slot design on the mainboard allows the cables to pass through the mainboard conveniently, reducing the clutter and interference of the cables; at the same time, the bent end below the cable tray is designed in an arc shape, and a wire-threading slot is provided on the surface of the bent end, so that the connecting wires on the mainboard can pass through the wire-passing slot of the mainboard through the wire-threading slot, providing a channel for the distribution of the connecting wires; the arc-shaped bent end is provided to guide the bending of the connecting wires, making the arrangement of the connecting wires more neat and beautiful, so that the connecting wires pass through the wire-threading slot into the wire groove, realizing efficient management of the connecting wires; the design of the thermal conductive silicone pad allows the heat generated by the mainboard during operation to be quickly absorbed and conducted to the protrusion and dissipated, thereby improving the heat dissipation performance and stability of use of the mainboard; and the thermal conductive silicone pad is located between the mainboard and the cable tray, reducing the friction between the connecting wires and the circuit board. BRIEF DESCRIPTION OF THE DRAWINGS

[0014] Figure 1 It is a three-dimensional diagram of the first direction of this embodiment;

[0015] Figure 2 It is a three-dimensional diagram of the second direction of this embodiment;

[0016] Figure 3 This is a schematic diagram of the structure of the first direction of this embodiment;

[0017] Figure 4 It is a structural schematic diagram of the second direction of this embodiment;

[0018] The reference numerals in the figure are: 1-mainboard, 2-cable plate, 3-wire passing slot, 4-bending end, 5-connection slot, 6-threading slot, 7-bump, 8-wire slot, 9-thermal conductive silicone pad, 10-connection platform, 11-connection hole, 12-mounting column, 13-mounting hole. DETAILED DESCRIPTION

[0019] The present invention is further described in detail below in conjunction with the accompanying drawings and specific implementation methods.

[0020] In this embodiment, refer to Figure 1-Figure 4 A circuit board for arranging wires is specifically implemented, comprising a mainboard 1 and a wiring board 2 arranged below the mainboard 1, wherein a conductive wire-passing slot 3 is provided on the surface of the mainboard 1, and a curved bending end 4 is formed by bending on one side of the wiring board 2 close to the wire-passing slot 3, a connecting slot 5 connected to the bending end 4 is provided on the mainboard 1, and a conductive threading slot 6 is provided on the curved side of the bending end 4, a protrusion 7 is provided on the surface of the wiring board 2, and a wire groove 8 is formed between two adjacent protrusions 7, one end of the wire groove 8 extends toward the bending end 4 and is connected to the threading slot 6, and a thermal conductive silicone pad 9 is connected to the top of the protrusion 7.

[0021] The protrusion 7 extends toward the top, and one end of the protrusion 7 contacts the surface of the bent end 4. The top of the protrusion 7 contacts the thermally conductive silicone pad 9 to form a heat dissipation fin. The thermally conductive silicone pad 9 abuts against the protrusion 7, so that the thermally conductive silicone pad 9 absorbs the heat generated by the operation of the motherboard 1 and transfers it to the protrusion 7. The protrusions 7 are arranged at intervals to form heat dissipation fins, which increase the contact area with the air and improve the heat dissipation efficiency of the motherboard 1. The threading notches 6 are arranged in an array with equal spacing along the surface of the bent end 4, and the protrusions 7 are arranged in an array with equal spacing along the surface of the wiring board 2. The threading notches 6 can be arranged to distribute the connecting wires of the motherboard 1 at intervals, which has a certain fixing effect, thereby preventing the accumulation and entanglement of the connecting wires.

[0022] A connection platform 10 is formed on the surface of the bent end 4, and a connection hole 11 matching the connection slot 5 is opened on the connection platform 10. The connection hole 11 is set to facilitate installation and connection with the connection slot 5, so that the cable plate 2 can be connected to the bottom of the motherboard 1, thereby improving the structure and appearance of the cable distribution and reducing the entanglement of the connection wires of the motherboard 1.

[0023] The thermal conductive silicone pad 9 is arranged between the mainboard 1 and the cable board 2, and the upper surface of the thermal conductive silicone pad 9 contacts the lower surface of the mainboard 1. The thermal conductive silicone pad 9 can enhance the heat conduction and heat dissipation effect of the mainboard 1 and prevent heat accumulation on the mainboard 1.

[0024] The four corners of the mainboard 1 are connected with mounting posts 12, and the surfaces of the mounting posts 12 are provided with conducting mounting holes 13, and the height of the mounting posts 12 is greater than the height of the wiring board 2. The mounting posts 12 form a gap between the lower surface of the mainboard 1 and the connection, thereby improving the contact with the air and enhancing the heat dissipation effect on the mainboard 1.

[0025] The specific use process of this embodiment is: place the cable board 2 under the mainboard 1, and fix it through the connection notch 5 on the mainboard 1 and the connection hole 11 of the connection platform 10 of the bending end 4, so that the thermal conductive silicone pad 9 is arranged between the cable board 2 and the mainboard 1, the upper surface of the thermal conductive silicone pad 9 contacts the lower surface of the mainboard 1, and the lower surface of the thermal conductive silicone pad 9 contacts the top of the protrusion 7, so that the heat generated by the mainboard 1 during operation can be quickly absorbed and conducted to the protrusion 7 and dissipated, thereby improving the heat dissipation performance and stability of the mainboard 1. The connecting wires on the mainboard 1 pass through the wire notch 3 and enter the threading notch 6 of the bending end 4, and extend to the wire groove 8, thereby providing a channel for the connection wires on the mainboard 1 to be distributed, and the arc-shaped bending end 4 is provided to guide the bending of the connecting wires, so that the connection wires are arranged more neatly and beautifully, so that the connecting wires can be stored, and efficient connection wire management is achieved.

[0026] The above is only a preferred embodiment of the utility model, and does not limit the utility model in any form. Although the utility model is disclosed as a preferred embodiment as above, it is not used to limit the utility model. Any technician familiar with this profession can make some changes or modifications to equivalent embodiments of equivalent changes by using the technical content disclosed above without departing from the scope of the technical solution of the utility model. However, any simple modification, equivalent change and modification made to the above embodiments according to the technology of the utility model, which does not depart from the content of the technical solution of the utility model, belongs to the scope of the technical solution of the utility model.

Claims

1. A circuit board for arranging wires, comprising a main board and a wiring board arranged below the main board, characterized in that: A conductive wire-passing slot is provided on the surface of the mainboard, a side of the wiring board close to the wire-passing slot is bent to form an arc-shaped bent end, a connecting slot connected to the bent end is provided on the mainboard, a plurality of conductive wire-threading slots are provided on the arc-shaped side of the bent end, a plurality of protrusions are provided on the surface of the wiring board, a wire groove is formed between two adjacent protrusions, one end of the wire groove extends toward the bent end and is connected to the wire-threading slot, and a thermal conductive silicone pad is connected to the top of the protrusion.

2. A circuit board for arranging wires according to claim 1, characterized in that: The protrusion extends toward the top, and one end of the protrusion contacts the surface of the bent end, and the top of the protrusion contacts the thermal conductive silicone pad to form a plurality of heat dissipation fins.

3. A circuit board for arranging wires according to claim 1, characterized in that: A connection platform is formed on the surface of the bent end, and a plurality of connection holes matched with the connection notches are provided on the connection platform.

4. A circuit board for arranging wires according to claim 1, characterized in that: The threading notches are distributed in an array with equal spacing along the surface of the bent end, and the protrusions are distributed in an array with equal spacing along the surface of the wiring board.

5. A circuit board for arranging cables according to any one of claims 1 to 4, characterized in that: The thermally conductive silicone pad is arranged between the mainboard and the wiring board, and the upper surface of the thermally conductive silicone pad contacts the lower surface of the mainboard.

6. A circuit board for arranging cables according to any one of claims 1 to 4, characterized in that: The four corners of the mainboard are connected with mounting columns, the surfaces of the mounting columns are provided with conducting mounting holes, and the height of the mounting columns is greater than the height of the wiring board.

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