High-intelligence double-laser-head laser processing equipment
By introducing structures such as worms, worm gears, dustproof covers, universal pulleys into high-intelligent dual laser head laser processing equipment, the problem of equipment being susceptible to dust intrusion and inconvenient movement is solved, and the equipment is dustproof and convenient to move is realized. Improves the practicality and maintenance convenience of the equipment.
Patent Information
- Application Number
- CN202420867395.4
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-04-25
- Publication Date
- 2025-01-17
- Estimated Expiration
- 2034-04-25
AI Technical Summary
The existing high-intelligent dual-laser head laser processing equipment lacks protective measures, which makes the equipment susceptible to dust intrusion and damage, and is not convenient for mobile use, requiring multiple people to carry it, which is time-consuming and labor-intensive.
A high-intelligent dual laser head laser processing equipment including chassis, dustproof mechanism and adjustment mechanism is designed. The equipment is dustproof and conveniently moved through structures such as worms, worm gears, dustproof covers, universal pulleys, etc., and through the clamping plate , slide chutes, hand brackets and other structures are designed for easy disassembly and assembly and maintenance of pulleys.
Effectively prevent dust from entering, reduce equipment damage, simplify equipment movement, reduce manual handling time, improve equipment practicality and maintenance convenience, and reduce pulley failure and maintenance difficulty.
Smart Images

Figure CN222359469U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to the technical field of laser processing equipment, in particular to a high-intelligence dual-laser head laser processing equipment. Background Art
[0002] In recent years, laser processing equipment has been rapidly developed and popularized. Due to the use of laser processing, the actual processing efficiency has also been significantly improved, and the previous complex, unfavorable cutting and inefficient processing mode has been improved.
[0003] After searching, Chinese patent announcement number: CN110883420A discloses a high-intelligence dual-laser head laser processing equipment, including a laser processing cabinet, a main control box arranged at the rear side of the laser processing cabinet, and a laser processing component and a manipulator component; a laser processing slot for accommodating the main control box, the laser processing component and the manipulator component is opened on the upper part of the laser processing cabinet; the laser processing component includes a first laser processing component and a second laser processing component arranged in parallel, and the first laser processing component includes a first laser head, a first optical cavity and a first lifting rod located at the rear of the first optical cavity for driving the first laser head to move up and down.
[0004] The above device has the following defects: the device structure does not have protective measures, the device is exposed to the outside for a long time, which easily leads to dust intrusion and is easily damaged, and the device is not convenient for mobile use, which requires multiple people to carry it, which is time-consuming and labor-intensive. Therefore, a high-intelligence dual laser head laser processing device is proposed to solve the above problems. Summary of the invention
[0005] In order to make up for the above shortcomings, the utility model provides a high-intelligence dual-laser head laser processing equipment, aiming to improve the problems in the prior art that the equipment structure has no protection measures, the equipment is exposed to the outside for a long time, which makes it easy for dust to enter and be damaged, and the equipment is not convenient for mobile use.
[0006] In order to achieve the above-mentioned purpose, the utility model adopts the following technical scheme: a high-intelligence dual-laser head laser processing equipment, including a chassis, the bottom inner wall of the chassis is fixedly connected with a high-intelligence laser processing device, the chassis is provided with a dustproof mechanism, the dustproof mechanism is provided with an adjustment mechanism, the dustproof mechanism includes a worm, the worm is rotatably connected to the inner wall of one side of the chassis through a bearing, the worm is meshingly connected with a worm wheel, the inner ring of the worm wheel is fixedly connected with a straight rod, the straight rod is fixedly connected with a dust cover, the bottom inner wall of the chassis is provided with a strip opening, the side inner wall of the dust cover is slidably connected with a support plate, and the outer wall of the support plate on the side away from the dust cover is fixedly connected with a universal pulley.
[0007] As a further description of the above technical solution: the adjustment mechanism includes a hand support, which is slidably connected to the side inner wall of the dust cover, one side outer wall of the hand support is fixedly connected with a spring, the side outer wall of the hand support away from the spring is fixedly connected with a clamping plate, the side outer wall of the support plate close to the clamping plate is provided with a sliding groove, and the top outer wall of the support plate is clamped with a spring damper.
[0008] As a further description of the above technical solution: one end of the worm penetrates through one side outer wall of the chassis, and the end of the worm away from the chassis is fixedly connected to an adjusting disk.
[0009] As a further description of the above technical solution: there are four support plates in total, the four support plates are symmetrical to each other, and the four support plates are slidably connected to the side inner walls of the dust cover respectively.
[0010] As a further description of the above technical solution: the inner diameter of the strip-shaped opening is adapted to the width of the support plate.
[0011] As a further description of the above technical solution: the clamping plate passes through one side of the dust cover, and the clamping plate is slidably connected to an inner wall of one side of the sliding groove.
[0012] As a further description of the above technical solution: one end of the spring damper away from the support plate is fixedly connected to an inner wall of one side of the dust cover.
[0013] As a further description of the above technical solution: a radiator is fixedly connected to an inner wall of one side of the chassis, and a vent is opened on an outer wall of one side of the chassis.
[0014] The utility model has the following beneficial effects:
[0015] 1. In the utility model, by setting structures such as worm gears, dust covers, and strip-shaped openings, high-intelligence laser processing equipment is protected from dust, which improves the equipment from being exposed to the outside for a long time, which is prone to dust ingress and damage. At the same time, the equipment can be conveniently moved to the desired placement area while preventing dust, which reduces manual handling time and improves practicality to a certain extent.
[0016] 2. In the utility model, by setting structures such as card plates, slide grooves, and hand brackets, the high-intelligence laser processing equipment is buffered and shock-absorbing when moving, reducing the looseness of parts of the equipment caused by severe vibration, thereby reducing malfunction problems. At the same time, a single pulley assembly can be conveniently disassembled and maintained, improving the problem of lack of lubricating oil or breakage of pulleys due to long-term use, which is inconvenient to replace and maintain. BRIEF DESCRIPTION OF THE DRAWINGS
[0017] Figure 1 This is a schematic diagram of the main view of a highly intelligent dual-laser head laser processing device proposed by the utility model;
[0018] Figure 2 A side view schematic diagram of a highly intelligent dual laser head laser processing device proposed by the utility model;
[0019] Figure 3 A schematic diagram of a high-intelligence dual-laser head laser processing device proposed by the utility model, wherein the device structure has no protective measures, the device is exposed to the outside for a long time, dust easily enters and is easily damaged, and the device is not convenient for mobile use;
[0020] Figure 4 This is a schematic diagram of a high-intelligence dual-laser head laser processing device proposed in the utility model. The device structure has no protective measures, the device is easily exposed to the outside for a long time, dust easily enters and is easily damaged, and the device is not convenient for mobile use.
[0021] Legend:
[0022] 1. Chassis; 2. Radiator; 3. High-intelligence laser processing device; 4. Ventilation port; 5. Dust-proof mechanism; 51. Worm; 52. Adjustment disk; 53. Worm gear; 54. Straight rod; 55. Dust cover; 56. Strip opening; 57. Support plate; 58. Universal pulley; 6. Adjustment mechanism; 61. Hand support; 62. Spring; 63. Card plate; 64. Slideway; 65. Spring damper. DETAILED DESCRIPTION
[0023] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.
[0024] Reference Figure 1-Figure 3The utility model provides an embodiment: a high-intelligence dual-laser head laser processing equipment, including a chassis 1, a high-intelligence laser processing device 3 is fixedly connected to the bottom inner wall of the chassis 1, a dustproof mechanism 5 is provided on the chassis 1, and an adjustment mechanism 6 is provided on the dustproof mechanism 5. The dustproof mechanism 5 includes a worm 51. By setting the worm 51, a worm wheel 53 has a certain self-locking property when the worm 51 does not rotate. The worm 51 is rotatably connected to the inner wall of one side of the chassis 1 through a bearing, and a worm wheel 53 is meshed and connected to the worm 51. The worm wheel 53 is A straight rod 54 is fixedly connected to the inner ring, and a worm gear 53 is provided to drive the straight rod 54 to rotate and adjust. A dust cover 55 is fixedly connected to the straight rod 54. The dust cover 55 is provided to isolate and protect the high-intelligence laser processing device 3 from dust. A strip opening 56 is provided on the bottom inner wall of the chassis 1. A support plate 57 is slidably connected to the side inner wall of the dust cover 55. A universal pulley 58 is fixedly connected to the outer wall of the support plate 57 away from the dust cover 55. The universal pulley 58 is provided to facilitate the support of the entire chassis 1 for convenient movement and transportation.
[0025] Reference Figure 2-Figure 3 One end of the worm 51 passes through the outer wall of one side of the chassis 1, and the end of the worm 51 away from the chassis 1 is fixedly connected with an adjusting disk 52. There are four support plates 57, and the four support plates 57 are symmetrical. The four support plates 57 are respectively slidably connected to the side inner walls of the dust cover 55. By setting the support plates 57, the support plates 57 are convenient for installing the universal pulley 58. The inner diameter of the strip opening 56 is matched with the width of the support plates 57. A radiator 2 is fixedly connected to the inner wall of one side of the chassis 1. By setting the radiator 2, the high-intelligence machine is cooled and cooled during processing. A vent 4 is opened on the outer wall of one side of the chassis 1, and the heat generated during processing is ventilated and cooled by setting the vent 4.
[0026] Reference Figure 3-Figure 4 The adjusting mechanism 6 includes a hand bracket 61, which is slidably connected to the side inner wall of the dust cover 55, and a spring 62 is fixedly connected to one side outer wall of the hand bracket 61. The card plate 63 is moved by setting the hand bracket 61, and the outer wall of the hand bracket 61 on the side away from the spring 62 is fixedly connected to the card plate 63. A slide groove 64 is provided on the outer wall of the side of the support plate 57 close to the card plate 63, and a spring damper 65 is clamped on the top outer wall of the support plate 57. By setting the spring damper 65, the chassis 1 is buffered and shock-absorbing when the whole moves. The card plate 63 passes through one side of the dust cover 55, and the card plate 63 is slidably connected to one side inner wall of the slide groove 64. By setting the slide groove 64, the card plate 63 is limitedly slid on the inner wall, and one end of the spring damper 65 away from the support plate 57 is fixedly connected to one side inner wall of the dust cover 55.
[0027] Working principle: The worm 51 is rotated by rotating the adjusting disk 52, and the rotation of the worm 51 drives the worm wheel 53 to rotate, and the rotation of the worm wheel 53 drives the straight rod 54 to rotate, and the rotation of the straight rod 54 drives the dust cover 55 to move, and the dust cover 55 moves to cover and isolate the high-intelligence laser processing device 3, so that the dust cover 55 fits inside the chassis 1, and at the same time, the movement of the dust cover 55 drives the support plate 57 to move, and the movement of the support plate 57 drives the universal pulley 58 to pass through the strip opening 56, so that the universal pulley 58 fits the ground to support the machine. The entire equipment of box 1 can be conveniently moved and transported. At the same time, during the movement, the vibration of the universal pulley 58 is transmitted to the support plate 57, and the support plate 57 transmits the vibration force to the spring damper 65 for buffering and shock absorption. At the same time, if a single universal pulley 58 is damaged by foreign objects or lacks lubricating oil for maintenance, the spring 62 is squeezed by pulling the hand bracket 61, and the movement of the hand bracket 61 drives the card plate 63 to move, so that the card plate 63 is separated from the slide groove 64, and then the support plate 57 is pulled out to maintain, replace and maintain the universal pulley 58.
[0028] Finally, it should be noted that the above is only a preferred embodiment of the present invention and is not intended to limit the present invention. Although the present invention has been described in detail with reference to the aforementioned embodiments, those skilled in the art can still modify the technical solutions described in the aforementioned embodiments or make equivalent substitutions for some of the technical features therein. Any modifications, equivalent substitutions, improvements, etc. made within the spirit and principles of the present invention should be included in the protection scope of the present invention.
Claims
1. A highly intelligent dual laser head laser processing device, comprising a chassis (1), characterized in that: The bottom inner wall of the chassis (1) is fixedly connected to a high-intelligence laser processing device (3); the chassis (1) is provided with a dustproof mechanism (5); the dustproof mechanism (5) is provided with an adjustment mechanism (6); the dustproof mechanism (5) comprises a worm (51); the worm (51) is rotatably connected to an inner wall of one side of the chassis (1) via a bearing; a worm wheel (53) is meshingly connected to the worm (51); a straight rod (54) is fixedly connected to the inner ring of the worm wheel (53); a dust cover (55) is fixedly connected to the straight rod (54); a strip-shaped opening (56) is opened on the bottom inner wall of the chassis (1); a support plate (57) is slidably connected to the side inner wall of the dust cover (55); and a universal pulley (58) is fixedly connected to the outer wall of the support plate (57) on a side away from the dust cover (55).
2. The high-intelligence dual-laser head laser processing equipment according to claim 1, characterized in that: The adjustment mechanism (6) comprises a hand support (61), the hand support (61) being slidably connected to the inner wall of the side of the dust cover (55), a spring (62) being fixedly connected to one outer wall of the hand support (61), a clamping plate (63) being fixedly connected to the outer wall of the hand support (61) away from the spring (62), a sliding groove (64) being formed on the outer wall of the support plate (57) close to the clamping plate (63), and a spring damper (65) being clamped to the top outer wall of the support plate (57).
3. The high-intelligence dual-laser head laser processing equipment according to claim 1, characterized in that: One end of the worm (51) penetrates through an outer wall of one side of the chassis (1), and one end of the worm (51) away from the chassis (1) is fixedly connected to an adjustment disk (52).
4. The high-intelligence dual-laser head laser processing equipment according to claim 1, characterized in that: There are four support plates (57) in total. The four support plates (57) are symmetrical to each other, and the four support plates (57) are slidably connected to the side inner wall of the dust cover (55).
5. The high-intelligence dual-laser head laser processing equipment according to claim 1, characterized in that: The inner diameter of the strip-shaped opening (56) is adapted to the width of the support plate (57).
6. The high-intelligence dual-laser head laser processing equipment according to claim 2, characterized in that: The clamping plate (63) passes through one side of the dust cover (55), and the clamping plate (63) is slidably connected to an inner wall of one side of the sliding groove (64).
7. The high-intelligence dual-laser head laser processing equipment according to claim 2, characterized in that: One end of the spring damper (65) away from the support plate (57) is fixedly connected to an inner wall of one side of the dust cover (55).
8. The high-intelligence dual-laser head laser processing equipment according to claim 1, characterized in that: A radiator (2) is fixedly connected to an inner wall of one side of the chassis (1), and a ventilation hole (4) is provided on an outer wall of one side of the chassis (1).
Citation Information
Patent Citations
Highly-intelligent double-laser-head laser machining equipment
CN110883420A