Soldering flux smearing device

Abstract

The utility model provides a soldering flux smearing device which comprises a base and a first liquid storage part arranged on the base, soldering flux is contained in the first liquid storage part, and a plurality of first notches and a plurality of second notches are correspondingly formed in the first end and the second end, in the first horizontal direction, of the first liquid storage part. The plurality of first notches and the plurality of second notches are arranged at intervals along the second horizontal direction; and each welding strip enters the first liquid storage part from one first notch and then is led out to the next procedure through the corresponding second notch, and the liquid level of the scaling powder in the first liquid storage part is higher than the height of the welding strip passing through the first liquid storage part, so that the welding strip is automatically smeared with the scaling powder after passing through the first liquid storage part. According to the soldering flux smearing device, soldering flux is automatically smeared on the solder strip, meanwhile, when the soldering flux is smeared on the solder strip, only traction force in the first horizontal direction is applied to the solder strip, the occurrence of pulling deformation of the solder strip when the soldering flux is smeared is greatly reduced, and the quality of the solder strip is guaranteed.

Description

Technical Field

[0001] The present application belongs to the technical field of photovoltaic cell production, and in particular, relates to a flux coating device. Background Art

[0002] When the cells are produced in strings, soldering tape is often needed. Before being stringed together, the soldering tape needs to be coated with flux to remove the oxide layer and dirt on the surface of the soldering tape to improve the final welding effect.

[0003] The existing flux coating device is usually equipped with several rollers immersed in the flux liquid surface. The solder strip passes over the rollers and is immersed in the flux before being pulled to the back-end station. When pulling the solder strip, several rollers will form a high reaction force, which can easily pull and deform the solder strip, affecting the quality of the solder strip. Utility Model Content

[0004] The purpose of the present application is to provide a soldering flux coating device to solve the problem in the prior art that the soldering flux coating device easily pulls and deforms the soldering ribbon.

[0005] To achieve this goal, this application adopts the following technical solutions:

[0006] The present application provides a soldering flux coating device, which comprises a base and a first liquid storage part, wherein:

[0007] The first liquid storage part is arranged on the base, the first liquid storage part contains soldering flux, a first end of the first liquid storage part along the first horizontal direction is provided with a plurality of first notches, a second end of the first liquid storage part along the first horizontal direction is provided with a plurality of second notches, the plurality of first notches and the plurality of second notches are arranged at intervals along the second horizontal direction, and the plurality of first notches correspond to the plurality of second notches one by one;

[0008] Each soldering ribbon enters the first liquid storage part through a first notch and is led out to the subsequent process through the corresponding second notch. The liquid level of the flux in the first liquid storage part is higher than the height of the soldering ribbon passing through the first liquid storage part, so that the soldering ribbon is automatically coated with flux after passing through the first liquid storage part, and the first horizontal direction is perpendicular to the second horizontal direction.

[0009] The flux coating device proposed in the present application is configured with a plurality of notches at the two ends of the first liquid storage section along the first horizontal direction, and the liquid level of the flux in the first liquid storage section is higher than the height of the solder strip passing through the first liquid storage section, so that the solder strip can be completely immersed below the liquid level of the flux in the first liquid storage section, and automatic coating of the flux is achieved when the solder strip passes through the first liquid storage section along the first horizontal direction; compared with the existing method of coating the flux by passing the solder strip around a roller immersed in the liquid level of the flux, the solder strip is only subjected to traction along the first horizontal direction when coating the flux, which greatly reduces the occurrence of pulling and deformation of the solder strip when coating the flux, thereby ensuring the quality of the solder strip and further ensuring the subsequent serial connection effect.

[0010] Optionally, the flux coating device also includes a second liquid storage part and a circulation pump arranged on the base, the first liquid storage part is arranged above the second liquid storage part or accommodated in the second liquid storage part, the second liquid storage part is used to receive the flux overflowing from the first notch and the second notch, the liquid inlet of the circulation pump is connected to the second liquid storage part, the liquid outlet of the circulation pump is connected to the first liquid storage part, and the circulation pump is configured to transport the flux in the second liquid storage part to the first liquid storage part.

[0011] By setting up the second liquid storage part, the flux overflowing from the first notch and the second notch can be collected; by setting up the circulation pump, the flux in the second liquid storage part can be automatically transported to the first liquid storage part, thereby realizing automatic circulation of the flux between the first liquid storage part and the second liquid storage part, so that the liquid level of the flux in the first liquid storage part is always higher than the height of the soldering tape passing through the first liquid storage part, thereby ensuring the quality of the flux applied on the soldering tape, with a high degree of automation, high application efficiency, simple structure, easy maintenance and low cost.

[0012] Optionally, the flux applying device further includes at least one guide component, which is disposed on the travel path of the solder strip to guide each solder strip.

[0013] By setting the guide component, each soldering strip can be guided when the soldering strip moves, so as to avoid deviation of each soldering strip when moving, thereby improving the application quality of the flux.

[0014] Optionally, the guide assembly includes a first guide assembly and / or a second guide assembly, wherein:

[0015] The first guide assembly is arranged at the outside of the first end of the first liquid storage part in the first horizontal direction, and the first guide assembly has a plurality of first guide channels for a single solder strip to pass through, and the plurality of first guide channels correspond to the plurality of first notches one by one, and the single solder strip passes through the corresponding first guide channel, the first notch and the second notch to be led out of the subsequent process;

[0016] The second guide assembly is arranged at intervals on the outside of the second end of the first liquid storage part in the first horizontal direction. The second guide assembly has a plurality of second guide channels for a single solder strip to pass through. The plurality of second guide channels correspond one-to-one to the plurality of second notches. The single solder strip passes through the corresponding first notch, second notch and second guide channel to be led out of the subsequent process.

[0017] By setting up the first guide component, it is achieved to guide each solder strip before it enters the first liquid storage section, so as to ensure that the position of each solder strip entering the first liquid storage section will not shift; by setting up the second guide component, it is achieved to guide each solder strip after it is led out of the first liquid storage section, so as to ensure that the position of each solder strip after it is led out of the first liquid storage section and coated with flux will not shift.

[0018] Optionally, the first guide assembly and the second guide assembly each include a guide seat and a plurality of guide posts, wherein:

[0019] A plurality of guide posts are installed on the guide seat at equal intervals along the second horizontal direction, and a first guide channel or a second guide channel is formed between two adjacent guide posts; or,

[0020] A plurality of guide posts are installed in pairs on the guide seat along the second horizontal direction, and a first guide channel or a second guide channel is formed between each pair of guide posts.

[0021] Through the cooperation of the guide seat and a plurality of guide columns, a first guide channel or a second guide channel is formed on the guide seat, providing a first guide assembly and a second guide assembly with a simple structure, low cost and easy maintenance.

[0022] Optionally, a collecting portion is further provided on the base, and the collecting portion is provided on one side of the second liquid storage portion close to the lead-out end of the soldering strip in the first horizontal direction, and the collecting portion is configured to collect flux dripping from the soldering strip passing through the collecting portion.

[0023] By setting up a collecting part, the flux dripping on the soldering ribbon passing through the collecting part can be automatically collected and reused, which reduces the processing cost of the soldering ribbon to a certain extent; at the same time, it can also ensure the cleanliness of the soldering ribbon processing environment in the machine, and prevent the flux dripping on the soldering ribbon from directly dripping onto the soldering ribbon processing equipment.

[0024] Optionally, an opening is provided at the bottom of the collecting portion, and the collecting portion discharges the collected soldering flux into the second liquid storage portion through the opening.

[0025] By arranging an opening on the collecting part, the collecting part is connected with the second liquid storage part, and the soldering flux in the collecting part is automatically discharged into the second liquid storage part, without manual operation, saving soldering flux and reducing production costs.

[0026] Optionally, a shielding member is hinged on the base; when the shielding member is closed, the shielding member covers the first liquid storage portion and the second liquid storage portion, and the shielding member has a channel for the welding strip to pass through between the two ends of the first horizontal direction and the base, and the width of the channel extends along the second horizontal direction.

[0027] By hingedly connecting a shielding piece on the base, the top openings of the first liquid storage section and the second liquid storage section are covered, thereby preventing the volatilized gas of the flux in the first liquid storage section and the second liquid storage section from being directly discharged into the workshop and causing pollution to the workshop, and preventing dirty matter from falling into the first liquid storage section and the second liquid storage section and causing contamination to the welding strip.

[0028] Optionally, a transparent window that can be opened or closed is provided on the shielding member, and when the transparent window is opened, soldering flux can be added to the first liquid storage part and / or the second liquid storage part through the transparent window.

[0029] By providing a transparent window on the shielding member, when adding flux, there is no need to open the entire shielding member, and only the transparent window needs to be opened to add flux to the first liquid storage part and / or the second liquid storage part, which is easy to operate and improves the efficiency of adding flux.

[0030] Optionally, an exhaust pipe is provided on the shielding member, and the exhaust pipe is connected to the exhaust gas pipeline. When the shielding member is closed, the gas volatilized by the flux is introduced into the exhaust gas pipeline through the exhaust pipe.

[0031] By arranging an exhaust pipe on the shielding member, the volatilized gas of the flux can be timely introduced into the exhaust gas pipe and discharged through the exhaust gas pipe, thereby greatly reducing the pollution of the volatilized gas of the flux to the workshop.

[0032] Optionally, a drain port is provided on the second liquid storage portion, and the soldering flux in the second liquid storage portion is discharged through the drain port.

[0033] By arranging a liquid discharge port on the second liquid storage part, the soldering flux that has been circulated for a long time in the second liquid storage part can be quickly discharged, which is convenient for maintenance. BRIEF DESCRIPTION OF THE DRAWINGS

[0034] Figure 1 It is a schematic diagram of the three-dimensional structure of the flux coating device provided in an embodiment of the present application;

[0035] Figure 2 is a schematic diagram of the internal structure of the flux coating device provided in an embodiment of the present application from a first perspective;

[0036] Figure 3 is a schematic diagram of the internal structure of the flux coating device provided in an embodiment of the present application from a second perspective;

[0037] Figure 4It is a schematic diagram of the three-dimensional structure of the first guide component of the flux coating device provided in an embodiment of the present application.

[0038] Figures 1 to 4 The following reference numerals are included:

[0039] Base 10;

[0040] The first liquid storage part 20: a first notch 200 and a second notch 201;

[0041] Welding strip 30;

[0042] A second liquid storage portion 40;

[0043] Circulation pump 50;

[0044] Guide assembly 60: first guide assembly 61, first guide channel 610, guide seat 611, guide column 612;

[0045] Collection unit 70;

[0046] Shielding member 80 : channel 81 , handle 82 , transparent window 83 , exhaust pipe 84 . DETAILED DESCRIPTION

[0047] In order to make the above-mentioned objects, features and advantages of the present application more obvious and easy to understand, the present application is further described in detail below in conjunction with the accompanying drawings and specific implementation methods.

[0048] When the battery cells are produced in strings, soldering tape is often needed. Before being stringed together, the soldering tape needs to be coated with flux to remove the oxide layer and dirt on the surface of the soldering tape.

[0049] The existing flux coating device is usually equipped with several rotatable rollers immersed in the flux liquid surface. The solder strip passes over the rollers and is immersed in the flux before being pulled to the back-end station. When pulling the solder strip, several rollers will form a high reaction force, which can easily pull and deform the solder strip, affecting the quality of the solder strip and further affecting the serial connection effect.

[0050] Therefore, this application proposes a flux coating device, see Figure 1 and Figure 2 As shown, the soldering flux coating device proposed in the embodiment of the present application includes a base 10 and a first liquid storage part 20, wherein: the first liquid storage part 20 is arranged on the base 10, and the first liquid storage part 20 contains soldering flux, and the first liquid storage part 20 is arranged along the first horizontal direction ( Figure 1 A plurality of first notches 200 are provided at the first end of the first liquid storage portion 20 along the first horizontal direction, and a plurality of second notches 201 are provided at the second end of the first liquid storage portion 20 along the first horizontal direction. The plurality of first notches 200 and the plurality of second notches 201 are both provided along the second horizontal direction ( Figure 1The plurality of first notches 200 and the plurality of second notches 201 are arranged at intervals (in the Y direction in the figure), and each soldering ribbon 30 enters the first liquid storage part 20 from a first notch 200 and is led out to the subsequent process through the corresponding second notch 201. The liquid level of the flux in the first liquid storage part 20 is higher than the height of the soldering ribbon 30 passing through the first liquid storage part 20, so that the soldering flux is automatically applied to the soldering ribbon 30 after passing through the first liquid storage part 20, and the first horizontal direction is perpendicular to the second horizontal direction.

[0051] It can be seen that the flux coating device proposed in the present application is configured with a plurality of notches at both ends of the first liquid storage section 20 along the first horizontal direction, and the liquid level of the flux in the first liquid storage section 20 is higher than the height of the solder strip 30 passing through the first liquid storage section 20, so that the solder strip 30 can be completely immersed below the liquid level of the flux in the first liquid storage section 20, and automatic coating of the flux is achieved when the solder strip 30 passes through the first liquid storage section 20 along the first horizontal direction; compared with the existing method of coating the flux by passing the solder strip around a roller immersed in the liquid level of the flux, the solder strip 30 is only subjected to traction along the first horizontal direction when coating the flux, which greatly reduces the occurrence of pulling and deformation of the solder strip when coating the flux, thereby ensuring the quality of the solder strip.

[0052] See also Figure 2 and Figure 3 As shown, as an embodiment, the solder flux coating device further includes a second liquid storage part 40 and a circulation pump 50 disposed on the base 10, the first liquid storage part 20 is disposed above the second liquid storage part 40 or accommodated in the second liquid storage part 40, the second liquid storage part 40 is used to receive the solder flux overflowing from the first notch 200 and the second notch 201, the liquid inlet of the circulation pump 50 is connected to the second liquid storage part 40, and the liquid inlet is disposed at the bottom of the second liquid storage part 40. The liquid outlet of the circulation pump 50 is connected to the first liquid storage part 20, and the circulation pump 50 is configured to transport the solder flux in the second liquid storage part 40 to the first liquid storage part 20.

[0053] Preferably, the first liquid storage part 20 is accommodated in the second liquid storage part 40 , and the bottom of the first liquid storage part 20 is arranged higher than the bottom of the second liquid storage part 40 .

[0054] Specifically, a partition is provided on the base 10 on the outer side of the first end of the first liquid storage part 20 along the first horizontal direction, and a partition is also provided on the base 10 on the outer side of the second end of the first liquid storage part 20 along the first horizontal direction. The second liquid storage part 40 is formed by the cooperation of the two partitions and the base 10.

[0055] It can be seen that by setting up the second liquid storage section 40, the flux at the overflow of the first notch 200 and the second notch 201 can be collected, which saves flux and saves production costs; by setting up the circulation pump 50, the flux in the second liquid storage section 40 can be automatically transported to the first liquid storage section 20, thereby realizing automatic circulation of the flux between the first liquid storage section 20 and the second liquid storage section 40, so that the liquid level of the flux in the first liquid storage section 20 is always higher than the height of the solder strip 30 passing through the first liquid storage section 20, thereby ensuring the quality of the flux applied on the solder strip 30, with a high degree of automation and high application efficiency.

[0056] As an embodiment, the flux applying device further includes at least one guide component 60 , which is disposed on the travel path of the soldering ribbon 30 to guide each soldering ribbon 30 .

[0057] It can be seen that by providing the guide assembly 60, each soldering strip 30 can be guided when the soldering strip 30 moves, thereby preventing each soldering strip 30 from deviating when moving, and improving the application quality of the flux.

[0058] As an embodiment, the guide assembly 60 includes a first guide assembly 61, which is arranged at the first end of the first liquid storage part 20 on the outside in the first horizontal direction. The first guide assembly 61 has a plurality of first guide channels 610 for a single solder strip 30 to pass through. The plurality of first guide channels 610 correspond one-to-one to a plurality of first notches 200. The single solder strip 30 passes through the corresponding first guide channel 610, the first notch 200 and the second notch 201 and is led out of the subsequent process.

[0059] Specifically, the first guide assembly 61 is located in or above the second liquid storage portion 40 .

[0060] It can be seen that by providing the first guide assembly 61, each solder strip 30 is guided before entering the first liquid storage portion 20 to ensure that the position of each solder strip entering the first liquid storage portion 20 will not be offset.

[0061] As an embodiment, the guide assembly 60 includes a second guide assembly 62, which is spaced apart at the second end of the first liquid storage portion 20 on the outside in the first horizontal direction. The second guide assembly 62 has a plurality of second guide channels for a single solder strip 30 to pass through, and the plurality of second guide channels correspond one-to-one to the plurality of second notches 201. The single solder strip 30 passes through the corresponding first notch 200, second notch 201 and second guide channel to be led out of the subsequent process.

[0062] Specifically, the second guide assembly 62 is located in or above the second liquid storage portion 40 .

[0063] It can be seen that by setting the second guide component 62, each solder strip 30 is guided after being led out from the first liquid storage part 20 to ensure that the position of each solder strip 30 after being led out from the first liquid storage part 20 and coated with flux will not be offset.

[0064] As an embodiment, the guide assembly 60 includes a first guide assembly 61 and a second guide assembly 62. The first guide assembly 61 is arranged at the first end of the first liquid storage portion 20 on the outside in the first horizontal direction. The first guide assembly 61 has a plurality of first guide channels 610 for a single solder strip 30 to pass through, and the plurality of first guide channels 610 correspond one-to-one to the plurality of first notches 200; the second guide assembly 62 is arranged at intervals at the second end of the first liquid storage portion 20 on the outside in the first horizontal direction. The second guide assembly 62 has a plurality of second guide channels for a single solder strip 30 to pass through, and the plurality of second guide channels correspond one-to-one to the plurality of second notches 201; the single solder strip 30 passes through the corresponding first guide channel 610, the first notch 200, the second notch 201 and the second guide channel and is led out of the subsequent process.

[0065] Specifically, the first guide assembly 61 and the second guide assembly 62 are both located in the second liquid storage portion 40 .

[0066] It can be seen that by setting the first guide component 61 and the second guide component 62, each solder strip 30 can be guided before entering the first liquid storage part 20 and after being led out of the first liquid storage part 20, so as to avoid the position of the solder strip 30 being shifted during the flux application process.

[0067] See 3 and Figure 4 As shown, as an embodiment, the first guide assembly 61 and the second guide assembly 62 each include a guide seat 611 and a plurality of guide columns 612, wherein: the plurality of guide columns 612 are installed on the guide seat 611 at equal intervals along the second horizontal direction, and a first guide channel 610 or a second guide channel is formed between two adjacent guide columns 612; or alternatively, the plurality of guide columns 612 are installed on the guide seat 611 in pairs along the second horizontal direction, and a first guide channel 610 or a second guide channel is formed between each pair of guide columns 612.

[0068] It can be seen that through the cooperation of the guide seat 611 and a plurality of guide columns 612, a first guide channel 610 or a second guide channel is formed on the guide seat 611, providing a first guide component 61 and a second guide component 62 with a simple structure, low cost and easy implementation.

[0069] See also Figure 2 and Figure 3As shown, as an embodiment, a collecting portion 70 is also provided on the base 10, and the collecting portion 70 is arranged on one side of the second liquid storage portion 40 close to the lead end of the soldering strip 30 in the first horizontal direction, and the collecting portion 70 is configured to collect the flux dripping on the soldering strip passing through the collecting portion 70.

[0070] It can be seen that by providing the collecting portion 70, the flux dripping on the soldering tape passing through the collecting portion 70 can be automatically collected and reused, thereby reducing the processing cost of the soldering tape 30 to a certain extent; at the same time, it can also ensure the cleanliness of the processing environment of the soldering tape 30, and prevent the flux dripping on the soldering tape 30 from directly dripping onto the soldering tape processing equipment.

[0071] As an implementation manner, the collecting portion 70 is provided with an opening at the bottom thereof, and the collecting portion 70 discharges the collected soldering flux into the second liquid storage portion 40 through the opening.

[0072] It can be seen that by setting an opening on the collecting part 70, the collecting part 70 is connected with the second liquid storage part 40, and the flux in the collecting part 70 is automatically discharged into the second liquid storage part 40, without manual operation, saving manpower and improving work efficiency.

[0073] See also Figure 1 and Figure 2 As shown, as an embodiment, a shielding member 80 is hinged on the base 10; when the shielding member 80 is closed, the shielding member 80 at least covers the first liquid storage part 20 and the second liquid storage part 40, and the shielding member 80 has a channel 81 for the welding strip to pass through between the two ends of the first horizontal direction and the base 10, and the width of the channel 81 extends along the second horizontal direction.

[0074] Specifically, the shielding member 80 is hinged to the base 10 through a hinge or hinge on the first side in the second horizontal direction, and the shielding member 80 can be opened or closed relative to the base 10 on the second side in the second horizontal direction. The shielding member 80 is provided with a handle 82 on the second side in the second horizontal direction, and the handle 82 is used to facilitate opening or closing of the shielding member 80.

[0075] It can be seen that by hingedly connecting the shielding member 80 on the base 10, the top openings of the first liquid storage section 20 and the second liquid storage section 40 are covered, thereby preventing the volatilized gas of the flux in the first liquid storage section 20 and the second liquid storage section 40 from being directly discharged into the workshop and causing pollution to the workshop.

[0076] As an embodiment, a transparent window 83 that can be opened or not is provided on the shielding member 80. The transparent window 83 is at least used for manually observing the soldering flux. When the transparent window 83 is set to be openable, the soldering flux can be conveniently added to the first liquid storage part 20 and / or the second liquid storage part 40 by opening the transparent window 83.

[0077] It can be seen that by providing an openable transparent window 83 on the shielding member 80, when adding flux, there is no need to open the entire shielding member 80. Only the transparent window 83 needs to be opened to add flux to the first liquid storage part 20 and / or the second liquid storage part 40. This facilitates operation and improves the efficiency of adding flux.

[0078] As an implementation mode, an exhaust pipe 84 is provided on the shielding member 80 , and the exhaust pipe 84 is connected to the exhaust gas pipeline. When the shielding member 80 is closed, the gas volatilized by the flux is introduced into the exhaust gas pipeline through the exhaust pipe 84 .

[0079] It can be seen that by arranging the exhaust pipe 84 on the shielding member 80, the volatilized gas of the flux can be timely introduced into the exhaust gas pipe and discharged through the exhaust gas pipe, which greatly reduces the pollution of the volatilized gas of the flux to the workshop.

[0080] As an implementation manner, a liquid discharge port (not shown in the figure) is disposed on the second liquid storage portion 40 , and the soldering flux in the second liquid storage portion 40 is discharged through the liquid discharge port.

[0081] The soldering flux coating device provided in the embodiment of the present application has the following advantages:

[0082] 1) Automatically apply flux to the soldering ribbon. When the soldering ribbon is applied with flux, it is only subjected to traction along the first horizontal direction, which greatly reduces the occurrence of pulling deformation of the soldering ribbon when applying flux, ensures the quality of the soldering ribbon, and further ensures the quality of the series connection;

[0083] 2) The automatic circulation of the soldering flux between the two liquid storage parts is realized, so that the liquid level of the soldering flux in the first liquid storage part is always higher than the height of the soldering strip passing through the first liquid storage part, thereby ensuring the quality of the soldering flux applied on the soldering strip, with high automation, high application efficiency, easy maintenance and low cost;

[0084] 3) A guide component is provided to prevent the solder strip from shifting during the soldering flux application process;

[0085] 4) A shielding member is provided, and an exhaust pipe is provided on the shielding member, which can timely direct the volatilized gas of the flux into the exhaust gas pipe, and discharge the volatilized gas of the flux through the exhaust gas pipe, thereby greatly reducing the pollution of the volatilized gas of the flux to the workshop.

[0086] The above embodiments are only to illustrate the basic principles and characteristics of the present application. The present application is not limited by the above examples. Without departing from the spirit and scope of the present application, the present application may be subject to various changes and modifications, which are within the scope of the present application to be protected. The scope of protection claimed in the present application is defined by the attached claims and their equivalents.

Claims

1. A flux coating device, characterized in that: The soldering flux coating device comprises a base and a first liquid storage portion, wherein: The first liquid storage part is arranged on the base, the first liquid storage part contains soldering flux, a first end of the first liquid storage part along the first horizontal direction is provided with a plurality of first notches, a second end of the first liquid storage part along the first horizontal direction is provided with a plurality of second notches, the plurality of first notches and the plurality of second notches are arranged at intervals along the second horizontal direction, and the plurality of first notches correspond to the plurality of second notches one by one; Each soldering ribbon enters the first liquid storage section from one of the first notches and is led out to the subsequent process through the corresponding second notch. The liquid level of the flux in the first liquid storage section is higher than the height of the soldering ribbon passing through the first liquid storage section, so that the soldering ribbon is automatically coated with flux after passing through the first liquid storage section, and the first horizontal direction is perpendicular to the second horizontal direction.

2. The flux coating device according to claim 1, characterized in that: The flux coating device also includes a second liquid storage part and a circulation pump arranged on the base, the first liquid storage part is arranged above the second liquid storage part or accommodated in the second liquid storage part, the second liquid storage part is used to receive the flux overflowing from the first notch and the second notch, the liquid inlet of the circulation pump is connected with the second liquid storage part, the liquid outlet of the circulation pump is connected with the first liquid storage part, and the circulation pump is configured to transport the flux in the second liquid storage part to the first liquid storage part.

3. The flux coating device according to claim 1, characterized in that: The soldering flux coating device further comprises at least one guide component, and the guide component is arranged on the travel path of the soldering ribbon to guide each soldering ribbon.

4. The flux coating device according to claim 3, characterized in that: The guide assembly comprises a first guide assembly and / or a second guide assembly, wherein: The first guide assembly is arranged at the outside of the first end of the first liquid storage part in the first horizontal direction, and the first guide assembly has a plurality of first guide channels for a single solder strip to pass through, and the plurality of first guide channels correspond to the plurality of first notches one by one, and the single solder strip passes through the corresponding first guide channel, the first notch and the second notch to be led out of the subsequent process; The second guide assembly is spaced apart at the outside of the second end of the first liquid storage part in the first horizontal direction. The second guide assembly has a plurality of second guide channels for a single solder strip to pass through. The plurality of second guide channels correspond one-to-one to the plurality of second notches. The single solder strip passes through the corresponding first notch, the second notch and the second guide channel to be led out of the subsequent process.

5. The soldering flux coating device according to claim 4, characterized in that: The first guide assembly and the second guide assembly both include a guide seat and a plurality of guide posts, wherein: The plurality of guide posts are installed on the guide seat at equal intervals along the second horizontal direction, and the first guide channel or the second guide channel is formed between two adjacent guide posts; or The plurality of guide posts are installed on the guide seat in pairs along the second horizontal direction, and the first guide channel or the second guide channel is formed between each pair of guide posts.

6. The soldering flux coating device according to claim 2, characterized in that: The base is also provided with a collecting portion, which is arranged on one side of the second liquid storage portion close to the lead-out end of the soldering strip in the first horizontal direction, and is configured to collect solder flux dripping from the soldering strip passing through the collecting portion.

7. The soldering flux coating device according to claim 6, characterized in that: The collecting portion is provided with an opening at the bottom thereof, and the collecting portion discharges the collected soldering flux into the second liquid storage portion through the opening.

8. The flux coating device according to claim 2, characterized in that: A shielding member is hinged on the base; When the shielding member is closed, the shielding member covers the first liquid storage portion and the second liquid storage portion, and the shielding member has a channel for the solder strip to pass through between the two ends of the first horizontal direction and the base, and the width of the channel extends along the second horizontal direction.

9. The soldering flux coating device according to claim 8, characterized in that: The shielding member is provided with a transparent window that can be opened or closed. When the transparent window is opened, soldering flux is added to the first liquid storage part and / or the second liquid storage part through the transparent window.

10. The flux applying device according to claim 8, characterized in that: The shielding member is provided with an exhaust pipe, which is communicated with the exhaust gas pipeline. When the shielding member is closed, the gas volatilized by the soldering flux is introduced into the exhaust gas pipeline through the exhaust pipe.

11. The flux applying device according to claim 2, characterized in that: The second liquid storage part is provided with a liquid discharge port, through which the soldering flux in the second liquid storage part is discharged.

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