Gluing machine for wafer

Abstract

The utility model discloses a gluing machine for wafers, which relates to the field of wafer processing and comprises a transverse plate, a driving component is mounted at the lower end of the transverse plate, an L-shaped plate is mounted on the left portion of the upper end of the transverse plate, a rotatable hollow cylinder is arranged in the middle of the upper end of the transverse plate, and a drying component is mounted on the right portion of the upper end of the L-shaped plate. And three second electric cylinders distributed in an annular array mode are installed on the lower inner wall of the hollow cylinder, first motors are installed at the output ends of the second electric cylinders correspondingly, suction cups are installed at the output ends of the three first motors correspondingly, the outer surface of the hollow cylinder is movably sleeved with a guide ring, and the guide ring is installed on the transverse plate. According to the utility model, the driving part, the second electric cylinder, the first motor and the suction cup are matched together, so that the working efficiency can be improved, the wafer can be conveniently and continuously glued, the time waste is reduced, and the productivity is improved.

Description

Technical Field

[0001] The utility model relates to the field of wafer processing, in particular to a glue coating machine for wafers. Background Art

[0002] A wafer refers to a silicon chip used to make silicon semiconductor circuits. Its original material is silicon; high-purity polycrystalline silicon is dissolved and doped with silicon crystal seeds, and then slowly pulled out to form a cylindrical single crystal silicon; the silicon crystal rod is ground, polished, and sliced ​​to form a silicon wafer, that is, a wafer. The wafer coater is a key equipment in semiconductor manufacturing, which is used to evenly coat the surface of the wafer with photoresist in preparation for the photolithography process.

[0003] The prior art (publication number: CN 220020096 U) discloses a wafer cover and a glue coating machine, which relates to the field of wafer glue coating technology. The wafer cover includes a cover body and an anti-sticking material layer or an easy-tear film, and a processing space is provided in the cover body, and the processing space is used to accommodate a suction cup structure with a wafer adsorbed. The anti-sticking material layer is arranged on the inner wall of the cover body, and the anti-sticking material layer is made of an anti-sticking material or the easy-tear film is attached to the inner wall of the cover body.

[0004] Although the above patent can improve the technical problem in the prior art that the inner side of the wafer cover is easily adhered to photoresist and difficult to clean, it has the following disadvantages: when the wafer is coated with glue, other operation steps cannot be carried out, and it is necessary to wait until the wafer coating is completed before the next operation can be carried out, which easily causes a waste of time. It takes a certain amount of time to load and unload the wafer, which cannot be completed when the wafer is coated with glue, affecting work efficiency and requiring further improvement. For this reason, we propose a glue coating machine for wafers. Utility Model Content

[0005] The main purpose of the utility model is to provide a glue coating machine for wafers, which can effectively solve the problems in the background technology.

[0006] In order to achieve the above purpose, the technical solution adopted by the utility model is:

[0007] A glue coating machine for wafers comprises a horizontal plate, a driving component is installed at the lower end of the horizontal plate, an L-shaped plate is installed at the left upper end of the horizontal plate, a rotatable hollow cylinder is provided in the middle of the upper end of the horizontal plate, a drying component is installed at the right upper end of the L-shaped plate, three second electric cylinders distributed in a circular array are installed on the lower inner wall of the hollow cylinder, first motors are installed at the output ends of the second electric cylinders, suction cups are installed at the output ends of the three first motors, a guide ring is movably sleeved on the outer surface of the hollow cylinder, and the guide ring is installed on the horizontal plate.

[0008] Preferably, the driving component includes an L-shaped frame, which is installed at the lower end of the horizontal plate, and a second motor is installed on the L-shaped frame. The output end of the second motor is transmission-connected to the first gear, the first gear is meshingly connected to the second gear, and the internal fixed sleeve of the second gear is provided with a connecting shaft.

[0009] Preferably, the upper end of the connecting shaft movably passes through the upper end of the transverse plate and is fixedly connected to the lower end of the hollow cylinder.

[0010] Preferably, the drying component includes a third electric cylinder, which is installed on the upper right part of the L-shaped plate, and the output end of the third electric cylinder movably passes through the upper wall of the L-shaped plate and is fixedly connected to a disc, a reflective plate is installed at the lower end of the disc, and a plurality of heating lamps are installed at the lower end of the reflective plate.

[0011] Preferably, a first electric cylinder is installed on the left upper end of the L-shaped plate, and an output end of the first electric cylinder movably penetrates the upper wall of the L-shaped plate and is fixedly connected to a glue coating head, and the glue coating head is located above the left suction cup.

[0012] Preferably, the heating lamp is located above the rear suction cup.

[0013] Preferably, a baffle is installed on the lower inner wall of the hollow cylinder.

[0014] Compared with the prior art, the utility model has the following beneficial effects:

[0015] 1. By setting the driving component, the second electric cylinder, the first motor and the suction cup to cooperate with each other, the working efficiency can be improved. When the wafer on the left side is coated with glue, the wafer is placed above the suction cup on the front side by the manipulator, and then the output end of the second electric cylinder on the front side is controlled to reset. After waiting for the processing to be completed, the second motor is controlled to drive the first gear to rotate, and the first gear drives the second gear to rotate. The second gear drives the hollow cylinder to rotate 120 degrees through the connecting shaft, so that the unprocessed wafer is rotated to the bottom of the glue coating head for glue coating, and the wafer with glue coating is rotated to the back side for the next operation. At the same time, the manipulator is controlled again to place the unprocessed wafer on the top of the suction cup on the front side, and after waiting for the glue coating to be completed, the driving component is controlled again to drive the hollow cylinder to rotate 120 degrees, so that the unprocessed wafer is rotated to the bottom of the glue coating head for glue coating, and the wafer with glue coating is rotated to the back side for the next operation. The processed wafer moves to the front side, and the manipulator is used to unload and reload, so that the wafer can be continuously coated with glue, which reduces the waste of time and improves the production capacity.

[0016] 2. By setting up a drying component, the wafer after glue coating can be dried. When in use, the output end of the third electric cylinder is controlled to drive the disc and the heating lamp to move downward, so that the heating lamp is close to the wafer to dry the photoresist, ensuring its rapid solidification and hardening, while ensuring the flatness and quality of the wafer surface, thereby improving production efficiency. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] Figure 1 It is a schematic diagram of the entire structure proposed in this embodiment;

[0018] Figure 2 Schematic diagram of the internal structure of the hollow cylinder in this embodiment;

[0019] Figure 3 Schematic diagram of the structure of the driving component in this embodiment;

[0020] Figure 4 Schematic diagram of the structure of the drying component in this embodiment.

[0021] In the figure: 1. horizontal plate; 2. driving component; 3. L-shaped plate; 4. glue coating head; 5. first electric cylinder; 6. drying component; 7. hollow cylinder; 8. guide ring; 9. baffle; 10. second electric cylinder; 11. first motor; 12. suction cup; 21. L-shaped frame; 22. second motor; 23. first gear; 24. second gear; 25. connecting shaft; 61. third electric cylinder; 62. disc; 63. reflective plate; 64. heating lamp. DETAILED DESCRIPTION

[0022] In order to make the technical means, creative features, objectives and effects achieved by the present invention easy to understand, the present invention is further described below in conjunction with specific implementation methods.

[0023] In the description of the present invention, it should be noted that the terms "upper", "lower", "inner", "outer", "front end", "rear end", "two ends", "one end", "the other end" and the like indicate positions or positional relationships based on the positions or positional relationships shown in the drawings, and are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operate in a specific orientation, and therefore cannot be understood as a limitation on the present invention. In addition, the terms "first" and "second" are used for descriptive purposes only and cannot be understood as indicating or implying relative importance.

[0024] In the description of the present invention, it should be noted that, unless otherwise clearly specified and limited, the terms "installed", "provided with", "connected", etc. should be understood in a broad sense. For example, "connected" can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection, or it can be an indirect connection through an intermediate medium, or it can be the internal communication of two components. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0025] like Figure 1-Figure 4 As shown, a glue coating machine for wafers comprises a transverse plate 1, a driving component 2 is installed at the lower end of the transverse plate 1, an L-shaped plate 3 is installed at the left upper end of the transverse plate 1, and the L-shaped plate 3 is detachably connected to the L-shaped plate 3 through a screw, a rotatable hollow cylinder 7 is arranged in the middle of the upper end of the transverse plate 1, a drying component 6 is installed at the upper right end of the L-shaped plate 3, three second electric cylinders 10 distributed in a circular array are installed on the lower inner wall of the hollow cylinder 7, the output ends of the second electric cylinders 10 are all installed with first motors 11, and the output ends of the three first motors 11 are all installed with suction cups 12, the outer surface of the hollow cylinder 7 is movably sleeved with a guide ring 8, the guide ring 8 is installed on the transverse plate 1, and the guide ring 8 is detachably connected to the transverse plate 1 through a screw, and the guide ring 8 is used to improve the rotation stability of the hollow cylinder 7, the front suction cup 12 is a processing station, the left suction cup 12 is a processing station, and the rear suction cup 12 is a drying station.

[0026] The driving component 2 is used to drive the hollow cylinder 7 to rotate, and the specific structure is: the driving component 2 includes an L-shaped frame 21, the L-shaped frame 21 is installed at the lower end of the horizontal plate 1, the L-shaped frame 21 is detachably connected to the horizontal plate 1 through a screw, a second motor 22 is installed on the L-shaped frame 21, the second motor 22 is detachably connected to the L-shaped frame 21 through a screw, the output end of the second motor 22 is transmission-connected with a first gear 23, the first gear 23 is fixedly connected to the output end of the second motor 22 through a sleeve, the first gear 23 is meshingly connected with a second gear 24, and the internal fixed sleeve of the second gear 24 is provided with a connecting shaft 25. When in use, the second motor 22 is controlled to drive the first gear 23 to rotate, the first gear 23 drives the second gear 24 to rotate, and the second gear 24 drives the hollow cylinder 7 to rotate one hundred and twenty degrees through the connecting shaft 25.

[0027] In order to drive the hollow cylinder 7 to rotate, the upper end of the connecting shaft 25 movably passes through the upper end of the transverse plate 1 and is fixedly connected to the lower end of the hollow cylinder 7 .

[0028] In order to ensure the rapid solidification and hardening of the photoresist, while ensuring the flatness and quality of the wafer surface, thereby improving production efficiency, the wafer after being coated with glue can be dried by the drying component 6. The drying component 6 includes a third electric cylinder 61, which is installed on the upper right part of the L-shaped plate 3. The third electric cylinder 61 is detachably connected to the L-shaped plate 3 by bolts. The output end of the third electric cylinder 61 movably penetrates the upper wall of the L-shaped plate 3 and is fixedly connected to a disc 62. A reflecting plate 63 is installed at the lower end of the disc 62. The reflecting plate 63 is used to reflect the light source of the heating lamp 64 to improve the drying efficiency. A number of heating lamps 64 are installed at the lower end of the reflecting plate 63. The heating lamp 64 is located above the rear suction cup 12. When in use, the output end of the third electric cylinder 61 is controlled to drive the disc 62 and the heating lamp 64 to move downward, so that the heating lamp 64 is close to the wafer to dry the photoresist.

[0029] Furthermore, a first electric cylinder 5 is installed on the left upper end of the L-shaped plate 3. The first electric cylinder 5 is detachably connected to the L-shaped plate 3 by bolts. The output end of the first electric cylinder 5 movably passes through the upper wall of the L-shaped plate 3 and is fixedly connected to a glue coating head 4. The glue coating head 4 is located above the left suction cup 12. The glue coating head 4 is used to transport glue to the wafer.

[0030] A baffle 9 is installed on the lower inner wall of the hollow cylinder 7. The baffle 9 is welded inside the hollow cylinder 7. The baffle 9 is in a herringbone shape and is used to prevent glue from being thrown onto wafers at different workstations.

[0031] The glue coating machine for wafers proposed by the utility model connects the glue coating head 4 with the photoresist pipeline. When the wafer on the left side needs to be coated with glue, the output end of the first electric cylinder 5 is controlled to drive the glue coating head 4 to move downward, so that the glue coating head 4 coats the glue on the surface of the wafer. When coating, the first motor 11 on the left side is controlled to drive the suction cup 12 on the left side to rotate, so that the glue is evenly coated on the wafer. At the same time, the second electric cylinder 10 on the front side is controlled to drive the suction cup 12 on the front side to move downward, so that the suction cup 12 is higher than the cross section of the hollow cylinder 7. The wafer is placed above the suction cup 12 on the front side by a manipulator, and then the output end of the second electric cylinder 10 on the front side is controlled to reset. After waiting for the processing to be completed, the output end of the first electric cylinder 5 is controlled to reset, and the second motor 22 is controlled to drive the first gear 23 to rotate, and the first gear 23 drives the second gear 24 to rotate. The second gear 24 drives the hollow cylinder 7 to rotate 120 degrees through the connecting shaft 25, so that the unprocessed wafers rotate to the bottom of the glue coating head 4 for glue coating, and the wafers that have been glued rotate to the back side for drying. At the same time, the robot is controlled again to place the unprocessed wafers on the top of the front suction cup 12. After waiting for the glue coating to be completed, the driving component 2 is controlled again to drive the hollow cylinder 7 to rotate 120 degrees, so that the unprocessed wafers rotate to the bottom of the glue coating head 4 for glue coating, and the wafers that have been glued rotate to the back side for the next operation. The processed wafers move to the front side, and the robot is used to unload and reload them, so that the wafers can be continuously coated with glue. During drying, the output end of the third electric cylinder 61 is controlled to drive the disc 62 and the heating lamp 64 to move downward, so that the heating lamp 64 is close to the wafer to dry the photoresist.

[0032] It is worth noting that the entire device is connected to a power supply and a main control button, and it is controlled by the main control button. Since the device matched with the control button is a common device and belongs to the existing mature technology, its electrical connection relationship and specific circuit structure will not be described here.

[0033] The above shows and describes the basic principle and main features of the utility model and the advantages of the utility model. Those skilled in the art should understand that the utility model is not limited by the above embodiments. The above embodiments and descriptions are only for explaining the principle of the utility model. Without departing from the spirit and scope of the utility model, the utility model may have various changes and improvements, which fall within the scope of the utility model to be protected. The scope of protection claimed by the utility model is defined by the attached claims and their equivalents.

Claims

1. A glue coating machine for wafers, comprising a horizontal plate (1), characterized in that: A driving component (2) is installed at the lower end of the transverse plate (1), an L-shaped plate (3) is installed at the left upper end of the transverse plate (1), a rotatable hollow cylinder (7) is arranged at the middle of the upper end of the transverse plate (1), a drying component (6) is installed at the right upper end of the L-shaped plate (3), three second electric cylinders (10) distributed in a circular array are installed on the lower inner wall of the hollow cylinder (7), the output ends of the second electric cylinders (10) are all installed with first motors (11), and the output ends of the three first motors (11) are all installed with suction cups (12), and the outer surface of the hollow cylinder (7) is movably sleeved with a guide ring (8), and the guide ring (8) is installed on the transverse plate (1).

2. The wafer glue coating machine according to claim 1, characterized in that: The driving component (2) comprises an L-shaped frame (21), the L-shaped frame (21) being mounted at the lower end of the horizontal plate (1), a second motor (22) being mounted on the L-shaped frame (21), an output end of the second motor (22) being transmission-connected to a first gear (23), the first gear (23) being meshingly connected to a second gear (24), and a connecting shaft (25) being fixedly sleeved inside the second gear (24).

3. The adhesive coating machine for wafers according to claim 2, characterized in that: The upper end of the connecting shaft (25) movably passes through the upper end of the transverse plate (1) and is fixedly connected to the lower end of the hollow cylinder (7).

4. The adhesive coating machine for wafers according to claim 1, characterized in that: The drying component (6) comprises a third electric cylinder (61), the third electric cylinder (61) being mounted on the upper right portion of the L-shaped plate (3), the output end of the third electric cylinder (61) movably passing through the upper wall of the L-shaped plate (3) and being fixedly connected to a disc (62), the lower end of the disc (62) being mounted with a reflective plate (63), and the lower end of the reflective plate (63) being mounted with a plurality of heating lamps (64).

5. The adhesive coating machine for wafers according to claim 1, characterized in that: A first electric cylinder (5) is installed on the left upper end of the L-shaped plate (3); an output end of the first electric cylinder (5) movably penetrates the upper wall of the L-shaped plate (3) and is fixedly connected to a glue coating head (4); the glue coating head (4) is located above the left suction cup (12).

6. The adhesive coating machine for wafers according to claim 4, characterized in that: The heating lamp (64) is located above the rear suction cup (12).

7. The adhesive coating machine for wafers according to claim 1, characterized in that: A baffle (9) is installed on the lower inner wall of the hollow cylinder (7).

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